TW364150B - Moulding apparatus with compensation element - Google Patents

Moulding apparatus with compensation element

Info

Publication number
TW364150B
TW364150B TW085100907A TW85100907A TW364150B TW 364150 B TW364150 B TW 364150B TW 085100907 A TW085100907 A TW 085100907A TW 85100907 A TW85100907 A TW 85100907A TW 364150 B TW364150 B TW 364150B
Authority
TW
Taiwan
Prior art keywords
mould
carrier
cavity
compensation element
moulding
Prior art date
Application number
TW085100907A
Other languages
English (en)
Inventor
Gerardus Franciscus Wilhelmus Peters
Hendrikus Johannes Bernardus Peters
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Application granted granted Critical
Publication of TW364150B publication Critical patent/TW364150B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/044—Rubber mold

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
TW085100907A 1995-02-09 1996-01-25 Moulding apparatus with compensation element TW364150B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9500238A NL9500238A (nl) 1995-02-09 1995-02-09 Omhulinrichting met compensatie-element.

Publications (1)

Publication Number Publication Date
TW364150B true TW364150B (en) 1999-07-11

Family

ID=19865562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100907A TW364150B (en) 1995-02-09 1996-01-25 Moulding apparatus with compensation element

Country Status (11)

Country Link
US (2) US5766650A (zh)
EP (1) EP0726598B1 (zh)
JP (1) JP3221827B2 (zh)
KR (1) KR100405575B1 (zh)
CN (1) CN1137441A (zh)
DE (1) DE69632095T2 (zh)
HK (1) HK1014081A1 (zh)
MY (1) MY140462A (zh)
NL (1) NL9500238A (zh)
SG (1) SG42885A1 (zh)
TW (1) TW364150B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
US6472252B2 (en) * 1997-07-23 2002-10-29 Micron Technology, Inc. Methods for ball grid array (BGA) encapsulation mold
US5923959A (en) * 1997-07-23 1999-07-13 Micron Technology, Inc. Ball grid array (BGA) encapsulation mold
TW341171U (en) * 1998-01-16 1998-09-21 Li-Li Chen A platform radial dissipation forming mold
JP3127889B2 (ja) * 1998-06-25 2001-01-29 日本電気株式会社 半導体パッケージの製造方法およびその成形用金型
JP3450223B2 (ja) * 1999-05-27 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置封入用金型、及び、半導体装置封入方法
DE19935441A1 (de) * 1999-07-28 2001-03-01 Siemens Ag Verfahren und Moldwerkzeug zum Umhüllen von elektronischen Bauelementen
US6747345B1 (en) * 2000-03-01 2004-06-08 Todd O. Bolken Exposed die molding apparatus
JP4431252B2 (ja) * 2000-05-22 2010-03-10 フィーサ株式会社 インサート成形方法及び金型
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
US6860731B2 (en) * 2001-07-09 2005-03-01 Asm Technology Singapore Pte Ltd. Mold for encapsulating a semiconductor chip
US7114939B2 (en) * 2002-04-11 2006-10-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Encapsulating brittle substrates using transfer molding
US6817854B2 (en) * 2002-05-20 2004-11-16 Stmicroelectronics, Inc. Mold with compensating base
US6857865B2 (en) * 2002-06-20 2005-02-22 Ultratera Corporation Mold structure for package fabrication
NL1022323C2 (nl) * 2003-01-08 2004-07-09 Fico Bv Inrichting en werkwijze voor het met omhulmateriaal omhullen van een op een drager bevestigde elektronische component.
NL1024248C2 (nl) * 2003-09-09 2005-03-10 Fico Bv Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.
US7098082B2 (en) * 2004-04-13 2006-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronics package assembly tool and method of manufacture therewith
US7241414B2 (en) * 2004-06-25 2007-07-10 Asm Technology Singapore Pte Ltd. Method and apparatus for molding a semiconductor device
US8043545B2 (en) * 2007-12-31 2011-10-25 Texas Instruments Incorporated Methods and apparatus to evenly clamp semiconductor substrates
US7901196B2 (en) * 2008-03-03 2011-03-08 Asm Technology Singapore Pte Ltd Molding apparatus incorporating pressure uniformity adjustment
US8226390B2 (en) * 2009-09-09 2012-07-24 Tyco Healthcare Group Lp Flexible shutoff insert molding device
EP2601033A4 (en) * 2010-08-06 2015-01-14 Husky Injection Molding MOLDING DEVICE WITH COMPENSATORY STRUCTURE
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
AT514569B1 (de) * 2013-08-21 2015-02-15 Engel Austria Gmbh Verfahren zum Betrieb einer Schließeinheit
JP5971270B2 (ja) * 2014-02-27 2016-08-17 トヨタ自動車株式会社 半導体装置の製造方法および製造装置
CN104526926B (zh) * 2014-12-11 2017-02-22 无锡模达科技有限公司 自动化几何补偿模具的方法
DE102017131110A1 (de) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh Verfahren zum einbetten von optoelektronischen bauelementen in eine schicht

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Publication number Priority date Publication date Assignee Title
JPS5253663A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Resin sealing mold
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4236689A (en) * 1979-06-11 1980-12-02 Lyall Electric, Inc. Connector mold with flexible wire guide
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
JPS6097815A (ja) * 1983-11-02 1985-05-31 Hitachi Ltd 成形方法および成形機
US4697784A (en) * 1985-05-15 1987-10-06 Texas Instruments Incorporated Injection mold for producing the housings of integrated circuits
JPS6256111A (ja) * 1985-09-05 1987-03-11 Sony Corp 樹脂封止金型
JPH02160518A (ja) * 1988-12-14 1990-06-20 Nagase Chiba Kk 電子部品等封止樹脂の低圧射出成形方法
US5059105A (en) * 1989-10-23 1991-10-22 Motorola, Inc. Resilient mold assembly
JPH04179130A (ja) * 1990-11-08 1992-06-25 Hitachi Tokyo Electron Co Ltd モールド型
US5118271A (en) * 1991-02-22 1992-06-02 Motorola, Inc. Apparatus for encapsulating a semiconductor device
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
JP2772447B2 (ja) * 1992-02-04 1998-07-02 シャープ株式会社 光半導体装置の製造方法
JPH0629339A (ja) * 1992-07-09 1994-02-04 Toshiba Corp 半導体素子の樹脂封止用装置
JPH0671685A (ja) * 1992-08-27 1994-03-15 Toshiba Corp 樹脂成形装置
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5991156A (en) * 1993-12-20 1999-11-23 Stmicroelectronics, Inc. Ball grid array integrated circuit package with high thermal conductivity
JPH07183317A (ja) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd 電子部品の製造装置及び製造方法
US5541450A (en) * 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package
US5626886A (en) * 1995-02-21 1997-05-06 Dai-Ichi Seiko Co., Ltd. Transfer molding machine for encapsulation of semiconductor devices

Also Published As

Publication number Publication date
EP0726598B1 (en) 2004-04-07
MY140462A (en) 2009-12-31
NL9500238A (nl) 1996-09-02
JPH08276461A (ja) 1996-10-22
JP3221827B2 (ja) 2001-10-22
KR960031108A (ko) 1996-09-17
HK1014081A1 (en) 1999-09-17
US5766650A (en) 1998-06-16
DE69632095T2 (de) 2005-04-14
SG42885A1 (en) 1997-10-17
US6019588A (en) 2000-02-01
EP0726598A1 (en) 1996-08-14
KR100405575B1 (ko) 2004-08-25
CN1137441A (zh) 1996-12-11
DE69632095D1 (de) 2004-05-13

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Legal Events

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MK4A Expiration of patent term of an invention patent