JP5770038B2 - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- JP5770038B2 JP5770038B2 JP2011162390A JP2011162390A JP5770038B2 JP 5770038 B2 JP5770038 B2 JP 5770038B2 JP 2011162390 A JP2011162390 A JP 2011162390A JP 2011162390 A JP2011162390 A JP 2011162390A JP 5770038 B2 JP5770038 B2 JP 5770038B2
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- pressure
- adhesive sheet
- anchor coat
- coat layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title description 38
- 230000001070 adhesive effect Effects 0.000 title description 38
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 108
- 239000010410 layer Substances 0.000 claims description 105
- 150000001875 compounds Chemical class 0.000 claims description 32
- -1 polyethylene terephthalate Polymers 0.000 claims description 30
- 239000003431 cross linking reagent Substances 0.000 claims description 26
- 229920000728 polyester Polymers 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 24
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 23
- 125000000524 functional group Chemical group 0.000 claims description 21
- 238000000227 grinding Methods 0.000 claims description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 229920006267 polyester film Polymers 0.000 description 24
- 239000007787 solid Substances 0.000 description 24
- 239000000126 substance Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 20
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000013522 chelant Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- JTBKFHQUYVNHSR-UHFFFAOYSA-N propan-2-yloxyalumane Chemical compound CC(C)O[AlH2] JTBKFHQUYVNHSR-UHFFFAOYSA-N 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- KRCDCPKXFNSAER-UHFFFAOYSA-N 1,4-dioxane;methyl acetate Chemical compound COC(C)=O.C1COCCO1 KRCDCPKXFNSAER-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 125000000422 delta-lactone group Chemical group 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- KCHWKBCUPLJWJA-UHFFFAOYSA-N dodecyl 3-oxobutanoate Chemical compound CCCCCCCCCCCCOC(=O)CC(C)=O KCHWKBCUPLJWJA-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 125000000457 gamma-lactone group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000011254 layer-forming composition Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
(1)基材フィルム、エネルギー線重合性基を有する化合物を含有するアンカーコート層およびエネルギー線硬化型粘着剤層がこの順に積層されてなる粘着シート。
アンカーコート層は、エネルギー線重合性基を有する化合物を含有する。エネルギー線重合性基は、紫外線や電子線などのエネルギー線照射を受けて重合する基であり、たとえばエチレン性不飽和結合を含有する基があげられ、具体的にはアクリロイル基、メタクリロイル基、ビニル基、アリール基などが例示される。なお、以下の説明では、アクリロイル基およびメタアクリロイル基を総称して(メタ)アクリロイル基と記載することがある。エネルギー線重合性基としては、導入が容易であり、反応性も良好な(メタ)アクリロイル基が特に好ましい。
本発明の粘着シートは、上述した基材フィルムのアンカーコート層上に、エネルギー線硬化型粘着剤層(以下において、単に「粘着剤層」と記載することがある。)が形成されてなる。
本発明の粘着シートは、板状部材の加工を行う際の板状部材の非加工面保護に好ましく用いられる。板状部材としては、たとえば半導体ウエハや、金属、ガラス、セラミックスなどからなる薄板があげられる。これらの薄板の一方の表面には保護されるべき回路等が形成され、他方の面には、研削等の加工が施される。このような加工を行う際に、保護されるべき回路等が形成された面に本発明の粘着シートが貼付される。
実施例および比較例で得た粘着シートから剥離材を剥離除去し、紫外線照射(230mW/cm2、190mJ/cm2)してエネルギー線硬化型粘着剤層の硬化後、JIS K 5600−5−6:1999のクロスカット法に基づき、格子パターンの各方向でのカット数を10個とし(格子マス目の数100マス)、カットの間隔を5mmとしてアンカーコート層とエネルギー線硬貨型粘着剤との密着性を評価した。粘着剤が剥離したマス目の個数を数えた。
実施例および比較例で得たアンカーコート層付き基材フィルムを5枚重ね合わせ、40℃80%RH(相対湿度)の条件下で784mN/cm2の荷重を重ね、一週間静置した。その後23℃50%環境下に1日放置した後、重ね合わせたサンプルを剥がし、フィルム面との接着性を下記の判断基準で評価した。
○:フィルム面との接着がない。
△:フィルム面とアンカーコート面が点で接着しているが、両者を手で剥がすのに問題はなく、剥がした後のアンカーコート層表面には目視でなんら変化が観察されない。
×:フィルム面とアンカーコート層が接着し、両者を手で剥がすことが不可能であるか、あるいは両者を手で剥がすことが可能であるが、剥がした後のアンカーコート層表面に目視で変化が観察される。
n−ブチルアクリレート85質量部、2−ヒドロキシエチルアクリレート15質量部からなる重量平均分子量約65万の共重合体100質量部と、メタクリロイルオキシエチルイソシアナート16質量部との反応により得られる側鎖にエネルギー線重合性基を有するエネルギー線硬化型共重合体に硬化剤(トルイレンジイソシアナートとトリメチロールプロパンの付加物)5質量部と、光重合開始剤(チバ・スペシャルティケミカルズ社製、イルガキュア184)5質量部を配合した粘着剤を用意し、粘着剤1とした。なお、配合部数はすべて固形分換算である。
アクリル系粘着剤(n-ブチルアクリレートとアクリル酸との共重合体)100質量部と、分子量8000の3官能ウレタンアクリレート系オリゴマー120質量部と、硬化剤(ジイソシアナート系)10質量部と、光重合開始剤(ベンゾフェノン系)5質量部とを混合し、粘着剤2とした。なお、配合部数はすべて固形分換算である。
(アンカーコート層付基材フィルム)
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液(アラコートAP2500E(荒川化学工業株式会社製、固形分50%))100質量部に、アジリジン系架橋剤としてアラコートCL2500(荒川化学工業株式会社製、固形分40%)60質量部を添加し、アンカーコート層形成用組成物を得た。この組成物においては、アクリレート変性ポリエステルを固形分として100質量部含有するとした場合、アジリジン系架橋剤を固形分として48質量部含有する(なお、実施例2以下のアクリレート変性ポリエステルと架橋剤の固形分換算での配合量は表に示すとおりである。)。
剥離材としてのSP−PET381031上に、粘着剤1を乾燥後の厚みが20μmとなるようにロールナイフ方式により塗布流延した後、温度100℃で1分間乾燥し、剥離材上に粘着剤層を得た。粘着剤層の露出面を上記のアンカーコート層付きポリエステル系基材フィルムのアンカーコート層面と貼り合わせて、ポリエステル系フィルム、アンカーコート層、エネルギー線硬化型粘着剤層、剥離材がこの順に積層された粘着シート1を得た。得られた粘着シート1におけるエネルギー線硬化型粘着剤層の密着性を評価した。結果を表1に示す。
粘着剤1に代えて粘着剤2を用いた以外は、上記と同様にして粘着シート2を得て、同様の評価を行った。結果を表1に示す。
アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製、固形分40%)の配合量を30質量部とした以外は、実施例1と同様にして粘着剤1を用いた粘着シート1および粘着剤2を用いた粘着シート2を得た。結果を表1に示す。
アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製、固形分40%)の配合量を15質量部とした以外は、上記と同様にした。結果を表1に示す。
アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製、固形分40%)を7質量部とした以外は、上記と同様にした。結果を表1に示す。
アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製、固形分40%)を添加しなかった以外は、上記と同様にした。結果を表1に示す。
アンカーコート層の厚みを0.08μmとした以外は、実施例2と同様にした。結果を表1に示す。
アンカーコート層の厚みを0.3μmとした以外は実施例2と同様にした。結果を表1に示す。
アンカーコート層の厚みを3μmとした以外は実施例2と同様にした。結果を表1に示す。
アンカーコート層の厚みを5μmとした以外は実施例1と同様にした。結果を表1に示す。
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液を、アラコートAP2500E(荒川化学工業株式会社製)からアラコートAP2510(荒川化学工業株式会社製、固形分30%)に換え、アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製、固形分40%)を10質量部とし、アンカーコート層の厚みを2μmとした以外は、実施例1と同様にした。結果を表1に示す。
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液を、アラコートAP2500E(荒川化学工業株式会社製)からアラコートAP2502B2(荒川化学工業株式会社製、固形分50%)に換え、アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製)を10質量部とし、アンカーコート層の厚みを2μmとした以外は、実施例1と同様にした。結果を表1に示す。
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液を、アラコートAP2500E(荒川化学工業株式会社製)からアラコートAP2503A(荒川化学工業株式会社製、固形分40%)に換え、アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製)60質量部をイソシアネート系架橋剤アラコートCL2503(荒川化学工業株式会社製、固形分40%)10質量部とし、アンカーコート層の厚みを2μmとした以外は、実施例1と同様にした。結果を表1に示す。
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液を、アラコートAP2500E(荒川化学工業株式会社製)からアラコートAP2503D2(荒川化学工業株式会社製、固形分40%)に換え、アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製)60質量部をイソシアネート系架橋剤アラコートCL2503(荒川化学工業株式会社製、固形分40%)10質量部とし、アンカーコート層の厚みを2μmとした以外は、実施例1と同様にした。結果を表1に示す。
アンカーコート層を設けず、ポリエチレンテレフタレートフィルムと粘着剤層を直接貼り合わせた以外は実施例1と同様にした。結果を表1に示す。
アクリレート変性ポリエステルを主成分とするポリエステル樹脂溶液アラコートAP2500E(荒川化学工業株式会社製)を、(メタ)アクリロイル基を有する化合物を含有しないポリエステル樹脂バイロン600(東洋紡績株式会社製)をメチルエチルケトンに溶解し固形分30%としたものに換え、アジリジン系架橋剤アラコートCL2500(荒川化学工業株式会社製)30質量部をイソシアネート系架橋剤コロネートHL(日本ポリウレタン株式会社製、固形分30%)10質量部に換え、アンカーコート層の厚みを2μmとした以外は、実施例1と同様にした。結果を表1に示す。
Claims (10)
- 基材フィルム、エネルギー線重合性基を有する化合物を含有するアンカーコート層およびエネルギー線硬化型粘着剤層がこの順に積層されてなり、
該基材フィルムがポリエステルからなり、
該アンカーコート層の厚さが0.1〜3μmである粘着シート。 - ポリエステルがポリエチレンテレフタレートである請求項1に記載の粘着シート。
- エネルギー線重合性基を有する化合物に含まれるエネルギー線重合性基が、(メタ)アクリロイル基である請求項1または2に記載の粘着シート。
- エネルギー線重合性基を有する化合物が、(メタ)アクリロイル基を有する重合体である請求項3に記載の粘着シート。
- (メタ)アクリロイル基を有する重合体が、(メタ)アクリレート変性ポリエステルである請求項4に記載の粘着シート。
- エネルギー線重合性基を有する化合物が、エネルギー線重合性基以外の反応性官能基を有し、アンカーコート層が架橋剤を含有する請求項1〜5の何れかに記載の粘着シート。
- エネルギー線硬化型粘着剤が、アクリル系重合体を含有する請求項1〜6の何れかに記載の粘着シート。
- エネルギー線硬化型粘着剤が、多官能紫外線硬化樹脂を含有する請求項1〜7の何れかに記載の粘着シート。
- 板状部材の加工を行う際の板状部材の非加工面保護用である請求項1〜8の何れかに記載の粘着シート。
- 半導体ウエハの裏面の研削を行う際の半導体ウエハの回路面保護用である請求項9に記載の粘着シート。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011162390A JP5770038B2 (ja) | 2011-07-25 | 2011-07-25 | 粘着シート |
US13/557,439 US20130029137A1 (en) | 2011-07-25 | 2012-07-25 | Adhesive Sheet |
KR1020120081210A KR20130012575A (ko) | 2011-07-25 | 2012-07-25 | 점착 시트 |
KR1020190082766A KR102106145B1 (ko) | 2011-07-25 | 2019-07-09 | 점착 시트 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011162390A JP5770038B2 (ja) | 2011-07-25 | 2011-07-25 | 粘着シート |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013023665A JP2013023665A (ja) | 2013-02-04 |
JP2013023665A5 JP2013023665A5 (ja) | 2014-07-03 |
JP5770038B2 true JP5770038B2 (ja) | 2015-08-26 |
Family
ID=47597436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011162390A Active JP5770038B2 (ja) | 2011-07-25 | 2011-07-25 | 粘着シート |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130029137A1 (ja) |
JP (1) | JP5770038B2 (ja) |
KR (2) | KR20130012575A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5946708B2 (ja) * | 2012-07-11 | 2016-07-06 | 積水化学工業株式会社 | 粘着テープ |
JP6095468B2 (ja) * | 2013-05-07 | 2017-03-15 | 三井化学株式会社 | プラスチック偏光レンズ及びその製造方法 |
WO2016100021A1 (en) * | 2014-12-19 | 2016-06-23 | 3M Innovative Properties Company | Adhesive article comprising a poly(meth)acrylate-based primer layer and methods of making same |
JP6206828B1 (ja) * | 2015-11-04 | 2017-10-04 | リンテック株式会社 | 硬化性樹脂フィルム、第1保護膜形成用シート及びバンプ形成面保護方法 |
JP6126722B2 (ja) * | 2016-04-14 | 2017-05-10 | 積水化学工業株式会社 | 粘着テープ |
JP7042667B2 (ja) | 2018-03-28 | 2022-03-28 | 古河電気工業株式会社 | 半導体チップの製造方法 |
CN110305592A (zh) * | 2019-05-23 | 2019-10-08 | 南通康尔乐复合材料有限公司 | 一种重工泡棉双面胶带及制作工艺 |
JP7490399B2 (ja) * | 2020-03-13 | 2024-05-27 | 日東電工株式会社 | 再剥離粘着テープ |
JP2022156837A (ja) | 2021-03-31 | 2022-10-14 | マクセル株式会社 | ワーク加工用粘着テープ |
JP2022156835A (ja) | 2021-03-31 | 2022-10-14 | マクセル株式会社 | ワーク加工用粘着テープ |
WO2023068088A1 (ja) * | 2021-10-20 | 2023-04-27 | デンカ株式会社 | 凸部を有する半導体ウエハの加工用粘着シートに用いられる基材 |
Family Cites Families (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4867330A (ja) * | 1971-12-20 | 1973-09-14 | ||
US4724026A (en) * | 1985-02-05 | 1988-02-09 | Omnicrom Systems Corporation | Process for selective transfer of metallic foils to xerographic images |
JPS6279649A (ja) * | 1985-10-03 | 1987-04-13 | Mitsui Toatsu Chem Inc | 半導体ダイシング方法 |
US5187007A (en) * | 1985-12-27 | 1993-02-16 | Lintec Corporation | Adhesive sheets |
FR2602777B1 (fr) * | 1986-08-12 | 1988-11-10 | Rhone Poulenc Films | Procede de revetement de films en polyester et nouveaux films comportant un revetement de surface |
JPH01232301A (ja) * | 1988-03-14 | 1989-09-18 | Nippon Zeon Co Ltd | 防眩フィルター |
US5096767A (en) * | 1989-02-03 | 1992-03-17 | Mitsubishi Paper Mills Limited | Alkali-removable label support and label |
US5002976A (en) * | 1989-02-23 | 1991-03-26 | Radcure Specialties, Inc. | Radiation curable acrylate polyesters |
EP0475592A3 (en) * | 1990-09-10 | 1992-08-19 | Minnesota Mining And Manufacturing Company | Coated article having improved adhesion to organic coatings |
US5445871A (en) * | 1990-10-30 | 1995-08-29 | Kansai Paint Co., Ltd. | Surface-modified plastic plate |
US5275918A (en) * | 1991-02-27 | 1994-01-04 | E. I. Du Pont De Nemours And Company | Ultraviolet curable heat activatable transfer toners |
JP3262607B2 (ja) * | 1992-11-09 | 2002-03-04 | 日本カーバイド工業株式会社 | 活性エネルギー線硬化型粘接着性組成物及びテープ |
JPH07171491A (ja) * | 1993-12-21 | 1995-07-11 | Sekisui Finechem Co Ltd | 光硬化性塗料の塗布硬化方法 |
JP3372332B2 (ja) * | 1993-12-27 | 2003-02-04 | 三井化学株式会社 | 半導体ウエハ裏面研削用フィルムの製造方法 |
JPH07193032A (ja) * | 1993-12-27 | 1995-07-28 | Mitsui Toatsu Chem Inc | 半導体ウエハ裏面研削用フィルムの製造方法 |
US6887640B2 (en) * | 2002-02-28 | 2005-05-03 | Sukun Zhang | Energy activated electrographic printing process |
TW311927B (ja) * | 1995-07-11 | 1997-08-01 | Minnesota Mining & Mfg | |
US5700302A (en) * | 1996-03-15 | 1997-12-23 | Minnesota Mining And Manufacturing Company | Radiation curable abrasive article with tie coat and method |
US5891530A (en) * | 1996-04-19 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Method for producing a coating |
JPH09328663A (ja) * | 1996-06-10 | 1997-12-22 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
US5905012A (en) * | 1996-07-26 | 1999-05-18 | Agfa-Gevaert, N.V. | Radiation curable toner particles |
DE19743564A1 (de) * | 1996-10-26 | 1998-04-30 | Henkel Kgaa | Lösungsmittelfreie strahlungshärtbare Primer |
JP2001511162A (ja) * | 1997-02-06 | 2001-08-07 | ノボ ノルディスク アクティーゼルスカブ | 付加され、そして/又は除去された付着基を有するポリペプチド−ポリマー結合体 |
JPH10279891A (ja) * | 1997-04-10 | 1998-10-20 | Sliontec:Kk | 接着シート及び該シートを用いた装飾骨材搭載シート |
