MX9800319A - Adhesivos y cintas para el procesamiento de pastillas semiconductoras. - Google Patents

Adhesivos y cintas para el procesamiento de pastillas semiconductoras.

Info

Publication number
MX9800319A
MX9800319A MX9800319A MX9800319A MX9800319A MX 9800319 A MX9800319 A MX 9800319A MX 9800319 A MX9800319 A MX 9800319A MX 9800319 A MX9800319 A MX 9800319A MX 9800319 A MX9800319 A MX 9800319A
Authority
MX
Mexico
Prior art keywords
tapes
semiconductor wafer
wafer processing
wafer
processing adhesives
Prior art date
Application number
MX9800319A
Other languages
English (en)
Other versions
MXPA98000319A (es
Inventor
Richard E Bennett
Gearld C Bird
Mark K Nestegard
Eleanor Rudin
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MX9800319A publication Critical patent/MX9800319A/es
Publication of MXPA98000319A publication Critical patent/MXPA98000319A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]

Abstract

La presente invencion se refiere a una cinta de procesamiento de pastillas semiconductoras que comprende un respaldo permanente y una capa de un adhesivo no sensible a la presion que comprende un copolímero de bloques elastoméricos, termoplásticos, sobre el respaldo permanente. Opcionalmente, el adhesivo puede incluir un modificador de la adhesion tal como una resina pegajosa, un hule o caucho líquido o un agente de fotorreticulacion. Las cintas son utiles para operaciones tanto de pulido de las pastillas como fragmentacion de las pastillas. También se describe un método de procesamiento de las pastillas semiconductoras.
MXPA/A/1998/000319A 1995-07-11 1998-01-09 Adhesivos y cintas para el procesamiento de pastillas semiconductoras MXPA98000319A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49989695A 1995-07-11 1995-07-11
US499896 1995-07-11

Publications (2)

Publication Number Publication Date
MX9800319A true MX9800319A (es) 1998-07-31
MXPA98000319A MXPA98000319A (es) 1998-11-09

Family

ID=

Also Published As

Publication number Publication date
EP0838086B1 (en) 1999-03-31
CA2224774A1 (en) 1997-01-30
TW311927B (es) 1997-08-01
DE69601942D1 (de) 1999-05-06
WO1997003461A1 (en) 1997-01-30
KR19990028881A (ko) 1999-04-15
DE69601942T2 (de) 1999-11-11
JP3643600B2 (ja) 2005-04-27
EP0838086A1 (en) 1998-04-29
JPH11508924A (ja) 1999-08-03
AU6177596A (en) 1997-02-10
KR100430350B1 (ko) 2004-06-16
CN1195424A (zh) 1998-10-07
US5851664A (en) 1998-12-22
MY123743A (en) 2006-06-30
AU703233B2 (en) 1999-03-18

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