Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/14—Anti-slip materials; Abrasives
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/14—Anti-slip materials; Abrasives
  • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
  • C09K3/1463—Aqueous liquid suspensions
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09G—POLISHING COMPOSITIONS; SKI WAXES
  • C09G1/00—Polishing compositions
  • C09G1/02—Polishing compositions containing abrasives or grinding agents
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/32115—Planarisation
  • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Definitions

• Patent Document 4 Japanese Patent Laid-Open No. 2002-231666
• polishing composition as described in any one of 1 to 10 above, further comprising an abrasive.
• polishing composition 0.01-2 mass% of alicyclic succinic acid (A), polycarboxylic acid having 2 or more carboxy groups, and nitrogen-containing heterocyclic group, amino group, hydroxyl group and Thiol group strength group force A carboxylic acid having at least one selected group and one or more carboxy groups, a powerful group force 0.1-5 mass of at least one carboxylic acid (B-la) selected %, An aliphatic carboxylic acid having 11 or more carbon atoms (B-2) having a long-chain hydrocarbon group having 10 or more carbon atoms and one or more carboxy groups, 0 to 0.5% by mass, and an oxidizing agent.
• a carboxylic acid having at least one selected group and one or more carboxy groups a powerful group force 0.1-5 mass of at least one carboxylic acid (B-la) selected %
• the polishing composition according to the above 14 or 15, comprising an oxidizing agent, a metal oxide solubilizer, a protective film forming agent, and water.
• polishing composition according to 16 wherein the protective film forming agent is an alicyclic succinic acid (A) and has a pH value in the range of 7.5 to 12.
• the protective film forming agent is an alicyclic succinic acid (A) and has a pH value in the range of 7.5 to 12.
• a method for polishing a surface of a semiconductor integrated circuit comprising polishing a copper film formed on a surface having a groove for wiring using the polishing composition according to any one of 1 to 20 above.
• FIG. 2 is a schematic cross section of a patterned wafer for explaining erosion.
• the polishing composition of the present invention contains a neutralized carboxylic acid, an oxidizing agent, and water, and a part of the carboxylic acid is an alicyclic succinic acid, and has a pH value. Is a polishing composition in the range of 7.5-12.
• the polishing composition of the present invention may contain other components in addition to the above-mentioned components, and it is particularly preferable that the abrasive contains a surfactant.
• the polishing composition of the present invention is characterized by containing an alicyclic succinic acid and a carboxylic acid other than the alicyclic succinic acid.
• Maleic anhydride adduct maleic acid modified product
• fumaric acid adduct fumaric acid modified product
• One or more selected from the group power consisting of an acrylic acid adduct (modified acrylic acid), and a dehydrogenated product is preferable, and as the dehydrogenated product, a part of the alicyclic ring becomes an aromatic ring by dehydrogenation. Also included.
• carboxylic acid (B-1) a polycarboxylic acid, a group force including a nitrogen-containing heterocyclic group, an amino group, a hydroxyl group, and a thiol group, at least one selected group and one or more forces
• a carboxylic acid having a group and at least one carboxylic acid selected from the group consisting of power are preferred.
• This carboxylic acid is hereinafter referred to as carboxylic acid (B-la).
• the polycarboxylic acid may have a functional group such as a nitrogen-containing heterocyclic group. More preferred are polycarboxylic acids or monocarboxylic acids having a pyridine ring or a quinoline ring, or aliphatic polycarboxylic acids having 6 or less carbon atoms such as oxalic acid.
• Carboxylic acid having a hydroxyl group (such as hydroxycarboxylic acid): lactic acid, malic acid, citrate, isocitrate, tartaric acid, glycolic acid, darconic acid, salicylic acid.
• the carboxylic acid (B-3) an aliphatic monocarboxylic acid having no long-chain hydrocarbon group having 8 or more carbon atoms, an aliphatic monocarboxylic acid having less than 10 carbon atoms having no functional group, and a functional group.
• aromatic monocarboxylic acids there are aromatic monocarboxylic acids.
• the carboxylic acid (B-3) is a power that can be appropriately used depending on the purpose. Usually, it is not a necessary component.
• the polishing composition of the present invention may contain two or more of the carboxylic acids (B-1) and carboxylic acids (B-3).
• the aliphatic carboxylic acid (B-2) is an aliphatic carboxylic acid having 11 or more carbon atoms and having a long-chain hydrocarbon group having 8 or more carbon atoms and one or more carboxy groups.
• the aliphatic carboxylic acid (B2) is preferably an aliphatic carboxylic acid containing 1 to 3 carboxy groups that does not contain a functional group other than a carboxy group.
• the number of carboxy groups is particularly preferably 1 or 2.
• the long-chain hydrocarbon group has a chain of continuous carbon atoms having 6 or more carbon atoms, and does not include a side-chain alkyl group, or in the case of including it, an alkyl group having 2 or less carbon atoms.
• the aliphatic carboxylic acid (B-2) having the structure as described above is not an essential component in the polishing composition of the present invention, but in addition to the carboxylic acid (B-1), particularly the carboxylic acid (B-2). — It is preferable to use a small amount together with la).
• the aliphatic carboxylic acid (B-2) is considered to perform a surfactant function in the polishing composition of the present invention.
• the solubility and dispersibility of the alicyclic oxalic acid (A) in water in the polishing composition of the present invention can be improved, or the alicyclic rosin can be added.
• the effect that the acid (A) promotes the action of forming a protective film on the surface of the copper film is obtained, and it is considered that the amount of dishing is more effectively suppressed.
• the mass and mass ratio of the carboxylic acid are those when the salt of the alicyclic succinic acid (A) or other organic carboxylic acid (B) is used. Even in terms of mass and mass ratio converted to carboxylic acid (COO H). That is, the polishing composition of the present invention is applied to the carbo Whether prepared using an acid or prepared using a carboxylate, the mass and mass ratio of the carboxylic acid should be the same if the molar amount is the same.
• a polishing agent used in the polishing method of the present invention contains a surfactant
• the principle is not clear, but it causes a chemical and physical action on the surface of the copper film so that the surface of the copper film is removed. A protective effect is obtained. Moreover, the effect that the dispersibility of an abrasive grain is improved is acquired.
• the surfactant that can be preferably contained include dodecylbenzene sulfonic acid, dodecyl sulfonic acid, and salts thereof, and the preferable content thereof for the polishing composition of the present invention is 0.01-0. 2% by weight.
• the salt include potassium salt and ammonia. Mus salt is preferably used.
• the metal oxide solubilizer corresponds to carboxylic acid (B-1) and carboxylic acid (B-la) in the above description
• the protective film forming agent refers to the protective film forming agent in the above description.
• alicyclic succinic acid (A) preferably has a pH value of 7.5 to 12, particularly preferably 8.5 to 10.5!
• the amount of dating is the depth represented by number 7 in Fig. 1 (b), as will be described later.
• the above dishing increase amount means that the copper is polished 200 nm at the dicing amount (X) at the time when the noria layer is exposed and the copper polishing rate before the barrier layer is exposed. It means the difference (Y-X) from the amount of dishing (Y) at the time of further polishing (ie over polishing) for the time required for.
• the polishing composition according to the present invention preferably has a polishing rate of copper before the barrier layer is exposed and is 100 times or more the polishing rate of the noria layer.
• this condition is added, it is often possible to further easily realize a highly accurate surface flatness when copper is used as a wiring metal.
• the second polishing step it is generally preferable to perform the second polishing step immediately after the first polishing step and complete the polishing using the second polishing step. Between the process and the second polishing process, other processes may be included before the first polishing process or after the second polishing process.
• the end time of the first polishing process, the start time and the end time of the second polishing process are not particularly limited and can be determined as appropriate according to the actual situation of polishing, but usually, a noria layer is provided on the insulating layer. It is preferable that when the provided copper layer is removed except for the wiring, the first polishing step is stopped and the second polishing step is started, and when the predetermined surface flatness is obtained, the second polishing step is stopped. .
• the material constituting the insulating layer which is one of the objects to be polished by the polishing composition according to the present invention, as such, any known one may be used.
• An example of a diacid-based carbon film can be given.
• the dioxide film is generally composed of a cross-linked structure of Si and O, and a force in which the ratio of the number of Si and O atoms is 1: 2 may be used.
• Tetraethoxysilane (TEOS) is a silane gas (SiH) and is deposited by plasma CVD as such a diacid oxide film.
• the polishing composition of the present invention when used, as shown in the above example, the initial dating value at the time when the barrier layer is exposed is small and does not substantially proceed due to overpolishing.
• overpolishing can be performed with sufficient margin without causing dating or erosion.
• the amount of dicing increase due to over-polishing can be suppressed to less than lOnm over the entire surface. At this time, no erosion occurs.
• the over-polishing is performed to remove the excess copper layer uniformly and evenly over the entire surface of the wafer, and when the polishing is finished, the amount of deicing is 20 nm. The effect that it can be made below is acquired.
• polishing compositions of Examples 1 to 5 and Examples 8 to 10 have an average primary particle size of 0.02.
• Example 11 The polishing composition of Example 11 was prepared in the same manner as in Example 2 except that the alicyclic succinic acid (A) was not contained.
• polishing compositions of Examples 12 to 14 except that dihydroabietic acid potassium salt, tetrahydroabietic acid potassium salt, and dehydroabietic acid potassium salt were used instead of rosin soap 30K as the alicyclic succinic acid, respectively. was prepared in the same manner as in Example 1.
• Example 16 Example 17, Example 18, and Example 19 were used except that Bandeis T-25K, Bandeis ⁇ -34 ⁇ , and Bandeis G-25— were used as the alicyclic oxalic acid, respectively.
• Example 17 the ⁇ value was set to 9.0.
• Bandeis 25—25 ⁇ and Bandeis ⁇ —34 ⁇ are trade names for the potassium salt of modified rosin produced by Harima Chemical Co.
• the monitoring was performed while monitoring the polishing end point using the ISRM Endpoint Detecting System.
• the tantalum-powered noria layer begins to be exposed, and after the polishing is finished until the polishing end point where the decrease in reflectivity almost stops and becomes constant, it is further over 30 seconds, 60 seconds or 25 seconds. Polished.
• the copper film on the noria layer has been removed except for a part of the wafer surface, and the excess copper film remaining in part is removed by overpolishing.
• the polishing time described in Table 2 below is the polishing time including the over polishing time.
• the content of 2-pyridine carboxylic acid, which is carboxylic acid (B-1), is 1% by mass; the content of ammonium persulfate, which is an oxidizing agent, is 1% by mass;
• the average primary particle size of colloidal silica was 20 nm and the content was 0.25% by mass; the pH adjuster used was constant with KOH, and the description was omitted in the table.
• Content means mass% with respect to the whole polishing composition mixed.
• dodecylbenzenesulfonic acid, which is a surfactant was neutralized with a pH adjuster and contained as another raw material.
• the pH adjuster used for neutralization is included in the pH adjusters in the table. Polishing evaluation was performed in the same manner as in Examples 1-19.
• Example 68 an alicyclic succinic acid (A) and a salt thereof were not contained, and a polishing composition was prepared with reference to Example 4 of JP-A No. 2002-12854.
• Example 72a and 72b only the amount of dishing is obtained when the over-polishing time is 30 seconds and 60 seconds. However, since it is considered that the dishing increases with the polishing time, both of these cases are dated. The increase is not expected to exceed 10 nm. In the case of Example 74a and b, the same applies to Example 75a and b. On the other hand, in the cases 73a and 73b, the dishing amount is already large at the time of the polishing end point, and the variation is also large.
• Table 7 summarizes the analysis results of the composition of the alicyclic succinic acid (A) used in each example.
• Rosin Soap 30K is 45 Abietic acid as a main component 55 mass 0/0, the dehydroabietic acid containing 20 to 25 weight 0/0, further, a rosin potassium salt containing It was found that about 13% by mass of fatty acid potassium salt containing linoleic acid and oleic acid as a main component was contained based on the total solid content of the fatty acid potassium salt combined.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Materials Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Priority Applications (3)

Applications Claiming Priority (6)

Publications (1)

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Cited By (27)

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• 2006
  • 2006-12-21 TW TW095148244A patent/TW200738852A/zh unknown
  • 2006-12-21 WO PCT/JP2006/325521 patent/WO2007072918A1/ja not_active Ceased
  • 2006-12-21 KR KR1020087014807A patent/KR20080078840A/ko not_active Withdrawn
  • 2006-12-21 JP JP2007551155A patent/JP4277930B2/ja not_active Expired - Fee Related
  • 2006-12-21 EP EP06835087A patent/EP1965417B1/en active Active
  • 2006-12-21 CN CN2006800487285A patent/CN101346804B/zh not_active Expired - Fee Related
• 2008
  • 2008-06-12 JP JP2008153645A patent/JP2008283203A/ja not_active Withdrawn
• 2009
  • 2009-04-06 JP JP2009092155A patent/JP2009152646A/ja not_active Withdrawn

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