JP2005531010A - 電子デバイスをバーンイン試験するためのシステム - Google Patents

電子デバイスをバーンイン試験するためのシステム Download PDF

Info

Publication number
JP2005531010A
JP2005531010A JP2004517971A JP2004517971A JP2005531010A JP 2005531010 A JP2005531010 A JP 2005531010A JP 2004517971 A JP2004517971 A JP 2004517971A JP 2004517971 A JP2004517971 A JP 2004517971A JP 2005531010 A JP2005531010 A JP 2005531010A
Authority
JP
Japan
Prior art keywords
burn
board
driver
power
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004517971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005531010A5 (enExample
Inventor
ブラッドリー アール ガン
アルベルト ジェイ カルデロン
ジョヴァン ジョヴァノヴィック
デイヴィッド ヘンドリクソン
Original Assignee
エイアー テスト システムズ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エイアー テスト システムズ filed Critical エイアー テスト システムズ
Publication of JP2005531010A publication Critical patent/JP2005531010A/ja
Publication of JP2005531010A5 publication Critical patent/JP2005531010A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/24—Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2004517971A 2002-06-27 2003-06-26 電子デバイスをバーンイン試験するためのシステム Pending JP2005531010A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/184,525 US6815966B1 (en) 2002-06-27 2002-06-27 System for burn-in testing of electronic devices
PCT/US2003/020332 WO2004003581A1 (en) 2002-06-27 2003-06-26 A system for burn-in testing of electronic devices

Publications (2)

Publication Number Publication Date
JP2005531010A true JP2005531010A (ja) 2005-10-13
JP2005531010A5 JP2005531010A5 (enExample) 2006-08-03

Family

ID=29999239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004517971A Pending JP2005531010A (ja) 2002-06-27 2003-06-26 電子デバイスをバーンイン試験するためのシステム

Country Status (7)

Country Link
US (2) US6815966B1 (enExample)
EP (1) EP1540360A1 (enExample)
JP (1) JP2005531010A (enExample)
CN (1) CN100395556C (enExample)
AU (1) AU2003247750A1 (enExample)
TW (1) TWI281987B (enExample)
WO (1) WO2004003581A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304208A (ja) * 2007-06-05 2008-12-18 Yokogawa Electric Corp 半導体試験装置用テストヘッド
JP2012117881A (ja) * 2010-11-30 2012-06-21 Nippon Eng Kk バーンインボード及びバーンインシステム
JP2013181975A (ja) * 2012-02-29 2013-09-12 Unitest Inc バーンインテスター用テストモジュール及びバーンインテスター
KR20220019597A (ko) * 2020-08-10 2022-02-17 킹 유안 일렉트로닉스 코포레이션 리미티드 반도체 컴포넌트 번인 테스트 모듈 및 번인 테스트 장비
JP7569517B2 (ja) 2019-03-29 2024-10-18 ジン パワー ゲーエムベーハー モジュール式電子装置ハウジング概念

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562636B1 (en) * 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
US7265561B2 (en) * 2003-09-30 2007-09-04 International Business Machines Corporation Device burn in utilizing voltage control
US20060139046A1 (en) * 2004-04-13 2006-06-29 Reliability Inc. Apparatus for reducing deflection of a mobile member in a chamber
KR100621104B1 (ko) * 2004-08-25 2006-09-19 삼성전자주식회사 전자장치
KR100680955B1 (ko) 2004-12-30 2007-02-08 주식회사 하이닉스반도체 번인 보드 장치 및 번인 보드 장치의 탑재 방법
JP4789920B2 (ja) * 2005-02-15 2011-10-12 株式会社アドバンテスト バーンイン装置
US7762822B2 (en) 2005-04-27 2010-07-27 Aehr Test Systems Apparatus for testing electronic devices
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
BRPI0801325A2 (pt) 2008-04-30 2010-01-12 Thomson Multimidia Ltda método automatizado para controlar e testar produtos
JP5563207B2 (ja) * 2008-08-01 2014-07-30 スリーエム イノベイティブ プロパティズ カンパニー 終端コネクタ
CN101644741B (zh) * 2008-08-04 2011-11-09 京元电子股份有限公司 具有电源塔的多层预烧板结构
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US7969175B2 (en) * 2009-05-07 2011-06-28 Aehr Test Systems Separate test electronics and blower modules in an apparatus for testing an integrated circuit
CN103364740A (zh) * 2012-04-10 2013-10-23 鸿富锦精密工业（深圳）有限公司 转接板及具有该转接板的直流电源测试系统
TWI465737B (zh) * 2012-08-14 2014-12-21 Accton Technology Corp 老化測試系統
CN103884928B (zh) * 2012-12-21 2017-06-23 中国科学院金属研究所 力电热多场耦合作用下微电子产品可靠性测试平台
TWI490516B (zh) * 2013-03-28 2015-07-01 Chroma Ate Inc Measurement device and method for automatic test equipment
JP2014215062A (ja) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 ハンドラーおよび検査装置
TWI570419B (zh) * 2015-07-31 2017-02-11 陽榮科技股份有限公司 Ic升溫裝置及方法
TWI550287B (zh) * 2015-10-30 2016-09-21 Hon Tech Inc Electronic components preheating unit and its application test classification equipment
TWI729056B (zh) 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
WO2018017402A1 (en) * 2016-07-21 2018-01-25 Canary Connect, Inc. Reversible power and data connector assembly
KR20250126856A (ko) 2017-03-03 2025-08-25 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
US10784607B2 (en) * 2018-12-27 2020-09-22 Quanta Computer Inc. Golden finger design methodology for high speed differential signal interconnections
JP6961632B2 (ja) * 2019-01-21 2021-11-05 株式会社アドバンテスト バーンインボード及びバーンイン装置
CN110737221B (zh) * 2019-10-23 2021-08-10 苏州腾伟电子有限公司 三十二通道矩阵开关板
CN114078718B (zh) * 2020-08-13 2025-02-28 京元电子股份有限公司 半导体元件预烧测试模块及其预烧测试装置
TWI759833B (zh) * 2020-08-25 2022-04-01 伊士博國際商業股份有限公司 具有功能測試之處理器燒機裝置
EP4517349A3 (en) 2020-10-07 2025-06-04 AEHR Test Systems Electronics tester
TWI741917B (zh) * 2020-12-18 2021-10-01 鴻勁精密股份有限公司 輸送裝置及其應用之測試設備
JP7623204B2 (ja) * 2021-04-19 2025-01-28 株式会社アドバンテスト バーンインボード、及び、バーンイン装置
CN116381365A (zh) * 2021-12-29 2023-07-04 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 适用于高压连接器的老化试验工装及试验装置
TWI860799B (zh) * 2023-07-28 2024-11-01 周宗貴 積體電路燒機系統的電源板結構
CN118330421B (zh) * 2024-06-17 2024-09-10 浙江杭可仪器有限公司 一种高集成性电子元器件老化测试装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145620A (en) 1977-10-05 1979-03-20 Serel Corporation Modular dynamic burn-in apparatus
US4924179A (en) * 1977-12-12 1990-05-08 Sherman Leslie H Method and apparatus for testing electronic devices
US4374317A (en) 1979-07-05 1983-02-15 Reliability, Inc. Burn-in chamber
US4432604A (en) * 1982-04-28 1984-02-21 Bell Telephone Laboratories, Incorporated Self-adjusting fiberoptic connector assembly
US4777434A (en) * 1985-10-03 1988-10-11 Amp Incorporated Microelectronic burn-in system
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
US4998180A (en) * 1989-05-23 1991-03-05 Clearpoint Research Corporation Bus device with closely spaced double sided daughter board
US5200885A (en) * 1990-04-26 1993-04-06 Micro Control Company Double burn-in board assembly
CA2073916A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
JP2863352B2 (ja) * 1991-08-29 1999-03-03 シャープ株式会社 半導体集積回路試験装置
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
KR100192575B1 (ko) * 1995-11-09 1999-06-15 윤종용 유니버셜 번-인 보오드
JPH09297162A (ja) * 1996-04-30 1997-11-18 Nittetsu Semiconductor Kk バーンインボード
JP2842840B2 (ja) * 1996-05-30 1999-01-06 山口日本電気株式会社 半導体装置のバーンイン試験装置
US6329831B1 (en) * 1997-08-08 2001-12-11 Advanced Micro Devices, Inc. Method and apparatus for reliability testing of integrated circuit structures and devices
CN1110847C (zh) * 1998-07-30 2003-06-04 曹骥 综合型集成电路高温动态老化装置
JP3235573B2 (ja) * 1998-11-05 2001-12-04 日本電気株式会社 半導体装置の試験システム
JP3446643B2 (ja) 1998-12-28 2003-09-16 安藤電気株式会社 バーンインボード及びバーンインテスト装置
JP2000206176A (ja) * 1999-01-07 2000-07-28 Nippon Scientific Co Ltd バ―イン装置
JP2003504889A (ja) 1999-07-14 2003-02-04 エイアー テスト システムズ ウエーハレベルバーンインおよび電気テスト装置および方法
US6562636B1 (en) 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6340895B1 (en) 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
CN1172359C (zh) * 2000-10-31 2004-10-20 京元电子股份有限公司 集成电路的预烧控制装置
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304208A (ja) * 2007-06-05 2008-12-18 Yokogawa Electric Corp 半導体試験装置用テストヘッド
JP2012117881A (ja) * 2010-11-30 2012-06-21 Nippon Eng Kk バーンインボード及びバーンインシステム
JP2013181975A (ja) * 2012-02-29 2013-09-12 Unitest Inc バーンインテスター用テストモジュール及びバーンインテスター
JP7569517B2 (ja) 2019-03-29 2024-10-18 ジン パワー ゲーエムベーハー モジュール式電子装置ハウジング概念
KR20220019597A (ko) * 2020-08-10 2022-02-17 킹 유안 일렉트로닉스 코포레이션 리미티드 반도체 컴포넌트 번인 테스트 모듈 및 번인 테스트 장비
KR102519003B1 (ko) * 2020-08-10 2023-04-11 킹 유안 일렉트로닉스 코포레이션 리미티드 반도체 컴포넌트 번인 테스트 모듈 및 번인 테스트 장비

Also Published As

Publication number Publication date
TW200400361A (en) 2004-01-01
US7063544B2 (en) 2006-06-20
EP1540360A1 (en) 2005-06-15
WO2004003581A1 (en) 2004-01-08
AU2003247750A1 (en) 2004-01-19
TWI281987B (en) 2007-06-01
CN100395556C (zh) 2008-06-18
CN1662822A (zh) 2005-08-31
US20050007137A1 (en) 2005-01-13
US6815966B1 (en) 2004-11-09

Similar Documents

Publication Publication Date Title
US7063544B2 (en) System for burn-in testing of electronic devices
US6562636B1 (en) Wafer level burn-in and electrical test system and method
US6433569B1 (en) Apparatus for testing an integrated circuit in an oven during burn-in
US4145620A (en) Modular dynamic burn-in apparatus
US7245139B2 (en) Tester channel to multiple IC terminals
US5880592A (en) Modular design for an IC testing burn-in oven
US5003156A (en) Dual configuration connector port for burn-in systems
JP3124762B2 (ja) 検査治具
JP2008545949A (ja) 電圧故障検出保護
CN103207366A (zh) 测试系统及印刷电路板组件的测试方法
KR20050024395A (ko) 전자 장치의 번인 검사를 위한 시스템
WO2001004641A2 (en) Wafer level burn-in and electrical test system and method
SG181207A1 (en) Burn-in board and burn-in system
US6954082B2 (en) Method and apparatus for testing of integrated circuit package
JP5351171B2 (ja) 回路ボードアッセンブリ及び誤挿入検出装置
EP0145194A1 (en) Automatic test equipment
US5963039A (en) Testing attachment reliability of devices
US6821156B1 (en) Method and sliding connector and circuit card combination for implementing hot plugging protection for regulator, power supplies and system cards
JP3667645B2 (ja) 汎用型バーンインボード
JP4333291B2 (ja) 故障診断システム
US20060181300A1 (en) Method for testing a circuit unit and test apparatus
Pendor et al. Winchester-Banana platform for high-temperature and high-voltage reliability testing with voltage monitoring capability
JPS60252932A (ja) ユニツト誤插入検出装置
JP2002063799A (ja) メモリボード試験装置・ソケットボード
JPH05215824A (ja) 加速寿命試験装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060615

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060615

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070824

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070903

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20071203

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20071210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080229

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081222

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090323

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090330

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090727

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091211