TW201121405A - Electro-magnetic wave shielding film and wiring board - Google Patents
Electro-magnetic wave shielding film and wiring board Download PDFInfo
- Publication number
- TW201121405A TW201121405A TW099130279A TW99130279A TW201121405A TW 201121405 A TW201121405 A TW 201121405A TW 099130279 A TW099130279 A TW 099130279A TW 99130279 A TW99130279 A TW 99130279A TW 201121405 A TW201121405 A TW 201121405A
- Authority
- TW
- Taiwan
- Prior art keywords
- wave shielding
- electromagnetic wave
- shielding film
- conductive layer
- silver powder
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000002050 diffraction method Methods 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 abstract description 6
- 239000004332 silver Substances 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 37
- 238000000576 coating method Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- -1 or the like Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 5
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000007561 laser diffraction method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- TWJNQYPJQDRXPH-UHFFFAOYSA-N 2-cyanobenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1C#N TWJNQYPJQDRXPH-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- 235000021360 Myristic acid Nutrition 0.000 description 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Natural products CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 101001012040 Pseudomonas aeruginosa (strain ATCC 15692 / DSM 22644 / CIP 104116 / JCM 14847 / LMG 12228 / 1C / PRS 101 / PAO1) Immunomodulating metalloprotease Proteins 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- SNPPWIUOZRMYNY-UHFFFAOYSA-N bupropion Chemical compound CC(C)(C)NC(C)C(=O)C1=CC=CC(Cl)=C1 SNPPWIUOZRMYNY-UHFFFAOYSA-N 0.000 description 1
- 229960001058 bupropion Drugs 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009216317 | 2009-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201121405A true TW201121405A (en) | 2011-06-16 |
Family
ID=43867163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099130279A TW201121405A (en) | 2009-09-18 | 2010-09-08 | Electro-magnetic wave shielding film and wiring board |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2011086930A (enExample) |
| KR (1) | KR20110031100A (enExample) |
| CN (1) | CN102026530B (enExample) |
| TW (1) | TW201121405A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5726048B2 (ja) * | 2011-11-14 | 2015-05-27 | 藤森工業株式会社 | Ｆｐｃ用電磁波シールド材 |
| KR102017121B1 (ko) | 2012-03-06 | 2019-09-02 | 토요잉크Sc홀딩스주식회사 | 도전성 미립자 및 그 제조 방법, 도전성 수지 조성물, 도전성 시트 및 전자파 차폐 시트 |
| CN105744818A (zh) * | 2016-02-03 | 2016-07-06 | 中电海康集团有限公司 | 一种柔性磁屏蔽和抗辐照薄膜 |
| CN107787111A (zh) * | 2016-08-25 | 2018-03-09 | 上海逻骅投资管理合伙企业（有限合伙） | 印刷电路板基材及其制造方法 |
| JP6564920B2 (ja) | 2017-09-27 | 2019-08-21 | Ｄｏｗａエレクトロニクス株式会社 | 銀粉混合物およびその製造方法並びに導電性ペースト |
| JP2021061365A (ja) * | 2019-10-09 | 2021-04-15 | 信越ポリマー株式会社 | 電磁波シールドフィルム、回路基板、及び回路基板の製造方法 |
| EP4181645A4 (en) | 2020-07-08 | 2024-07-24 | Daicel Corporation | Resin molded body, and method for manufacturing same |
| EP4460161A4 (en) | 2021-12-27 | 2025-11-26 | Daicel Corp | SURFACE STRUCTURES |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06306201A (ja) * | 1993-04-23 | 1994-11-01 | Toyo Ink Mfg Co Ltd | 電磁波遮蔽性樹脂組成物 |
| JP2000216591A (ja) * | 1999-01-25 | 2000-08-04 | Matsushita Electric Ind Co Ltd | シ―ルド材 |
| JP3510834B2 (ja) * | 2000-01-28 | 2004-03-29 | 株式会社巴川製紙所 | 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板 |
| JP2002158487A (ja) * | 2000-11-20 | 2002-05-31 | Nok Corp | グロメット |
| JP3874634B2 (ja) * | 2001-08-10 | 2007-01-31 | 福田金属箔粉工業株式会社 | 導体ペースト用のフレーク状銀粉及びそれを用いた導体ペースト |
| JP2004022568A (ja) * | 2002-06-12 | 2004-01-22 | Nishizaki:Kk | マイナスイオン効果を有する電磁波シールド部材 |
| JP3894312B2 (ja) * | 2002-10-31 | 2007-03-22 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物及び導電性ゴム部材 |
| JP2004231792A (ja) * | 2003-01-30 | 2004-08-19 | Nippon Perunotsukusu Kk | 難燃性導電接着性組成物、フィルムおよびフラットケーブル |
| JP4363340B2 (ja) * | 2004-03-12 | 2009-11-11 | 住友電気工業株式会社 | 導電性銀ペースト及びそれを用いた電磁波シールド部材 |
| JP2005277262A (ja) * | 2004-03-26 | 2005-10-06 | Toray Ind Inc | 電磁波シールドフィルム |
| JP4673573B2 (ja) * | 2004-04-21 | 2011-04-20 | 小松精練株式会社 | 電磁波シールド材の製造方法 |
| JP4324029B2 (ja) * | 2004-06-25 | 2009-09-02 | 住友電工プリントサーキット株式会社 | 金属膜及び接着剤層を有する積層フィルム及びその製造方法 |
| KR100624316B1 (ko) * | 2004-12-30 | 2006-09-13 | 제일모직주식회사 | 도전성 페인트 조성물 및 이를 적용한 전자파 차폐용도전막 |
| CN100584180C (zh) * | 2005-02-18 | 2010-01-20 | 东洋油墨制造株式会社 | 电磁波屏蔽性粘合薄膜、其制备方法以及被粘合物的电磁波屏蔽方法 |
| CN100363450C (zh) * | 2005-11-04 | 2008-01-23 | 上海市合成树脂研究所 | 一种水基导电涂料 |
| JP4635888B2 (ja) * | 2006-02-01 | 2011-02-23 | 藤倉化成株式会社 | 導電性ペーストおよび導電性回路の製造方法 |
| CN101108947A (zh) * | 2006-07-21 | 2008-01-23 | 靳一名 | 一种镀银铜粉导电涂料及其制备方法 |
| JP2008028258A (ja) * | 2006-07-24 | 2008-02-07 | Nisshinbo Ind Inc | 積層シートおよびその製造方法 |
| JP2008177463A (ja) * | 2007-01-22 | 2008-07-31 | Kyocera Chemical Corp | フレキシブル配線板用接着剤組成物、フレキシブル配線板用カバーレイ、および電磁波シールド層付フレキシブル配線板 |
| JP2008171828A (ja) * | 2008-03-26 | 2008-07-24 | Toyobo Co Ltd | 導電性ペースト及びこれを用いた印刷回路 |
| CN101279369B (zh) * | 2008-05-15 | 2010-08-25 | 金川集团有限公司 | 高分散性片状银粉的制备方法 |
| JP5847516B2 (ja) * | 2010-10-01 | 2016-01-20 | Ｄｏｗａエレクトロニクス株式会社 | フレーク状銀粉及び導電性ペースト |
-
2010
- 2010-09-08 TW TW099130279A patent/TW201121405A/zh unknown
- 2010-09-10 KR KR1020100088675A patent/KR20110031100A/ko not_active Withdrawn
- 2010-09-17 JP JP2010208686A patent/JP2011086930A/ja active Pending
- 2010-09-17 CN CN201010288051.0A patent/CN102026530B/zh active Active
-
2014
- 2014-10-31 JP JP2014222568A patent/JP2015073105A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN102026530B (zh) | 2015-09-30 |
| JP2015073105A (ja) | 2015-04-16 |
| JP2011086930A (ja) | 2011-04-28 |
| CN102026530A (zh) | 2011-04-20 |
| KR20110031100A (ko) | 2011-03-24 |
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