TWI281987B - A system for burn-in testing of electronic devices - Google Patents
A system for burn-in testing of electronic devices Download PDFInfo
- Publication number
- TWI281987B TWI281987B TW092117365A TW92117365A TWI281987B TW I281987 B TWI281987 B TW I281987B TW 092117365 A TW092117365 A TW 092117365A TW 92117365 A TW92117365 A TW 92117365A TW I281987 B TWI281987 B TW I281987B
- Authority
- TW
- Taiwan
- Prior art keywords
- board
- burner
- drive
- connector
- power
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/24—Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Environmental & Geological Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/184,525 US6815966B1 (en) | 2002-06-27 | 2002-06-27 | System for burn-in testing of electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200400361A TW200400361A (en) | 2004-01-01 |
| TWI281987B true TWI281987B (en) | 2007-06-01 |
Family
ID=29999239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092117365A TWI281987B (en) | 2002-06-27 | 2003-06-26 | A system for burn-in testing of electronic devices |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6815966B1 (enExample) |
| EP (1) | EP1540360A1 (enExample) |
| JP (1) | JP2005531010A (enExample) |
| CN (1) | CN100395556C (enExample) |
| AU (1) | AU2003247750A1 (enExample) |
| TW (1) | TWI281987B (enExample) |
| WO (1) | WO2004003581A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI715101B (zh) * | 2018-12-27 | 2021-01-01 | 廣達電腦股份有限公司 | 電路裝置及轉接卡 |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6562636B1 (en) * | 1999-07-14 | 2003-05-13 | Aehr Test Systems | Wafer level burn-in and electrical test system and method |
| US6815966B1 (en) * | 2002-06-27 | 2004-11-09 | Aehr Test Systems | System for burn-in testing of electronic devices |
| US7265561B2 (en) * | 2003-09-30 | 2007-09-04 | International Business Machines Corporation | Device burn in utilizing voltage control |
| US20060139046A1 (en) * | 2004-04-13 | 2006-06-29 | Reliability Inc. | Apparatus for reducing deflection of a mobile member in a chamber |
| KR100621104B1 (ko) * | 2004-08-25 | 2006-09-19 | 삼성전자주식회사 | 전자장치 |
| KR100680955B1 (ko) | 2004-12-30 | 2007-02-08 | 주식회사 하이닉스반도체 | 번인 보드 장치 및 번인 보드 장치의 탑재 방법 |
| JP4789920B2 (ja) * | 2005-02-15 | 2011-10-12 | 株式会社アドバンテスト | バーンイン装置 |
| JP5085534B2 (ja) | 2005-04-27 | 2012-11-28 | エイアー テスト システムズ | 電子デバイスを試験するための装置 |
| JP4957395B2 (ja) * | 2007-06-05 | 2012-06-20 | 横河電機株式会社 | 半導体試験装置用テストヘッド |
| US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
| BRPI0801325A2 (pt) | 2008-04-30 | 2010-01-12 | Thomson Multimidia Ltda | método automatizado para controlar e testar produtos |
| JP5563207B2 (ja) * | 2008-08-01 | 2014-07-30 | スリーエム イノベイティブ プロパティズ カンパニー | 終端コネクタ |
| CN101644741B (zh) * | 2008-08-04 | 2011-11-09 | 京元电子股份有限公司 | 具有电源塔的多层预烧板结构 |
| US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
| US7969175B2 (en) * | 2009-05-07 | 2011-06-28 | Aehr Test Systems | Separate test electronics and blower modules in an apparatus for testing an integrated circuit |
| JP2012117881A (ja) * | 2010-11-30 | 2012-06-21 | Nippon Eng Kk | バーンインボード及びバーンインシステム |
| KR101309081B1 (ko) * | 2012-02-29 | 2013-09-17 | 주식회사 유니테스트 | 번인 테스터 |
| CN103364740A (zh) * | 2012-04-10 | 2013-10-23 | 鸿富锦精密工业(深圳)有限公司 | 转接板及具有该转接板的直流电源测试系统 |
| TWI465737B (zh) * | 2012-08-14 | 2014-12-21 | Accton Technology Corp | 老化測試系統 |
| CN103884928B (zh) * | 2012-12-21 | 2017-06-23 | 中国科学院金属研究所 | 力电热多场耦合作用下微电子产品可靠性测试平台 |
| TWI490516B (zh) * | 2013-03-28 | 2015-07-01 | Chroma Ate Inc | Measurement device and method for automatic test equipment |
| JP2014215062A (ja) * | 2013-04-23 | 2014-11-17 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| TWI570419B (zh) * | 2015-07-31 | 2017-02-11 | 陽榮科技股份有限公司 | Ic升溫裝置及方法 |
| TWI550287B (zh) * | 2015-10-30 | 2016-09-21 | Hon Tech Inc | Electronic components preheating unit and its application test classification equipment |
| KR102789332B1 (ko) | 2016-01-08 | 2025-03-31 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 |
| WO2018017402A1 (en) * | 2016-07-21 | 2018-01-25 | Canary Connect, Inc. | Reversible power and data connector assembly |
| KR102495427B1 (ko) | 2017-03-03 | 2023-02-02 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 |
| JP6961632B2 (ja) * | 2019-01-21 | 2021-11-05 | 株式会社アドバンテスト | バーンインボード及びバーンイン装置 |
| DE102019002350B3 (de) * | 2019-03-29 | 2020-06-10 | Sinn Power Gmbh | Modulares elektronikgehäusekonzept |
| CN110737221B (zh) * | 2019-10-23 | 2021-08-10 | 苏州腾伟电子有限公司 | 三十二通道矩阵开关板 |
| TWI749690B (zh) * | 2020-08-10 | 2021-12-11 | 京元電子股份有限公司 | 半導體元件預燒測試模組及其預燒測試裝置 |
| CN114078718B (zh) * | 2020-08-13 | 2025-02-28 | 京元电子股份有限公司 | 半导体元件预烧测试模块及其预烧测试装置 |
| TWI759833B (zh) * | 2020-08-25 | 2022-04-01 | 伊士博國際商業股份有限公司 | 具有功能測試之處理器燒機裝置 |
| US11835575B2 (en) | 2020-10-07 | 2023-12-05 | Aehr Test Systems | Electronics tester |
| TWI741917B (zh) * | 2020-12-18 | 2021-10-01 | 鴻勁精密股份有限公司 | 輸送裝置及其應用之測試設備 |
| JP7623204B2 (ja) * | 2021-04-19 | 2025-01-28 | 株式会社アドバンテスト | バーンインボード、及び、バーンイン装置 |
| CN116381365A (zh) * | 2021-12-29 | 2023-07-04 | 中国航天科工飞航技术研究院(中国航天海鹰机电技术研究院) | 适用于高压连接器的老化试验工装及试验装置 |
| TWI860799B (zh) * | 2023-07-28 | 2024-11-01 | 周宗貴 | 積體電路燒機系統的電源板結構 |
| CN118330421B (zh) * | 2024-06-17 | 2024-09-10 | 浙江杭可仪器有限公司 | 一种高集成性电子元器件老化测试装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4145620A (en) | 1977-10-05 | 1979-03-20 | Serel Corporation | Modular dynamic burn-in apparatus |
| US4924179A (en) * | 1977-12-12 | 1990-05-08 | Sherman Leslie H | Method and apparatus for testing electronic devices |
| US4374317A (en) | 1979-07-05 | 1983-02-15 | Reliability, Inc. | Burn-in chamber |
| US4432604A (en) * | 1982-04-28 | 1984-02-21 | Bell Telephone Laboratories, Incorporated | Self-adjusting fiberoptic connector assembly |
| US4777434A (en) * | 1985-10-03 | 1988-10-11 | Amp Incorporated | Microelectronic burn-in system |
| US5103168A (en) * | 1988-10-27 | 1992-04-07 | Grumman Aerospace Corporation | Stress testing equipment with an integral cooling plenum |
