WO2005050751A3 - Encapsulation assembly for electronic devices - Google Patents

Encapsulation assembly for electronic devices Download PDF

Info

Publication number
WO2005050751A3
WO2005050751A3 PCT/US2004/037597 US2004037597W WO2005050751A3 WO 2005050751 A3 WO2005050751 A3 WO 2005050751A3 US 2004037597 W US2004037597 W US 2004037597W WO 2005050751 A3 WO2005050751 A3 WO 2005050751A3
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulation assembly
electronic devices
electronic device
encapsulation
barrier structure
Prior art date
Application number
PCT/US2004/037597
Other languages
French (fr)
Other versions
WO2005050751A2 (en
Inventor
James Daniel Tremel
Matthew Dewey Hubert
Original Assignee
Du Pont
James Daniel Tremel
Matthew Dewey Hubert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, James Daniel Tremel, Matthew Dewey Hubert filed Critical Du Pont
Priority to EP04800977A priority Critical patent/EP1683209A2/en
Priority to JP2006539838A priority patent/JP4980718B2/en
Publication of WO2005050751A2 publication Critical patent/WO2005050751A2/en
Publication of WO2005050751A3 publication Critical patent/WO2005050751A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Liquid Crystal (AREA)

Abstract

Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet; and a barrier structure that extends from the sheet, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. In some embodiments, the barrier structure is designed to be used with adhesives to bond the encapsulation assembly to the electronic device. Gettering materials may be optionally used.
PCT/US2004/037597 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices WO2005050751A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04800977A EP1683209A2 (en) 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices
JP2006539838A JP4980718B2 (en) 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
US60/519,139 2003-11-12
US61922204P 2004-10-15 2004-10-15
US60/619,222 2004-10-15

Publications (2)

Publication Number Publication Date
WO2005050751A2 WO2005050751A2 (en) 2005-06-02
WO2005050751A3 true WO2005050751A3 (en) 2005-07-28

Family

ID=34623092

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/037597 WO2005050751A2 (en) 2003-11-12 2004-11-10 Encapsulation assembly for electronic devices

Country Status (5)

Country Link
EP (1) EP1683209A2 (en)
JP (1) JP4980718B2 (en)
KR (1) KR20060113710A (en)
TW (1) TWI365677B (en)
WO (1) WO2005050751A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9004972B2 (en) 2006-01-20 2015-04-14 Samsung Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080211090A1 (en) * 2005-07-05 2008-09-04 Koninklijke Philips Electronics, N.V. Packed Semiconductor Sensor Chip For Use In Liquids
DE102005053722B4 (en) * 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Cover wafer, in the microsystem technology usable component with such a wafer and soldering method for connecting corresponding component parts
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100671647B1 (en) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 Organic light emitting display device
KR100732817B1 (en) * 2006-03-29 2007-06-27 삼성에스디아이 주식회사 Organic light-emitting display device and the preparing method of the same
DE102006016260B4 (en) * 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiple component with several components containing active structures (MEMS) for later separation, flat substrate or flat cap structure, component with active structures that can be used in microsystem technology, single substrate or cap structure with active structures and method for producing a multiple component
US7800303B2 (en) 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR20080051756A (en) * 2006-12-06 2008-06-11 삼성에스디아이 주식회사 Organic light emitting display apparatus and method of manufacturing thereof
TW200836580A (en) * 2007-02-28 2008-09-01 Corning Inc Seal for light emitting display device and method
TWI378592B (en) * 2007-09-04 2012-12-01 Iner Aec Executive Yuan Sealing material for solid oxide fuel cells
DE102007053849A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Arrangement comprising an optoelectronic component
ITMI20071903A1 (en) * 2007-10-04 2009-04-05 Getters Spa METHOD FOR THE PRODUCTION OF SOLAR PANELS THROUGH THE USE OF A POLYMER TRISTRATE INCLUDING A COMPOSITE GETTER SYSTEM
EP2053026B1 (en) * 2007-10-26 2014-04-02 Institute of Nuclear Energy Research, Atomic Energy Council Sealing material for solid oxide fuel cells
KR100976457B1 (en) * 2008-10-22 2010-08-17 삼성모바일디스플레이주식회사 Organic Electroluminescence Device And Method For Fabricating Of The Same
KR100993415B1 (en) * 2009-03-24 2010-11-09 삼성모바일디스플레이주식회사 Organic light emitting display device
KR101180234B1 (en) * 2009-04-03 2012-09-05 (주)엘지하우시스 Building integrated photovoltaic module with design layer
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
JP5382119B2 (en) * 2009-06-24 2014-01-08 三菱化学株式会社 Organic electronic device and manufacturing method thereof
US8505337B2 (en) * 2009-07-17 2013-08-13 Corning Incorporated Methods for forming fritted cover sheets and glass packages comprising the same
JP5824809B2 (en) 2010-02-10 2015-12-02 日本電気硝子株式会社 Sealing material and sealing method using the same
KR101297375B1 (en) * 2011-09-05 2013-08-19 주식회사 에스에프에이 Chemical Vapor Deposition Apparatus for Flat Display
JP2014007198A (en) * 2012-06-21 2014-01-16 Kaneka Corp Crystal silicon-based photoelectric conversion device and manufacturing method of the same
US8926337B2 (en) * 2012-08-24 2015-01-06 Apple Inc. Method for improving connector enclosure adhesion
JP6192911B2 (en) * 2012-09-10 2017-09-06 株式会社カネカ Organic EL device and manufacturing method thereof
JP6192912B2 (en) * 2012-09-14 2017-09-06 株式会社カネカ Organic EL device
TWI581422B (en) * 2013-05-15 2017-05-01 財團法人工業技術研究院 Environmental sensitive electronic device package
US9450202B2 (en) 2012-10-31 2016-09-20 Industrial Technology Research Institute Environmental sensitive electronic device package having side wall barrier structure
US8829507B2 (en) * 2012-12-06 2014-09-09 General Electric Company Sealed organic opto-electronic devices and related methods of manufacturing
JP6185304B2 (en) * 2013-06-28 2017-08-23 株式会社カネカ Crystalline silicon photoelectric conversion device and manufacturing method thereof
CN104030578B (en) * 2014-07-03 2016-08-17 王磊 Vacuum compound isolation fender member
CN107046104A (en) * 2017-01-10 2017-08-15 广东欧珀移动通信有限公司 OLED encapsulating structures and preparation method thereof
TWI750421B (en) * 2018-10-30 2021-12-21 立景光電股份有限公司 Display panel

