KR960031108A - 보정부재가 구비된 성형장치 - Google Patents

보정부재가 구비된 성형장치 Download PDF

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Publication number
KR960031108A
KR960031108A KR1019960001346A KR19960001346A KR960031108A KR 960031108 A KR960031108 A KR 960031108A KR 1019960001346 A KR1019960001346 A KR 1019960001346A KR 19960001346 A KR19960001346 A KR 19960001346A KR 960031108 A KR960031108 A KR 960031108A
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South Korea
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molding apparatus
molding
spring
carrier
mold
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KR1019960001346A
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KR100405575B1 (ko
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게라르두스 프란시스쿠스 빌헬무스 피터스
핸드릭쿠스 요하누스 베르나르두스 피터스
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제이. 더블유. 바우드
피코 비. 브이.
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Publication of KR100405575B1 publication Critical patent/KR100405575B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/044—Rubber mold

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

본 발명은 편평한 캐리어상에 칩을 성형하기 위한 성형장치에 관한 것으로, 상호 이동가능하고 그 사이에 캐리어가 수용되는 2개의 몰드부로 형성되고 성형중공이 구비된 그 중 하나의 몰드부는 캐리어의 외주선단에 대해 압착될 수 있는 주형과, 이 주형내에 설치되고 홈으로 성형중공과 연결된 적어도 하나의 주조물질용 중공으로 압력을 가하는 수단을 구비하며, 적어도 하나의 보정부재가 설치되어 몰드부가 폐쇄된 상태에서 캐리어의 하나의 측면이 성형중공의 외주선단에 대해 밀폐되어 고정된다.

Description

보정부재가 구비된 성형장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 스프링링이 구비된 작동상태의 성형장치의 단면 개략도.
제2도는 본 발명에 따른 스프링들에 의해 지지된 상면부가 구비된 성형장치의 부분절개 사시도.
제3도는 탄성스트립이 구비된 성형장치의 부분절개 사시도.
제4도는 성형된 칩이 있는 탄성스트립이 고정된 캐리어의 부분절개 사시도.
제5도는 제1도로 도시된 성형장치의 변형실시예의 부분절개 사시도.
제6도는 고정장치가 구비된 성형장치의 부분절개 사시도.
제7도는 프로파일부의 형태로 보정부재가 구비된 성형장치를 도시한 사시도.

Claims (14)

  1. 상호 이동가능하면서 그 사이에 캐리어(4,22,27)가 수용될 수 있는 2개의 몰드부(2,3;14,18)로 형성되고 그 중 성형중공(5,15)이 구비된 몰드부는 캐리어(4,22,27)의 외주선단(12,24)에 대해 압착될 수 있는 주형과, 적어도 하나의 주조물질(7)용 중공(5,15)내로 가압시키면서 홈(8,16)으로 성형중공(5,15)과 연결되고 상기 주형내에 설치된 가압수단(6)을 구비하고, 적어도 하나의 보정부재가 설치되어 몰드부(2,3;14,18)들이 닫힌 상태에서 몰드부의 외주선단들은 캐리어의 한 측면에 대해 밀폐고정되는 편평한 캐리어(4,22,27)상에 칩을 성형하는 보정부재가 구비된 성형장치(1,13,23,29,35,39).
  2. 제1항에 있어서, 상기 몰드부(2,3;14,18)들이 폐쇄된 상태에서 소정크기의 힘으로 서로에 대해 가압되어지는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  3. 제1항 또는 제2항에 있어서, 상기 성형중공(5,15)과 이격된 캐리어(4,22,27)의 한 측면상에 보정부재가 놓이는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  4. 제1항 내지 제3항 중 어느 한 항에 있어서, 적어도 하나의 상기 몰드부가 서로에 대해 이동될 수 있으면서 스프링(21,32,33)의 삽입으로 상호 연결되는 다수개의 상면부(19,20;30,31;36;40)들이 구비되는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  5. 제2항에 있어서, 상기 스프링(21,32,33)의 탄성이 조정가능한 것을 특징으로 하는 보정부재가 구비된 성형장치.
  6. 제2항 또는 제3항에 있어서, 상기 스프링(21,32,33)이 기계식 스프링인 것을 특징으로 하는 보정부재가 구비된 성형장치.
  7. 제2항 또는 제3항에 있어서, 상기 스프링(21,32,33)이 수압식 스프링인 것을 특징으로 하는 보정부재가 구비된 성형장치.
  8. 제2항 또는 제3항에 있어서, 상기 스프링(21,32,33)이 가스(gas)식 스프링인 것을 특징으로 하는 보정부재가 구비된 성형장치.
  9. 제1항 내지 제8항 중 어느 한 항에 있어서, 적어도 하나의 몰드부(2,3:14,18)가 서로에 대해 이동가능하면서 적어도 하나의 고정장치(37)의 삽입으로 상호 결합된 다수개의 상면부(19,20;30,31;36,40)들이 구비되는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  10. 제1항 내지 제9항중 어느 한 항에 있어서, 상기 보정부재가 탄성스트립(26)인 것을 특징으로 하는 보정부재가 구비된 성형장치.
  11. 제10항에 있어서, 상기 탄성스트립(26)이 몰드부(2,3:14,18)의 접촉측면에 고정되는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  12. 제10항에 있어서, 상기 탄성스트립(26)이 캐리어(4,22,27)에 결합되는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  13. 제10항에 있어서, 상기 탄성스트립(26)이 캐리어(4,22,27)와 몰드부(2,3;14,18) 사이에 분리부재로써 설치되는 것을 특징으로 하는 보정부재가 구비된 성형장치.
  14. 제1항 내지 제13항 중 어느 한 항에 있어서, 상기 보정부재가 스프링(11)인 것을 특징으로 하는 보정부재가 구비된 성형장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960001346A 1995-02-09 1996-01-23 보정부재가구비된성형장치 KR100405575B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9500238A NL9500238A (nl) 1995-02-09 1995-02-09 Omhulinrichting met compensatie-element.
NL95.00238 1995-02-09

Publications (2)

Publication Number Publication Date
KR960031108A true KR960031108A (ko) 1996-09-17
KR100405575B1 KR100405575B1 (ko) 2004-08-25

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US (2) US5766650A (ko)
EP (1) EP0726598B1 (ko)
JP (1) JP3221827B2 (ko)
KR (1) KR100405575B1 (ko)
CN (1) CN1137441A (ko)
DE (1) DE69632095T2 (ko)
HK (1) HK1014081A1 (ko)
MY (1) MY140462A (ko)
NL (1) NL9500238A (ko)
SG (1) SG42885A1 (ko)
TW (1) TW364150B (ko)

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TW364150B (en) 1999-07-11
EP0726598B1 (en) 2004-04-07
MY140462A (en) 2009-12-31
NL9500238A (nl) 1996-09-02
JPH08276461A (ja) 1996-10-22
JP3221827B2 (ja) 2001-10-22
HK1014081A1 (en) 1999-09-17
US5766650A (en) 1998-06-16
DE69632095T2 (de) 2005-04-14
SG42885A1 (en) 1997-10-17
US6019588A (en) 2000-02-01
EP0726598A1 (en) 1996-08-14
KR100405575B1 (ko) 2004-08-25
CN1137441A (zh) 1996-12-11
DE69632095D1 (de) 2004-05-13

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