| US4998180A (en) * | 1989-05-23 | 1991-03-05 | Clearpoint Research Corporation | Bus device with closely spaced double sided daughter board |
| US5200885A (en) * | 1990-04-26 | 1993-04-06 | Micro Control Company | Double burn-in board assembly |
| CA2073916A1 (en) * | 1991-07-19 | 1993-01-20 | Tatsuya Hashinaga | Burn-in apparatus and method |
| JP2863352B2 (ja) * | 1991-08-29 | 1999-03-03 | シャープ株式会社 | 半導体集積回路試験装置 |
| US5429510A (en) * | 1993-12-01 | 1995-07-04 | Aehr Test Systems, Inc. | High-density interconnect technique |
| KR100192575B1 (ko) * | 1995-11-09 | 1999-06-15 | 윤종용 | 유니버셜 번-인 보오드 |
| JPH09297162A (ja) * | 1996-04-30 | 1997-11-18 | Nittetsu Semiconductor Kk | バーンインボード |
| JP2842840B2 (ja) * | 1996-05-30 | 1999-01-06 | 山口日本電気株式会社 | 半導体装置のバーンイン試験装置 |
| US6329831B1 (en) * | 1997-08-08 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for reliability testing of integrated circuit structures and devices |
| CN1110847C (zh) * | 1998-07-30 | 2003-06-04 | 曹骥 | 综合型集成电路高温动态老化装置 |
| JP3235573B2 (ja) * | 1998-11-05 | 2001-12-04 | 日本電気株式会社 | 半導体装置の試験システム |
| JP3446643B2 (ja) | 1998-12-28 | 2003-09-16 | 安藤電気株式会社 | バーンインボード及びバーンインテスト装置 |
| JP2000206176A (ja) * | 1999-01-07 | 2000-07-28 | Nippon Scientific Co Ltd | バ―イン装置 |
| US6340895B1 (en) | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
| US6562636B1 (en) | 1999-07-14 | 2003-05-13 | Aehr Test Systems | Wafer level burn-in and electrical test system and method |
| AU7329200A (en) | 1999-07-14 | 2001-01-30 | Aehr Test Systems Inc. | Wafer level burn-in and electrical test system and method |
| CN1172359C (zh) * | 2000-10-31 | 2004-10-20 | 京元电子股份有限公司 | 集成电路的预烧控制装置 |
| US6815966B1 (en) * | 2002-06-27 | 2004-11-09 | Aehr Test Systems | System for burn-in testing of electronic devices |
-
2002
- 2002-06-27 US US10/184,525 patent/US6815966B1/en not_active Expired - Lifetime
-
2003
- 2003-06-26 AU AU2003247750A patent/AU2003247750A1/en not_active Abandoned
- 2003-06-26 JP JP2004517971A patent/JP2005531010A/ja active Pending
- 2003-06-26 WO PCT/US2003/020332 patent/WO2004003581A1/en not_active Ceased
- 2003-06-26 TW TW092117365A patent/TWI281987B/zh not_active IP Right Cessation
- 2003-06-26 EP EP03762138A patent/EP1540360A1/en not_active Ceased
- 2003-06-26 CN CNB038147327A patent/CN100395556C/zh not_active Expired - Fee Related
-
2004
- 2004-08-11 US US10/917,139 patent/US7063544B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI715101B (zh) * | 2018-12-27 | 2021-01-01 | 廣達電腦股份有限公司 | 電路裝置及轉接卡 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200400361A (en) | 2004-01-01 |
| AU2003247750A1 (en) | 2004-01-19 |
| JP2005531010A (ja) | 2005-10-13 |
| US20050007137A1 (en) | 2005-01-13 |
| US7063544B2 (en) | 2006-06-20 |
| CN100395556C (zh) | 2008-06-18 |
| EP1540360A1 (en) | 2005-06-15 |
| US6815966B1 (en) | 2004-11-09 |
| CN1662822A (zh) | 2005-08-31 |
| WO2004003581A1 (en) | 2004-01-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |