TW200717743A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW200717743A
TW200717743A TW095136825A TW95136825A TW200717743A TW 200717743 A TW200717743 A TW 200717743A TW 095136825 A TW095136825 A TW 095136825A TW 95136825 A TW95136825 A TW 95136825A TW 200717743 A TW200717743 A TW 200717743A
Authority
TW
Taiwan
Prior art keywords
resin layer
sealing resin
semiconductor device
semiconductor chip
post
Prior art date
Application number
TW095136825A
Other languages
English (en)
Inventor
Osamu Miyata
Shingo Higuchi
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005356651A external-priority patent/JP2007165402A/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority claimed from JP2006271658A external-priority patent/JP5279180B2/ja
Publication of TW200717743A publication Critical patent/TW200717743A/zh

Links

Classifications

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    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095136825A 2005-10-03 2006-10-03 Semiconductor device TW200717743A (en)

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JP2005356651A JP2007165402A (ja) 2005-12-09 2005-12-09 半導体装置
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US8432046B2 (en) 2013-04-30
US20120032325A1 (en) 2012-02-09
WO2007040229A1 (ja) 2007-04-12
US20090224409A1 (en) 2009-09-10
KR20080049807A (ko) 2008-06-04
US8063495B2 (en) 2011-11-22
CN101278394B (zh) 2010-05-19
US8659174B2 (en) 2014-02-25
CN101278394A (zh) 2008-10-01

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