AU5095696A - Process for preparing resin molding having fine recesses on the surface thereof - Google Patents

Process for preparing resin molding having fine recesses on the surface thereof

Info

Publication number
AU5095696A
AU5095696A AU50956/96A AU5095696A AU5095696A AU 5095696 A AU5095696 A AU 5095696A AU 50956/96 A AU50956/96 A AU 50956/96A AU 5095696 A AU5095696 A AU 5095696A AU 5095696 A AU5095696 A AU 5095696A
Authority
AU
Australia
Prior art keywords
resin molding
fine recesses
preparing resin
preparing
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU50956/96A
Inventor
Reiko Chiba
Yoshichi Hagiwara
Keiichi Kinashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WR Grace and Co Conn
Original Assignee
WR Grace and Co Conn
WR Grace and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WR Grace and Co Conn, WR Grace and Co filed Critical WR Grace and Co Conn
Publication of AU5095696A publication Critical patent/AU5095696A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU50956/96A 1995-03-15 1996-03-15 Process for preparing resin molding having fine recesses on the surface thereof Abandoned AU5095696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7-83148 1995-03-15
JP8314895A JPH08259714A (en) 1995-03-15 1995-03-15 Production of resin molding having fine recesses on the surface
PCT/JP1996/000659 WO1996028502A1 (en) 1995-03-15 1996-03-15 Process for preparing resin molding having fine recesses on the surface thereof

Publications (1)

Publication Number Publication Date
AU5095696A true AU5095696A (en) 1996-10-02

Family

ID=13794148

Family Applications (1)

Application Number Title Priority Date Filing Date
AU50956/96A Abandoned AU5095696A (en) 1995-03-15 1996-03-15 Process for preparing resin molding having fine recesses on the surface thereof

Country Status (3)

Country Link
JP (1) JPH08259714A (en)
AU (1) AU5095696A (en)
WO (1) WO1996028502A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093272A1 (en) * 2005-03-04 2006-09-08 Murata Manufacturing Co., Ltd. Wiring substrate, manufacturing method thereof, and resin body surface treatment method
WO2012050072A1 (en) * 2010-10-13 2012-04-19 東洋紡績株式会社 Polyimide film, method for manufacturing same, and method for manufacturing layered product
JP2012197358A (en) * 2011-03-22 2012-10-18 Denso Corp Bonded article and method of manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140582A (en) * 1974-04-30 1975-11-11
JPS57188895A (en) * 1981-05-18 1982-11-19 Nippon Electric Co Method of producing printed circuit board
JPS6422934A (en) * 1987-07-16 1989-01-25 Polyplastics Co Molded plastic product having roughened surface for surface treatment and production thereof

Also Published As

Publication number Publication date
JPH08259714A (en) 1996-10-08
WO1996028502A1 (en) 1996-09-19

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