TW200738852A - Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit - Google Patents

Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit

Info

Publication number
TW200738852A
TW200738852A TW095148244A TW95148244A TW200738852A TW 200738852 A TW200738852 A TW 200738852A TW 095148244 A TW095148244 A TW 095148244A TW 95148244 A TW95148244 A TW 95148244A TW 200738852 A TW200738852 A TW 200738852A
Authority
TW
Taiwan
Prior art keywords
polishing
semiconductor integrated
acid
integrated circuit
polishing composition
Prior art date
Application number
TW095148244A
Other languages
English (en)
Chinese (zh)
Inventor
Iori Yoshida
Hiroyuki Kamiya
Satoshi Takemiya
Atsushi Hayashi
Norihito Nakazawa
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200738852A publication Critical patent/TW200738852A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095148244A 2005-12-21 2006-12-21 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit TW200738852A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005368082 2005-12-21
JP2006125474 2006-04-28
JP2006277585 2006-10-11

Publications (1)

Publication Number Publication Date
TW200738852A true TW200738852A (en) 2007-10-16

Family

ID=38188693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148244A TW200738852A (en) 2005-12-21 2006-12-21 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit

Country Status (6)

Country Link
EP (1) EP1965417B1 (enExample)
JP (3) JP4277930B2 (enExample)
KR (1) KR20080078840A (enExample)
CN (1) CN101346804B (enExample)
TW (1) TW200738852A (enExample)
WO (1) WO2007072918A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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JPWO2008155987A1 (ja) * 2007-06-20 2010-08-26 旭硝子株式会社 研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法
KR20100020975A (ko) * 2007-06-20 2010-02-23 아사히 가라스 가부시키가이샤 연마용 조성물 및 반도체 집적 회로 장치의 제조 방법
JP5226278B2 (ja) * 2007-11-08 2013-07-03 株式会社クラレ 研磨用スラリー
JP5413567B2 (ja) * 2008-02-06 2014-02-12 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
WO2009098924A1 (ja) * 2008-02-06 2009-08-13 Jsr Corporation 化学機械研磨用水系分散体および化学機械研磨方法
JP5413568B2 (ja) * 2008-02-06 2014-02-12 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5413566B2 (ja) * 2008-02-06 2014-02-12 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2009224771A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333740B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333744B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨方法および化学機械研磨用水系分散体の製造方法
JP2010028079A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333742B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2009224767A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333739B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
WO2009104517A1 (ja) * 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
KR20100123678A (ko) * 2008-02-18 2010-11-24 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
JP2010041027A (ja) * 2008-02-18 2010-02-18 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010028077A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010034497A (ja) * 2008-02-18 2010-02-12 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010028078A (ja) * 2008-02-18 2010-02-04 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP2010016344A (ja) * 2008-02-18 2010-01-21 Jsr Corp 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333741B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5333743B2 (ja) * 2008-02-18 2013-11-06 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法
JP5782257B2 (ja) * 2008-05-01 2015-09-24 Jsr株式会社 化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法
TW201012909A (en) * 2008-08-28 2010-04-01 Asahi Glass Co Ltd Abrasive composition and method for manufacturing semiconductor integrated circuit device
TWI457423B (zh) * 2008-11-10 2014-10-21 旭硝子股份有限公司 A polishing composition, and a method for manufacturing a semiconductor integrated circuit device
JP6051679B2 (ja) * 2012-08-22 2016-12-27 住友電気工業株式会社 研磨用組成物および化合物半導体基板の製造方法
WO2015140850A1 (ja) * 2014-03-20 2015-09-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
EP3268810B1 (en) * 2015-03-12 2022-07-06 Merck Patent GmbH Compositions and methods that promote charge complexing copper protection during low pka driven polymer stripping
CN110447090A (zh) * 2017-03-22 2019-11-12 三菱化学株式会社 半导体器件用基板的清洗液、半导体器件用基板的清洗方法、半导体器件用基板的制造方法和半导体器件用基板
JP7002853B2 (ja) * 2017-04-03 2022-01-20 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法
CN107841288A (zh) * 2017-12-12 2018-03-27 戚明海 Cmp研磨剂及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171858B2 (ja) * 1999-06-23 2008-10-29 Ｊｓｒ株式会社 研磨用組成物および研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
TWI291987B (en) * 2003-07-04 2008-01-01 Jsr Corp Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
ATE463838T1 (de) * 2003-09-30 2010-04-15 Fujimi Inc Polierzusammensetzung und polierverfahren
TWI347969B (en) * 2003-09-30 2011-09-01 Fujimi Inc Polishing composition
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride

Also Published As

Publication number Publication date
EP1965417A1 (en) 2008-09-03
EP1965417A4 (en) 2009-08-05
EP1965417B1 (en) 2013-03-06
WO2007072918A1 (ja) 2007-06-28
CN101346804A (zh) 2009-01-14
CN101346804B (zh) 2010-05-26
KR20080078840A (ko) 2008-08-28
JP2008283203A (ja) 2008-11-20
JP4277930B2 (ja) 2009-06-10
JPWO2007072918A1 (ja) 2009-06-04
JP2009152646A (ja) 2009-07-09

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