TWI279914B - High performance FET devices and methods thereof - Google Patents
High performance FET devices and methods thereof Download PDFInfo
- Publication number
- TWI279914B TWI279914B TW093112010A TW93112010A TWI279914B TW I279914 B TWI279914 B TW I279914B TW 093112010 A TW093112010 A TW 093112010A TW 93112010 A TW93112010 A TW 93112010A TW I279914 B TWI279914 B TW I279914B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- insulating layer
- gate
- component
- strained
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 49
- 239000002019 doping agent Substances 0.000 claims abstract description 27
- 239000012535 impurity Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000013078 crystal Substances 0.000 claims description 24
- 229910052799 carbon Inorganic materials 0.000 claims description 17
- 238000000151 deposition Methods 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 230000008021 deposition Effects 0.000 claims description 12
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 229910052732 germanium Inorganic materials 0.000 claims description 11
- 239000004575 stone Substances 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 229920005591 polysilicon Polymers 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 229910052684 Cerium Inorganic materials 0.000 claims description 5
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 3
- 230000002829 reductive effect Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims 2
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- 229940119177 germanium dioxide Drugs 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 11
- 239000012212 insulator Substances 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 216
- 239000000463 material Substances 0.000 description 19
- 239000004065 semiconductor Substances 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- 230000005669 field effect Effects 0.000 description 6
- 238000000059 patterning Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910001922 gold oxide Inorganic materials 0.000 description 3
- -1 layer Chemical compound 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000007833 carbon precursor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 235000010269 sulphur dioxide Nutrition 0.000 description 1
- 239000004291 sulphur dioxide Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/2807—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28255—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor belonging to Group IV and not being elemental silicon, e.g. Ge, SiGe, SiGeC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
- H10D30/0275—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs forming single crystalline semiconductor source or drain regions resulting in recessed gates, e.g. forming raised source or drain regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6728—Vertical TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6735—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
- H10D64/259—Source or drain electrodes being self-aligned with the gate electrode and having bottom surfaces higher than the interface between the channel and the gate dielectric
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/427,233 US6909186B2 (en) | 2003-05-01 | 2003-05-01 | High performance FET devices and methods therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200509395A TW200509395A (en) | 2005-03-01 |
| TWI279914B true TWI279914B (en) | 2007-04-21 |
Family
ID=33310083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093112010A TWI279914B (en) | 2003-05-01 | 2004-04-29 | High performance FET devices and methods thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (6) | US6909186B2 (cg-RX-API-DMAC7.html) |
| JP (2) | JP2004336048A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI279914B (cg-RX-API-DMAC7.html) |
Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6703688B1 (en) | 2001-03-02 | 2004-03-09 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
| US6830976B2 (en) * | 2001-03-02 | 2004-12-14 | Amberwave Systems Corproation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
| US6995430B2 (en) | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
| US7074623B2 (en) | 2002-06-07 | 2006-07-11 | Amberwave Systems Corporation | Methods of forming strained-semiconductor-on-insulator finFET device structures |
| US6946371B2 (en) | 2002-06-10 | 2005-09-20 | Amberwave Systems Corporation | Methods of fabricating semiconductor structures having epitaxially grown source and drain elements |
| US6982474B2 (en) | 2002-06-25 | 2006-01-03 | Amberwave Systems Corporation | Reacted conductive gate electrodes |
| KR100474850B1 (ko) * | 2002-11-15 | 2005-03-11 | 삼성전자주식회사 | 수직 채널을 가지는 비휘발성 sonos 메모리 및 그 제조방법 |
| CN100437970C (zh) | 2003-03-07 | 2008-11-26 | 琥珀波系统公司 | 一种结构及用于形成半导体结构的方法 |
| US6909186B2 (en) * | 2003-05-01 | 2005-06-21 | International Business Machines Corporation | High performance FET devices and methods therefor |
| US7199011B2 (en) * | 2003-07-16 | 2007-04-03 | Texas Instruments Incorporated | Method to reduce transistor gate to source/drain overlap capacitance by incorporation of carbon |
| US7355253B2 (en) * | 2003-08-22 | 2008-04-08 | International Business Machines Corporation | Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates |
| US7198995B2 (en) * | 2003-12-12 | 2007-04-03 | International Business Machines Corporation | Strained finFETs and method of manufacture |
| US7224007B1 (en) * | 2004-01-12 | 2007-05-29 | Advanced Micro Devices, Inc. | Multi-channel transistor with tunable hot carrier effect |
| US7105391B2 (en) * | 2004-03-04 | 2006-09-12 | International Business Machines Corporation | Planar pedestal multi gate device |
| CN1950872A (zh) * | 2004-05-11 | 2007-04-18 | 皇家飞利浦电子股份有限公司 | 柔性显示装置 |
| CN101032028A (zh) * | 2004-07-27 | 2007-09-05 | 新加坡科技研究局 | 可靠接点 |
| US7598134B2 (en) * | 2004-07-28 | 2009-10-06 | Micron Technology, Inc. | Memory device forming methods |
| US7238567B2 (en) * | 2004-08-23 | 2007-07-03 | Texas Instruments Incorporated | System and method for integrating low schottky barrier metal source/drain |
| JP2006100600A (ja) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP4945072B2 (ja) * | 2004-11-09 | 2012-06-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US7306997B2 (en) * | 2004-11-10 | 2007-12-11 | Advanced Micro Devices, Inc. | Strained fully depleted silicon on insulator semiconductor device and manufacturing method therefor |
| US20060105559A1 (en) * | 2004-11-15 | 2006-05-18 | International Business Machines Corporation | Ultrathin buried insulators in Si or Si-containing material |
| US7393733B2 (en) | 2004-12-01 | 2008-07-01 | Amberwave Systems Corporation | Methods of forming hybrid fin field-effect transistor structures |
| US20060113603A1 (en) * | 2004-12-01 | 2006-06-01 | Amberwave Systems Corporation | Hybrid semiconductor-on-insulator structures and related methods |
| WO2006070309A1 (en) * | 2004-12-28 | 2006-07-06 | Koninklijke Philips Electronics N.V. | Semiconductor device having strip- shaped channel and method for manufacturing such a device |
| US7132322B1 (en) | 2005-05-11 | 2006-11-07 | International Business Machines Corporation | Method for forming a SiGe or SiGeC gate selectively in a complementary MIS/MOS FET device |
| US9153645B2 (en) | 2005-05-17 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
| US8324660B2 (en) | 2005-05-17 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
| FR2887370B1 (fr) * | 2005-06-17 | 2007-12-28 | Commissariat Energie Atomique | Procede de fabrication d'un transistor isole a canal contraint |
| US7411252B2 (en) * | 2005-06-21 | 2008-08-12 | International Business Machines Corporation | Substrate backgate for trigate FET |
| US20070001223A1 (en) * | 2005-07-01 | 2007-01-04 | Boyd Diane C | Ultrathin-body schottky contact MOSFET |
| JP2007019177A (ja) * | 2005-07-06 | 2007-01-25 | Toshiba Corp | 半導体装置 |
| US7947546B2 (en) * | 2005-10-31 | 2011-05-24 | Chartered Semiconductor Manufacturing, Ltd. | Implant damage control by in-situ C doping during SiGe epitaxy for device applications |
| WO2007112066A2 (en) | 2006-03-24 | 2007-10-04 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures and related methods for device fabrication |
| US8173551B2 (en) | 2006-09-07 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Defect reduction using aspect ratio trapping |
| US7799592B2 (en) | 2006-09-27 | 2010-09-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Tri-gate field-effect transistors formed by aspect ratio trapping |
| WO2008039534A2 (en) | 2006-09-27 | 2008-04-03 | Amberwave Systems Corporation | Quantum tunneling devices and circuits with lattice- mismatched semiconductor structures |
| US8502263B2 (en) | 2006-10-19 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-emitter-based devices with lattice-mismatched semiconductor structures |
| JP4316605B2 (ja) * | 2006-12-22 | 2009-08-19 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
| DE102007008562A1 (de) * | 2007-02-21 | 2008-08-28 | Qimonda Ag | Feldeffekttransistor-Anordnung |
| WO2008124154A2 (en) | 2007-04-09 | 2008-10-16 | Amberwave Systems Corporation | Photovoltaics on silicon |
| US7825328B2 (en) | 2007-04-09 | 2010-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitride-based multi-junction solar cell modules and methods for making the same |
| US8304805B2 (en) | 2009-01-09 | 2012-11-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor diodes fabricated by aspect ratio trapping with coalesced films |
| US8237151B2 (en) | 2009-01-09 | 2012-08-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diode-based devices and methods for making the same |
| US8329541B2 (en) | 2007-06-15 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | InP-based transistor fabrication |
| US8344242B2 (en) | 2007-09-07 | 2013-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-junction solar cells |
| US20090142891A1 (en) * | 2007-11-30 | 2009-06-04 | International Business Machines Corporation | Maskless stress memorization technique for cmos devices |
| US7982269B2 (en) * | 2008-04-17 | 2011-07-19 | International Business Machines Corporation | Transistors having asymmetric strained source/drain portions |
| US8183667B2 (en) | 2008-06-03 | 2012-05-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Epitaxial growth of crystalline material |
| US8274097B2 (en) | 2008-07-01 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reduction of edge effects from aspect ratio trapping |
| US8981427B2 (en) | 2008-07-15 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing of small composite semiconductor materials |
| CN102160145B (zh) | 2008-09-19 | 2013-08-21 | 台湾积体电路制造股份有限公司 | 通过外延层过成长的元件形成 |
| US20100072515A1 (en) | 2008-09-19 | 2010-03-25 | Amberwave Systems Corporation | Fabrication and structures of crystalline material |
| US8253211B2 (en) | 2008-09-24 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor sensor structures with reduced dislocation defect densities |
| JP5496635B2 (ja) * | 2008-12-19 | 2014-05-21 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| WO2010114956A1 (en) | 2009-04-02 | 2010-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Devices formed from a non-polar plane of a crystalline material and method of making the same |
| US8039356B2 (en) * | 2010-01-20 | 2011-10-18 | International Business Machines Corporation | Through silicon via lithographic alignment and registration |
| JP2011187491A (ja) * | 2010-03-04 | 2011-09-22 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
| US8168503B2 (en) * | 2010-03-18 | 2012-05-01 | International Business Machines Corporation | Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide |
| CN101901837A (zh) * | 2010-06-24 | 2010-12-01 | 复旦大学 | 一种栅控pn场效应晶体管及其控制方法 |
| US8513765B2 (en) * | 2010-07-19 | 2013-08-20 | International Business Machines Corporation | Formation method and structure for a well-controlled metallic source/drain semiconductor device |
| CN101937930A (zh) * | 2010-08-31 | 2011-01-05 | 清华大学 | 一种高性能场效应晶体管及其形成方法 |
| WO2012073583A1 (en) * | 2010-12-03 | 2012-06-07 | Kabushiki Kaisha Toshiba | Method of forming an inpurity implantation layer |
| CN102130011B (zh) * | 2010-12-30 | 2016-08-10 | 复旦大学 | 一种晶体管的制造方法 |
| US8929809B2 (en) * | 2011-03-22 | 2015-01-06 | Radeum, Inc. | Techniques for wireless communication of proximity based content |
| JP5794949B2 (ja) * | 2012-05-29 | 2015-10-14 | 東京エレクトロン株式会社 | シリコン膜の形成方法およびその形成装置 |
| US9385131B2 (en) * | 2012-05-31 | 2016-07-05 | Globalfoundries Inc. | Wrap-around fin for contacting a capacitor strap of a DRAM |
| US9059292B2 (en) * | 2012-08-02 | 2015-06-16 | International Business Machines Corporation | Source and drain doping profile control employing carbon-doped semiconductor material |
| EP2704199B1 (en) * | 2012-09-03 | 2020-01-01 | IMEC vzw | Method of manufacturing a semiconductor device |
| CN103839891A (zh) * | 2012-11-26 | 2014-06-04 | 中国科学院微电子研究所 | 一种半导体结构及其制造方法 |
| KR102021978B1 (ko) * | 2012-12-06 | 2019-09-18 | 삼성전자주식회사 | 블로킹 막을 갖는 반도체 소자 및 그 형성 방법 |
| US8895339B2 (en) * | 2012-12-18 | 2014-11-25 | Freescale Semiconductor, Inc. | Reducing MEMS stiction by introduction of a carbon barrier |
| US9108842B2 (en) * | 2013-07-19 | 2015-08-18 | Freescale Semiconductor, Inc. | Reducing microelectromechanical systems stiction by formation of a silicon carbide layer |
| US9349863B2 (en) | 2013-08-07 | 2016-05-24 | Globalfoundries Inc. | Anchored stress-generating active semiconductor regions for semiconductor-on-insulator finfet |
| CN104425601B (zh) * | 2013-08-30 | 2018-02-16 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
| US9691763B2 (en) * | 2013-12-27 | 2017-06-27 | International Business Machines Corporation | Multi-gate FinFET semiconductor device with flexible design width |
| US9954104B2 (en) * | 2014-01-24 | 2018-04-24 | Globalfoundries Inc. | Multiwidth finFET with channel cladding |
| US9660035B2 (en) | 2014-01-29 | 2017-05-23 | International Business Machines Corporation | Semiconductor device including superlattice SiGe/Si fin structure |
| US9263584B2 (en) | 2014-02-11 | 2016-02-16 | International Business Machines Corporation | Field effect transistors employing a thin channel region on a crystalline insulator structure |
| US9105689B1 (en) | 2014-03-24 | 2015-08-11 | Silanna Semiconductor U.S.A., Inc. | Bonded semiconductor structure with SiGeC layer as etch stop |
| US9269608B2 (en) | 2014-03-24 | 2016-02-23 | Qualcomm Switch Corp. | Bonded semiconductor structure with SiGeC/SiGeBC layer as etch stop |
| US9543323B2 (en) * | 2015-01-13 | 2017-01-10 | International Business Machines Corporation | Strain release in PFET regions |
| US9837415B2 (en) | 2015-06-25 | 2017-12-05 | International Business Machines Corporation | FinFET structures having silicon germanium and silicon fins with suppressed dopant diffusion |
| US9947755B2 (en) * | 2015-09-30 | 2018-04-17 | International Business Machines Corporation | III-V MOSFET with self-aligned diffusion barrier |
| US9627381B1 (en) | 2015-12-15 | 2017-04-18 | International Business Machines Corporation | Confined N-well for SiGe strain relaxed buffer structures |
| US10431583B2 (en) | 2016-02-11 | 2019-10-01 | Samsung Electronics Co., Ltd. | Semiconductor device including transistors with adjusted threshold voltages |
| US9911804B1 (en) | 2016-08-22 | 2018-03-06 | International Business Machines Corporation | Vertical fin field effect transistor with air gap spacers |
| US11538905B2 (en) * | 2016-09-30 | 2022-12-27 | Intel Corporation | Nanowire transistors employing carbon-based layers |
| US10553495B2 (en) * | 2017-10-19 | 2020-02-04 | International Business Machines Corporation | Nanosheet transistors with different gate dielectrics and workfunction metals |
| KR102481476B1 (ko) | 2017-11-17 | 2022-12-26 | 삼성전자 주식회사 | 반도체 소자 |
| US11476366B2 (en) * | 2018-04-02 | 2022-10-18 | Intel Corporation | Transistor including wrap around source and drain contacts |
| CN109888001B (zh) * | 2019-02-03 | 2021-02-02 | 中国科学院微电子研究所 | 半导体器件及其制造方法及包括该器件的电子设备 |
| CN114078966B (zh) * | 2020-08-13 | 2023-12-01 | 复旦大学 | 一种复合沟道结构的射频AlGaN/GaN器件及其制造方法 |
| CN112582476B (zh) * | 2020-12-09 | 2022-05-06 | 全芯智造技术有限公司 | 半导体器件及其形成方法 |
| TW202240012A (zh) * | 2021-03-05 | 2022-10-16 | 荷蘭商Asm Ip私人控股有限公司 | 膜沉積系統及方法 |
| US11575043B1 (en) * | 2021-07-23 | 2023-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and manufacturing method of the same |
| CN116825838A (zh) * | 2022-03-17 | 2023-09-29 | 长鑫存储技术有限公司 | 半导体结构及其制造方法、存储器及其制造方法 |
| CN116435324B (zh) * | 2023-06-09 | 2023-09-26 | 湖北江城芯片中试服务有限公司 | 半导体结构及其制备方法、半导体器件 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150963A (ja) * | 1986-12-12 | 1988-06-23 | Fujitsu Ltd | 半導体装置 |
| JPH04142079A (ja) * | 1990-10-02 | 1992-05-15 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
| KR960002088B1 (ko) * | 1993-02-17 | 1996-02-10 | 삼성전자주식회사 | 에스오아이(SOI : silicon on insulator) 구조의 반도체 장치 제조방법 |
| JP3778581B2 (ja) * | 1993-07-05 | 2006-05-24 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JPH0855989A (ja) * | 1994-08-10 | 1996-02-27 | Hitachi Ltd | Mos型半導体装置 |
| JP3645390B2 (ja) * | 1997-01-17 | 2005-05-11 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US6492694B2 (en) * | 1998-02-27 | 2002-12-10 | Micron Technology, Inc. | Highly conductive composite polysilicon gate for CMOS integrated circuits |
| KR100279264B1 (ko) | 1998-12-26 | 2001-02-01 | 김영환 | 더블 게이트 구조를 갖는 에스·오·아이 트랜지스터 및 그의제조방법 |
| US6218711B1 (en) | 1999-02-19 | 2001-04-17 | Advanced Micro Devices, Inc. | Raised source/drain process by selective sige epitaxy |
| KR100332108B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
| JP3371121B2 (ja) * | 1999-09-29 | 2003-01-27 | 独立行政法人産業技術総合研究所 | 半導体製造方法 |
| CN1180483C (zh) | 2000-03-27 | 2004-12-15 | 松下电器产业株式会社 | SiGeC半导体晶体及其制造方法 |
| JP2001284558A (ja) * | 2000-03-31 | 2001-10-12 | Fujitsu Ltd | 積層半導体基板及びその製造方法並びに半導体装置 |
| GB2364259B (en) | 2000-07-05 | 2002-06-26 | Yienn Lih Entpr Co Ltd | Adjustment device of a pepper grinding tool |
| JP4447128B2 (ja) | 2000-07-12 | 2010-04-07 | 富士通マイクロエレクトロニクス株式会社 | 絶縁ゲート型半導体装置の製造方法 |
| US6524935B1 (en) * | 2000-09-29 | 2003-02-25 | International Business Machines Corporation | Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer technique |
| US7163864B1 (en) * | 2000-10-18 | 2007-01-16 | International Business Machines Corporation | Method of fabricating semiconductor side wall fin |
| US6395589B1 (en) | 2001-02-12 | 2002-05-28 | Advanced Micro Devices, Inc. | Fabrication of fully depleted field effect transistor with high-K gate dielectric in SOI technology |
| US6406951B1 (en) | 2001-02-12 | 2002-06-18 | Advanced Micro Devices, Inc. | Fabrication of fully depleted field effect transistor with raised source and drain in SOI technology |
| JP4866534B2 (ja) * | 2001-02-12 | 2012-02-01 | エーエスエム アメリカ インコーポレイテッド | 半導体膜の改良された堆積方法 |
| KR100401130B1 (ko) * | 2001-03-28 | 2003-10-10 | 한국전자통신연구원 | 수직형 채널을 가지는 초미세 mos 트랜지스터 제조방법 |
| JP2002289871A (ja) * | 2001-03-28 | 2002-10-04 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6603156B2 (en) | 2001-03-31 | 2003-08-05 | International Business Machines Corporation | Strained silicon on insulator structures |
| JP3647777B2 (ja) * | 2001-07-06 | 2005-05-18 | 株式会社東芝 | 電界効果トランジスタの製造方法及び集積回路素子 |
| WO2003015160A2 (en) * | 2001-08-09 | 2003-02-20 | Amberwave Systems Corporation | Dual layer cmos devices |
| JP2003092399A (ja) | 2001-09-18 | 2003-03-28 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| EP1428262A2 (en) | 2001-09-21 | 2004-06-16 | Amberwave Systems Corporation | Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same |
| US7202139B2 (en) * | 2002-02-07 | 2007-04-10 | Taiwan Semiconductor Manufacturing Company , Ltd. | MOSFET device with a strained channel |
| US6800910B2 (en) | 2002-09-30 | 2004-10-05 | Advanced Micro Devices, Inc. | FinFET device incorporating strained silicon in the channel region |
| US6794718B2 (en) | 2002-12-19 | 2004-09-21 | International Business Machines Corporation | High mobility crystalline planes in double-gate CMOS technology |
| US6815738B2 (en) | 2003-02-28 | 2004-11-09 | International Business Machines Corporation | Multiple gate MOSFET structure with strained Si Fin body |
| US6909186B2 (en) * | 2003-05-01 | 2005-06-21 | International Business Machines Corporation | High performance FET devices and methods therefor |