TW442537B (en) * | 1997-04-24 | 2001-06-23 | Ind Tech Res Inst | Mixed emulsion composition and method for making the same |
JPH11279408A (ja) * | 1997-06-02 | 1999-10-12 | Dainippon Ink & Chem Inc | 水性樹脂の製造法、水性硬化性樹脂組成物および水性塗料 |
JP3659795B2 (ja) * | 1998-03-17 | 2005-06-15 | 電気化学工業株式会社 | 粘着シート |
US6235387B1 (en) * | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
US6174061B1 (en) * | 1998-03-31 | 2001-01-16 | Raytheon Company | Compact electro-optical sensor assembly having single aperture for multiple detectors |
EP0960900B1 (en) * | 1998-05-25 | 2004-01-14 | Toyo Boseki Kabushiki Kaisha | Thermoplastic laminate film |
JP3739570B2 (ja) * | 1998-06-02 | 2006-01-25 | リンテック株式会社 | 粘着シートおよびその利用方法 |
US6106950A (en) * | 1998-06-04 | 2000-08-22 | H. B. Fuller Licesing & Financing Inc. | Waterborne primer and oxygen barrier coating with improved adhesion |
JP3669196B2 (ja) * | 1998-07-27 | 2005-07-06 | 日東電工株式会社 | 紫外線硬化型粘着シート |
US6165609A (en) * | 1998-10-30 | 2000-12-26 | Avery Dennison Corporation | Security coatings for label materials |
CN1137028C (zh) * | 1998-11-20 | 2004-02-04 | 琳得科株式会社 | 压敏粘合片及其使用方法 |
JP2000158859A (ja) * | 1998-11-30 | 2000-06-13 | Toppan Forms Co Ltd | 感圧接着性プリント用シート |
JP3727192B2 (ja) * | 1999-03-01 | 2005-12-14 | 株式会社きもと | 透明導電性薄膜易接着フィルム及びこれを用いたタッチパネル |
JP4531883B2 (ja) * | 1999-03-25 | 2010-08-25 | リンテック株式会社 | 帯電防止性粘着シート |
JP2000281991A (ja) * | 1999-03-30 | 2000-10-10 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
DE19920799A1 (de) * | 1999-05-06 | 2000-11-16 | Basf Coatings Ag | Thermisch und mit aktinischer Strahlung härtbarer Beschichtungsstoff und seine Verwendung |
US7641966B2 (en) * | 1999-06-14 | 2010-01-05 | Nitto Denko Corporation | Re-release adhesive and re-release adhesive sheet |
DE19961402A1 (de) * | 1999-12-20 | 2001-07-05 | Basf Coatings Ag | Verfahren zur Herstellung von Beschichtungen aus thermisch und mit aktinischer Strahlung härtbaren Beschichtungstoffen |
GB0005612D0 (en) * | 2000-03-09 | 2000-05-03 | Avecia Bv | Aqueous polymer compositions |
DE10012580A1 (de) * | 2000-03-15 | 2001-09-27 | Basf Coatings Ag | Verfahren zur Herstellung von Beschichtungen, Klebschichten und Dichtungen aus mit aktinischer Strahlung härtbaren Beschichtungsstoffen, Klebstoffen und Dichtungsmassen |
JP4597323B2 (ja) * | 2000-07-07 | 2010-12-15 | リンテック株式会社 | 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート |
JP2002060529A (ja) * | 2000-08-22 | 2002-02-26 | Fuji Photo Film Co Ltd | 高密着ハードコートフィルム |
DE10064552B4 (de) * | 2000-12-22 | 2004-10-07 | Nexpress Solutions Llc | Verfahren und Maschine zum Bedrucken und/oder Beschichten eines Substrats |
US20020156144A1 (en) * | 2001-02-09 | 2002-10-24 | Williams Kevin Alan | UV-curable, non-chlorinated adhesion promoters |
JP5201379B2 (ja) * | 2001-03-26 | 2013-06-05 | リケンテクノス株式会社 | アンカーコート剤、易接着性基材フィルム及び積層フィルム |
US6720042B2 (en) * | 2001-04-18 | 2004-04-13 | 3M Innovative Properties Company | Primed substrates comprising radiation cured ink jetted images |
JP4812963B2 (ja) * | 2001-05-18 | 2011-11-09 | リンテック株式会社 | 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法 |
JP3926117B2 (ja) * | 2001-07-17 | 2007-06-06 | リンテック株式会社 | ハードコートフィルム |
CN100334690C (zh) * | 2002-03-27 | 2007-08-29 | 三井化学株式会社 | 半导体晶片表面保护用粘结膜及用该粘结膜的半导体晶片的保护方法 |
KR100490885B1 (ko) | 2002-04-17 | 2005-05-19 | 중앙대학교 산학협력단 | 직각 교차 실린더를 이용한 영상기반 렌더링 방법 |
JP2005255706A (ja) * | 2004-03-09 | 2005-09-22 | Lintec Corp | 粘接着剤組成物、光ディスク製造用シートおよび光ディスク |
JP4367769B2 (ja) * | 2004-04-13 | 2009-11-18 | 日東電工株式会社 | 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法 |
DE102004023637A1 (de) * | 2004-05-10 | 2005-12-08 | Tesa Ag | UV-vernetzende Blockcopolymere |
JP4574234B2 (ja) * | 2004-06-02 | 2010-11-04 | リンテック株式会社 | 半導体加工用粘着シートおよび半導体チップの製造方法 |
US20060252234A1 (en) * | 2004-07-07 | 2006-11-09 | Lintec Corporation | Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device |
JP2006143915A (ja) * | 2004-11-22 | 2006-06-08 | Lintec Corp | 粘着シート及びその製造方法 |
TWI333672B (en) * | 2005-03-29 | 2010-11-21 | Furukawa Electric Co Ltd | Wafer-dicing adhesive tape and method of producing chips using the same |
US20090076183A1 (en) * | 2005-05-04 | 2009-03-19 | John Jun Chiao | Radiation curable methacrylate polyesters |
US7544458B2 (en) * | 2005-07-27 | 2009-06-09 | Hewlett-Packard Development Company, L.P. | Composition, method and device for liquid electrophotographic printing |
JP5063016B2 (ja) * | 2006-03-23 | 2012-10-31 | リンテック株式会社 | 粘着シート及び剥離シート |
US7935424B2 (en) * | 2006-04-06 | 2011-05-03 | Lintec Corporation | Adhesive sheet |
JP5283838B2 (ja) * | 2006-11-04 | 2013-09-04 | 日東電工株式会社 | 熱剥離性粘着シート及び被着体回収方法 |
JP5049620B2 (ja) * | 2007-03-20 | 2012-10-17 | リンテック株式会社 | 粘着シート |
EP2139971A4 (en) * | 2007-04-13 | 2011-09-21 | 3M Innovative Properties Co | ANTISTATIC TRANSPARENT SELF-ADHESIVE ADHESIVE |
JP5032231B2 (ja) * | 2007-07-23 | 2012-09-26 | リンテック株式会社 | 半導体装置の製造方法 |
PL2025506T3 (pl) * | 2007-08-13 | 2011-03-31 | Tesa Se | Taśma klejąca z nośnikiem piankowym |
JP5608957B2 (ja) * | 2007-09-27 | 2014-10-22 | 横浜ゴム株式会社 | 硬化性樹脂組成物 |
KR101454183B1 (ko) * | 2007-11-12 | 2014-10-27 | 린텍 코포레이션 | 점착 시트 |
WO2009113485A1 (ja) * | 2008-03-10 | 2009-09-17 | 三井化学株式会社 | プライマー組成物 |
US20100051165A1 (en) * | 2008-08-28 | 2010-03-04 | Tombs Thomas N | Electrographic digitally patterning of metal films |
JP2010053239A (ja) * | 2008-08-28 | 2010-03-11 | Dow Corning Toray Co Ltd | 光硬化型プライマー組成物、該組成物からなるプライマー層を備えた構造体およびその製造方法 |
US8417171B2 (en) * | 2008-10-24 | 2013-04-09 | Eastman Kodak Company | Method and apparatus for printing embossed reflective images |
JP2010194796A (ja) * | 2009-02-24 | 2010-09-09 | Dic Corp | 活性エネルギー線硬化性転写シート |
JP6085076B2 (ja) * | 2009-03-16 | 2017-02-22 | リンテック株式会社 | 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法 |
KR101812998B1 (ko) * | 2010-02-11 | 2017-12-28 | 아라까와 가가꾸 고교 가부시끼가이샤 | 활성에너지선 경화 피막을 포함하는 플라스틱 필름용 언더코트제 및 활성에너지선 경화 피막을 포함하는 플라스틱필름 |
JP5681374B2 (ja) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
JP5439264B2 (ja) * | 2010-04-19 | 2014-03-12 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
US20120058317A1 (en) * | 2010-09-03 | 2012-03-08 | Michelman, Inc. | Energy curable primer coating |
JP2012180494A (ja) * | 2011-02-10 | 2012-09-20 | Nitto Denko Corp | 自発巻回性粘着シート及び切断体の製造方法 |
-
2011
- 2011-07-25 JP JP2011162390A patent/JP5770038B2/ja active Active
-
2012
- 2012-07-25 KR KR1020120081210A patent/KR20130012575A/ko active Application Filing
- 2012-07-25 US US13/557,439 patent/US20130029137A1/en not_active Abandoned
-
2019
- 2019-07-09 KR KR1020190082766A patent/KR102106145B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20190084933A (ko) | 2019-07-17 |
KR20130012575A (ko) | 2013-02-04 |
JP2013023665A (ja) | 2013-02-04 |
KR102106145B1 (ko) | 2020-04-29 |
US20130029137A1 (en) | 2013-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5770038B2 (ja) | 粘着シート | |
TWI471401B (zh) | And a method for manufacturing a dicing film and a wafer having a protective film forming layer | |
KR101880644B1 (ko) | 표면 보호 시트 | |
JP6274588B2 (ja) | 保護膜形成層付ダイシングシートおよびチップの製造方法 | |
KR101570959B1 (ko) | 보호막 형성용 복합 시트 | |
KR102152605B1 (ko) | 보호막 형성용 필름 | |
WO2014069638A1 (ja) | 粘着シート | |
JP5464635B2 (ja) | 半導体ウエハ加工用粘着シートおよびその使用方法 | |
US20160326403A1 (en) | Composite Sheet For Protective-Film Formation | |
JP6006936B2 (ja) | 保護膜形成層付ダイシングシートおよびチップの製造方法 | |
TWI694129B (zh) | 樹脂膜形成用薄片、樹脂膜形成用複合薄片、及矽晶圓之再生方法 | |
JP6210827B2 (ja) | 半導体加工用シート | |
KR20180022532A (ko) | 보호막 형성용 복합 시트 | |
JP2017183547A (ja) | リワーク方法 | |
JP7404073B2 (ja) | 半導体加工用粘着テープ | |
WO2014017473A1 (ja) | 保護膜形成層、保護膜形成用シート及び半導体装置の製造方法 | |
JP7387510B2 (ja) | 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法 | |
WO2021166991A1 (ja) | 裏面保護膜形成用複合体、第一積層体の製造方法、第三積層体の製造方法、及び裏面保護膜付き半導体装置の製造方法 | |
JP2022157810A (ja) | 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法 | |
TW202237770A (zh) | 保護膜形成膜、保護膜形成用複合片、以及晶圓之再生方法 | |
JP2023133980A (ja) | ワーク加工用粘着シート、及び半導体装置 | |
JP2022146567A (ja) | 保護膜形成フィルム、保護膜形成用複合シート、保護膜付きワーク加工物の製造方法、及び保護膜付きワークの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140509 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140509 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20140509 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150303 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150501 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150526 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150624 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5770038 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R157 | Certificate of patent or utility model (correction) |
Free format text: JAPANESE INTERMEDIATE CODE: R157 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |