TW448476B - Processing apparatus having integrated pumping system - Google Patents

Processing apparatus having integrated pumping system Download PDF

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Publication number
TW448476B
TW448476B TW088121928A TW88121928A TW448476B TW 448476 B TW448476 B TW 448476B TW 088121928 A TW088121928 A TW 088121928A TW 88121928 A TW88121928 A TW 88121928A TW 448476 B TW448476 B TW 448476B
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Taiwan
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pump
chamber
patent application
scope
item
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TW088121928A
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English (en)
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Peter Reimer
Pedram Sabouri
Dennis R Smith
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/02—Surge control
    • F04D27/0261—Surge control by varying driving speed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86035—Combined with fluid receiver
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86083—Vacuum pump
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86139—Serial
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86163—Parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)

Description

448476 經濟.部智蕙財產局員工消費合作社印製 A8 B8 C8 D8 '申請專利範圍 力控制器，用以藉由調整泵之速度而控制該真空隔絕室中 之氣體壓力。 13· —種處理一基材之設備，該設備至少包含·· (a) —處理室，包含一支撐件及一氣體分配器，使被 支樓於該支撐件上之一基材被經由該氣體分g己器所引入處 理至之處理氣體所處理： (b) —排氣系統包含具有南果容量之一預真空泵相鄰 於該處理室’該預真空粟具有一入口連接至該處理室，以 由該處理室快速排氣，及一出口用以排出該被排出之處理 氣體至大氣壓力； (c) 一壓力控制器，用以藉由調整該預真空泵之速度 而控制該處理室中之處理氣體的壓力。 一 ▲ 14·如申請專利範圍第13項所述之設備，更包含一 冋具空泵，具有一入口連接至該處理室及一出口棑氣至 預真空泵。 15.如申請專利範圍第14項所述之設備，其中該預 真空栗係能由大Μ力排氣至少於q i托耳對該處理室抽 真工及該冋真空泵係能由〇1托耳對該處理室抽真空至 少於10·9托耳。 16·如申請專利範圍第13項所述之設備，更包含一 .............^................ (請先閲讀背面之注意事項再填寫本頁) 30 448476
六、申請專利範圍 月，J級官道延伸於該預真空泵之入〇及該處理室之間，該前 級管道具有少於2米之長度β 經濟部智慧財產局員工消費合作社印製 17·如申請專利範圍第16項所述之設備，其中該前 級管道具有一少於80 mm之直徑。 18.如申請專利拜圍第13項所述之設備，其中該入 口係直接連接至該處理室，實質上沒有前級管道。 19·如申請專利範圍第13項所述之設備，其中該預· 真空泵係靠於該處理室上。 20· —種用以處理基材之設備，該設備至少包含： 一室； 一泵，該泵可在不同轉速下運轉且該泵相鄰於該室； 一壓力控制器，用以藉由提供與該室内之氣體壓力相 關的壓力信號；及 一泵控制器，該泵控制器接受該壓力控制器所提供之 該壓力信號使該泵之運轉速率來做相對應之改變，而控制 該室中之氣體壓力。 21.如申請專利範圍第20項所述之設備，其中該果 控制器改變該泵之轉速。 ..............^.........^......... (請先閲讀背面之注意事項再填寫本頁) 31
448476 六、申請專利範圍 22.如申請專利範圍第2〇項所述之設備，其中該泵 控制器改變該泵之排氣構件的速度。 23. 如申請專利範圍第2〇項所述之設備’其中該泵 包含一預真空泵或一低真空泵^ 24. 如申請專利範圍第2〇項所述之設備其中該泵 及該室之間並没有實際存在一前級管道。 2j.如申請專利範圍第2〇項所述之設備更包含一 前級官道延伸於該泵及該室之間，該前級管道具有一少於 2米之長度。 {請先閲讀背面之注意事項再填寫本頁) 裝· -,τ 26.如申請專利範圍第2〇項所述之設備，其中該泵 係靠於該室上。 27. —種用以處理一基材之方法，該方法至少包含步 驟： 以一泵由一室中排出氣體； 經濟部智慧財產局員工消費合作社印製 量測該室中之氣體壓力； 根據量測所得之氣體壓力來調整該泵之運轉速率；以 及 藉由調整該泵之運轉速率，而調整該室中之氣體壓 力0 448476 Α8 Β8 C8 D8 六、申清專利範圍 28·如申請專利範圍第27項所述之方法，更包含步 驟： 玫置一或多數基材於該室中，該室包含真空隔絕室， 傳送室或處理室。 29.如申請專利範圍第27項所述之方法，更包含步 驟： 調整該泵之排氣構件之旋轉速率。 3 0. —種處理於一室中之一基材之方法，該方法至少 包含步驟： 放置一基材於一室之一支撐件上，及以一泵排氣該 室； 將一氣體引入該室中，並適度地激發該氣體，以處理 該支撐件上之該基材； 量測該室中之氣體壓力； 根據該室中所量得之氣體壓力，而調整該泵之運轉速 率；及 藉由調整該泵之運轉速率，而調整該室令之氣體壓 力。 31·如申請專利範圍第30項所述之方法，其中該調 整該泵之運轉速率的步驟包含調整該泵之旋轉速率。 ..............f.......·玎.........f (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 33 448476 Α8 Β8 C8 D8 、申請專利範圍 32· —種用以處理一基材之設備，該設備至少包含： 一泵，具有多數入口埠，第一入口淳用以由第一室或第一 泵排出氣體，及一第二入口埠用以由第二室或第二泵排出 氣體》 33·如申請專利範圍第32項所述之設備，其中該第 一入口埠係連接至該第一室，及該第二入口淳係連接至該 第二室。 34·如申請專利範圍第32項所述之設備，其中該第 一及該第二入口璋係連接至該栗之一或多數入口級。 35·如申請專利範囱第32項所述之設備，其中該入 口級係以平行配置連接至該泵之其他級。 36·如申請專利範圍第32項所述之設備，其中該泵 係靠於至少一室。 37·如申請專利範圍第32項所述之設備，其中該泵 包含一出口，將所排出之氣體棑至大氣壓力。 38·如申請專利範圍第32項所述之設備，更包含一 前級管道延伸於該入口埠及該些室或其他泵之間，該前級 34 .............♦........、可.........t f請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 女 1½ r /r^KTQ\ λ a ^ ^ nan 經 濟 部 智 慧 財 產 局 貝 X 消 費 合 社 印 製 申請專利範圍 營道均具有少於2米之長度β 39.如申請專利範圍第32項所述之設備，其中該入 Q埠係直接連接至該些室或其他泵，而實際上沒有前級笔 、& 〇 4〇·如申請專利範圍第32項所述之設備，其中該泵 包含一預真空泵或一低真空泵。 人’ 41.如申請專利範圍第32項所述之設備，更包含一 壓力控制器，用以藉由調整泵之連度而控制該些 體壓力。 一 ·τ灾氣 夕42· 一種用以處理基材之設備，該設備至少包含：— 多重入口泵，具有第一入口埠於第一入口級，及一— 口埠於第二入口級，該第一入口埠係用以由第 ：入 氣體。 田弟一至次第一泵排出 一 43.如申請專利範圍第心項所述之設備兑 蜂係連接至該第一室，及該第一係連二該 44.如申請專利範圍第42項所述之設備，其中該多 .............ά.........tr………*t f請先閱讀背面之>i*事¾再填、寫本頁) 35
448476 Α8 Β8 C8 D8 、申請專利範圍 里入口泵係靠於該些室 之至少一 室上 經濟部智慧財產局員工消費合作社印製 45. ”請專利範圍第42項所述之設備，其中該多 泵包含-出口，將所排出氣趙排至大氣麼力。 =· Μ請專利範圍第42項所述之設備，更包含諸 則級官道，該些前級管道具有少於2求之長度。 47·如中請專利範圍第42項所述之聽，其中該入 口埠係實際上不以前級管道直接連接至該些室或其他泵 上0 Μ.如申請專利範圍第42項所述之設備，其中該多 重入口泵包含一預真空泵或一低真空 ，49·如申請專利範圍第42項所述之設備，更包含一 壓力控制器，用以藉由調整該泵之速度而控制該些室 氣體壓力。 種用以處理一基材之設備，該設備至少包含： (a) 多數室，其形狀及大小上適於夹持一或多數基材· 及 ^ (b) —泵，具有一第一入口埠於一第一入口級中，及 一第二入口埠於一第二入口級中，該第一入口埠用以由一 36
太祕落 P 痔 4 田去聞闭合 AiB ΊΟΊ 一 —---- J ..............^.........tr.........t (請先閲讀背面之注意事項再場寫本頁)
8 8 8 8 A B CD 448476 、申請專利範圍 第一室排出氣體，及該第二入口埠用以由一第二室排出氣 體β 51. 如申請專利範圍第50項所述之設備，其中該些 室係安裝於單一平台上，該泵係靠於該平台上。 52. 如申請專利範圍第50項所述之設備，其令該第 一入口埠係連接至該第一室，及該第二入口埠係連接至該 第二室。 53. 如申請專利範圍第50項所述之設備，其中該泵 靠於該些室之至少一室。 54. 如辛請專利範圍第50項所述之設備，其中該泵 包含一出口，將被排出之氣體排出至大氣壓力。 55. 如中請專利範圍第50項所述之設備，更包含諸 前級管道延伸於入口埠及該些室之間，該些前級管道均具 有少於2米之長度。 56. 如申請專利範圍第50項所述之設備，其中該入 口埠係直接連接至該些室，而實際上沒有前級管道。 57. 如申請專利範圍第50項所述之設備，其中該泵 37 ..............裝.........訂.........t (請先閲讀背面之注急事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 太铋珞疮油阳由S0闭宕进港诏玫八格\
8 8 8 8 ABCD 448476 六、申請專利範圍 包含一預真空泵或一低真空泵。 58.如申請專利範圍第50項所述之設備，更包含一 壓力控制器，用以藉由調整泵之速度而控制該些室中之氣 體壓力。 ..............^.........•可.........t (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 8 3 女紅奋；杰阳士团田含择进'r»MC\ Λ λ 44 mnv Ί0Γ7八技、
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KR20000048366A (ko) 2000-07-25
US20050034767A1 (en) 2005-02-17
US6817377B1 (en) 2004-11-16
US7077159B1 (en) 2006-07-18
KR100696020B1 (ko) 2007-03-15
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JP2000254480A (ja) 2000-09-19
EP1014427A2 (en) 2000-06-28

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