TW224538B - - Google Patents
Info
- Publication number
- TW224538B TW224538B TW082103870A TW82103870A TW224538B TW 224538 B TW224538 B TW 224538B TW 082103870 A TW082103870 A TW 082103870A TW 82103870 A TW82103870 A TW 82103870A TW 224538 B TW224538 B TW 224538B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/299—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
- H10D62/307—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations the doping variations being parallel to the channel lengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/152—Source regions of DMOS transistors
- H10D62/153—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
- H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77610291A | 1991-10-15 | 1991-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW224538B true TW224538B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-06-01 |
Family
ID=25106461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082103870A TW224538B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-10-15 | 1993-05-18 |
Country Status (6)
Cited By (2)
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---|---|---|---|---|
GB2445469A (en) * | 2007-01-05 | 2008-07-09 | Snap On Tools Corp | Adjustable tool extender |
TWI476923B (zh) * | 2012-05-04 | 2015-03-11 | Richtek Technology Corp | 雙擴散汲極金屬氧化物半導體元件及其製造方法 |
Families Citing this family (84)
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---|---|---|---|---|
US5306652A (en) * | 1991-12-30 | 1994-04-26 | Texas Instruments Incorporated | Lateral double diffused insulated gate field effect transistor fabrication process |
JP3221766B2 (ja) * | 1993-04-23 | 2001-10-22 | 三菱電機株式会社 | 電界効果トランジスタの製造方法 |
US5439831A (en) * | 1994-03-09 | 1995-08-08 | Siemens Aktiengesellschaft | Low junction leakage MOSFETs |
US5466616A (en) * | 1994-04-06 | 1995-11-14 | United Microelectronics Corp. | Method of producing an LDMOS transistor having reduced dimensions, reduced leakage, and a reduced propensity to latch-up |
US5512495A (en) * | 1994-04-08 | 1996-04-30 | Texas Instruments Incorporated | Method of manufacturing extended drain resurf lateral DMOS devices |
JP3275569B2 (ja) * | 1994-10-03 | 2002-04-15 | 富士電機株式会社 | 横型高耐圧電界効果トランジスタおよびその製造方法 |
US5585294A (en) * | 1994-10-14 | 1996-12-17 | Texas Instruments Incorporated | Method of fabricating lateral double diffused MOS (LDMOS) transistors |
US5534721A (en) * | 1994-11-30 | 1996-07-09 | At&T Corp. | Area-efficient layout for high voltage lateral devices |
US5753958A (en) * | 1995-10-16 | 1998-05-19 | Sun Microsystems, Inc. | Back-biasing in asymmetric MOS devices |
US6831331B2 (en) | 1995-11-15 | 2004-12-14 | Denso Corporation | Power MOS transistor for absorbing surge current |
US6242787B1 (en) | 1995-11-15 | 2001-06-05 | Denso Corporation | Semiconductor device and manufacturing method thereof |
JP3528420B2 (ja) * | 1996-04-26 | 2004-05-17 | 株式会社デンソー | 半導体装置およびその製造方法 |
SE513284C2 (sv) * | 1996-07-26 | 2000-08-14 | Ericsson Telefon Ab L M | Halvledarkomponent med linjär ström-till-spänningskarasterik |
US6160290A (en) * | 1997-11-25 | 2000-12-12 | Texas Instruments Incorporated | Reduced surface field device having an extended field plate and method for forming the same |
US5900663A (en) * | 1998-02-07 | 1999-05-04 | Xemod, Inc. | Quasi-mesh gate structure for lateral RF MOS devices |
US6340826B1 (en) * | 1998-03-30 | 2002-01-22 | Agisilaos Iliadis | Infra-red light emitting Si-MOSFET |
US6252278B1 (en) * | 1998-05-18 | 2001-06-26 | Monolithic Power Systems, Inc. | Self-aligned lateral DMOS with spacer drift region |
JP2000022142A (ja) * | 1998-06-29 | 2000-01-21 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
US6117738A (en) * | 1998-11-20 | 2000-09-12 | United Microelectronics Corp. | Method for fabricating a high-bias semiconductor device |
US6424005B1 (en) * | 1998-12-03 | 2002-07-23 | Texas Instruments Incorporated | LDMOS power device with oversized dwell |
US6084277A (en) * | 1999-02-18 | 2000-07-04 | Power Integrations, Inc. | Lateral power MOSFET with improved gate design |
JP3374099B2 (ja) * | 1999-03-12 | 2003-02-04 | 三洋電機株式会社 | 半導体装置の製造方法 |
US6211552B1 (en) * | 1999-05-27 | 2001-04-03 | Texas Instruments Incorporated | Resurf LDMOS device with deep drain region |
US6365932B1 (en) | 1999-08-20 | 2002-04-02 | Denso Corporation | Power MOS transistor |
DE60040798D1 (de) * | 1999-10-27 | 2008-12-24 | Kansai Electric Power Co | Halbleiteranordnung mit Driftbereichen mit entgegengesetzten Leitungstypen |
US6599782B1 (en) * | 2000-01-20 | 2003-07-29 | Sanyo Electric Co., Ltd. | Semiconductor device and method of fabricating thereof |
IL134701A0 (en) * | 2000-02-23 | 2001-04-30 | J P M E D Ltd | Homogeneous solid matrix containing vegetable proteins |
EP1158583A1 (en) | 2000-05-23 | 2001-11-28 | STMicroelectronics S.r.l. | Low on-resistance LDMOS |
TW521437B (en) | 2000-10-19 | 2003-02-21 | Sanyo Electric Co | Semiconductor device and process thereof |
GB0107408D0 (en) * | 2001-03-23 | 2001-05-16 | Koninkl Philips Electronics Nv | Field effect transistor structure and method of manufacture |
JP3431909B2 (ja) * | 2001-08-21 | 2003-07-28 | 沖電気工業株式会社 | Ldmosトランジスタの製造方法 |
US6730962B2 (en) * | 2001-12-07 | 2004-05-04 | Texas Instruments Incorporated | Method of manufacturing and structure of semiconductor device with field oxide structure |
EP1321985B1 (en) * | 2001-12-20 | 2007-10-24 | STMicroelectronics S.r.l. | Method of integrating metal oxide semiconductor field effect transistors |
KR100867574B1 (ko) * | 2002-05-09 | 2008-11-10 | 페어차일드코리아반도체 주식회사 | 고전압 디바이스 및 그 제조방법 |
US7825488B2 (en) | 2006-05-31 | 2010-11-02 | Advanced Analogic Technologies, Inc. | Isolation structures for integrated circuits and modular methods of forming the same |
US7667268B2 (en) * | 2002-08-14 | 2010-02-23 | Advanced Analogic Technologies, Inc. | Isolated transistor |
JP4825688B2 (ja) * | 2002-09-11 | 2011-11-30 | 株式会社東芝 | 半導体装置の製造方法 |
US7719054B2 (en) * | 2006-05-31 | 2010-05-18 | Advanced Analogic Technologies, Inc. | High-voltage lateral DMOS device |
US6921946B2 (en) * | 2002-12-16 | 2005-07-26 | Koninklijke Philips Electronics N.V. | Test structure for electrical well-to-well overlay |
US20040201078A1 (en) * | 2003-04-11 | 2004-10-14 | Liping Ren | Field plate structure for high voltage devices |
DE102004009521B4 (de) * | 2004-02-27 | 2020-06-10 | Austriamicrosystems Ag | Hochvolt-PMOS-Transistor, Maske zur Herstellung einer Wanne und Verfahren zur Herstellung eines Hochvolt-PMOS-Transistors |
KR100540371B1 (ko) * | 2004-03-02 | 2006-01-11 | 이태복 | 고 내압용 반도체 소자 및 그 제조방법 |
US20080164537A1 (en) * | 2007-01-04 | 2008-07-10 | Jun Cai | Integrated complementary low voltage rf-ldmos |
US7125777B2 (en) * | 2004-07-15 | 2006-10-24 | Fairchild Semiconductor Corporation | Asymmetric hetero-doped high-voltage MOSFET (AH2MOS) |
US7312481B2 (en) * | 2004-10-01 | 2007-12-25 | Texas Instruments Incorporated | Reliable high-voltage junction field effect transistor and method of manufacture therefor |
US20060097292A1 (en) * | 2004-10-29 | 2006-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device |
JP4387291B2 (ja) * | 2004-12-06 | 2009-12-16 | パナソニック株式会社 | 横型半導体デバイスおよびその製造方法 |
KR100629605B1 (ko) * | 2004-12-31 | 2006-09-27 | 동부일렉트로닉스 주식회사 | 엘디모스 채널 형성 방법 |
US7109562B2 (en) * | 2005-02-07 | 2006-09-19 | Leadtrend Technology Corp. | High voltage laterally double-diffused metal oxide semiconductor |
US7381603B2 (en) * | 2005-08-01 | 2008-06-03 | Semiconductor Components Industries, L.L.C. | Semiconductor structure with improved on resistance and breakdown voltage performance |
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US7671411B2 (en) | 2006-03-02 | 2010-03-02 | Volterra Semiconductor Corporation | Lateral double-diffused MOSFET transistor with a lightly doped source |
JP5061538B2 (ja) * | 2006-09-01 | 2012-10-31 | 株式会社デンソー | 半導体装置 |
CN100446275C (zh) * | 2006-09-14 | 2008-12-24 | 电子科技大学 | 高压SensorFET器件 |
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US7807555B2 (en) * | 2007-07-31 | 2010-10-05 | Intersil Americas, Inc. | Method of forming the NDMOS device body with the reduced number of masks |
US7999318B2 (en) * | 2007-12-28 | 2011-08-16 | Volterra Semiconductor Corporation | Heavily doped region in double-diffused source MOSFET (LDMOS) transistor and a method of fabricating the same |
JP5272410B2 (ja) * | 2008-01-11 | 2013-08-28 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP5329118B2 (ja) * | 2008-04-21 | 2013-10-30 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Dmosトランジスタ |
US8097930B2 (en) * | 2008-08-08 | 2012-01-17 | Infineon Technologies Ag | Semiconductor devices with trench isolations |
JP5487852B2 (ja) * | 2008-09-30 | 2014-05-14 | サンケン電気株式会社 | 半導体装置 |
JP5349885B2 (ja) | 2008-09-30 | 2013-11-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
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US7745294B2 (en) * | 2008-11-10 | 2010-06-29 | Texas Instruments Incorporated | Methods of manufacturing trench isolated drain extended MOS (demos) transistors and integrated circuits therefrom |
US8643090B2 (en) * | 2009-03-23 | 2014-02-04 | Infineon Technologies Ag | Semiconductor devices and methods for manufacturing a semiconductor device |
US9385241B2 (en) * | 2009-07-08 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrostatic discharge (ESD) protection circuits, integrated circuits, systems, and methods for forming the ESD protection circuits |
CN101964361B (zh) * | 2009-07-24 | 2012-08-29 | 新唐科技股份有限公司 | 金属氧化半导体晶体管与其制造方法 |
JP5434501B2 (ja) * | 2009-11-13 | 2014-03-05 | 富士通セミコンダクター株式会社 | Mosトランジスタおよび半導体集積回路装置、半導体装置 |
US20120037989A1 (en) * | 2010-08-16 | 2012-02-16 | Macronix International Co., Ltd. | Ldmos having single-strip source contact and method for manufacturing same |
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US8754469B2 (en) * | 2010-10-26 | 2014-06-17 | Texas Instruments Incorporated | Hybrid active-field gap extended drain MOS transistor |
US8963199B2 (en) | 2011-03-18 | 2015-02-24 | Renesas Electronics Corporation | Semiconductor device and method for manufacturing same |
US8685824B2 (en) * | 2012-06-21 | 2014-04-01 | Richtek Technology Corporation, R.O.C. | Hybrid high voltage device and manufacturing method thereof |
JP2014138091A (ja) * | 2013-01-17 | 2014-07-28 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
EP3024018B1 (en) * | 2013-07-19 | 2018-08-08 | Nissan Motor Co., Ltd | Semiconductor device |
JP2015023208A (ja) * | 2013-07-22 | 2015-02-02 | 旭化成エレクトロニクス株式会社 | 電界効果トランジスタ及び半導体装置、電界効果トランジスタの製造方法 |
US9245996B2 (en) | 2014-01-02 | 2016-01-26 | United Microelectronics Corp. | Lateral double-diffused metal-oxide-semiconudctor transistor device and layout pattern for LDMOS transistor device |
JP6339404B2 (ja) * | 2014-04-10 | 2018-06-06 | 旭化成エレクトロニクス株式会社 | 半導体装置の製造方法及び半導体装置 |
CN105720099A (zh) * | 2014-12-02 | 2016-06-29 | 无锡华润上华半导体有限公司 | N型横向双扩散金属氧化物半导体场效应管 |
KR102177431B1 (ko) * | 2014-12-23 | 2020-11-11 | 주식회사 키 파운드리 | 반도체 소자 |
JP6740831B2 (ja) * | 2016-09-14 | 2020-08-19 | 富士電機株式会社 | 半導体装置 |
CN110120423B (zh) * | 2019-05-05 | 2022-03-22 | 南京邮电大学 | 一种ldmos器件及其制备方法 |
US11658184B2 (en) * | 2020-12-02 | 2023-05-23 | Texas Instruments Incorporated | Fin field effect transistor with merged drift region |
CN114823340A (zh) * | 2021-01-29 | 2022-07-29 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及半导体结构的形成方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5654071A (en) * | 1979-10-09 | 1981-05-13 | Nec Corp | Insulated gate field-effect transistor |
JPS5670662A (en) * | 1979-11-13 | 1981-06-12 | Nec Corp | Insulated gate type field effect transistor |
US4394674A (en) * | 1979-10-09 | 1983-07-19 | Nippon Electric Co., Ltd. | Insulated gate field effect transistor |
DE3046749C2 (de) * | 1979-12-10 | 1986-01-16 | Sharp K.K., Osaka | MOS-Transistor für hohe Betriebsspannungen |
US4947232A (en) * | 1980-03-22 | 1990-08-07 | Sharp Kabushiki Kaisha | High voltage MOS transistor |
JPS56160072A (en) * | 1980-04-23 | 1981-12-09 | Nec Corp | Manufacture of insulated gate type field effect transistor |
JPS56169369A (en) * | 1980-05-30 | 1981-12-26 | Sharp Corp | High withstand voltage mos field effect semiconductor device |
JPS5759383A (en) * | 1980-09-29 | 1982-04-09 | Hitachi Ltd | Mos semiconductor device |
JPS57106165A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Insulating gate type field-effect transistor |
JPS5889866A (ja) * | 1981-11-24 | 1983-05-28 | Hitachi Ltd | 絶縁ゲ−ト半導体装置 |
EP0114435B1 (en) * | 1982-12-21 | 1987-03-18 | Koninklijke Philips Electronics N.V. | Lateral dmos transistor devices suitable for sourcefollower applications |
JPS6179260A (ja) * | 1984-09-26 | 1986-04-22 | Nec Corp | 高電圧絶縁ゲ−ト型電界効果トランジスタ |
JPS61171165A (ja) * | 1985-01-25 | 1986-08-01 | Nissan Motor Co Ltd | Mosトランジスタ |
US4912053A (en) * | 1988-02-01 | 1990-03-27 | Harris Corporation | Ion implanted JFET with self-aligned source and drain |
JPH02102575A (ja) * | 1988-10-11 | 1990-04-16 | Nec Corp | 半導体装置 |
JP2730088B2 (ja) * | 1988-10-12 | 1998-03-25 | 日本電気株式会社 | 高耐圧半導体装置 |
US5055896A (en) * | 1988-12-15 | 1991-10-08 | Siliconix Incorporated | Self-aligned LDD lateral DMOS transistor with high-voltage interconnect capability |
US4966858A (en) * | 1989-11-02 | 1990-10-30 | Motorola, Inc. | Method of fabricating a lateral semiconductor structure including field plates for self-alignment |
-
1992
- 1992-10-13 DE DE69225552T patent/DE69225552T2/de not_active Expired - Lifetime
- 1992-10-13 EP EP92117474A patent/EP0537684B1/en not_active Expired - Lifetime
- 1992-10-14 KR KR1019920018876A patent/KR100232369B1/ko not_active Expired - Lifetime
- 1992-10-15 JP JP27743692A patent/JP3187980B2/ja not_active Expired - Lifetime
- 1992-11-16 US US07/976,713 patent/US5304827A/en not_active Expired - Lifetime
-
1993
- 1993-05-18 TW TW082103870A patent/TW224538B/zh not_active IP Right Cessation
-
1994
- 1994-03-16 US US08/213,887 patent/US5382535A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2445469A (en) * | 2007-01-05 | 2008-07-09 | Snap On Tools Corp | Adjustable tool extender |
GB2445469B (en) * | 2007-01-05 | 2011-07-27 | Snap On Tools Corp | Adjustable tool extender |
US8534165B2 (en) | 2007-01-05 | 2013-09-17 | Snap-On Incorporated | Adjustable tool extender |
TWI476923B (zh) * | 2012-05-04 | 2015-03-11 | Richtek Technology Corp | 雙擴散汲極金屬氧化物半導體元件及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE69225552D1 (de) | 1998-06-25 |
KR100232369B1 (ko) | 1999-12-01 |
US5382535A (en) | 1995-01-17 |
EP0537684B1 (en) | 1998-05-20 |
EP0537684A1 (en) | 1993-04-21 |
JP3187980B2 (ja) | 2001-07-16 |
DE69225552T2 (de) | 1999-01-07 |
US5304827A (en) | 1994-04-19 |
KR930009101A (ko) | 1993-05-22 |
JPH05267652A (ja) | 1993-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |