TWI223011B - Electroless gold plating solution and process - Google Patents
Electroless gold plating solution and process Download PDFInfo
- Publication number
- TWI223011B TWI223011B TW089101339A TW89101339A TWI223011B TW I223011 B TWI223011 B TW I223011B TW 089101339 A TW089101339 A TW 089101339A TW 89101339 A TW89101339 A TW 89101339A TW I223011 B TWI223011 B TW I223011B
- Authority
- TW
- Taiwan
- Prior art keywords
- gold
- nickel
- hydroxylamine
- plating solution
- circuit board
- Prior art date
Links
- 239000010931 gold Substances 0.000 title claims abstract description 59
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 59
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 238000007747 plating Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008569 process Effects 0.000 title description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 56
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000003792 electrolyte Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000000243 solution Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 19
- 150000003839 salts Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- -1 gold ammonium cyanide compound Chemical class 0.000 claims description 8
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 150000002344 gold compounds Chemical class 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 claims description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 4
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 2
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical group [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 claims 2
- 150000002443 hydroxylamines Chemical class 0.000 claims 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims 1
- ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical compound C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 claims 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RHVJXFXPRRTZFJ-UHFFFAOYSA-N NO.NO.P(=O)(O)(O)O Chemical compound NO.NO.P(=O)(O)(O)O RHVJXFXPRRTZFJ-UHFFFAOYSA-N 0.000 claims 1
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 claims 1
- 239000012493 hydrazine sulfate Substances 0.000 claims 1
- 150000002429 hydrazines Chemical class 0.000 claims 1
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 235000010289 potassium nitrite Nutrition 0.000 claims 1
- 239000004304 potassium nitrite Substances 0.000 claims 1
- 235000010288 sodium nitrite Nutrition 0.000 claims 1
- 238000007654 immersion Methods 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 239000013049 sediment Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009545 invasion Effects 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- WOFVPNPAVMKHCX-UHFFFAOYSA-N N#C[Au](C#N)C#N Chemical compound N#C[Au](C#N)C#N WOFVPNPAVMKHCX-UHFFFAOYSA-N 0.000 description 1
- QWZRZYWLWTWVLF-UHFFFAOYSA-N O.OP(O)=O Chemical compound O.OP(O)=O QWZRZYWLWTWVLF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ARHBWGMHXPPGCZ-UHFFFAOYSA-N [K].[Au](C#N)(C#N)C#N Chemical compound [K].[Au](C#N)(C#N)C#N ARHBWGMHXPPGCZ-UHFFFAOYSA-N 0.000 description 1
- QRWKBMNJWYWXJU-UHFFFAOYSA-N [K].[Au](C#N)(C#N)C#N.[K] Chemical compound [K].[Au](C#N)(C#N)C#N.[K] QRWKBMNJWYWXJU-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- GABPAXJCPQEORA-UHFFFAOYSA-K azanium;gold(3+);disulfite Chemical compound [NH4+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O GABPAXJCPQEORA-UHFFFAOYSA-K 0.000 description 1
- LJJNEPKMBSUEND-UHFFFAOYSA-O azanium;gold;cyanide Chemical compound [NH4+].[Au].N#[C-] LJJNEPKMBSUEND-UHFFFAOYSA-O 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000254 damaging effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- KPQDSKZQRXHKHY-UHFFFAOYSA-N gold potassium Chemical compound [K].[Au] KPQDSKZQRXHKHY-UHFFFAOYSA-N 0.000 description 1
- HYYHQASRTSDPOD-UHFFFAOYSA-N hydroxylamine;phosphoric acid Chemical compound ON.OP(O)(O)=O HYYHQASRTSDPOD-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 1
- VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11771599P | 1999-01-27 | 1999-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI223011B true TWI223011B (en) | 2004-11-01 |
Family
ID=22374429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089101339A TWI223011B (en) | 1999-01-27 | 2000-01-27 | Electroless gold plating solution and process |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6383269B1 (enExample) |
| EP (1) | EP1026285A3 (enExample) |
| JP (1) | JP4783484B2 (enExample) |
| KR (1) | KR100712261B1 (enExample) |
| TW (1) | TWI223011B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915888B1 (ja) * | 1998-01-28 | 1999-07-05 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
| SG94721A1 (en) * | 1999-12-01 | 2003-03-18 | Gul Technologies Singapore Ltd | Electroless gold plated electronic components and method of producing the same |
| KR20030033034A (ko) * | 2000-08-21 | 2003-04-26 | 니혼 리로날 가부시키가이샤 | 치환 무전해 금 도금액, 및 상기 도금액 제조용 첨가제 |
| JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
| DE10139555B4 (de) * | 2001-08-10 | 2008-10-16 | Robert Bosch Gmbh | Verfahren zum Aufbringen einer Haftvermittlerschicht auf einer Metallschicht eines Chips |
| JP3892730B2 (ja) * | 2002-01-30 | 2007-03-14 | 関東化学株式会社 | 無電解金めっき液 |
| WO2004003551A1 (ja) * | 2002-06-28 | 2004-01-08 | Canon Kabushiki Kaisha | プローブ担体､プローブ担体の作成方法及びプローブ担体の評価方法及びそれを用いた標的核酸の検出方法 |
| JP4638818B2 (ja) * | 2003-06-10 | 2011-02-23 | Ｊｘ日鉱日石金属株式会社 | 無電解金めっき液 |
| CN1981347A (zh) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | 导电性微粒、导电性微粒的制造方法、和各向异性导电材料 |
| JP5116956B2 (ja) * | 2005-07-14 | 2013-01-09 | 関東化学株式会社 | 無電解硬質金めっき液 |
| JP4932542B2 (ja) * | 2007-03-05 | 2012-05-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 無電解金めっき液 |
| GB0711302D0 (en) * | 2007-06-12 | 2007-07-25 | Buss Chemtech Ag | Process & apparatus |
| KR100981445B1 (ko) * | 2008-05-07 | 2010-09-13 | (주)인터플렉스 | 연성인쇄회로기판의 고연성 Ａｕ 표면처리방법 |
| US20110147038A1 (en) * | 2009-12-17 | 2011-06-23 | Honeywell International Inc. | Oxidation-resistant high temperature wires and methods for the making thereof |
| WO2015010198A1 (en) | 2013-07-24 | 2015-01-29 | National Research Council Of Canada | Process for depositing metal on a substrate |
| KR101444687B1 (ko) | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
| CN113054077A (zh) * | 2021-03-16 | 2021-06-29 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置及拼接显示装置 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3032436A (en) | 1960-11-18 | 1962-05-01 | Metal Proc Co Inc | Method and composition for plating by chemical reduction |
| US3753874A (en) | 1971-12-21 | 1973-08-21 | Amp Inc | Method and electrolyte for electrodepositing a gold-arsenic alloy |
| DE3029785A1 (de) * | 1980-08-04 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures goldbad zur stromlosen abscheidung von gold |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| JPS596365A (ja) * | 1982-06-30 | 1984-01-13 | Toshiba Corp | 無電解金メツキ方法 |
| DE3237394A1 (de) * | 1982-10-08 | 1984-04-12 | Siemens AG, 1000 Berlin und 8000 München | Chemisches vergoldungsbad |
| JPS60125379A (ja) | 1983-12-07 | 1985-07-04 | Shinko Electric Ind Co Ltd | 無電解金めっき液 |
| US5202151A (en) | 1985-10-14 | 1993-04-13 | Hitachi, Ltd. | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
| CN1003524B (zh) | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
| US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
| DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
| DD265915A1 (de) * | 1987-11-10 | 1989-03-15 | Akad Wissenschaften Ddr | Verfahren zur stromlosen abscheidung von gold |
| JPH0826471B2 (ja) | 1988-11-14 | 1996-03-13 | 新光電気工業株式会社 | 金めっき液 |
| JP3058178B2 (ja) | 1990-01-18 | 2000-07-04 | エヌ・イーケムキヤツト株式会社 | 無電解金めつき液 |
| US5232492A (en) | 1992-01-23 | 1993-08-03 | Applied Electroless Concepts Inc. | Electroless gold plating composition |
| WO1994012686A1 (fr) | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Bain autocatalytique de placage d'or |
| US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
| EP0618307B1 (en) * | 1993-03-26 | 1997-11-12 | C. Uyemura & Co, Ltd | Electroless gold plating bath |
| JP2927142B2 (ja) * | 1993-03-26 | 1999-07-28 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
| US5318621A (en) | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
| KR960005765A (ko) * | 1994-07-14 | 1996-02-23 | 모리시다 요이치 | 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법 |
| JP3426817B2 (ja) * | 1995-11-17 | 2003-07-14 | 日立化成工業株式会社 | 無電解金めっき液 |
| JPH09157859A (ja) | 1995-12-01 | 1997-06-17 | Hitachi Chem Co Ltd | 無電解金めっき液 |
| JPH09171714A (ja) * | 1995-12-21 | 1997-06-30 | Nippon Chem Ind Co Ltd | 導電性粉体 |
| JPH09287077A (ja) | 1996-04-19 | 1997-11-04 | Hitachi Chem Co Ltd | 無電解金めっき液 |
| JPH08253872A (ja) | 1996-04-22 | 1996-10-01 | Hitachi Ltd | 電子部品の金めっき方法 |
| JP3259906B2 (ja) * | 1997-04-15 | 2002-02-25 | イビデン株式会社 | 無電解めっき用接着剤およびプリント配線板 |
| JPH1112753A (ja) | 1997-06-20 | 1999-01-19 | Hitachi Chem Co Ltd | 無電解金めっき方法 |
| DE19745601C2 (de) | 1997-10-08 | 2001-07-12 | Fraunhofer Ges Forschung | Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung |
| US5935306A (en) * | 1998-02-10 | 1999-08-10 | Technic Inc. | Electroless gold plating bath |
| JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| JP3677617B2 (ja) | 1999-06-08 | 2005-08-03 | 小島化学薬品株式会社 | 無電解金めっき液 |
-
2000
- 2000-01-25 US US09/490,928 patent/US6383269B1/en not_active Expired - Lifetime
- 2000-01-26 KR KR1020000003661A patent/KR100712261B1/ko not_active Expired - Lifetime
- 2000-01-26 EP EP00300548A patent/EP1026285A3/en not_active Withdrawn
- 2000-01-27 JP JP2000019278A patent/JP4783484B2/ja not_active Expired - Lifetime
- 2000-01-27 TW TW089101339A patent/TWI223011B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000219973A (ja) | 2000-08-08 |
| EP1026285A3 (en) | 2001-12-12 |
| KR20000053621A (ko) | 2000-08-25 |
| JP4783484B2 (ja) | 2011-09-28 |
| EP1026285A2 (en) | 2000-08-09 |
| KR100712261B1 (ko) | 2007-04-26 |
| US6383269B1 (en) | 2002-05-07 |
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| MK4A | Expiration of patent term of an invention patent |