TW311927B - - Google Patents
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- Publication number
- TW311927B TW311927B TW084108609A TW84108609A TW311927B TW 311927 B TW311927 B TW 311927B TW 084108609 A TW084108609 A TW 084108609A TW 84108609 A TW84108609 A TW 84108609A TW 311927 B TW311927 B TW 311927B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive tape
- adhesive
- semiconductor wafer
- patent application
- wafer processing
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 claims description 264
- 239000002390 adhesive tape Substances 0.000 claims description 184
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49989695A | 1995-07-11 | 1995-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW311927B true TW311927B (en, 2012) | 1997-08-01 |
Family
ID=23987198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084108609A TW311927B (en, 2012) | 1995-07-11 | 1995-08-17 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5851664A (en, 2012) |
| EP (1) | EP0838086B1 (en, 2012) |
| JP (1) | JP3643600B2 (en, 2012) |
| KR (1) | KR100430350B1 (en, 2012) |
| CN (1) | CN1195424A (en, 2012) |
| AU (1) | AU703233B2 (en, 2012) |
| CA (1) | CA2224774A1 (en, 2012) |
| DE (1) | DE69601942T2 (en, 2012) |
| MY (1) | MY123743A (en, 2012) |
| TW (1) | TW311927B (en, 2012) |
| WO (1) | WO1997003461A1 (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558781B (zh) * | 2012-04-13 | 2016-11-21 | 東京應化工業股份有限公司 | 黏著劑組成物，黏著薄膜及黏貼方法 |
| TWI609061B (zh) * | 2012-08-13 | 2017-12-21 | 東京應化工業股份有限公司 | 接著劑組成物、接著薄膜及貼附方法 |
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- 1996-06-13 WO PCT/US1996/010336 patent/WO1997003461A1/en active IP Right Grant
- 1996-06-13 DE DE69601942T patent/DE69601942T2/de not_active Expired - Lifetime
- 1996-06-13 KR KR10-1998-0700183A patent/KR100430350B1/ko not_active Expired - Fee Related
- 1996-06-13 EP EP96919427A patent/EP0838086B1/en not_active Expired - Lifetime
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- 1996-06-13 JP JP53601196A patent/JP3643600B2/ja not_active Expired - Fee Related
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558781B (zh) * | 2012-04-13 | 2016-11-21 | 東京應化工業股份有限公司 | 黏著劑組成物，黏著薄膜及黏貼方法 |
| US10793756B2 (en) | 2012-04-13 | 2020-10-06 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition, adhesive film, and bonding method |
| TWI609061B (zh) * | 2012-08-13 | 2017-12-21 | 東京應化工業股份有限公司 | 接著劑組成物、接著薄膜及貼附方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69601942T2 (de) | 1999-11-11 |
| EP0838086A1 (en) | 1998-04-29 |
| DE69601942D1 (de) | 1999-05-06 |
| KR100430350B1 (ko) | 2004-06-16 |
| MY123743A (en) | 2006-06-30 |
| CA2224774A1 (en) | 1997-01-30 |
| JP3643600B2 (ja) | 2005-04-27 |
| AU703233B2 (en) | 1999-03-18 |
| AU6177596A (en) | 1997-02-10 |
| CN1195424A (zh) | 1998-10-07 |
| JPH11508924A (ja) | 1999-08-03 |
| KR19990028881A (ko) | 1999-04-15 |
| WO1997003461A1 (en) | 1997-01-30 |
| US5851664A (en) | 1998-12-22 |
| MX9800319A (es) | 1998-07-31 |
| EP0838086B1 (en) | 1999-03-31 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |