TW200524461A - Encapsulation assembly for electronic devices - Google Patents

Abstract

Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet; and a barrier structure that extends from the sheet, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. In some embodiments, the barrier structure is designed to be used with adhesives to bond the encapsulation assembly to the electronic device. Gettering materials may be optionally used.

Description

200524461 IX. Description of the invention: [Technical field to which the invention belongs] The present invention generally relates to a packaging assembly for an electronic device to prevent the electronic device from being exposed to pollutants. [Prior Art] Many electronic devices need to be protected from moisture, and in some cases, protected from oxygen, hydrogen, and / or organic vapors to prevent various types of degradation. These devices include organic light emitting diode (' OLED ") devices based on polymer or small molecule structures, microelectronic devices based on Shixi IC technology, and MEMS devices based on silicon micromachining. Exposure to the atmosphere can lead to cathodic degradation caused by oxide or hydroxide formation (resulting in reduced efficiency / brightness), corrosion, or static friction, respectively. Although there are various air-tight packaging and sealing technologies to solve this problem, these technologies have limitations in terms of performance life and manufacturability, resulting in high costs. [Summary of the Invention] The present invention provides a package assembly for an electronic device having a substrate and an active area. The package assembly includes: a barrier sheet, and a barrier structure extending from the sheet, where: # 此 卜The wall structure is configured such that the electronic device is substantially sealed when used on an electronic device in combination with an adhesive 2 M for bonding the package assembly to the device substrate; and wherein the barrier structure is not fused to the In one embodiment, the device is configured with a barrier structure so as to avoid direct contact with the substrate of the electronic device when the device is bonded to the package assembly. 97426.doc 200524461 The present invention also provides a package assembly for an electronic device having a substrate (which further has a sealing structure) and an active area, the package assembly including ... a barrier having a substantially flat surface Sheet; and a barrier structure extending from the flat surface, wherein: the barrier structure is configured such that the electronic device is substantially hermetically sealed when used on an electronic device; and wherein the barrier structure is configured such that it communicates with the electronic device The sealing structure on the device substrate is engaged. In an alternative method, the present invention provides a package assembly for an electronic device having a substrate, the substrate further having a barrier structure extending from the substrate and outside an active area, the package assembly comprising a The flat surface barrier sheet and a sealing structure; and wherein the sealing structure is configured so that it engages with the barrier structure on the device substrate. In another embodiment, the present invention provides a package assembly for an electronic device having a substrate and an active area, the package assembly comprising: a barrier sheet; and a barrier structure extending from a surface of the sheet, the The barrier structure further includes a heating element, wherein the barrier structure is configured such that the electronic device is substantially hermetically sealed when used on the electronic device. Electronic devices with such packages are also provided. The foregoing general description and the following detailed description are merely exemplary and explanatory 'and are not restrictive of the invention as defined by the scope of the accompanying patent application. [Embodiment] 97426.doc 200524461 The present invention provides a package assembly for an electronic device having a substrate and an active area. The package assembly includes: a barrier sheet; and a barrier structure extending from the sheet, wherein : The barrier structure is configured so that the electronic device is substantially hermetically sealed when used on an electronic device for bonding with the package assembly to the device substrate; and wherein the barrier The structure is not fused to the device substrate. In one embodiment, the barrier structure is configured so as to avoid direct contact with the electronic device substrate when the device is bonded to the package assembly. The present invention also provides a package assembly for an electronic device having a substrate (which further has a sealing structure) and an active area, the package assembly comprising: a barrier sheet having a substantially flat surface; and The flat surface extending barrier structure, wherein the barrier structure is configured so as to substantially hermetically seal the electronic device when used on an electronic device; and wherein the barrier structure is configured such that it is on the device substrate The sealing structure murmurs. In an alternative method, the present invention provides a package assembly for an electronic device having a substrate, the substrate further having a barrier structure extending from the substrate and outside an active area, the package assembly comprising a The flat surface barrier sheet and a sealing structure; and wherein the sealing structure is configured so that it engages with the barrier structure on the device substrate. In another embodiment, the present invention provides a package assembly for an electronic device having a substrate and an active area. The package assembly includes: 97426.doc 200524461 a barrier sheet; and a sheet extending from a surface of the sheet. A barrier structure, further comprising a heating element, wherein the barrier structure is configured to substantially hermetically seal the electronic device when used on an electronic device. The present invention also provides an electronic device with the special package assembly. The detailed description first proposes the definition and clarification of terms, and then proposes the electronic device structure. 1. Definition and clarification of terms Before defining details of the embodiments described below, some terms are defined or clarified. When the term " activation " as used herein relates to a radiation emitting electronic component, it is intended to provide an appropriate signal to the radiation emitting electronic component to emit radiation of a desired wavelength or wavelength spectrum. The term "adhesive" is intended to mean a solid or liquid substance capable of holding a material by surface attachment. Examples of adhesives include, but are not limited to, organic and inorganic materials such as those using the following materials: ethylene vinyl acetate Purpose, phenolic resin, rubber (natural and synthetic), carboxyl polymers, polyamide, polyimide, styrene butadiene copolymer, polyfilament, epoxy, urethane, acrylic, isocyanate, Polyvinyl acetate, & vinyl alcohol, polybenzimidazole, adhesives, cyanoacrylates, and mixtures and combinations thereof. The term, ambient conditions, is intended to mean conditions in the space in which humans are located. For example, in the microelectronics industry The ambient conditions of a clean room may include: a temperature of about 2 (rc, a relative humidity of about 40 / °), use of fluorescent lighting (with or without a yellow light fixture), no sunlight (from the outdoors), and floors "Artificial ... IV wall material" is intended to generally prevent related pollutants (such as air, oxygen, hydrogen, organic vaporization, etc.) under conditions where the final device will likely be exposed. Example, moisture) through a material may be used to make materials of barrier materials include (but are not limited to) · m glassy metals, metal oxides, metal nitrides, and combinations thereof.

The term `` P early wall sheet '' is intended to refer to the use of many known techniques, including spinning, extraction, molding, hammering, casting, pressing, rolling house, stone tooth light, and combinations thereof. A sheet or layer (which may have—or multiple sublayers or impregnated materials). In the implementation, the barrier sheet has a permeability of less than 1 () · 2 g / m2 / 24 hr / at_. The barrier sheet can be made of any material that has low gas and moisture permeability and is stable at the processing and operating temperatures to which it is exposed. Examples of materials that can be used for the barrier sheet include, but are not limited to: glass, ceramics, metals, metal oxides, metal nitrides, and combinations thereof. The term " pollutant, " is intended to mean oxygen, air, water, organic vapor, or other gaseous materials that can be destructive to sensitive areas of an electronic device, such as the electroactive area of an organic light emitting display.

The term " ceramic " is intended to mean an inorganic composition other than glass that can be used in its manufacture or subsequent use by firing, calcining, sintering or fusing at least a portion of the inorganic material, and forming, for example, porcelain or bricks The fired clay composition, and the refractory material are heat-treated to harden the inorganic composition. The term "packaging assembly" is intended to mean one or more electrons that can be used to cover and seal an electrically active region on a substrate. A component and forms a structure that at least partially seals the one or more electronic components to isolate them from ambient conditions. In combination with a substrate that includes one or more electronic components, the package assembly generally protects a portion of this (these) electronic components from damage originating from sources outside the electronic device 97426.doc -10-200524461. In one embodiment, a cover itself or a combination of other objects may form a device. The term "complementary overnight" is intended to mean one of two structures that complete each other: structure. The two structures that are complementary to each other are similar in shape, such as a triangular rib that fits into a triangular groove. The term "electronic active region" " It is intended to refer to an area of a substrate occupied by one or more circuits, one or more electronic components, or a combination thereof from a plan view. For example, in an organic light emitting display towel, the electroactive area includes a device portion having at least a luminescent material. And the term, "electronic device" is intended to mean a circuit, an electronic component, or a combination of these "functions" when properly connected and supplied with an appropriate potential. An electronic device can be used to design a device. A system may be considered as a part of a system. Examples of electronic devices include displays, sensor arrays: avionics, island fish, wide-source + reply, dead, telephone, and many other consumer types and Foreman

electronic product. M term, "salvation" is intended to mean the insertion lock, mesh, placement, reception, or any combination thereof of the first structure with respect to the second structure. The term " feed trough " is intended to mean a passageway that interlocks, engages, receives, or any combination thereof in one structure (e.g., a housing) with another (e.g., a 'feeding rib'). Two or two ribs " is intended to extend from a workpiece (e.g., a base plate) and be inserted into, e.g., an 'engagement slot,' interlock with the other structure, engage, place in a structure, or be received by the other structure Raised ridges. The term " getter material " is intended to mean a material used to absorb or a variety of undesirable materials (such as water, oxygen, t, organic vapors, and mixtures thereof) 97426.doc 200524461. The getter material can be a solid, a paste, a liquid, or a vapor. One type of getter material or a mixture or combination of two or more materials may be used. Examples include many materials such as inorganic molecular sieves such as zeolite. The term "glass" is intended to mean an inorganic composition that is primarily silicon dioxide and may contain one or more dopings to improve its properties. For example, rather than undoped glass, phosphorus-doped glass may be used To slow or substantially stop the migration of mobile ions; and compared to undoped glass, boron-doped glass can be used to reduce the flow temperature of this material. "Surge button heating element" is intended to mean a structure when current flows It will generate heat when passing through the structure or when the structure is exposed to light (such as electromagnetic radiation). The term "hermetically sealed" is intended to mean a structure (or a combination of multiple structures) that substantially prevents the passage of air, moisture, and other contaminants under ambient conditions. The term "occluded structure" is intended to be used to align two At least one of the complementary structures of a part (eg, Feng Jun assembly and housing). The occlusal structure can fit another occlusal structure to properly align the two parts. The term " top cover, which means-structure , Or its combination with—or more of its objects—can be used to cover or seal the electrically active area of a substrate: or multiple electronic components, and form at least a discrete seal of the multiple electronic components To isolate it from ambient conditions. The term "metallic" is intended to mean that it contains one or more metals. For example, the ten layers of metal may include: elemental metals themselves, cladding, alloys, plural layers of elements:, any combination of claddings or alloys, or any combination of the foregoing. The term " perimeter, ' intends to mean a closed curve that constrains the central area of the baffle. 97426.doc -12-200524461 The perimeter is not limited to any particular geometry. The term "organic electronic device" is intended to mean a four-unit organic electronic device including-or a plurality of semiconductor layers or materials, including: a paste that converts electrical energy into radiation, such as a 'light emitting diode, a light emitting diode display diode, (2) devices that detect signals by electronic methods (for example, light detection: ③ & lead batteries, photoresistors, light-controlled switches, photoelectric crystals, photoelectric & infrared (IR " Valence detectors or biosensors); (3) devices that convert radiation into electricity (for example, photovoltaic devices or solar cells); and (4) devices that include or include a bun assembly (for example, a transistor) Or a diode), wherein the or other electronic components include—or a plurality of organic semiconductor layers. The term "organic active layer" is intended to mean one or more organic layers, wherein one of the organic layers can form a rectifying junction itself or when in contact with a dissimilar material. The term " rectifying junction ,, It is intended that the interface in the semiconductor layer or the interface formed by the semiconductor layer and the interface between different materials. One type of charge carriers flows more easily through the interface in one direction than in the opposite direction. The ρη junction is an example of a rectifying junction that can be used as a diode. The "surgical entry seal structure" is intended to mean the complementary structure of the barrier structure, but it is not a complement to the substantial part of the early wall structure. For each instance, σ small case> shell or kudou is enough to make up the round end part of the semi-circular barrier structure. The term "structure" is intended to mean one or more patterned layers or members, itself or in combination with one or more other patterned layers or members, to form a unit for the desired purpose. 97426.doc 200524461 Terminology "Substrate" is intended to mean a workpiece that may be rigid or flexible and may include one or more layers of one or more materials including, but not limited to, glass, polymer, metal Or ceramic material or a combination thereof. The term "substantially continuous" is intended to mean that a structure extends without interruption and forms a closed geometric element (eg, triangle, rectangle, circle, loop, irregular shape, etc.). The term "transparent" is intended to mean the ability to transmit at least 70% of radiation at a wavelength or wavelength spectrum (eg, visible light). As used herein, the term "comprises / comprising,", "" includes / including "' ',' Has / having 'or any other variant thereof is intended to override non-exclusive inclusions. For example, a method, process, article, or device that contains a list of elements is not necessarily limited to those elements, but may include other elements that are not explicitly listed or that are inherent to the method, process, article, or device. In addition, unless expressly stated to the contrary, or " means inclusive or, rather than exclusive, L 'any of the following-the conditions satisfy the condition B. A is true (or exists) and 8 is False (or non-existent), a is false (or non-existent) and B is true (or existent), and all of [3] are true (or existent). μm, the use of-(a / an) " is used to describe the elements and parts of the present invention. This is done merely for the sake of giving the general meaning of the invention. :::: Enclose one or at least one ’and include the singular as well, unless clearly thinking otherwise. Team is not otherwise defined

^ All the technical and scientific words used for scare have the same meaning as those familiar with the buzzwords of the present invention. The following describes the appropriate method and the test can also be used in the test. It is also possible to use the practice or test of the method of the society + hair month. The methods and materials of Tian Shu are similar or equal. All publications, patent applications, patents, and other references mentioned herein are incorporated herein by reference in their entirety. In case of conflict, the present specification, including definitions, will control. In addition, the materials, methods, and examples are illustrative only and are not intended to be limiting. 2. Electronic device structure Electronic devices that can benefit from the present invention include (but are not limited to): light-emitting diodes, organic displays, photovoltaic devices, field emission displays, electrochemical displays, plasma displays, and micro-motor systems , Photonic devices, and other electronic devices using integrated circuits (for example, including (but not limited to) accelerators: gyroscopes, motion sensors). Therefore, the size of the package assembly can be very small and will vary based on the type of electronic device used with it. Referring to Figs. 1 to 3, an electronic device according to an embodiment is described, and it is generally designated as 500. In a specific embodiment, although the electronic device is an organic electronic device C, the electronic device may also be any electronic device including an internal area that needs to be sealed. As shown, in FIGS. 1 to 3, the electronic device 500 includes a substrate 502. The electroactive region 504 is formed on the substrate 502. In addition, the electronic device 500 includes a package assembly 506. As shown in FIGS. 2 and 3, the package assembly 506 includes a surface 508 and a barrier structure 510 extending from the surface 508 (i.e., the surface of the barrier sheet). In a specific embodiment, the barrier structure 51 (made of a barrier material) is a glass bead deposited or otherwise formed on the surface of the package assembly 506. The barrier structure 510 has a thickness, that is, a size at which it extends from the barrier sheet under its peak extension. The thickness may be a uniform thickness, or may vary depending on the type of the barrier sheet, the manufacturing method of the barrier sheet and the barrier structure, and the type of the device substrate to which the package assembly is ultimately attached. For example, barrier 97426.doc -15- 200524461 wall structure 510 may be made by first depositing a barrier material in a solid form, such as a paste or fluid, and then further processing the material to make the barrier structure. Or it can be made by, for example, other techniques to produce the barrier structure independently of the barrier sheet or the barrier structure 508 and the barrier structure 510 are co-manufactured. 2 and 3 also illustrate that the package assembly 506 may be formed with an inner region 512 on the barrier sheet 508. One or more layers 514 may be deposited on the inner region 512, such as on top of the inner region 512 (which It may be made with a cavity or may be substantially flat) or on the side of the inner region 512. Although this area is shown as a part of the formed barrier sheet, if the barrier structural element 5 is thick enough to be trapped in the electroactive region to be packaged, the internal region can be fabricated by using the element 510 itself. The layer 514 includes a getter material. In another specific embodiment, as shown in FIGS. 4 and 5, an adhesive 5 16 (which can be deposited in more than one location; as shown at 52) is an alternative embodiment illustrating the use of different adhesives ) Fixing the package assembly 506 to the substrate 502. In a specific embodiment, when the package assembly 506 is fixed to the substrate 502 using the adhesive 516, as depicted in FIG. 516 A barrier 518 is formed between the package assembly 506 and the substrate 502 to minimize the gap therebetween. When the device is packaged, the barrier structure is not fused to the surface of the barrier sheet and the device substrate at the same time. In addition, in a specific embodiment, the distance between the barrier structure 510 and the substrate 502 is not greater than 微米 microns. Therefore, the permeation path through the adhesive 516 is substantially narrowed, and the water permeation through the adhesive 516 is substantially reduced. 97426.doc -16- 200524461 Referring now to FIG. 6 and FIG. 7, an electronic device of an alternative embodiment is described, and it is generally labeled as 1000. As shown in FIG. 6, the electronic device 1000 includes a substrate 1002. In addition, an electroactive region 1000 is formed on the substrate 2000. In addition, the electronic device 1000 includes a package assembly 1006. As shown in Figs. 6 and 7, the package assembly 1006 includes a surface 1008 and a barrier structure 1010 fixed to the surface 1008. In a specific embodiment, the barrier structures 1010 are glass beads deposited or otherwise formed on the surface of the package assembly 1006. FIG. 6 and FIG. 7 also depict the heating element 1012 embedded in the barrier structure 1010. In a specific embodiment, the heating element 1012 can be selectively heated. In a specific embodiment, the heating element 1012 may be made of a compound having silicon nitride and a refractory metal such as titanium, tungsten, and a button, and may generate heat when the heating element 1012 is subjected to electromagnetic radiation. In another specific embodiment, the heating element may be a resistance wire that generates heat when a current is applied thereto. In a particular embodiment, a source 1014 is included, and the source can selectively expose the heating element 1012 to electromagnetic radiation or current. The heating may occur before the package assembly and the electronic device are assembled, or in some embodiments after this. During the assembly process, the barrier structure 1010 may be placed between the substrate 1002 and the package assembly 1006 so that the barrier structure is juxtaposed with the substrate 1002 and the package assembly 1006. In addition, during the assembling process, electromagnetic radiation or current may be applied to the heating element 1012 to heat the heating element 1012. When the temperature of the heating element ι012 reaches the melting point of the barrier structure 1010, the barrier structure 1010 will melt and fuse with the substrate 1002 and / or the package assembly 1006. Therefore, the barrier structure 1010 can be used to form an air-tight seal between the substrate 1002 and the package assembly 1006. In a specific embodiment, locally applying heat to the barrier structure 1010 can substantially prevent 97426.doc -17- 200524461 electronically active layer 1004 from otherwise melting the barrier structure 1010 and fusing it to the substrate 1002 described herein And the damage caused by the heat or electromagnetic radiation required for the package assembly. 6 and 7 further illustrate that the package assembly 1006 may be formed to have an internal region 1016, and one or more layers 1018 'may be deposited on the internal region 1016, such as on top of the internal region 1016. On or on the side of the internal area 1016. In a particular embodiment, layer 1018 includes a getter material, such as one or more getter materials described herein. Although not illustrated in the figure, it is further envisioned that the barrier structure 1010 can be deposited on the device substrate ', wherein a getter material is used in a manner otherwise depicted in the drawing. Referring to Fig. 8 ', an alternative embodiment of an electronic device is shown and designated 1200. FIG. 8 depicts an electronic device 1200 including a substrate 1202. In addition, the electroactive region 1204 is formed on the substrate 1202. The electronic device 120 also includes a package assembly 1206. As shown in FIG. 8, the package assembly 1206 includes a surface 1208 to which the barrier structure 1210 can be fixed. In a specific embodiment, the barrier structure 1210 is a glass bead that can be deposited between the surface 1208 and the substrate 1202 of the package assembly 1206. FIG. 8 also depicts a heating element 1212 that can fit into the surface 1208 of the package assembly 1206. In a specific embodiment, when the barrier structure 1210 is placed between the package assembly 1206 and the substrate 1202 so as to be juxtaposed with the package assembly 1206 and the substrate 1202, the heating element 1212 contacts the barrier structure 1210. In addition, when the heating element 1212 is heated, the barrier structure 1210 is soluble and fused with the package assembly 1206 and the substrate 'to form an air-tight seal around the electroactive region 1204. The localized heating associated with the heating element 1212 substantially reduces the damage to the electroactive area 1204 caused by overheating 97426.doc -18- 200524461. Referring to Fig. 9, an alternative embodiment of an electronic device is shown and designated 1300. FIG. 9 illustrates an electronic device 1300 including a substrate 1302. In addition, an electroactive region 1304 is formed on the substrate 1302. The electronic device 1300 also includes a package assembly 1306. As shown in FIG. 9, the package assembly 1306 includes a surface 1308 to which the barrier structure 1310 can be fixed. In a specific embodiment, the barrier structure 1310 is a glass bead that can be deposited between the surface 1308 of the package assembly 1306 and the substrate 1302. FIG. 9 also depicts that the heating element 1312 can be embedded in the substrate 1302 around the electroactive region 1304. In a specific embodiment, when the barrier structure 13 10 is placed between the package assembly 1306 and the substrate 1302 so as to be juxtaposed with the package assembly 130 and the substrate 1302, the heating element 13 12 contacts the barrier structure 1310. In addition, when the heating element 1312 is heated, the barrier structure 1310 can be melted and fused with the package assembly 1306 and the substrate to form an air-tight seal around the electrically active region 1304. 10 and FIG. 11, an electronic device according to an embodiment is illustrated, and is generally designated as 1400. As shown in FIGS. 10 and u, the electronic device 1400 includes a substrate 1402. An electroactive region 1404 is formed on the substrate 1402. In addition, the electronic device 1400 includes a package assembly 1406. As shown in FIG. 10 and FIG. 丨, the package assembly 1406 includes a surface 1408 and a barrier structure 1410 extending from the surface 1408. In a specific embodiment, the barrier structure 1410 is a glass bead formed with the package assembly 1406. In this example, the barrier structure μ is made of the same or different material as that used in the arid wall sheet, and can be made using a molding technique, and can be any desired barrier structure contour. In the description of FIG. 10, the thickness of the barrier structure 1410 is changed in its width 97426.doc -19-200524461. In a specific embodiment, the adhesive assembly 1412 can be used to fix the package assembly 1406 to the substrate 1402. In a specific embodiment, when using the adhesive 1412 to fix the package assembly 1406 to the substrate 1402, as depicted in FIG. 11, the adhesive 1412 and the barrier structure 1410 form an air-tight barrier between the package assembly 1406 and the substrate 1402. 1418. FIG. 12 illustrates an electronic device according to another embodiment, which is generally labeled as 160. As shown in FIG. 12 ', the electronic device 1600 includes a substrate 1602. The electroactive region 1604 is formed on the substrate 1602. In addition, the electronic device 1600 includes a package assembly 1606. As shown in FIG. 12, the package assembly 1606 includes a surface 1608 and a first occlusion barrier structure 1610 extending from the surface 1608. In a particular embodiment, the first bite barrier structure 1610 is a substantially continuous intermeshing rib extending from a surface 1608 of the package assembly 1606. In addition, the substantially continuous ribs are integrally formed with the package assembly 1606 and have a generally semicircular cross section. FIG. 12 also illustrates that the substrate 1602 includes a second occlusion barrier structure 1612 as a complement to the first occlusion barrier structure 1610. In particular, the second occlusal structure 1612 is correspondingly sized and shaped to receive a substantially continuous engagement groove of the first occluder barrier structure 1610. In a specific embodiment, when the electronic device 1 600 is assembled, the first bite barrier structure 1610 fits into the second bite structure 1612. In addition, in a specific embodiment, the package assembly 1606 can be fixed to the substrate 1602 by heating the area where the bite structures 1610, 1612 are located or the surrounding area to fuse the bite structures. In another specific embodiment, an adhesive may be used to secure the first occlusal barrier structure 1610 to the second occlusal structure 1612. FIG. 13 depicts an electronic device of another embodiment, which is labeled 1700. In this specific example of 97426.doc -20-200524461, the electronic device 1700 includes a substrate 1702, and an electroactive region 1704 is formed on the substrate 1702. In addition, the substrate includes a substantially continuous meshing rib 1706 formed integrally with the substrate 1702. As shown in FIG. ㈠, the electronic device 1700 includes a package assembly 1708. Figure 13 depicts that the package assembly 1708 includes a surface 1710 with a substantially continuous engagement groove 1712 formed therein. In a specific embodiment, the engaging ribs 1706 and the engaging grooves each have a semi-circular cross section. FIG. 14 illustrates an electronic device 1800 of another embodiment. The electronic device 1800 has a substantially continuous engagement that extends from the package assembly 1804 and can fit into a substantially continuous engagement groove 1806 formed in the substrate 1808. Ribs 1802. As shown in Fig. 14, the engaging ribs 1802 and the engaging grooves 1806 each have a rectangular cross section. Referring to FIG. 15, there is illustrated an electronic device 1900 according to another embodiment. The electronic device 1900 includes a substantially continuous engaging groove 19 extending from the substrate 1904 and capable of being fitted into the package assembly 1908. 6 substantially continuous meshing ribs 1902. As shown in FIG. 15, the engaging ribs 19202 and the engaging grooves 1906 each have a rectangular cross section. FIG. 16 illustrates an electronic device 2000 of another embodiment. The electronic device 2000 has a substantially continuous engagement groove 2006 that extends from the package assembly 2004 and can fit into a substrate 2008 formed in the substrate 2008. The meshing ribs 2002. As shown in FIG. 6, the engaging rib 2000 and the engaging groove 2006 have a triangular cross section. Referring to FIG. 17, there is illustrated an electronic device 2100 according to another embodiment. The electronic device 2100 includes a substantially continuous engagement groove 2106 extending from a substrate 2104 and capable of mating into a package assembly 2108 97426.doc -21-200524461. The substantially continuous meshing ribs 2102. As shown in Fig. 17, the engaging ribs 2102 and the engaging grooves 2106 each have a triangular cross section. FIG. 18 illustrates an electronic device 2200 according to another embodiment. The electronic device 2200 has a substantially continuous engagement rib 2202 extending from the package assembly 2204 and capable of fitting into a substantially continuous engagement groove 2206 formed in the substrate 2208. As shown in Fig. 18, the engaging rib 2202 and the engaging groove 2206 each have a truncated conical cross section. Referring to FIG. 19, an electronic device 2300 according to another embodiment is illustrated. The electronic device 2300 includes a substantially continuous engagement rib extending from a substrate 2304 and capable of fitting into a substantially continuous engagement groove 2306 formed in a package assembly 2308. 2302. As shown in Fig. 19, the engaging ribs 2302 and the engaging grooves 2306 each have a truncated conical cross section. 20 and 21 illustrate an electronic device 2400 according to another embodiment. The electronic device 2400 has a first substantially continuous engaging rib 2402 extending from the package assembly 2404. As shown in FIG. 21, when the package assembly 2404 and the substrate When 2408 is engaged, the first substantially continuous engagement rib 2402 may surround a second substantially continuous engagement rib 2406 extending from the base plate 2408. As shown in FIG. 21, the engaging ribs 2402 and 2406 are complementary shapes and each has a triangular cross section. Referring to FIG. 22, an electronic device 2600 according to another embodiment is illustrated. The electronic device 2600 includes a substantially continuous engagement rib 2606 extending from a package assembly 2604 and can be positioned substantially within a base plate 2608 or substantially by the same. The engaging ribs 2606 surround a substantially continuous engaging rib 2602. As shown in 97426.doc -22- 200524461 22, the engaging ribs 2602 and 2606 are complementary shapes and each has a triangular cross section. FIG. 23 illustrates an electronic device 2700 according to yet another embodiment. The electronic device 2700 has a first substantially continuous engagement rib 2702 extending from the package assembly 2704, and when the package assembly 2704 is engaged with the substrate 2708, the first substantially The continuous engagement ribs 2702 may generally surround a second substantially continuous engagement rib 2706 extending from the base plate 2708. As shown in FIG. 23, the engaging ribs 2702 and 2706 are complementary shapes and each has a square cross section. Referring to FIG. 24, there is illustrated an electronic device 2800 according to another embodiment. The electronic device 2800 includes a substantially continuous engagement rib 2806 extending from a package assembly 2804 and can be located substantially within a base plate 2808 or substantially by the same. The engaging ribs 2806 surround the substantially continuous engaging ribs 2802. As shown in FIG. 24, the engaging ribs 2802 and 2806 are complementary shapes and each has a rectangular cross section. FIG. 25 illustrates an electronic device 2900 according to yet another embodiment. The electronic device 2900 has a first substantially continuous engagement rib 2902 extending from the package assembly 2904, and when the package assembly 2904 is engaged with the substrate 2908, the first substantially The continuous engagement ribs 2902 may surround a second substantially continuous engagement rib 2906 extending from the base plate 2908. As shown in FIG. 25, the engaging ribs 2902 and 2906 are complementary shapes and each has a truncated conical cross section. Referring to FIG. 26, there is illustrated an electronic device 3000 according to yet another embodiment. The electronic device 3000 includes a substantially continuous engagement rib 3006 extending from the package assembly 3004 and may be located substantially in the base plate 3008 or substantially by the same. A substantially continuous engagement rib 3002 surrounded by the engagement rib 3006. As shown in 97426.doc -23- 200524461 26, the engaging ribs 3002 and 3006 are complementary shapes. Referring now to FIG. 27, a plan view of the package assembly designated 3100 is illustrated. As shown in FIG. 27, the package assembly 3100 includes an inner region 3102 surrounded by a first barrier structure 3104 extending from a surface of the package assembly 3100. The first early wall structure 3 106 extends from the surface of the package assembly 3 100 surrounding the first barrier structure 3 104. In a specific embodiment, each of the barrier structures 3 04, 3 106 is an engagement rib, an engagement groove, or a combination thereof. In addition, in a particular embodiment, 'each barrier structure 3104, 3106 may have a semi-circular, rectangular, triangular, frusto-conical or square cross-section. As shown in FIG. 27, a first layer of getter material 3108 may be deposited on the surface of the package assembly 3100 in the inner region 3102. A second layer of getter material 3 1 10 may be deposited on the surface of the package assembly 3100 between the inner area 3 0 2 and the first barrier structure 3104. The third layer of getter material 3112 may be deposited on the surface of the package assembly 3100 between the first barrier structure 3104 and the second barrier structure 3106. In addition, a fourth layer of getter material 3114 may be deposited on the surface of the package assembly 3100 around the second barrier structure 3106. In a specific embodiment, any one of the structures 3104, 3106 may be omitted from the structure of the package assembly 3100. In addition, any combination of the getter material layers 3108, 3110, 3112, and 3114 can be omitted from the structure of the package assembly 3100. FIG. 28 illustrates a cross-sectional view of a package assembly of another embodiment, designated 4100. The inner area 4102 is formed by the barrier structure 4104 and is arranged outside the active area 4120 of the device. The inner region 4102 includes a getter material 4108. The figure does not show the adhesive that bonds the package assembly to the device 4122. 97426.doc -24- 200524461 a It is clear from these drawings that the 'barrier structure can be located on the barrier sheet so that when the device is packaged, it can be outside the electrically active area, and the structure can be located on the periphery of the barrier sheet. | Earthly soil,,, on the edge of the mouth, directly adjacent to the edge, or farther away from u, the edge is more inward σρ. Although spacers are not required to lift the package assembly off the substrate on which A is placed, these spacers may also be used as appropriate. -In each of the embodiments described herein, the use of an adhesive is preferred over: The packaging technology of the component 'the seal formed between the package assembly and the device substrate substantially reduces the penetration of contaminants through the Sealing is also superior to sealing elements that fuse or sinter the barrier structure to both the barrier surface and the device substrate, improving manufacturing options. In an embodiment using a heating element (for example, see element 1012 in FIG. 7), a glass-containing material is heated to fuse the barrier structure with glass particles to the barrier sheet or to both the barrier sheet and the device substrate as necessary. . In some embodiments, the barrier structure is configured to allow it to be in contact with the device substrate; in other embodiments, the (Chapter I wall structure is configured to not allow contact; When the package is completed, the distance from the device substrate is no more than 1 micron. In these embodiments, it has been found that many applications can accept the penetration of contaminants, and the choice of adhesive can be based mainly on the penetration of contaminants other than the adhesive Factors such as, to name a few, adhesive strength, UV durability, environmental issues, price, and ease of application. It has been found that in some embodiments, use (for example) The assembly shown in Figure 28 is used to package pixilated monochrome organic light-emitting diodes (using glass barrier structures, epoxy adhesives, and zeolite getter materials). From environmental tests (60 ° C / 85% relative humidity) And 85 97426.doc -25- 200524461 degrees / 85 / 〇relative humidity) results show unexpected results. · No measurable pixel collection after 1_ hours of exposure under the first set of conditions And when under the second and K conditions, n is exposed to & and other test strips, and a pixel shrinkage of less than 5% is measured after __ hours. In the shell example, the 'barrier structure is made up of less than 10%. _2 g / m2 / 24 hr / atm permeability barrier material. In another embodiment, the barrier structure has a permeability of less than 10 2 g / m2 / 24 hr / atn ^. In one embodiment, The p-early wall structure has a permeability to gas and moisture of less than about 10-6 g / m2 / 24 hr / atm at room temperature. In an embodiment, the barrier material is an inorganic material. In one embodiment, The barrier structure is made of a material selected from glass, ceramic, metal, metal oxide, metal nitride, and combinations thereof. In one embodiment, the 'barrier material includes a non-hermetic substrate with a coating of the barrier material. In one embodiment, the barrier structure has the same thickness as the electronically active display component of the device (eg, it may correspond to feature 504 in FIG. 3, 1004 in FIG. 7, or 1304 in FIG. 9). In one embodiment, the barrier material is glass and is conjugated as a frit composition. Terms used herein A frit composition is intended to mean a composition comprising glass powder dispersed in an organic medium. After the frit composition is applied to a barrier sheet, it is cured and densified to form a glass structure. As used herein, the term, 'Curing' means sufficiently drying to stabilize the deposited powder composition, such as to prevent the composition from being unacceptably applied to an improper location or to prevent damage due to the surface on which the cured powder composition is stored (eg, due to stacking). The term "To salute, transform" means to heat or reheat the composition to substantially drive off all volatiles (including (but not limited to) liquid media) and cause the glass powder particles to fuse 97426.doc -26- 200524461 and adhere to its application To the surface of the baffle. Densification can be performed in an oxidizing or M atmosphere (such as air, nitrogen or argon), where the densification temperature and time are sufficient to volatilize (burn out) the organic materials in the assembly layer and sinter any glass-containing materials in these layers. Material, thus dense thick film layer. With densification, the permeability of glass decreases. In one embodiment, the glass is fully densified. In the actual example, the 'densification' is determined by the transparency of the fired glass, and full transparency indicates sufficient densification. The frit composition is well known to me and many commercial materials are commercially available. In the known examples, the glass powder contains 1-50% SiO 2 and SiO 80 / in weight percent. B2〇3, 0.90% Bi2 03, 0-90% PbO, 0-90% P205, 0-60%

Li2 O-30 / o Al2O3, 0] 0/0 K2O, 0] 0 /. Na20 and 30% Mo (wherein 'M is selected from Ba, Sr, Ca, Zn, Cu, Mg, and a mixture thereof). These glasses may be composed of other oxides. For example, Zr02 and Ge02 can be partially incorporated into the glass structure. The high content of Pb, Bi or p in the glass provides a very low softening point that allows the frit composition to be densified at a low degree. These glasses do not crystallize during the conversion process because these elements tend to provide good glass stability and high solid solubility with other glass elements. Other glass modifiers or additives can be added to modify glass characteristics to achieve better compatibility with the substrate. For example, the coefficient of thermal expansion of glass () can be determined by the relative capacity of other glass components in low softening temperature glass. Additional examples of glass powders include substances that contain one of the following: Pb0,

To control. Appropriate at least one thing 97426.doc -27- 200524461

Na20, u20, P205, NaF and CdO and MO (where 0 is oxygen and M is selected from Ba, Sr, Pb, Ca, Zη, Cu, Mg, and mixtures thereof). For example, the glass may include 10-90 wt% Pb0, 0-20 wt% Al2O3, 0-40 wt ° / 〇Si〇2, 0-15 wt% b2 03, 0-15 wt% Zn 〇, 〇-85% by weight Beta-203, 0.10% by weight Na20, 0.5% by weight Li20, 0-45% by weight P205, 〇-20% by weight NaF, and 0-10% by weight cdO. The glass may include: 0-15 wt% PbO, 0-5 wt% a1203, 0-20 wt% Si02, 0-15 wt% B2 03, 0-15 wt% ZnO, 65-85 wt 0 / 〇Bi203, 0_ 10 wt% Na / 20, 0-5 wt% Li20, 0-29 wt% P205, 0-20 wt% NaF, and 0-10 wt% Cdo. The glass can be ground in a ball mill to provide powder-sized particles (in one embodiment, the powder size is 2-6 microns). The glass described herein is manufactured using conventional glass manufacturing techniques. For example, glass can be prepared as follows. In order to prepare a glass frit in an amount of 500-2000 grams, the ingredients are weighed, then mixed in a desired ratio, and heated in a bottom loading furnace to form a melt in a starting alloy crucible. The heating temperature depends on the material and can be reached to a peak temperature (1100-1400 ° C) and time that makes the melt completely liquid and homogeneous. These glass melts are quenched by rotating stainless steel rolls in the opposite direction to form glass flakes of 10-20 mils thick. Next, the resulting glass flakes are ground to form a powder having a 50% volume distribution set between 2 and 5 microns, but the particle size can vary depending on the final application of the package assembly. Then, the glass powder is formulated into a thicker film composition (or "paste") with a filler and an organic medium. Based on the total composition including the glass and the organic medium, about 5 to about The amount of glass powder is about 76% by weight. In one embodiment, the organic medium contains water. In one embodiment, the organic medium includes 97426.doc • 28 · 200524461 including ester alcohol. The organic medium in which glass is dispersed Contains organic polymer binders dissolved in volatile organic solvents and other soluble materials, such as plasticizers; tablets, knifes, strippers, defoamers, and wetting agents. These solids can be mixed with an organic medium by mechanical mixing to form a paste, a compound called, paste, which has a consistency and rheology suitable for printing. 2 Liquid can be used as the organic medium f, and water can be included in the organic medium f. organic

The medium must be a medium in which solids can be dispersed to a sufficient degree. The rheological properties of the medium must be such that the composition has good application properties. These characteristics include: 分散 dispersion with sufficient stability, good application of the composition, proper viscosity, thixotropy, proper wettability of substrates and solids, good drying rate, good firing characteristics, and resistance to rudeness # 作 的 dry film strength. In embodiments, the organic medium comprises a suitable polymer and one or more solvents.

In certain embodiments, the polymer used in the organic medium is selected from the group consisting of ethyl cellulose, ethyl m cellulose, wood rosin, or a mixture of ethyl cellulose and resin, low Polymethyl acrylate of carbon number alcohol, monobutyl ether of ethylene glycol monoacetic acid, and mixtures thereof. The most widely used solvents found in thick film compositions are ethyl acetate, and terpenes (such as or ten-terpineol) or with other solvents (such as kerosene dibutyl diphthalate, butyl carbohydrate) Alcohol, butylcarbitol acetate, hexanediol, and mixtures of high-boiling alcohols and alcohol esters (including isobutyl alcohol and 2-ethylhexanol). In addition, the vehicle can also be included on the substrate A volatile liquid that promotes rapid hardening later. In the embodiment, the medium is selected from ethyl cellulose 97426.doc -29- 200524461 and M pinol. The balance of these and other rheniums to obtain the desired viscosity and Volatility requirements. Water can also be used as part of the organic medium. The ratio of the organic medium in the thin film group a to the glass frit solids in the dispersion depends on the method used when subtracting substances and the type of organic medium used. And can vary. Generally, the dispersion will contain 50-880 wt% glass and 20-50 wt% 1% vehicle to obtain a good coating. Within these limits, it is necessary to use the smallest possible amount relative to solids Binder to reduce the amount of organic matter that must be removed by pyrolysis Get better particle fillers that reduce shrinkage during firing. The content of the organic medium is selected to provide casting, printing (such as screen printing or inkjet printing), molding, stencil printing, extrusion or spray coating , Brush coating, injection distribution coating, doctor blade coating, and the like and consistency and rheology. In the case of screen printing, the mesh size of the screen controls the thickness of the deposited material. In one embodiment, the silk The screen used in screen printing has a mesh size from 25 to 600; in one embodiment, the mesh size is from 50 to 500; in one embodiment, the mesh size is 200-350; in another embodiment The mesh size is from 200 to 275; and in another embodiment, the mesh size is from 275 to 350. For reference purposes, the mesh size may have a change line number that can change the film formed during the printing process. The larger the screen mesh number, the smaller the mesh size will cause the thinner the deposit. Based on the purpose of reference, the following table is provided about the mesh size of the screen. The two types of screen mesh size r are US Sieve Series and Tyler Equiva lent, the latter is sometimes referred to as Tyler Mesh Size or Tyler Standard Sieve Series. The mesh size of these grades is given in the table below, and it provides an indication of particle size. The net number system is based on every 97426 in the screen. doc -30- 200524461 A measure of how many openings a linear inch has. The difference between the US sieve size and the Tyler sieve size is that it is an arbitrary number. US Sieve Size Tyler Equivalent Opening 2V2 mesh mm 8.00 m 0.312 3 mesh 6.73 0.265 3V2 ^ 3V2 mesh 5.66 0.233 4 mesh 4 4.76 0.187 5 mesh 5 4.00 0.157 6 mesh 6 3.36 0.132 7 mesh 7 2.83 0.111 8 mesh 8 2.38 0.0937 10 mesh 9 2.00 0.0787 12 mesh 10 1.68 0.0661 14 mesh 12 1.41 0.0555 No. 16 14 mesh 1.19 0.0469 No. 18 16 mesh 1.00 0.0394 20 No. 20 mesh 0.841 0.0331 25 No. 24 mesh 0.707 0.0278 30 No. 28 mesh 0.595 0.0234 35 No. 32 mesh 0.500 0.0197 40 No. 35 mesh 0.420 0.0165 45 No. 42 mesh 0.354 0.0139 No. 50 48 mesh 0.297 0.0117 No. 60 60 mesh 0.250 0.0098 No. 70 65 mesh 0.210 0.0083 No. 80 80 mesh 0.177 0.0 070 100 No. 100 mesh 0.149 0.0059 120 No. 115 mesh 0.125 0.0049 140 No. 150 mesh 0.105 0.0041 170 No. 170 mesh 0.088 0.0035 200 No. 200 mesh 0.074 0.0029 230 No. 250 mesh 0.063 0.0025 270 No. 270 mesh 0.053 0.0021 325 No. 325 mesh 0.044 0.0017 400 No. 400 mesh 0.037 0.0015 Note: The source of the table is AZoM.com. 97426.doc -31-200524461 The deposited frit composition is dried to remove and cure the volatile organic medium. Curing can be performed by any conventional means. In one embodiment, the composition is heated in an oven at about 100-120 C, but the temperature may vary depending on the softening point of the glass used and the type of getter material (if used). Alternatively, other techniques may be used to heat the frit without substantially heating the barrier sheet. Then, if necessary, the cured material is densified. For example, densification may be performed by any conventional means and may be completed as part of a heating cycle immediately after curing heating, or may be achieved by two or more separate heating cycles with or between the heating cycles. No degree of cooling. In some embodiments, the frit composition is densified when heated at 400-650 ° C in a standard thick film conveyor furnace having a stylized heating cycle to form a fired product: or in a box furnace. When glass is used to make the barrier structure, the final thickness of the barrier structure formed from the frit composition can be determined by the deposition method, the glass content in the composition, and

In an embodiment, the barrier material is metal. Almost all metals have the necessary low permeability to gases and moisture. As long as it is stable to the atmosphere and adheres to the barrier sheet, the metal is selected from Groups 3-13 of the Periodic Table. Completely here. Any gold-to-barrier sheet can then be used. In one embodiment, the pedigrees in the periodic table use the IUPAC numbering system here.

Coded from left to right as 1-18 (CRC 97426.doc -32- 200524461

Handbook of Chemistry and Physics, 81st edition, 2000). In a known example, the 'metal system is selected from Al, Zn, In, Sn, Cr, Ni, and combinations thereof. The metal can be applied by any conventional deposition technique. In one embodiment, the metal is applied by vapor deposition through a mask. In one embodiment, the metal is applied by sputtering. The barrier material may be applied in one layer, or it may be applied in more than one layer to achieve the desired thickness and geometry. For example, the frit composition can be applied in multiple layers by successive screen printing steps. The composition in different layers may be the same or different. In one embodiment, the barrier structure is made by using a suitable barrier material applied in an uninterrupted continuous manner. In another embodiment, another barrier structure can be made by changing its position on the surface of the barrier sheet, and if desired, this multiple structure may have interruptions in the barrier structure pattern as appropriate (i.e., throughout the device (Not a continuous feature around the active area). Although the perimeter is three-dimensional, it appears as a line of material 'around the outer portion of the major surface of the barrier sheet or can be placed only around the perimeter of the active area of the device. It has no gaps or openings, and it defines a barrier sheet region to be sealed to the substrate of the electronic device. In one embodiment, the package assembly is configured such that the barrier structure does not directly contact the substrate of the device when the device is sealed. In the O-Example, the barrier sheet comprises glass. Most glasses have a permeability of less than about 10-10 g / m2 / 24hr / atm. In the embodiment, the glass is selected from borosilicate and soda-lime glass. In one embodiment, the barrier sheet is substantially flat. In one embodiment, the barrier sheet has a generally flat outer edge and a shaped interior. In one embodiment, the barrier ribs are rectangular. In the example 97426.doc • 33-200524461, the 'barrier sheet has a thickness in the range of 0.1 mm to 5.0 mm. In one embodiment, as shown in FIG. 1, the perimeter 2 has a rectangular shape surrounding the outer edge of the barrier sheet 1, like a window frame. In one embodiment, the perimeter of the barrier material has a circular shape. In one embodiment, the perimeter of the barrier material has an irregular shape adapted to be complementary to a particular substrate of the electronic device. The barrier structure itself may have different geometries. The edges can be straight,

Taper or curve. The top can be flat or beveled. In one embodiment, the geometry of the top of the barrier structure is designed to mesh with its complement in the relevant area of the substrate. For example, they can engage in tongue and groove configurations. The I1 early wall structure may have any width and thickness that will provide protection from contaminants such as hydrogen and oxygen, and moisture, and may have requirements for packaging or other applications to be used with the packaging assembly. In one embodiment, the barrier structure has a width in the range of 10 to 5000 microns and a thickness in the range of 5 to 500 microns. In one embodiment, the barrier structure is about 7 microns thick. In one embodiment, the barrier structure has a width in the range of 5000 to 2000 microns and a thickness in the dry range of M to 100 microns. This thickness can be achieved by using more than one structure. In one embodiment, two or more successive deposition patterns are applied to the barrier structure material (e.g., around the perimeter of the active area of the device) to form two or more structures on the barrier. The materials used to make these structures may be the same or different ' and the shapes and sizes of the structures may be the same or different. In the embodiment, the structures from the barrier sheet are the same and have the same shape. 97426.doc -34 · 200524461 In order to use package assembly, at least-adhesive is applied to the barrier structure, barrier sheet, substrate of electronic device, or any combination thereof. If the adhesive is applied only to the substrate of the electronic device, it must be deposited in such a manner that the substrate and the barrier sheet can be coupled together. In one embodiment, an adhesive is applied to the bottom and outer edges of the barrier structure. In another embodiment, an adhesive is applied to a substrate of an electronic device. The adhesive is selected by considering whether the adhesive adheres the barrier structure to the device substrate, or if the barrier structure is located on the device substrate, the adhesive must adhere the barrier structure to the barrier sheet. The advantages of certain embodiments are apparent. That is, although a properly designed p-chapter wall structure is used, a smaller amount of adhesive can be used than otherwise necessary. In addition, because the area associated with penetration of the adhesive contaminants is small, one or more adhesives can be selected from a large number of adhesive compositions. In one embodiment, when a glass barrier structure is used, the adhesive is a UV-curable epoxy. These materials are well known to me and generally available. Other adhesive materials can also be used as long as they have sufficient adhesion and mechanical strength. In one embodiment, an electronic device with a barrier sheet is provided, and the barrier structure packaging assembly is applied to the electronic device by applying a suitable adhesive to a substrate of the electronic device. Other characteristics of the substrate are mainly controlled by the requirements of the electronic device. For example, for an organic light emitting diode display device, the substrate is usually transparent so that it can transmit the generated light. The substrate can be made of rigid or flexible materials, such as glass, ceramic, metal, polymer films, and combinations thereof. In one embodiment, the substrate comprises glass. In one embodiment, the substrate is flexible. In one embodiment, the substrate 97426.doc -35- 200524461 includes a thin polymer. In a real example, the package is mounted on a substrate of an electronic device for use. This assembly step can be completed in normal ambient conditions, or it can be formed under controlled conditions, including the reduced pressure or inert atmosphere required or required by the electronic device to which it is applied. In one embodiment, the barrier sheet also has a getter material applied thereto. In one embodiment, a getter material is deposited on the surface of the barrier sheet so that when the device is assembled, the getter material is located between the barrier structure and the active area of the device. If necessary, a getter material of an optional extra position can be deposited. The getter material can be in the form of powder, pellets, discs, or films. In one embodiment, a getter material is applied to the baffle sheet as part of a thick film paste composition, as in U.S. Application No. 10 / 71267〇 and U.S. Provisional No. 60 / 5 disclosed in No. 19139. In one embodiment, at least a portion of the getter material is deposited on the outside of the active area of the device so that when the package assembly is used with the device, a square cavity is formed on the active area of the device. In embodiments where the getter material is deposited on the barrier sheet, the getter material may be activated in a separate step from the packaging assembly itself and optionally before applying the packaging assembly to the device. Therefore, the package assembly can be stored for a long time under ordinary storage conditions, because the getter material can be activated at a later time when the package assembly is used to manufacture the device. In these embodiments, once the getter material is activated, the packaging assembly can be maintained in a controlled environment 'and in this way the effectiveness of the getter material will not prematurely disappear. 97426.doc -36- 200524461 Consuming. In one embodiment, by using the package assembly shown in FIG. 28 to package an organic light emitting diode display device, an improved device life has been observed. Examples The following examples illustrate the use of glass as a structural material applied to a glass barrier sheet for packaging assembly of an organic light emitting diode display. Examples 1-3 Table 1 shows a series of silicate glass compositions that have been found suitable as barrier materials in the new method. All glasses are made by mixing raw materials and melting them in a platinum crucible at 1100-1400 ° C. The resulting melt is stirred and quenched by pouring it onto the surface of a counter-rotating stainless steel drum or pouring it into a water tank. The glass powder prepared for use in the present invention is adjusted to an average size of 2 to 5 microns by wet grinding or dry grinding using an alumina ball medium before being formulated into a paste. The milled wet charge was dried in a hot air oven and deagglomerated by a screening method. See Table 1 Weight percentage of glass composition Example # sT〇2 1 2 3

AI2O3 Bi2〇3 Β2〇3 CaO ZnO PbO 7.1 2.1 69.8 8.4 0.5 12.0 15.82.6 81.6 14.81 0.82 11.83 6.58 65.96 Example 4-6 The glass composition was based on a Texanol® solvent (Eastman 97426.doc -37- 200524461

A mixture of ester alcohol (2,2,4-trimethyl], 3.pentanediol monoisobutyrate) sold by Chemical Co. and ethyl cellulose resin is prepared by mixing glass with an organic medium. Table 2 illustrates examples of the composition. The solvent content can be used to adjust the paste viscosity and film thickness of different deposition methods. The frit composition was printed on a soda lime silicate-based glass sheet using a 200 mesh screen at 120. (: Drying to evaporate the solvent, and then firing in a box furnace at a peak temperature of 450 550C for 1-2 hours to form a glass structure on the glass sheet. A transfer furnace with a heating / cooling distribution of 3-6 hours is also used Process some samples at 550 ° C for 1 hour. Repeat printing / firing steps to produce a thicker structure when needed. Depending on paste viscosity and screen mesh size, the firing thickness of a single printed glass structure is between In the range of 10 microns to 25 microns 0 The printed frit composition is densely fired and exhibits good adhesion to glass flakes. No cracks or blistering is observed on the surface of the fired structure. Regardless Regarding the composition of the paste, the thickness uniformity of the barrier structure after firing is maintained within + Λ2 microns.-"

Example 7 In this example, a barium metal coating was used to simulate electronic devices ^, summer < moisture 97426.doc -38- 200524461 air sensitivity. A 300 Angstrom thick barium coating was deposited on a 0.77 111111 glass substrate. The substrate was packaged with a glass barrier structure (1 mm wide by 80 microns thick) made of # 1 glass in Table 1, and fired on a 0.7 mm thick glass sheet as a barrier sheet. The two sheets were joined using a UV curable epoxy. A similar example was prepared with no frit barrier structure. Visual observations show that samples made of glass barrier structures protect the barium film better from moisture and oxygen in the air than samples without glass barrier structures. Visual observation was quantified by measuring the resistance of a 300 angstrom barium film between adjacent electrodes and plotting it as a function of time when the packages were subjected to a 60 DegC / 90% ruler environment. The moisture that penetrates into the package through the epoxy seal will chemically react with the barium coating, resulting in different sheet resistances. See Figure 29. The information states that the use of getter materials is subject to availability. [Brief Description of the Drawings] FIG. 1 includes a plan view of an electronic device. FIG. 2 includes a cross-sectional view of the electronic device taken along a line 2_2 in FIG. 1. FIG. 3 includes another cross-sectional view of the electronic device shown in FIGS. 1 and 2. FIG. 4 includes another cross-sectional view of the electronic device shown in FIGS. 1 to 3. FIG. 5 includes a detailed cross-sectional view of the electronic device taken along a circle 5 in FIG. 4. FIG. FIG. 6 includes a cross-sectional view of the electronic device of the first alternative embodiment. FIG. 7 includes another cross-sectional view of the electronic device of the first alternative embodiment. FIG. 8 includes a cross-sectional view of an electronic device of a second alternative embodiment. FIG. 9 includes a cross-sectional view of an electronic device according to a third alternative embodiment. 97426.doc -39- 200524461 FIG. 10 includes a cross-sectional view of an electronic device of a fourth alternative embodiment. FIG. 11 includes another cross-sectional view of the fourth alternative embodiment of the electronic device shown in FIG. FIG. 12 includes a cross-sectional view of an electronic device according to a fifth alternative embodiment. FIG. 13 includes a cross-sectional view of an electronic device according to a sixth alternative embodiment. FIG. 14 includes a cross-sectional view of an electronic device according to a seventh alternative embodiment. FIG. 15 includes a cross-sectional view of an electronic device of an eighth alternative embodiment. FIG. 16 includes a cross-sectional view of an electronic device according to a ninth alternative embodiment. FIG. 17 includes a cross-sectional view of an electronic device of a tenth alternative embodiment. FIG. 18 includes a cross-sectional view of an electronic device according to an eleventh alternative embodiment. FIG. 19 includes a cross-sectional view of an electronic device of a twelfth alternative embodiment. FIG. 20 includes a cross-sectional view of an electronic device according to a thirteenth alternative embodiment. FIG. 21 includes another cross-sectional view of the thirteenth alternative embodiment of the electronic device shown in FIG. 20. FIG. FIG. 22 includes a cross-sectional view of an electronic device of a fourteenth alternative embodiment. FIG. 23 includes a cross-sectional view of an electronic device of a fifteenth alternative embodiment. FIG. 24 includes a cross-sectional view of an electronic device of a sixteenth alternative embodiment. FIG. 25 includes a cross-sectional view of an electronic device of a seventeenth alternative embodiment. FIG. 26 includes a cross-sectional view of an electronic device of an eighteenth alternative embodiment. Figure 27 includes a plan view of a package assembly. FIG. 28 includes a cross-sectional view of an electronic device of a nineteenth alternative embodiment. Figure 29 is a graph illustrating the rate at which barium films are consumed using various packaging techniques. [Description of main component symbols] 97426.doc -40- 200524461 2 500, 1000, 1200, 1300, 1400, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2300, 2400, 2600, 2700, 2800, 2900, 2900, 3000 510, 1010, 1210, 1310, 1410, 3104, 3106, 4104 512, 1016, 3102, 4102 514, 1018, 3108, 3110, 3112, 3114, 4108 502, 1002, 1202, 1302, 1402, 1602, 1702 1808, 1904, 2008, 2104, 2208, 2304, 2408, 2608, 2708, 2808, 2908, 3008 504, 1004, 1204, 1304, 1404, 1604, 1704 506, 1006, 1206, 1306, 1406, 1606, 1708, 1708 1804, 1908, 2004, 2108, 2204, 2308, 2404, 2604, 2704, 2804, 2904, 3004, 3100, 4100 Perimeter electronic device barrier structure inner area getter material layer substrate electroactive area package assembly and assembly 97426.doc- 41-200524461 508 518 516, 520, 1412 1012, 1212, 1312 1008, 1208, 1308, 1408 1608, 1710 1610, 1612 1706, 1802, 1902, 2002, 2102, 2202, 2302, 2602, 2606, 2802, 2806, 3002, 3006 1806, 1906, 2006, 2106, 2206, 2306 2402, 2702, 2902 2706, 2706, 2706 2906 4122 4120 1014 Barrier sheet / surface barrier adhesive heating element surface bite barrier structure feeding rib grooving groove first substantially continuous meshing rib second substantially continuous meshing rib device active area source 97426.doc -42-

