TWI365677B - Encapsulation assembly for electronic devices - Google Patents

Encapsulation assembly for electronic devices

Info

Publication number
TWI365677B
TWI365677B TW093134578A TW93134578A TWI365677B TW I365677 B TWI365677 B TW I365677B TW 093134578 A TW093134578 A TW 093134578A TW 93134578 A TW93134578 A TW 93134578A TW I365677 B TWI365677 B TW I365677B
Authority
TW
Taiwan
Prior art keywords
electronic devices
encapsulation assembly
encapsulation
assembly
electronic
Prior art date
Application number
TW093134578A
Other languages
Chinese (zh)
Other versions
TW200524461A (en
Inventor
James Daniel Tremel
Matthew Dewey Hubert
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200524461A publication Critical patent/TW200524461A/en
Application granted granted Critical
Publication of TWI365677B publication Critical patent/TWI365677B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
TW093134578A 2003-11-12 2004-11-12 Encapsulation assembly for electronic devices TWI365677B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
US61922204P 2004-10-15 2004-10-15

Publications (2)

Publication Number Publication Date
TW200524461A TW200524461A (en) 2005-07-16
TWI365677B true TWI365677B (en) 2012-06-01

Family

ID=34623092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093134578A TWI365677B (en) 2003-11-12 2004-11-12 Encapsulation assembly for electronic devices

Country Status (5)

Country Link
EP (1) EP1683209A2 (en)
JP (1) JP4980718B2 (en)
KR (1) KR20060113710A (en)
TW (1) TWI365677B (en)
WO (1) WO2005050751A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493799B (en) * 2012-08-24 2015-07-21 Apple Inc Connector and method of enclosing a connector
TWI750421B (en) * 2018-10-30 2021-12-21 立景光電股份有限公司 Display panel

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1904840A2 (en) * 2005-07-05 2008-04-02 Koninklijke Philips Electronics N.V. Packed semiconductor sensor chip for use in liquids
DE102005053722B4 (en) * 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Cover wafer, in the microsystem technology usable component with such a wafer and soldering method for connecting corresponding component parts
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100673765B1 (en) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 Organic light-emitting display device and the preparing method of the same
KR100671647B1 (en) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 Organic light emitting display device
KR100732817B1 (en) * 2006-03-29 2007-06-27 삼성에스디아이 주식회사 Organic light-emitting display device and the preparing method of the same
DE102006016260A1 (en) * 2006-04-06 2007-10-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Micromechanical housing with at least two cavities with different internal pressure and / or gas composition and method for their production
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
KR20080051756A (en) * 2006-12-06 2008-06-11 삼성에스디아이 주식회사 Organic light emitting display apparatus and method of manufacturing thereof
TW200836580A (en) * 2007-02-28 2008-09-01 Corning Inc Seal for light emitting display device and method
TWI378592B (en) * 2007-09-04 2012-12-01 Iner Aec Executive Yuan Sealing material for solid oxide fuel cells
DE102007053849A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Arrangement comprising an optoelectronic component
ITMI20071903A1 (en) * 2007-10-04 2009-04-05 Getters Spa METHOD FOR THE PRODUCTION OF SOLAR PANELS THROUGH THE USE OF A POLYMER TRISTRATE INCLUDING A COMPOSITE GETTER SYSTEM
EP2053026B1 (en) * 2007-10-26 2014-04-02 Institute of Nuclear Energy Research, Atomic Energy Council Sealing material for solid oxide fuel cells
KR100976457B1 (en) 2008-10-22 2010-08-17 삼성모바일디스플레이주식회사 Organic Electroluminescence Device And Method For Fabricating Of The Same
KR100993415B1 (en) * 2009-03-24 2010-11-09 삼성모바일디스플레이주식회사 Organic light emitting display device
KR101180234B1 (en) * 2009-04-03 2012-09-05 (주)엘지하우시스 Building integrated photovoltaic module with design layer
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
KR101700989B1 (en) 2009-06-24 2017-01-31 미쓰비시 가가꾸 가부시키가이샤 Organic electronic device and method for producing the same
US8505337B2 (en) 2009-07-17 2013-08-13 Corning Incorporated Methods for forming fritted cover sheets and glass packages comprising the same
JP5824809B2 (en) 2010-02-10 2015-12-02 日本電気硝子株式会社 Sealing material and sealing method using the same
KR101297375B1 (en) * 2011-09-05 2013-08-19 주식회사 에스에프에이 Chemical Vapor Deposition Apparatus for Flat Display
JP2014007198A (en) * 2012-06-21 2014-01-16 Kaneka Corp Crystal silicon-based photoelectric conversion device and manufacturing method of the same
JP6192911B2 (en) * 2012-09-10 2017-09-06 株式会社カネカ Organic EL device and manufacturing method thereof
JP6192912B2 (en) * 2012-09-14 2017-09-06 株式会社カネカ Organic EL device
US9450202B2 (en) 2012-10-31 2016-09-20 Industrial Technology Research Institute Environmental sensitive electronic device package having side wall barrier structure
TWI581422B (en) * 2013-05-15 2017-05-01 財團法人工業技術研究院 Environmental sensitive electronic device package
US8829507B2 (en) * 2012-12-06 2014-09-09 General Electric Company Sealed organic opto-electronic devices and related methods of manufacturing
JP6185304B2 (en) * 2013-06-28 2017-08-23 株式会社カネカ Crystalline silicon photoelectric conversion device and manufacturing method thereof
CN104030578B (en) * 2014-07-03 2016-08-17 王磊 Vacuum compound isolation fender member
CN107046104A (en) * 2017-01-10 2017-08-15 广东欧珀移动通信有限公司 OLED encapsulating structures and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process
JPS61136247A (en) * 1984-12-07 1986-06-24 Toshiba Corp Semiconductor device
US6426484B1 (en) * 1996-09-10 2002-07-30 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
JPH11121167A (en) * 1997-10-16 1999-04-30 Tdk Corp Organic electroluminescent element
JP2000040585A (en) * 1998-07-21 2000-02-08 Tdk Corp Organic el element module
US6255239B1 (en) * 1998-12-04 2001-07-03 Cerdec Corporation Lead-free alkali metal-free glass compositions
JP2001057287A (en) * 1999-08-20 2001-02-27 Tdk Corp Organic el element
US6333460B1 (en) * 2000-04-14 2001-12-25 International Business Machines Corporation Structural support for direct lid attach
JP2002299043A (en) * 2001-03-30 2002-10-11 Sanyo Electric Co Ltd Sealing structure of organic electroluminescence display
JP2005510831A (en) * 2001-05-24 2005-04-21 オリオン エレクトリック カンパニー，リミテッド Container for encapsulation of organic light-emitting diode and method for manufacturing the same
US6933537B2 (en) * 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices
JP3942017B2 (en) * 2002-03-25 2007-07-11 富士フイルム株式会社 Light emitting element
JP2005086032A (en) * 2003-09-09 2005-03-31 Kyocera Corp Vessel for accommodating piezoelectric vibrator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493799B (en) * 2012-08-24 2015-07-21 Apple Inc Connector and method of enclosing a connector
TWI750421B (en) * 2018-10-30 2021-12-21 立景光電股份有限公司 Display panel

Also Published As

Publication number Publication date
JP4980718B2 (en) 2012-07-18
EP1683209A2 (en) 2006-07-26
TW200524461A (en) 2005-07-16
JP2007516611A (en) 2007-06-21
WO2005050751A2 (en) 2005-06-02
WO2005050751A3 (en) 2005-07-28
KR20060113710A (en) 2006-11-02

Similar Documents

Publication Publication Date Title
TWI365677B (en) Encapsulation assembly for electronic devices
AU2003292417A8 (en) Electronic devices
AU2003252952A8 (en) Organic electronic devices
GB2413121B (en) Cord-reel assembly for electronic devices
HK1072678A1 (en) Electronic device
GB0225202D0 (en) Electronic components
GB2406438B (en) Hermetic seals for electronic components
TWI349343B (en) Encapsulation structure for display devices
AU2003232716A8 (en) An integrated circuit package
GB2400239B (en) Electronic assembly
GB0301389D0 (en) Electronic circuit arrangement
EP1634775A4 (en) Electronic equipment
GB0229660D0 (en) Electronic devices
GB2398295B (en) Electronic de-scalers
TW572564U (en) Clammer-typed electronic device
EP1666993A4 (en) Electronic device
GB2400491B (en) Semiconductor devices
AU2003203358A1 (en) External electronic device
GB0706468D0 (en) Electrical Circuit Package
GB2395193B (en) Electronic de-scalers
TW553546U (en) External attaching type electronic device
GB0306919D0 (en) Electronic identification devices
GB0303285D0 (en) Electronic component packaging
GB0220504D0 (en) Electronic devices
PL114157U1 (en) Electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees