JP2005531010A5 - - Google Patents

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Publication number
JP2005531010A5
JP2005531010A5 JP2004517971A JP2004517971A JP2005531010A5 JP 2005531010 A5 JP2005531010 A5 JP 2005531010A5 JP 2004517971 A JP2004517971 A JP 2004517971A JP 2004517971 A JP2004517971 A JP 2004517971A JP 2005531010 A5 JP2005531010 A5 JP 2005531010A5
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JP
Japan
Prior art keywords
burn
driver
board
signal
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004517971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005531010A (ja
Filing date
Publication date
Priority claimed from US10/184,525 external-priority patent/US6815966B1/en
Application filed filed Critical
Publication of JP2005531010A publication Critical patent/JP2005531010A/ja
Publication of JP2005531010A5 publication Critical patent/JP2005531010A5/ja
Pending legal-status Critical Current

Links

JP2004517971A 2002-06-27 2003-06-26 電子デバイスをバーンイン試験するためのシステム Pending JP2005531010A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/184,525 US6815966B1 (en) 2002-06-27 2002-06-27 System for burn-in testing of electronic devices
PCT/US2003/020332 WO2004003581A1 (en) 2002-06-27 2003-06-26 A system for burn-in testing of electronic devices

Publications (2)

Publication Number Publication Date
JP2005531010A JP2005531010A (ja) 2005-10-13
JP2005531010A5 true JP2005531010A5 (enExample) 2006-08-03

Family

ID=29999239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004517971A Pending JP2005531010A (ja) 2002-06-27 2003-06-26 電子デバイスをバーンイン試験するためのシステム

Country Status (7)

Country Link
US (2) US6815966B1 (enExample)
EP (1) EP1540360A1 (enExample)
JP (1) JP2005531010A (enExample)
CN (1) CN100395556C (enExample)
AU (1) AU2003247750A1 (enExample)
TW (1) TWI281987B (enExample)
WO (1) WO2004003581A1 (enExample)

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US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
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US20060139046A1 (en) * 2004-04-13 2006-06-29 Reliability Inc. Apparatus for reducing deflection of a mobile member in a chamber
KR100621104B1 (ko) * 2004-08-25 2006-09-19 삼성전자주식회사 전자장치
KR100680955B1 (ko) 2004-12-30 2007-02-08 주식회사 하이닉스반도체 번인 보드 장치 및 번인 보드 장치의 탑재 방법
JP4789920B2 (ja) * 2005-02-15 2011-10-12 株式会社アドバンテスト バーンイン装置
TWI339737B (en) 2005-04-27 2011-04-01 Aehr Test Systems Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device
JP4957395B2 (ja) * 2007-06-05 2012-06-20 横河電機株式会社 半導体試験装置用テストヘッド
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
BRPI0801325A2 (pt) 2008-04-30 2010-01-12 Thomson Multimidia Ltda método automatizado para controlar e testar produtos
JP5563207B2 (ja) * 2008-08-01 2014-07-30 スリーエム イノベイティブ プロパティズ カンパニー 終端コネクタ
CN101644741B (zh) * 2008-08-04 2011-11-09 京元电子股份有限公司 具有电源塔的多层预烧板结构
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US7969175B2 (en) * 2009-05-07 2011-06-28 Aehr Test Systems Separate test electronics and blower modules in an apparatus for testing an integrated circuit
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KR101309081B1 (ko) * 2012-02-29 2013-09-17 주식회사 유니테스트 번인 테스터
CN103364740A (zh) * 2012-04-10 2013-10-23 鸿富锦精密工业（深圳）有限公司 转接板及具有该转接板的直流电源测试系统
TWI465737B (zh) * 2012-08-14 2014-12-21 Accton Technology Corp 老化測試系統
CN103884928B (zh) * 2012-12-21 2017-06-23 中国科学院金属研究所 力电热多场耦合作用下微电子产品可靠性测试平台
TWI490516B (zh) * 2013-03-28 2015-07-01 Chroma Ate Inc Measurement device and method for automatic test equipment
JP2014215062A (ja) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 ハンドラーおよび検査装置
TWI570419B (zh) * 2015-07-31 2017-02-11 陽榮科技股份有限公司 Ic升溫裝置及方法
TWI550287B (zh) * 2015-10-30 2016-09-21 Hon Tech Inc Electronic components preheating unit and its application test classification equipment
KR20250123227A (ko) 2016-01-08 2025-08-14 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
EP3488501A4 (en) * 2016-07-21 2020-03-25 Canary Connect, Inc. REVERSIBLE CONNECTOR ASSEMBLY FOR POWER AND DATA
KR20240146697A (ko) 2017-03-03 2024-10-08 에어 테스트 시스템즈 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
US10784607B2 (en) * 2018-12-27 2020-09-22 Quanta Computer Inc. Golden finger design methodology for high speed differential signal interconnections
JP6961632B2 (ja) * 2019-01-21 2021-11-05 株式会社アドバンテスト バーンインボード及びバーンイン装置
DE102019002350B3 (de) * 2019-03-29 2020-06-10 Sinn Power Gmbh Modulares elektronikgehäusekonzept
CN110737221B (zh) * 2019-10-23 2021-08-10 苏州腾伟电子有限公司 三十二通道矩阵开关板
TWI749690B (zh) * 2020-08-10 2021-12-11 京元電子股份有限公司 半導體元件預燒測試模組及其預燒測試裝置
CN114078718B (zh) * 2020-08-13 2025-02-28 京元电子股份有限公司 半导体元件预烧测试模块及其预烧测试装置
TWI759833B (zh) * 2020-08-25 2022-04-01 伊士博國際商業股份有限公司 具有功能測試之處理器燒機裝置
EP4517349A3 (en) 2020-10-07 2025-06-04 AEHR Test Systems Electronics tester
TWI741917B (zh) * 2020-12-18 2021-10-01 鴻勁精密股份有限公司 輸送裝置及其應用之測試設備
JP7623204B2 (ja) * 2021-04-19 2025-01-28 株式会社アドバンテスト バーンインボード、及び、バーンイン装置
CN116381365A (zh) * 2021-12-29 2023-07-04 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 适用于高压连接器的老化试验工装及试验装置
TWI860799B (zh) * 2023-07-28 2024-11-01 周宗貴 積體電路燒機系統的電源板結構
CN118330421B (zh) * 2024-06-17 2024-09-10 浙江杭可仪器有限公司 一种高集成性电子元器件老化测试装置

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JP2842840B2 (ja) * 1996-05-30 1999-01-06 山口日本電気株式会社 半導体装置のバーンイン試験装置
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JP3235573B2 (ja) * 1998-11-05 2001-12-04 日本電気株式会社 半導体装置の試験システム
JP3446643B2 (ja) 1998-12-28 2003-09-16 安藤電気株式会社 バーンインボード及びバーンインテスト装置
JP2000206176A (ja) * 1999-01-07 2000-07-28 Nippon Scientific Co Ltd バ―イン装置
US6340895B1 (en) 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
AU7329200A (en) 1999-07-14 2001-01-30 Aehr Test Systems Inc. Wafer level burn-in and electrical test system and method
US6562636B1 (en) 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
CN1172359C (zh) * 2000-10-31 2004-10-20 京元电子股份有限公司 集成电路的预烧控制装置
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices

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