Claims (1)

200524461 X. Patent application park: 1. A package assembly for an electronic device having a substrate and an active area. The package assembly includes: a barrier sheet, and a barrier structure extending from the sheet Wherein, the barrier structure is configured such that when an electronic device is combined with an adhesive for bonding the package assembly to the device substrate, the electronic device is substantially hermetically sealed; and wherein the barrier structure is not Fusion into the device substrate. 2. The package assembly of claim 1, wherein the barrier structure includes a barrier material selected from the group consisting of: glass, ceramics, metallic materials, or a combination thereof. 3. The package assembly of claim 1, further comprising a getter material, the getter material being deposited on the baffle sheet and configured to be located when the device is bonded to the package assembly The outside of the active area of the device is still exposed to the active area. 4. A package assembly for an electronic device having a substrate and an active area, the substrate further having a sealing structure, the package assembly including: a barrier sheet having a generally flat surface; and A barrier structure extending from the flat surface, wherein: the barrier structure is configured so as to substantially hermetically seal the electronic device when used on an electronic device; and wherein the barrier structure is configured to be on a substrate of the device. The sealing structure is engaged. 97426.doc 200524461 5. The assembly of claim 4, further comprising a getter material, the getter material being deposited on the baffle sheet in a state such that when the device is bonded to the package assembly, it is located in the The outside of the device active area, that is, still exposed to the device active area. 6. The assembly of claim 4, wherein the barrier structure is configured to be substantially directly in contact with the sealing structure on the device substrate. 7. The assembly of claim 1 or 4, further comprising an adhesive that adheres to the barrier structure, and the adhesive is stored in a position sufficient to adhere the assembly to the inside of the device. 8_ —A packaging assembly for an electronic device, comprising a barrier sheet having a substantially flat surface and a sealing structure, and wherein the sealing structure is configured to be a barrier on the substrate of the electronic device Structural engagement 0 9 · The assembly of claim 1 or 4, wherein the barrier structure comprises a glass material. 10. A seal for an electronic device having a substrate, the seal including ... a barrier structure; and a heating element in contact with the barrier structure. 11. The seal of claim 10, wherein the heating element is disposed on a surface of a packaging assembly juxtaposed with the barrier structure, and wherein the barrier structure is fused after the heating element heats the barrier structure, so that At least a part of an air-tight seal is formed between the seal assembly and the X »H device substrate. 12. Sealing as described in the above item, wherein the heating element fuses the barrier structure to the package assembly and the device substrate after heating. 13. Packaging and assembly for an organic electronic device, including: 97426.doc -2-200524461-Dimensional Covering-Organic Electronic Device-Electroactive Active Area Wall Sheet; and a first bite structure, wherein: the first The bite structure is configured to be adhered to a second bite structure of a substrate; X the second bite structure is a complement of the first bite structure; and the combination of the first and second bite structures can form a gas At least part of the seal. 14. 15. 16. 17. 18. The package assembly of claim U, wherein the package assembly is transparent. For example, the package assembly of claim 14, wherein the shape of the first bite structure is generally a semicircular shape, a triangular shape, a rectangular shape, or a truncated cone shape. As in the package assembly of claim 15, wherein the first bite structure includes a substantially continuous meshing rib. If the package assembly of claim 16 further comprises a getter material, the getter material is disposed along the surface and configured to be exposed to the electronically active area. An electronic device comprising:-a substrate including-an electroactive region of an organic electronic device;-a package assembly covering the electroactive region, whose " Hai package assembly includes a barrier surface facing the device substrate; and-includes- The barrier structure of the barrier material, wherein the barrier structure is adhered to and sealed to the barrier surface and the substrate, and the barrier structure is not more than 1 micron away from the device substrate. 97426.doc 200524461 19. The organic electronic device according to claim 18, further comprising an adhesive contacting the barrier structure and the device substrate. 20. The organic electronic device of claim 19, wherein the barrier material comprises glass, ceramic, metal, or a combination thereof. 21. The organic electronic device of claim 20, the package assembly further comprising a getter material exposed to the electronically active area. 22 · —Packaging assembly for an electronic device, the electronic device having a US board, the substrate having a barrier structure extending from the substrate and outside an active area, the package assembly includes: A flat surface and a barrier rib of a sealing structure; and wherein the barrier rib is configured to be engaged with the barrier rib on the device substrate. 23 · An electronic device including a package assembly as claimed in item 22. 24 · —A method for sealing an electronic device on a substrate, comprising: forming a package assembly including a barrier sheet and a barrier structure extending from the sheet; 'applying an adhesive to the barrier structure and the substrate At least one of: and, bonding an early wall structure to the substrate such that the electronic device is closed by the package assembly. 25. The method of claim 24, wherein the barrier structure comprises an airtight material selected from the group consisting of glass, ceramic, metal, metal oxide, metal nitride, and combinations thereof. 97426.doc 200524461 26. The method of claim 25, wherein the barrier structure is formed of a frit composition. 27. The method of claim 26, further comprising curing and densifying the frit composition. 28. The method of claim 26, wherein the frit composition comprises a glass powder comprising at least one of the following: pb0; Al2O3; Si02; B203; Zno; Bi2O3; Na20; Li20; P205; NaF and CdO; and M0, where 0 is oxygen, and M is selected from the group consisting of &, pb, Ca, Zn, Cu, Mg, and mixtures thereof. 29 · 种 用; # Package assembly of an electronic device with a substrate and an active area, the package assembly comprising: a barrier sheet; and a barrier junction # extending from the surface of the sheet, the barrier structure further comprising a heating element 'Wherein the barrier structure is configured such that the electronic device is substantially hermetically sealed when used on an electronic device. 30. If the package assembly of item 13 or 29 is requested, the electronic device is selected from the group consisting of a light-emitting diode, a light-emitting diode display, a laser diode, a light detector, and a light guide battery. Photoresistors, light-controlled switches, photovoltaic crystals 'electrochemical displays, photocells, UIM detectors, photovoltaic installations Yangyue b / photoelectric sensors, transistors, field emission displays, plasma displays' micro-motor systems, Photonic devices, electronic devices using integrated circuits, accelerators, gyroscopes, motion sensors, or diodes. 97426.doc