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0910228A1 (en) * 1997-10-16 1999-04-21 TDK Corporation Organic electroluminescent device
EP1079666A2 (en) * 1999-08-20 2001-02-28 TDK Corporation Organic EL device
US6333460B1 (en) * 2000-04-14 2001-12-25 International Business Machines Corporation Structural support for direct lid attach
US20020108940A1 (en) * 1996-09-10 2002-08-15 Hembree David R. Circuit and method for heating an adhesive to package or rework a semiconductor die
EP1246272A2 (en) * 2001-03-30 2002-10-02 SANYO ELECTRIC Co., Ltd. Sealing structure of organic electroluminescent display
WO2003005774A1 (en) * 2001-05-24 2003-01-16 Orion Electric Co., Ltd. Container for encapsulating oled and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process
JPS61136247A (en) * 1984-12-07 1986-06-24 Toshiba Corp Semiconductor device
JP2000040585A (en) * 1998-07-21 2000-02-08 Tdk Corp Organic el element module
US6255239B1 (en) * 1998-12-04 2001-07-03 Cerdec Corporation Lead-free alkali metal-free glass compositions
US6933537B2 (en) * 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
JP3942017B2 (en) * 2002-03-25 2007-07-11 富士フイルム株式会社 Light emitting element
JP2005086032A (en) * 2003-09-09 2005-03-31 Kyocera Corp Vessel for accommodating piezoelectric vibrator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108940A1 (en) * 1996-09-10 2002-08-15 Hembree David R. Circuit and method for heating an adhesive to package or rework a semiconductor die
EP0910228A1 (en) * 1997-10-16 1999-04-21 TDK Corporation Organic electroluminescent device
EP1079666A2 (en) * 1999-08-20 2001-02-28 TDK Corporation Organic EL device
US6333460B1 (en) * 2000-04-14 2001-12-25 International Business Machines Corporation Structural support for direct lid attach
EP1246272A2 (en) * 2001-03-30 2002-10-02 SANYO ELECTRIC Co., Ltd. Sealing structure of organic electroluminescent display
WO2003005774A1 (en) * 2001-05-24 2003-01-16 Orion Electric Co., Ltd. Container for encapsulating oled and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9004972B2 (en) 2006-01-20 2015-04-14 Samsung Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure

Also Published As

Publication number Publication date
TW200524461A (en) 2005-07-16
JP2007516611A (en) 2007-06-21
JP4980718B2 (en) 2012-07-18
TWI365677B (en) 2012-06-01
KR20060113710A (en) 2006-11-02
WO2005050751A2 (en) 2005-06-02
EP1683209A2 (en) 2006-07-26

Similar Documents

Publication Publication Date Title
WO2005050751A3 (en) Encapsulation assembly for electronic devices
WO2006087653A3 (en) An oled device
TW200631064A (en) Semiconductor device
WO2007014294A3 (en) Solutions integrated circuit integration of alternative active area materials
EP1840941A3 (en) Semiconductor device and manufacturing method thereof
WO2008057671A3 (en) Electronic device including a conductive structure extending through a buried insulating layer
AU1904000A (en) Encapsulation for organic led device
WO2009086289A3 (en) Solar cell package for solar concentrator
WO2005119803A3 (en) Encapsulating oled devices
TW200723411A (en) Semiconductor devices having nitrogen-incorporated active region and methods of fabricating the same
WO2007095061A3 (en) Device including semiconductor nanocrystals and a layer including a doped organic material and methods
EP1617494A3 (en) Organic photovoltaic component with encapsulation
WO2006107507A3 (en) Wafer level package including a device wafer integrated with a passive component
TW200620657A (en) Recessed semiconductor device
TW200802790A (en) Electronic substrate, semiconductor device, and electronic device
WO2007051765A3 (en) Electrically programmable fuse
EP1909326A4 (en) Semiconductor element and electric device
TW200733026A (en) Circuit structure of a display
WO2008103331A3 (en) Wide-bandgap semiconductor devices
TW200723969A (en) Power core devices and methods of making thereof
WO2003030272A3 (en) Method for encapsulation of electronic devices
CA2409912A1 (en) Improvements in grounding and thermal dissipation for integrated circuit packages
WO2007081932A3 (en) Integrated iii-nitride devices
TW200503579A (en) Organic electronic device
TW200721418A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200480030779.6

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004800977

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: PA/a/2006/005270

Country of ref document: MX

WWE Wipo information: entry into national phase

Ref document number: 1020067009170

Country of ref document: KR

Ref document number: 2006539838

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2004800977

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020067009170

Country of ref document: KR