TW349262B - Semiconductor device related to wiring and process for producing the same - Google Patents

Semiconductor device related to wiring and process for producing the same

Info

Publication number
TW349262B
TW349262B TW085111906A TW85111906A TW349262B TW 349262 B TW349262 B TW 349262B TW 085111906 A TW085111906 A TW 085111906A TW 85111906 A TW85111906 A TW 85111906A TW 349262 B TW349262 B TW 349262B
Authority
TW
Taiwan
Prior art keywords
film
insulation film
semiconductor device
stop
wiring
Prior art date
Application number
TW085111906A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiro Inohara
Hideki Shibata
Tadashi Matsuno
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW349262B publication Critical patent/TW349262B/zh

Links

Classifications

    • H10D64/011—
    • H10W20/033—
    • H10W20/071—
    • H10W20/082—
    • H10W20/084—
    • H10W20/086—
    • H10W20/40—
    • H10W20/42—
    • H10W20/425—
    • H10W20/085—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
TW085111906A 1995-09-29 1996-09-30 Semiconductor device related to wiring and process for producing the same TW349262B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25373695 1995-09-29
JP8212332A JPH09153545A (ja) 1995-09-29 1996-08-12 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW349262B true TW349262B (en) 1999-01-01

Family

ID=26519157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111906A TW349262B (en) 1995-09-29 1996-09-30 Semiconductor device related to wiring and process for producing the same

Country Status (8)

Country Link
US (2) US5976972A (index.php)
EP (1) EP0766303B1 (index.php)
JP (1) JPH09153545A (index.php)
KR (1) KR100253852B1 (index.php)
CN (2) CN1266760C (index.php)
DE (1) DE69625975T2 (index.php)
MY (1) MY113878A (index.php)
TW (1) TW349262B (index.php)

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US6853079B1 (en) 2002-08-15 2005-02-08 National Semiconductor Corporation Conductive trace with reduced RF impedance resulting from the skin effect
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US7320934B2 (en) * 2005-06-20 2008-01-22 Infineon Technologies Ag Method of forming a contact in a flash memory device
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JP5192779B2 (ja) * 2007-11-02 2013-05-08 株式会社コナミデジタルエンタテインメント ゲーム装置、ゲーム装置の制御方法及びプログラム
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JP2011134837A (ja) * 2009-12-24 2011-07-07 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2011086969A (ja) * 2011-02-01 2011-04-28 Rohm Co Ltd 半導体装置およびその製造方法
JP2014039059A (ja) * 2013-10-21 2014-02-27 Rohm Co Ltd 半導体装置およびその製造方法
FR3062236A1 (fr) * 2017-01-23 2018-07-27 Stmicroelectronics (Rousset) Sas Barre de connexion
US11984403B2 (en) 2019-11-15 2024-05-14 Dyi-chung Hu Integrated substrate structure, redistribution structure, and manufacturing method thereof
CN112820711A (zh) * 2019-11-15 2021-05-18 胡迪群 集成基板结构、重布线结构及其制造方法

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Also Published As

Publication number Publication date
DE69625975D1 (de) 2003-03-06
EP0766303A2 (en) 1997-04-02
US6163067A (en) 2000-12-19
KR100253852B1 (ko) 2000-05-01
KR970018091A (ko) 1997-04-30
MY113878A (en) 2002-06-29
JPH09153545A (ja) 1997-06-10
CN1154170C (zh) 2004-06-16
CN1501472A (zh) 2004-06-02
US5976972A (en) 1999-11-02
DE69625975T2 (de) 2003-08-28
EP0766303A3 (index.php) 1997-04-23
CN1152191A (zh) 1997-06-18
CN1266760C (zh) 2006-07-26
EP0766303B1 (en) 2003-01-29

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees