DE69601942T2 - Klebstoffe und klebstreifen zum herstellen von halbleiterwaffeln - Google Patents

Klebstoffe und klebstreifen zum herstellen von halbleiterwaffeln

Info

Publication number
DE69601942T2
DE69601942T2 DE69601942T DE69601942T DE69601942T2 DE 69601942 T2 DE69601942 T2 DE 69601942T2 DE 69601942 T DE69601942 T DE 69601942T DE 69601942 T DE69601942 T DE 69601942T DE 69601942 T2 DE69601942 T2 DE 69601942T2
Authority
DE
Germany
Prior art keywords
waffles
adhesives
tape
semiconductor
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69601942T
Other languages
English (en)
Other versions
DE69601942D1 (de
Inventor
Richard Bennett
Gearld Bird
Mark Nestegard
Eleanor Rudin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69601942D1 publication Critical patent/DE69601942D1/de
Publication of DE69601942T2 publication Critical patent/DE69601942T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
DE69601942T 1995-07-11 1996-06-13 Klebstoffe und klebstreifen zum herstellen von halbleiterwaffeln Expired - Lifetime DE69601942T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49989695A 1995-07-11 1995-07-11
PCT/US1996/010336 WO1997003461A1 (en) 1995-07-11 1996-06-13 Semiconductor wafer processing adhesives and tapes

Publications (2)

Publication Number Publication Date
DE69601942D1 DE69601942D1 (de) 1999-05-06
DE69601942T2 true DE69601942T2 (de) 1999-11-11

Family

ID=23987198

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69601942T Expired - Lifetime DE69601942T2 (de) 1995-07-11 1996-06-13 Klebstoffe und klebstreifen zum herstellen von halbleiterwaffeln

Country Status (11)

Country Link
US (1) US5851664A (de)
EP (1) EP0838086B1 (de)
JP (1) JP3643600B2 (de)
KR (1) KR100430350B1 (de)
CN (1) CN1195424A (de)
AU (1) AU703233B2 (de)
CA (1) CA2224774A1 (de)
DE (1) DE69601942T2 (de)
MY (1) MY123743A (de)
TW (1) TW311927B (de)
WO (1) WO1997003461A1 (de)

Families Citing this family (154)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW311927B (de) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US6312800B1 (en) 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
WO1999026282A1 (fr) * 1997-11-18 1999-05-27 Mitsui Chemicals, Incorporated Procede de fabrication pour plaquette en semiconducteur
DE19755222A1 (de) * 1997-12-12 1999-06-24 Beiersdorf Ag Selbstklebend ausgerüstetes Trägermaterial
JP3903447B2 (ja) * 1998-01-21 2007-04-11 リンテック株式会社 粘着シート
US7351470B2 (en) * 1998-02-19 2008-04-01 3M Innovative Properties Company Removable antireflection film
US6589650B1 (en) 2000-08-07 2003-07-08 3M Innovative Properties Company Microscope cover slip materials
US6800378B2 (en) * 1998-02-19 2004-10-05 3M Innovative Properties Company Antireflection films for use with displays
US6039833A (en) * 1998-03-04 2000-03-21 Lucent Technologies Inc. Method and apparatus for component pickup
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US6140151A (en) * 1998-05-22 2000-10-31 Micron Technology, Inc. Semiconductor wafer processing method
JP2000311873A (ja) * 1999-02-26 2000-11-07 The Inctec Inc ダイシングシート
US6573124B1 (en) * 1999-05-03 2003-06-03 Hughes Electronics Corp. Preparation of passivated chip-on-board electronic devices
US6688948B2 (en) * 1999-07-07 2004-02-10 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer surface protection method
US6184064B1 (en) 2000-01-12 2001-02-06 Micron Technology, Inc. Semiconductor die back side surface and method of fabrication
US6852012B2 (en) * 2000-03-17 2005-02-08 Wafer Solutions, Inc. Cluster tool systems and methods for in fab wafer processing
JP3485525B2 (ja) * 2000-07-06 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
DE10036803A1 (de) * 2000-07-28 2002-02-07 Tesa Ag Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(A/C)-P(B)-P(A/C)
DE10036804A1 (de) * 2000-07-28 2002-02-07 Tesa Ag Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(B)-P(A/C)-P(B)
US6655281B1 (en) 2000-08-08 2003-12-02 3M Innovative Properties Company Flexographic printing elements with improved air bleed
JP2002100587A (ja) * 2000-09-22 2002-04-05 Nitto Denko Corp ダイシング用固定シート及びダイシング方法
JP3710368B2 (ja) * 2000-09-25 2005-10-26 シャープ株式会社 積層フィルムの製造方法
KR20030033084A (ko) * 2000-09-27 2003-04-26 스트라스바흐, 인코포레이티드 배면연마 테이프를 남겨두고 웨이퍼를 배면연마하는 방법
JP4780828B2 (ja) * 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
US6730595B2 (en) * 2000-12-12 2004-05-04 Mitsui Chemicals, Inc. Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6730532B1 (en) * 2001-02-27 2004-05-04 Cypress Semiconductor Corporation Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
US6901984B1 (en) 2001-02-27 2005-06-07 Cypress Semiconductor Corporation Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol
US6931298B1 (en) 2001-02-27 2005-08-16 Cypress Semiconductor Corporation Integrated back-end integrated circuit manufacturing assembly
US6632012B2 (en) 2001-03-30 2003-10-14 Wafer Solutions, Inc. Mixing manifold for multiple inlet chemistry fluids
JP3733418B2 (ja) * 2001-04-16 2006-01-11 シャープ株式会社 粘接着シート、積層シート及び液晶表示装置
DE10121556A1 (de) * 2001-05-03 2002-11-14 Infineon Technologies Ag Verfahren zum Rückseitenschleifen von Wafern
US6884504B2 (en) * 2001-05-04 2005-04-26 3M Innovative Properties Company Repositionable adhesive label for optical recording media
DE10129608A1 (de) * 2001-06-20 2003-05-28 Tesa Ag Stripfähige Systeme auf Basis von Acrylatblockcopolymeren
US6589809B1 (en) * 2001-07-16 2003-07-08 Micron Technology, Inc. Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
WO2003022935A1 (en) * 2001-09-11 2003-03-20 3M Innovative Properties Company Smudge resistant nanocomposite hardcoats and methods for making same
US20030092246A1 (en) * 2001-10-11 2003-05-15 Wanat Stanley F. Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
SG120887A1 (en) * 2001-12-03 2006-04-26 Disco Corp Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
AU2003236002A1 (en) * 2002-04-11 2003-10-20 Disco Corporation Method for manufacturing semiconductor chip
US7425618B2 (en) 2002-06-14 2008-09-16 Medimmune, Inc. Stabilized anti-respiratory syncytial virus (RSV) antibody formulations
JP4333581B2 (ja) * 2002-07-31 2009-09-16 日本ゼオン株式会社 熱可塑性エラストマー成形体
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
US6879050B2 (en) 2003-02-11 2005-04-12 Micron Technology, Inc. Packaged microelectronic devices and methods for packaging microelectronic devices
JP4614416B2 (ja) * 2003-05-29 2011-01-19 日東電工株式会社 半導体チップの製造方法およびダイシング用シート貼付け装置
WO2005005501A1 (en) * 2003-06-18 2005-01-20 Adhesives Research, Inc. Heat releasable wafer dicing tape
DE112004001583B4 (de) * 2003-09-01 2012-06-14 Mitsui Chemicals Tohcello, Inc. Verfahren zur Bildung eines Metallfilms
US20050096613A1 (en) * 2003-11-04 2005-05-05 Carper James D. Cling film fastening system for disposable soft goods
NL1026749C2 (nl) * 2004-07-30 2005-08-19 Fico Bv Werkwijze omhullen van een elektronische component met behulp van een kunststof object, en kunststof object.
CN100575438C (zh) 2004-11-12 2009-12-30 三井化学株式会社 薄膜状粘结剂以及使用该粘结剂的半导体封装体
US20060138681A1 (en) * 2004-12-27 2006-06-29 Asml Netherlands B.V. Substrate and lithography process using the same
CA2596506C (en) 2005-02-09 2021-04-06 Avi Biopharma, Inc. Antisense composition and method for treating muscle atrophy
US20060233791A1 (en) 2005-02-15 2006-10-19 Duke University Anti-CD19 antibodies and uses in oncology
EP1885755A4 (de) 2005-05-05 2009-07-29 Univ Duke Cd19-antikörper-therapie für autoimmunerkrankungen
JP4549239B2 (ja) 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
EP1900470B1 (de) * 2005-06-27 2012-06-13 Nitto Denko Corporation Oberflächenschutzfolie für lasermaterialbearbeitung
WO2007035333A1 (en) * 2005-09-16 2007-03-29 Cree, Inc. Methods of processing semiconductor wafers having silicon carbide power devices thereon
EP2540741A1 (de) 2006-03-06 2013-01-02 Aeres Biomedical Limited Humanisierte Anti-CD22-Antikörper und ihre Verwendung bei der Behandlung von Krebs, Transplantationen und Autoimmunerkrankungen
JP4667308B2 (ja) * 2006-06-23 2011-04-13 三井化学株式会社 半導体ウェハダイシング用保護シート及びそれを用いた半導体ウェハのダイシング方法
US20080113456A1 (en) * 2006-11-15 2008-05-15 International Business Machines Corporation Process for protecting image sensor wafers from front surface damage and contamination
US7844099B2 (en) * 2006-11-15 2010-11-30 International Business Machines Corporation Inspection method for protecting image sensor devices with front surface protection
RU2549701C2 (ru) 2007-05-07 2015-04-27 Медиммун, Ллк Анти-icos антитела и их применение в лечении онкологических, связанных с трансплантацией и аутоиммунных заболеваний
DE102008003775A1 (de) * 2007-09-18 2009-03-26 Siemens Aktiengesellschaft Verfahren und Vorrichtung zum Transportieren und Bearbeiten mehrerer Gegenstände
US20090146234A1 (en) * 2007-12-06 2009-06-11 Micron Technology, Inc. Microelectronic imaging units having an infrared-absorbing layer and associated systems and methods
RU2490278C2 (ru) 2007-12-21 2013-08-20 Медиммун Лимитед ЭЛЕМЕНТ, СВЯЗЫВАЮЩИЙСЯ С α-РЕЦЕПТОРОМ ИНТЕРЛЕЙКИНА-4 (IL-4Rα)-173
EP2927244A1 (de) 2008-09-19 2015-10-07 MedImmune, LLC Gegen DLL4 gerichtete Antikörper und ihre Verwendung
EP2379595A2 (de) 2008-12-23 2011-10-26 AstraZeneca AB Gegen a5b1 gerichtete gezielt bindende mittel und anwendungen davon
JP5346685B2 (ja) * 2009-05-21 2013-11-20 倉敷化工株式会社 防振部材
US20110012239A1 (en) * 2009-07-17 2011-01-20 Qualcomm Incorporated Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
NZ599405A (en) 2009-11-24 2014-09-26 Medimmune Ltd Targeted binding agents against b7-h1
JP5189124B2 (ja) * 2010-03-23 2013-04-24 日東電工株式会社 ダイシング用固定シート及びダイシング方法
CN102061474B (zh) * 2010-10-01 2012-06-27 绍兴旭昌科技企业有限公司 一种半导体晶圆的超厚度化学减薄方法
CN102074541B (zh) * 2010-11-26 2014-09-03 天水华天科技股份有限公司 一种无载体无引脚栅格阵列ic芯片封装件及其生产方法
DE102011079687A1 (de) 2011-07-22 2013-01-24 Wacker Chemie Ag Temporäre Verklebung von chemisch ähnlichen Substraten
JP5770038B2 (ja) * 2011-07-25 2015-08-26 リンテック株式会社 粘着シート
DK2551314T3 (da) 2011-07-29 2014-10-27 3M Innovative Properties Co Profileret beskyttelsestape til rotorblade til vindturbinegeneratorer
US20130085139A1 (en) 2011-10-04 2013-04-04 Royal Holloway And Bedford New College Oligomers
WO2013065417A1 (ja) * 2011-10-31 2013-05-10 東京応化工業株式会社 ウエハと当該ウエハの支持体とを接着するための接着剤組成物、接着フィルム及び積層体
KR101393895B1 (ko) * 2011-11-02 2014-05-13 (주)엘지하우시스 절단성이 우수한 반도체 웨이퍼 표면보호용 점착필름
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8646505B2 (en) 2011-11-18 2014-02-11 LuxVue Technology Corporation Micro device transfer head
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8518204B2 (en) * 2011-11-18 2013-08-27 LuxVue Technology Corporation Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
US8573469B2 (en) 2011-11-18 2013-11-05 LuxVue Technology Corporation Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
US9773750B2 (en) 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
JP5680128B2 (ja) 2012-04-13 2015-03-04 東京応化工業株式会社 接着剤組成物、接着フィルム、及び貼付方法
US9548332B2 (en) 2012-04-27 2017-01-17 Apple Inc. Method of forming a micro LED device with self-aligned metallization stack
US9105492B2 (en) 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
US9034754B2 (en) 2012-05-25 2015-05-19 LuxVue Technology Corporation Method of forming a micro device transfer head with silicon electrode
US8415771B1 (en) 2012-05-25 2013-04-09 LuxVue Technology Corporation Micro device transfer head with silicon electrode
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
US8415768B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant monopolar micro device transfer head with silicon electrode
US8415767B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8383506B1 (en) 2012-07-06 2013-02-26 LuxVue Technology Corporation Method of forming a compliant monopolar micro device transfer head with silicon electrode
US8933433B2 (en) 2012-07-30 2015-01-13 LuxVue Technology Corporation Method and structure for receiving a micro device
JP2014037458A (ja) * 2012-08-13 2014-02-27 Tokyo Ohka Kogyo Co Ltd 接着剤組成物、接着フィルムおよび貼付方法
JP6128970B2 (ja) * 2012-08-13 2017-05-17 東京応化工業株式会社 接着剤組成物、接着フィルム、貼付方法、および処理方法
US8791530B2 (en) 2012-09-06 2014-07-29 LuxVue Technology Corporation Compliant micro device transfer head with integrated electrode leads
US9162880B2 (en) 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
US8835940B2 (en) 2012-09-24 2014-09-16 LuxVue Technology Corporation Micro device stabilization post
US8941215B2 (en) 2012-09-24 2015-01-27 LuxVue Technology Corporation Micro device stabilization post
US9558721B2 (en) 2012-10-15 2017-01-31 Apple Inc. Content-based adaptive refresh schemes for low-power displays
JP6059507B2 (ja) * 2012-10-25 2017-01-11 東京応化工業株式会社 接着剤組成物及び接着フィルム
SG10201608703SA (en) 2012-11-08 2016-12-29 Eleven Biotherapeutics Inc Il-6 antagonists and uses thereof
DE102012220954A1 (de) 2012-11-16 2014-05-22 Wacker Chemie Ag Schleifbare Siliconelastomerzusammensetzung und deren Verwendung
US9178123B2 (en) 2012-12-10 2015-11-03 LuxVue Technology Corporation Light emitting device reflective bank structure
US9236815B2 (en) 2012-12-10 2016-01-12 LuxVue Technology Corporation Compliant micro device transfer head array with metal electrodes
US9159700B2 (en) 2012-12-10 2015-10-13 LuxVue Technology Corporation Active matrix emissive micro LED display
US9255001B2 (en) 2012-12-10 2016-02-09 LuxVue Technology Corporation Micro device transfer head array with metal electrodes
US9029880B2 (en) 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US9166114B2 (en) 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9105714B2 (en) 2012-12-11 2015-08-11 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging bollards
US9314930B2 (en) 2012-12-14 2016-04-19 LuxVue Technology Corporation Micro pick up array with integrated pivot mount
US9391042B2 (en) * 2012-12-14 2016-07-12 Apple Inc. Micro device transfer system with pivot mount
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
US9308649B2 (en) 2013-02-25 2016-04-12 LuxVue Techonology Corporation Mass transfer tool manipulator assembly
US9095980B2 (en) 2013-02-25 2015-08-04 LuxVue Technology Corporation Micro pick up array mount with integrated displacement sensor
US8791474B1 (en) 2013-03-15 2014-07-29 LuxVue Technology Corporation Light emitting diode display with redundancy scheme
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
US9484504B2 (en) 2013-05-14 2016-11-01 Apple Inc. Micro LED with wavelength conversion layer
US9217541B2 (en) 2013-05-14 2015-12-22 LuxVue Technology Corporation Stabilization structure including shear release posts
US9136161B2 (en) 2013-06-04 2015-09-15 LuxVue Technology Corporation Micro pick up array with compliant contact
US20160329173A1 (en) 2013-06-12 2016-11-10 Rohinni, LLC Keyboard backlighting with deposited light-generating sources
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US8928021B1 (en) 2013-06-18 2015-01-06 LuxVue Technology Corporation LED light pipe
US9035279B2 (en) 2013-07-08 2015-05-19 LuxVue Technology Corporation Micro device with stabilization post
US9296111B2 (en) 2013-07-22 2016-03-29 LuxVue Technology Corporation Micro pick up array alignment encoder
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
US9153548B2 (en) 2013-09-16 2015-10-06 Lux Vue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
US8980273B1 (en) 2014-07-15 2015-03-17 Kymab Limited Method of treating atopic dermatitis or asthma using antibody to IL4RA
US8986691B1 (en) 2014-07-15 2015-03-24 Kymab Limited Method of treating atopic dermatitis or asthma using antibody to IL4RA
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9768345B2 (en) 2013-12-20 2017-09-19 Apple Inc. LED with current injection confinement trench
US9450147B2 (en) 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area
US9583466B2 (en) 2013-12-27 2017-02-28 Apple Inc. Etch removal of current distribution layer for LED current confinement
US9542638B2 (en) 2014-02-18 2017-01-10 Apple Inc. RFID tag and micro chip integration design
US9583533B2 (en) 2014-03-13 2017-02-28 Apple Inc. LED device with embedded nanowire LEDs
US9522468B2 (en) 2014-05-08 2016-12-20 Apple Inc. Mass transfer tool manipulator assembly with remote center of compliance
US9318475B2 (en) 2014-05-15 2016-04-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
US9741286B2 (en) 2014-06-03 2017-08-22 Apple Inc. Interactive display panel with emitting and sensing diodes
JP6193813B2 (ja) * 2014-06-10 2017-09-06 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体及びこれらを使用する薄型ウエハの製造方法
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
US9425151B2 (en) 2014-06-17 2016-08-23 Apple Inc. Compliant electrostatic transfer head with spring support layer
US9570002B2 (en) 2014-06-17 2017-02-14 Apple Inc. Interactive display panel with IR diodes
US9828244B2 (en) 2014-09-30 2017-11-28 Apple Inc. Compliant electrostatic transfer head with defined cavity
US9705432B2 (en) 2014-09-30 2017-07-11 Apple Inc. Micro pick up array pivot mount design for strain amplification
ES2756275T3 (es) 2014-11-07 2020-04-27 Sesen Bio Inc Anticuerpos contra IL-6 mejorados
US9478583B2 (en) 2014-12-08 2016-10-25 Apple Inc. Wearable display having an array of LEDs on a conformable silicon substrate
MA41795A (fr) 2015-03-18 2018-01-23 Sarepta Therapeutics Inc Exclusion d'un exon induite par des composés antisens dans la myostatine
CA3002761A1 (en) 2015-11-04 2017-05-11 Astrazeneca Ab Dipeptidyl peptidase-4 and periostin as predictors of clinical response to eosinophil-targeted therapeutic agents in eosinophilic diseases
WO2017124109A1 (en) 2016-01-15 2017-07-20 Rohinni, LLC Apparatus and method of backlighting through a cover on the apparatus
CN106497446B (zh) * 2016-11-09 2022-06-10 宁波启合新材料科技有限公司 一种胶带的制备方法
WO2018203260A1 (en) 2017-05-05 2018-11-08 3M Innovative Properties Company Profiled films
CN115368830A (zh) * 2021-05-18 2022-11-22 杭州福斯特应用材料股份有限公司 胶膜、其制备方法及应用

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281383A (en) * 1962-08-09 1966-10-25 Phillips Petroleum Co Branched polymers prepared from monolithium-terminated polymers and compounds having at least three reactive sites
US3837994A (en) * 1968-04-25 1974-09-24 T Flanagan Manufacture of perfect bound books
US4028292A (en) * 1974-05-23 1977-06-07 Johnson & Johnson Hot melt adhesive
US4136071A (en) * 1976-05-18 1979-01-23 Johnson & Johnson Mixed block polymer adhesive
US4080348A (en) * 1976-05-18 1978-03-21 Johnson & Johnson Tacky adhesive
US4166706A (en) * 1977-08-01 1979-09-04 Johnson & Johnson Lift-off tape and process
US4662874A (en) * 1983-08-03 1987-05-05 Johnson & Johnson Body member conformable disposable articles
JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
WO1985005734A1 (en) * 1984-05-29 1985-12-19 Mitsui Toatsu Chemicals, Incorporated Film for machining wafers
US4968559A (en) * 1985-02-14 1990-11-06 Bando Chemical Industries. Ltd. Pressure sensitive adhesive film with barrier layer
EP0191534B1 (de) * 1985-02-14 1990-05-23 Bando Chemical Industries, Ltd. Verfahren zum Schneiden einer Halbleiterscheibe in Würfel
JPH0691057B2 (ja) * 1985-09-07 1994-11-14 日東電工株式会社 半導体ウエハの保護部材
JPS6266825A (ja) * 1985-09-18 1987-03-26 日東電工株式会社 積層マツト
JPH068403B2 (ja) * 1985-11-21 1994-02-02 三井石油化学工業株式会社 ウエハダイシング用接着シ−ト
EP0252739B1 (de) * 1986-07-09 1993-10-06 LINTEC Corporation Klebestreifen zum Kleben von Plättchen
US4822653A (en) * 1987-08-05 1989-04-18 National Starch And Chemical Corporation Recyclable hot melt adhesive compositions
US4797322A (en) * 1987-11-30 1989-01-10 The Kendall Company Novel adhesives
JPH02269672A (ja) * 1989-04-07 1990-11-05 Mitsubishi Electric Corp 電子部品用包装テープ
KR920702018A (ko) * 1989-08-01 1992-08-12 미시마 마사요시 웨이퍼 가공용 필름
US5143968A (en) * 1989-08-11 1992-09-01 The Dow Chemical Company Polystyrene-polyisoprene-polystyrene block copolymers, hot melt adhesive compositions, and articles produced therefrom
KR910015403A (ko) * 1990-02-14 1991-09-30 사와무라 하루오 웨이퍼 가공용 필름
US5085655A (en) * 1990-07-19 1992-02-04 Avery Dennison Corporation Cohesive tape system
TW215453B (de) * 1991-06-28 1993-11-01 Furukawa Electric Co Ltd
KR930006846A (ko) * 1991-09-02 1993-04-22 사와무라 하루오 반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프
JP2728333B2 (ja) * 1992-02-24 1998-03-18 リンテック株式会社 ウェハ貼着用粘着シートおよびチップのピックアップ方法
DE4230784A1 (de) * 1992-09-15 1994-03-17 Beiersdorf Ag Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape)
JP3106227B2 (ja) * 1992-10-26 2000-11-06 アキレス株式会社 自己粘着性エラストマーシート
US5274036A (en) * 1992-11-17 1993-12-28 Ralf Korpman Associates Pressure sensitive adhesive
JP2743958B2 (ja) * 1993-07-01 1998-04-28 信越化学工業株式会社 複合粘着体
CA2171542C (en) * 1993-10-12 1999-09-14 Carolyn Marie Anderson Polystyrene-ethylene/butylene-polystyrene hot melt adhesive
US5403658A (en) * 1994-04-15 1995-04-04 Shell Oil Company Adhesives containing vinyl aromatic hydrocarbon/diene/acrylic monomer block copolymers
TW311927B (de) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg

Also Published As

Publication number Publication date
JPH11508924A (ja) 1999-08-03
US5851664A (en) 1998-12-22
AU6177596A (en) 1997-02-10
KR100430350B1 (ko) 2004-06-16
AU703233B2 (en) 1999-03-18
CA2224774A1 (en) 1997-01-30
JP3643600B2 (ja) 2005-04-27
EP0838086B1 (de) 1999-03-31
MY123743A (en) 2006-06-30
MX9800319A (es) 1998-07-31
WO1997003461A1 (en) 1997-01-30
CN1195424A (zh) 1998-10-07
TW311927B (de) 1997-08-01
KR19990028881A (ko) 1999-04-15
DE69601942D1 (de) 1999-05-06
EP0838086A1 (de) 1998-04-29

Similar Documents

Publication Publication Date Title
DE69601942D1 (de) Klebstoffe und klebstreifen zum herstellen von halbleiterwaffeln
NO961006D0 (no) Fosfonomononukleinsyrer, fremgangsmåter for fremstilling derav og anvendelse av forbindelsene
DE69415068D1 (de) Mikromotor und Herstellungsverfahren desselben
NO962179L (no) Fremgangsmåte for fremstilling av metallocen og anvendelse derav
FI931657A0 (fi) Menetelmä endo-osteaalisten materiaalien käsittelemiseksi
NO960552D0 (no) Elektrode og fremstilling av elektroden
NO952573D0 (no) Blandinger for behandling av diabetiske komplikasjoner
DE69634951D1 (de) Topische verwendung von betulinsäure zur behandlung bösartiger melanome
DE69218621T2 (de) Endlosformular und vorrichtung zum herstellen von briefbogen davon
FI962370A0 (fi) Laite tissuen valmistamiseksi
DE59004662D1 (de) Zubereitung zum Lösen von Beschichtungen und Klebern.
DE69530705D1 (de) Selenium-konjugate für die herstellung von freien radikalen enthaltende arzneimittel
NO972402D0 (no) Fremgangsmåte for fremstilling av bærere
DE68916045D1 (de) Halbleiteranordnung und Verfahren zum Herstellen derselben.
NO994505L (no) Forbedret fremgangsmåte for fremstilling av tiazolidindioner og nye tiazolidindioner
ATE156222T1 (de) Deckenkonstruktion und verfahren zum herstellen derselben
DE69116234D1 (de) Verfahren zum Herstellen von Cyclohexylacetat
NO942531D0 (no) Fremgangsmåte for fremstilling av 3-acylöstratriener og acylbenzener
NO307080B1 (no) Fremgangsmåte for fremstilling av katalysatorer og anvendelse derav
DE59807153D1 (de) Einrichtung zum Herstellen und Verpacken von Zigaretten
DE69721699D1 (de) Enrichtung zum herstellen von zigaretten
NO304222B1 (no) Apparat for behandling av t°ybÕnd
FI940551A0 (fi) Menetelmä fenyylibentsamidijohdannaisten valmistamiseksi
DE59707847D1 (de) Einrichtung zum Herstellen und Verpacken von Zigaretten
DE59501977D1 (de) Gebinde-Packung und Verfahren zum Herstellen derselben

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PAE REINHARD, SKUHRA, WEISE & PARTNER GBR, 80801 M