| US7202132B2 (en) * | 2004-01-16 | 2007-04-10 | International Business Machines Corporation | Protecting silicon germanium sidewall with silicon for strained silicon/silicon germanium MOSFETs |
| US7060539B2 (en) * | 2004-03-01 | 2006-06-13 | International Business Machines Corporation | Method of manufacture of FinFET devices with T-shaped fins and devices manufactured thereby |
| US7224033B2 (en) * | 2005-02-15 | 2007-05-29 | International Business Machines Corporation | Structure and method for manufacturing strained FINFET |
| US7387946B2 (en) * | 2005-06-07 | 2008-06-17 | Freescale Semiconductor, Inc. | Method of fabricating a substrate for a planar, double-gated, transistor process |
-
2003
- 2003-05-01 US US10/427,233 patent/US6909186B2/en not_active Expired - Lifetime
-
2004
- 2004-04-29 TW TW093112010A patent/TWI279914B/zh not_active IP Right Cessation
- 2004-04-30 JP JP2004135589A patent/JP2004336048A/ja active Pending
-
2005
- 2005-02-25 US US11/065,816 patent/US7358122B2/en not_active Expired - Lifetime
- 2005-02-26 US US11/067,186 patent/US7411214B2/en not_active Expired - Lifetime
-
2008
- 2008-01-09 US US11/971,392 patent/US7563657B2/en not_active Expired - Fee Related
- 2008-01-10 US US11/971,939 patent/US7510916B2/en not_active Expired - Fee Related
- 2008-01-11 US US12/013,230 patent/US7547930B2/en not_active Expired - Fee Related
- 2008-10-02 JP JP2008257859A patent/JP5255396B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP5255396B2 (ja) | 2013-08-07 |
| US20050161711A1 (en) | 2005-07-28 |
| US7411214B2 (en) | 2008-08-12 |
| TW200509395A (en) | 2005-03-01 |
| US20080108196A1 (en) | 2008-05-08 |
| US20080111156A1 (en) | 2008-05-15 |
| US7510916B2 (en) | 2009-03-31 |
| US6909186B2 (en) | 2005-06-21 |
| JP2009065177A (ja) | 2009-03-26 |
| US20080132021A1 (en) | 2008-06-05 |
| US7358122B2 (en) | 2008-04-15 |
| US20040217430A1 (en) | 2004-11-04 |
| US20050156169A1 (en) | 2005-07-21 |
| US7547930B2 (en) | 2009-06-16 |
| US7563657B2 (en) | 2009-07-21 |
| JP2004336048A (ja) | 2004-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI279914B (en) | High performance FET devices and methods thereof | |
| US8895395B1 (en) | Reduced resistance SiGe FinFET devices and method of forming same | |
| TWI252539B (en) | Semiconductor device and manufacturing method therefor | |
| US9761698B2 (en) | Air gap contact formation for reducing parasitic capacitance | |
| US8574970B2 (en) | Method of forming an extremely thin semiconductor insulator (ETSOI) FET having a stair-shaped raised source/drain | |
| TWI345308B (en) | Semiconductor devices | |
| CN101256949B (zh) | 应变soi衬底的制造方法和在其上制造cmos器件的方法 | |
| TW460978B (en) | A semiconductor device and its fabrication method | |
| TWI312544B (en) | Semiconductor device, cmos device and p-type semiconductor device | |
| US10692976B2 (en) | GaN-on-Si switch devices | |
| TW200834925A (en) | Transistor device and method of manufacturing such a transistor device | |
| TW200423403A (en) | Chip incorporating partially-depleted and fully-depleted transistors and method of fabricating the same | |
| US10854591B2 (en) | Semiconductor device including a repeater/buffer at upper metal routing layers and methods of manufacturing the same | |
| WO2012006880A1 (zh) | P型半导体器件及其制造方法 | |
| US9472406B2 (en) | Metal semiconductor alloy contact resistance improvement | |
| TWI849861B (zh) | 堆疊裝置結構之隔離柱結構 | |
| JP2005079277A (ja) | 電界効果トランジスタ | |
| JP2004200335A (ja) | 絶縁ゲート型電界効果トランジスタを含む半導体装置及びその製造方法 | |
| CN101866858B (zh) | 凹陷沟道型pnpn场效应晶体管的制造方法 | |
| US12513971B2 (en) | Method for making elevated source-drain structure of PMOS in FDSOI process | |
| US20240030071A1 (en) | Method for making elevated source-drain structure of pmos in fdsoi process | |
| TW200919587A (en) | SOI device with pseudo gate-all-around and the method for making the same | |
| CN118198068A (zh) | 一种互补型场效应晶体管器件及其制备方法 | |
| CN118198131A (zh) | 一种全包围栅铁电场效应晶体管及其制备方法 | |
| TWI279906B (en) | SOI device and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |