CN100395556C - 用于电子设备的预烧测试的系统 - Google Patents

用于电子设备的预烧测试的系统 Download PDF

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Publication number
CN100395556C
CN100395556C CNB038147327A CN03814732A CN100395556C CN 100395556 C CN100395556 C CN 100395556C CN B038147327 A CNB038147327 A CN B038147327A CN 03814732 A CN03814732 A CN 03814732A CN 100395556 C CN100395556 C CN 100395556C
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CN
China
Prior art keywords
burn
board
connector
power
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB038147327A
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English (en)
Chinese (zh)
Other versions
CN1662822A (zh
Inventor
B·R·冈恩
A·J·卡尔德龙
J·约万诺维奇
D·亨德里克森
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Aehr Test Systems Inc
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Aehr Test Systems Inc
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Publication date
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of CN1662822A publication Critical patent/CN1662822A/zh
Application granted granted Critical
Publication of CN100395556C publication Critical patent/CN100395556C/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/24—Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
CNB038147327A 2002-06-27 2003-06-26 用于电子设备的预烧测试的系统 Expired - Fee Related CN100395556C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/184,525 2002-06-27
US10/184,525 US6815966B1 (en) 2002-06-27 2002-06-27 System for burn-in testing of electronic devices

Publications (2)

Publication Number Publication Date
CN1662822A CN1662822A (zh) 2005-08-31
CN100395556C true CN100395556C (zh) 2008-06-18

Family

ID=29999239

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038147327A Expired - Fee Related CN100395556C (zh) 2002-06-27 2003-06-26 用于电子设备的预烧测试的系统

Country Status (7)

Country Link
US (2) US6815966B1 (enExample)
EP (1) EP1540360A1 (enExample)
JP (1) JP2005531010A (enExample)
CN (1) CN100395556C (enExample)
AU (1) AU2003247750A1 (enExample)
TW (1) TWI281987B (enExample)
WO (1) WO2004003581A1 (enExample)

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* Cited by examiner, † Cited by third party
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US6562636B1 (en) * 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
US7265561B2 (en) * 2003-09-30 2007-09-04 International Business Machines Corporation Device burn in utilizing voltage control
US20060139046A1 (en) * 2004-04-13 2006-06-29 Reliability Inc. Apparatus for reducing deflection of a mobile member in a chamber
KR100621104B1 (ko) * 2004-08-25 2006-09-19 삼성전자주식회사 전자장치
KR100680955B1 (ko) 2004-12-30 2007-02-08 주식회사 하이닉스반도체 번인 보드 장치 및 번인 보드 장치의 탑재 방법
JP4789920B2 (ja) * 2005-02-15 2011-10-12 株式会社アドバンテスト バーンイン装置
JP5085534B2 (ja) 2005-04-27 2012-11-28 エイアー テスト システムズ 電子デバイスを試験するための装置
JP4957395B2 (ja) * 2007-06-05 2012-06-20 横河電機株式会社 半導体試験装置用テストヘッド
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
BRPI0801325A2 (pt) 2008-04-30 2010-01-12 Thomson Multimidia Ltda método automatizado para controlar e testar produtos
JP5563207B2 (ja) * 2008-08-01 2014-07-30 スリーエム イノベイティブ プロパティズ カンパニー 終端コネクタ
CN101644741B (zh) * 2008-08-04 2011-11-09 京元电子股份有限公司 具有电源塔的多层预烧板结构
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US7969175B2 (en) * 2009-05-07 2011-06-28 Aehr Test Systems Separate test electronics and blower modules in an apparatus for testing an integrated circuit
JP2012117881A (ja) * 2010-11-30 2012-06-21 Nippon Eng Kk バーンインボード及びバーンインシステム
KR101309081B1 (ko) * 2012-02-29 2013-09-17 주식회사 유니테스트 번인 테스터
CN103364740A (zh) * 2012-04-10 2013-10-23 鸿富锦精密工业（深圳）有限公司 转接板及具有该转接板的直流电源测试系统
TWI465737B (zh) * 2012-08-14 2014-12-21 Accton Technology Corp 老化測試系統
CN103884928B (zh) * 2012-12-21 2017-06-23 中国科学院金属研究所 力电热多场耦合作用下微电子产品可靠性测试平台
TWI490516B (zh) * 2013-03-28 2015-07-01 Chroma Ate Inc Measurement device and method for automatic test equipment
JP2014215062A (ja) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 ハンドラーおよび検査装置
TWI570419B (zh) * 2015-07-31 2017-02-11 陽榮科技股份有限公司 Ic升溫裝置及方法
TWI550287B (zh) * 2015-10-30 2016-09-21 Hon Tech Inc Electronic components preheating unit and its application test classification equipment
KR102789332B1 (ko) 2016-01-08 2025-03-31 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
WO2018017402A1 (en) * 2016-07-21 2018-01-25 Canary Connect, Inc. Reversible power and data connector assembly
KR102495427B1 (ko) 2017-03-03 2023-02-02 에어 테스트 시스템즈 일렉트로닉스 테스터
US10784607B2 (en) * 2018-12-27 2020-09-22 Quanta Computer Inc. Golden finger design methodology for high speed differential signal interconnections
JP6961632B2 (ja) * 2019-01-21 2021-11-05 株式会社アドバンテスト バーンインボード及びバーンイン装置
DE102019002350B3 (de) * 2019-03-29 2020-06-10 Sinn Power Gmbh Modulares elektronikgehäusekonzept
CN110737221B (zh) * 2019-10-23 2021-08-10 苏州腾伟电子有限公司 三十二通道矩阵开关板
TWI749690B (zh) * 2020-08-10 2021-12-11 京元電子股份有限公司 半導體元件預燒測試模組及其預燒測試裝置
CN114078718B (zh) * 2020-08-13 2025-02-28 京元电子股份有限公司 半导体元件预烧测试模块及其预烧测试装置
TWI759833B (zh) * 2020-08-25 2022-04-01 伊士博國際商業股份有限公司 具有功能測試之處理器燒機裝置
US11835575B2 (en) 2020-10-07 2023-12-05 Aehr Test Systems Electronics tester
TWI741917B (zh) * 2020-12-18 2021-10-01 鴻勁精密股份有限公司 輸送裝置及其應用之測試設備
JP7623204B2 (ja) * 2021-04-19 2025-01-28 株式会社アドバンテスト バーンインボード、及び、バーンイン装置
CN116381365A (zh) * 2021-12-29 2023-07-04 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 适用于高压连接器的老化试验工装及试验装置
TWI860799B (zh) * 2023-07-28 2024-11-01 周宗貴 積體電路燒機系統的電源板結構
CN118330421B (zh) * 2024-06-17 2024-09-10 浙江杭可仪器有限公司 一种高集成性电子元器件老化测试装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145620A (en) * 1977-10-05 1979-03-20 Serel Corporation Modular dynamic burn-in apparatus
US5406212A (en) * 1991-07-19 1995-04-11 Sumitomo Electric Industries, Ltd. Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors
JPH09318702A (ja) * 1996-05-30 1997-12-12 Nec Yamaguchi Ltd 半導体装置のバーンイン試験装置
CN1244035A (zh) * 1998-07-30 2000-02-09 曹骥 综合型集成电路高温动态老化装置
DE19962868A1 (de) * 1998-12-28 2000-08-03 Ando Electric Burn-In-Leiterplatte
WO2001004641A2 (en) * 1999-07-14 2001-01-18 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6215324B1 (en) * 1999-01-07 2001-04-10 Nippon Scientific Co., Ltd. Dynamic burn-in test equipment
US6297659B1 (en) * 1998-11-05 2001-10-02 Nec Corporation Test system for testing semiconductor device
US6329831B1 (en) * 1997-08-08 2001-12-11 Advanced Micro Devices, Inc. Method and apparatus for reliability testing of integrated circuit structures and devices
CN1351372A (zh) * 2000-10-31 2002-05-29 京元电子股份有限公司 集成电路的预烧控制装置

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US4924179A (en) * 1977-12-12 1990-05-08 Sherman Leslie H Method and apparatus for testing electronic devices
US4374317A (en) 1979-07-05 1983-02-15 Reliability, Inc. Burn-in chamber
US4432604A (en) * 1982-04-28 1984-02-21 Bell Telephone Laboratories, Incorporated Self-adjusting fiberoptic connector assembly
US4777434A (en) * 1985-10-03 1988-10-11 Amp Incorporated Microelectronic burn-in system
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
US4998180A (en) * 1989-05-23 1991-03-05 Clearpoint Research Corporation Bus device with closely spaced double sided daughter board
US5200885A (en) * 1990-04-26 1993-04-06 Micro Control Company Double burn-in board assembly
JP2863352B2 (ja) * 1991-08-29 1999-03-03 シャープ株式会社 半導体集積回路試験装置
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
KR100192575B1 (ko) * 1995-11-09 1999-06-15 윤종용 유니버셜 번-인 보오드
JPH09297162A (ja) * 1996-04-30 1997-11-18 Nittetsu Semiconductor Kk バーンインボード
US6340895B1 (en) 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6562636B1 (en) 1999-07-14 2003-05-13 Aehr Test Systems Wafer level burn-in and electrical test system and method
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145620A (en) * 1977-10-05 1979-03-20 Serel Corporation Modular dynamic burn-in apparatus
US5406212A (en) * 1991-07-19 1995-04-11 Sumitomo Electric Industries, Ltd. Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors
JPH09318702A (ja) * 1996-05-30 1997-12-12 Nec Yamaguchi Ltd 半導体装置のバーンイン試験装置
US6329831B1 (en) * 1997-08-08 2001-12-11 Advanced Micro Devices, Inc. Method and apparatus for reliability testing of integrated circuit structures and devices
CN1244035A (zh) * 1998-07-30 2000-02-09 曹骥 综合型集成电路高温动态老化装置
US6297659B1 (en) * 1998-11-05 2001-10-02 Nec Corporation Test system for testing semiconductor device
DE19962868A1 (de) * 1998-12-28 2000-08-03 Ando Electric Burn-In-Leiterplatte
US6215324B1 (en) * 1999-01-07 2001-04-10 Nippon Scientific Co., Ltd. Dynamic burn-in test equipment
WO2001004641A2 (en) * 1999-07-14 2001-01-18 Aehr Test Systems Wafer level burn-in and electrical test system and method
CN1351372A (zh) * 2000-10-31 2002-05-29 京元电子股份有限公司 集成电路的预烧控制装置

Also Published As

Publication number Publication date
TW200400361A (en) 2004-01-01
AU2003247750A1 (en) 2004-01-19
JP2005531010A (ja) 2005-10-13
US20050007137A1 (en) 2005-01-13
TWI281987B (en) 2007-06-01
US7063544B2 (en) 2006-06-20
EP1540360A1 (en) 2005-06-15
US6815966B1 (en) 2004-11-09
CN1662822A (zh) 2005-08-31
WO2004003581A1 (en) 2004-01-08

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080618

Termination date: 20110626