TW318931B - - Google Patents

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Publication number
TW318931B
TW318931B TW083100868A TW83100868A TW318931B TW 318931 B TW318931 B TW 318931B TW 083100868 A TW083100868 A TW 083100868A TW 83100868 A TW83100868 A TW 83100868A TW 318931 B TW318931 B TW 318931B
Authority
TW
Taiwan
Prior art keywords
fault
ram
circuit
test device
patent application
Prior art date
Application number
TW083100868A
Other languages
English (en)
Chinese (zh)
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Application granted granted Critical
Publication of TW318931B publication Critical patent/TW318931B/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56008—Error analysis, representation of errors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38—Response verification devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/72—Masking faults in memories by using spares or by reconfiguring with optimized replacement algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
    • G01R31/31935—Storing data, e.g. failure memory
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5602—Interface to device under test
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5604—Display of error information
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5606—Error catch memory

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
TW083100868A 1993-01-29 1994-02-02 TW318931B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/011,003 US5588115A (en) 1993-01-29 1993-01-29 Redundancy analyzer for automatic memory tester

Publications (1)

Publication Number Publication Date
TW318931B true TW318931B (enExample) 1997-11-01

Family

ID=21748439

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100868A TW318931B (enExample) 1993-01-29 1994-02-02

Country Status (7)

Country Link
US (1) US5588115A (enExample)
JP (1) JP3650411B2 (enExample)
KR (1) KR100328357B1 (enExample)
DE (1) DE4402796C2 (enExample)
FR (1) FR2701120B1 (enExample)
IT (1) IT1267996B1 (enExample)
TW (1) TW318931B (enExample)

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* Cited by examiner, † Cited by third party
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US7468977B1 (en) 1995-07-12 2008-12-23 Nortel Networks Limited LAN/ATM switch having local packet switching and an ATM core fabric
US7031296B1 (en) * 1995-09-29 2006-04-18 Nortel Networks Limited Method and apparatus for managing the flow of data within a switching device
US6427185B1 (en) * 1995-09-29 2002-07-30 Nortel Networks Limited Method and apparatus for managing the flow of data within a switching device
US5720031A (en) * 1995-12-04 1998-02-17 Micron Technology, Inc. Method and apparatus for testing memory devices and displaying results of such tests
KR0172347B1 (ko) * 1995-12-23 1999-03-30 김광호 반도체 메모리장치의 병렬테스트 회로
US5754556A (en) * 1996-07-18 1998-05-19 Teradyne, Inc. Semiconductor memory tester with hardware accelerators
US6009536A (en) * 1996-09-20 1999-12-28 Micron Electronics, Inc. Method for using fuse identification codes for masking bad bits on memory modules
US6314527B1 (en) 1998-03-05 2001-11-06 Micron Technology, Inc. Recovery of useful areas of partially defective synchronous memory components
US6332183B1 (en) 1998-03-05 2001-12-18 Micron Technology, Inc. Method for recovery of useful areas of partially defective synchronous memory components
US6381708B1 (en) 1998-04-28 2002-04-30 Micron Technology, Inc. Method for decoding addresses for a defective memory array
US6381707B1 (en) 1998-04-28 2002-04-30 Micron Technology, Inc. System for decoding addresses for a defective memory array
US6496876B1 (en) 1998-12-21 2002-12-17 Micron Technology, Inc. System and method for storing a tag to identify a functional storage location in a memory device
US6442724B1 (en) * 1999-04-02 2002-08-27 Teradyne, Inc. Failure capture apparatus and method for automatic test equipment
US6536005B1 (en) * 1999-10-26 2003-03-18 Teradyne, Inc. High-speed failure capture apparatus and method for automatic test equipment
US6675335B1 (en) * 1999-12-29 2004-01-06 Advanced Micro Devices, Inc. Method and apparatus for exercising external memory with a memory built-in self-test
US6578157B1 (en) 2000-03-06 2003-06-10 Micron Technology, Inc. Method and apparatus for recovery of useful areas of partially defective direct rambus rimm components
US7269765B1 (en) 2000-04-13 2007-09-11 Micron Technology, Inc. Method and apparatus for storing failing part locations in a module
US6499118B1 (en) * 2000-05-17 2002-12-24 Teradyne, Inc. Redundancy analysis method and apparatus for ATE
KR100399435B1 (ko) * 2001-02-27 2003-09-29 주식회사 하이닉스반도체 반도체 메모리 장치와 그의 리페어 해석 방법
US7051253B2 (en) * 2001-08-16 2006-05-23 Infineon Technologies Richmond Lp Pseudo fail bit map generation for RAMS during component test and burn-in in a manufacturing environment
DE10145717A1 (de) * 2001-09-17 2003-04-10 Infineon Technologies Ag Verfahren zum Testen integrierter Halbleiterspeichereinrichtungen
US6842866B2 (en) * 2002-10-25 2005-01-11 Xin Song Method and system for analyzing bitmap test data
DE10256487B4 (de) * 2002-12-03 2008-12-24 Infineon Technologies Ag Integrierter Speicher und Verfahren zum Testen eines integrierten Speichers
EP1447813B9 (en) * 2003-02-12 2008-10-22 Infineon Technologies AG Memory built-in self repair (MBISR) circuits / devices and method for repairing a memory comprising a memory built-in self repair (MBISR) structure
US7509543B2 (en) * 2003-06-17 2009-03-24 Micron Technology, Inc. Circuit and method for error test, recordation, and repair
DE10337284B4 (de) * 2003-08-13 2014-03-20 Qimonda Ag Integrierter Speicher mit einer Schaltung zum Funktionstest des integrierten Speichers sowie Verfahren zum Betrieb des integrierten Speichers
JP4514028B2 (ja) * 2004-05-20 2010-07-28 ルネサスエレクトロニクス株式会社 故障診断回路及び故障診断方法
KR100579049B1 (ko) * 2004-05-22 2006-05-12 삼성전자주식회사 메모리 테스트 장치 및 이를 수행하는 방법
US20050283669A1 (en) * 2004-06-03 2005-12-22 Adkisson Richard W Edge detect circuit for performance counter
US7676530B2 (en) * 2004-06-03 2010-03-09 Hewlett-Packard Development Company, L.P. Duration minimum and maximum circuit for performance counter
US7624319B2 (en) * 2004-06-03 2009-11-24 Hewlett-Packard Development Company, L.P. Performance monitoring system
JP2006048767A (ja) * 2004-07-30 2006-02-16 Elpida Memory Inc 半導体メモリ試験装置
KR100609540B1 (ko) 2005-03-18 2006-08-08 주식회사 하이닉스반도체 불량 셀 처리 회로를 포함하는 불휘발성 강유전체 메모리장치 및 제어 방법
US7395465B2 (en) * 2006-01-13 2008-07-01 International Business Machines Corporation Memory array repair where repair logic cannot operate at same operating condition as array
US20080270854A1 (en) * 2007-04-24 2008-10-30 Micron Technology, Inc. System and method for running test and redundancy analysis in parallel
CN101441587B (zh) * 2007-11-19 2011-05-18 辉达公司 用于自动分析gpu测试结果的方法和系统
US11360840B2 (en) 2020-01-20 2022-06-14 Samsung Electronics Co., Ltd. Method and apparatus for performing redundancy analysis of a semiconductor device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414665A (en) * 1979-11-21 1983-11-08 Nippon Telegraph & Telephone Public Corp. Semiconductor memory device test apparatus
USRE32388E (en) * 1980-01-09 1987-03-31 Burroughs Corporation Apparatus for analyzing semiconductor memories
US4309657A (en) * 1980-01-09 1982-01-05 Burroughs Corporation Apparatus for analyzing semiconductor memories
US4389715A (en) * 1980-10-06 1983-06-21 Inmos Corporation Redundancy scheme for a dynamic RAM
US4736373A (en) * 1981-08-03 1988-04-05 Pacific Western Systems, Inc. Memory tester having concurrent failure data readout and memory repair analysis
US4450560A (en) * 1981-10-09 1984-05-22 Teradyne, Inc. Tester for LSI devices and memory devices
DE3482901D1 (de) * 1983-05-11 1990-09-13 Hitachi Ltd Pruefgeraet fuer redundanzspeicher.
DE3671670D1 (de) * 1985-03-26 1990-07-05 Siemens Ag Verfahren zum betreiben eines halbleiterspeichers mit integrierter paralleltestmoeglichkeit und auswerteschaltung zur durchfuehrung des verfahrens.
US4876685A (en) * 1987-06-08 1989-10-24 Teradyne, Inc. Failure information processing in automatic memory tester
JP2938470B2 (ja) * 1989-06-01 1999-08-23 三菱電機株式会社 半導体記憶装置
US5157664A (en) * 1989-09-21 1992-10-20 Texas Instruments Incorporated Tester for semiconductor memory devices
US5138619A (en) * 1990-02-15 1992-08-11 National Semiconductor Corporation Built-in self test for integrated circuit memory
US5280486A (en) * 1990-03-16 1994-01-18 Teradyne, Inc. High speed fail processor
FR2665793B1 (fr) * 1990-08-10 1993-06-18 Sgs Thomson Microelectronics Circuit integre de memoire avec redondance et adressage ameliore en mode de test.
JPH04177700A (ja) * 1990-11-13 1992-06-24 Toshiba Corp メモリ不良解析装置

Also Published As

Publication number Publication date
DE4402796C2 (de) 2003-02-06
DE4402796A1 (de) 1994-08-04
ITTO940048A0 (it) 1994-01-31
JPH06295598A (ja) 1994-10-21
US5588115A (en) 1996-12-24
KR940018944A (ko) 1994-08-19
FR2701120A1 (fr) 1994-08-05
ITTO940048A1 (it) 1995-07-31
FR2701120B1 (fr) 1997-08-14
IT1267996B1 (it) 1997-02-20
KR100328357B1 (ko) 2002-06-20
JP3650411B2 (ja) 2005-05-18

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