KR20060113710A - Encapsulation assembly for electronic devices - Google Patents

Abstract

Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet; and a barrier structure that extends from the sheet, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. In some embodiments, the barrier structure is designed to be used with adhesives to bond the encapsulation assembly to the electronic device. Gettering materials may be optionally used.

Description

Encapsulation Assembly for Electronic Devices

Cross Reference to Related Application

This application is incorporated by reference in U.S. Patent Application, filed Nov. 2003, incorporated herein by reference. Provisional Application No. Claim 60 / 519,139 as priority.

The present invention generally relates to an encapsulation assembly for an electronic device for preventing the electronic device from being exposed to contaminants.

Many electronic devices require protection from moisture, and in some cases, protection from oxygen, hydrogen and / or organic vapors in order to prevent various types of decomposition. Such devices include organic light emitting diode (“OLED”) devices based on polymer or small molecule configurations, microelectronic devices based on silicon IC technology, and MEMS devices based on silicon micro-machining. Exposure to the atmosphere, respectively, can lead to cathodic decomposition by oxide or hydroxide formation (which results in reduced performance / brightness), corrosion or static friction. Sealed packaging and sealing techniques exist that solve this problem, but they have limitations in performance life and manufacturing capability and are therefore expensive.

Summary of the Invention

Barrier sheet; And

Barrier structure extending from the sheet (here,

The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device with an adhesive for bonding the encapsulation assembly to the device substrate; Barrier structure is not fused to the device substrate)

An encapsulation assembly for an electronic device having a substrate and an active region is provided. In one embodiment, the barrier structure is arranged to avoid direct contact with the electronic device substrate when the device is coupled to the encapsulation assembly.

Also,

A barrier sheet having a substantially flat surface; And

Barrier structure that extends from a flat surface (here

The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device; Barrier structure is arranged to engage a sealing structure on the device substrate)

An encapsulation assembly for an electronic device having a substrate and an active region further comprising a sealing structure is provided.

Alternatively, add a barrier structure extending from the substrate and outside of the active region, including a barrier sheet having a substantially flat surface and a sealing structure, wherein the sealing structure is disposed to engage the barrier structure on the device substrate. An encapsulation assembly for an electronic device having a substrate is provided.

In another embodiment,

Barrier sheet; And

A barrier structure extending from the surface of the sheet, further comprising a heating element, wherein the barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device

An encapsulation assembly for an electronic device having a substrate and an active region is provided.

Also provided is an electronic device having such an encapsulation assembly.

The foregoing general description and the following detailed description are exemplary and explanatory only, and do not limit the invention, as defined by the appended claims.

In the accompanying drawings the invention is illustrated by way of example and not limitation.

1 includes a top view of an electronic device.

FIG. 2 includes a cross-sectional view of the electronic device taken along line 2-2 in FIG. 1.

3 includes another cross-sectional view of the electronic device shown in FIGS. 1 and 2.

FIG. 4 includes another cross-sectional view of the electronic device shown in FIGS. 1 to 3.

FIG. 5 includes a detailed cross-sectional view of the electronic device taken in circular portion 5 in FIG. 4.

6 includes a cross-sectional view of a first alternative implementation of an electronic device.

7 includes another cross-sectional view of a first alternative embodiment of an electronic device.

8 includes one cross-sectional view of a second alternative implementation of an electronic device.

9 includes a cross-sectional view of a third alternative implementation of an electronic device.

10 includes a cross-sectional view of a fourth alternative embodiment of an electronic device.

FIG. 11 includes another cross-sectional view of the fourth alternative embodiment shown in FIG. 10.

12 includes a cross-sectional view of a fifth alternative implementation of an electronic device.

13 includes a cross-sectional view of a sixth alternative embodiment of an electronic device.

14 includes a cross-sectional view of a seventh alternative implementation of an electronic device.

15 includes a cross-sectional view of an eighth alternative implementation of an electronic device.

16 includes a cross-sectional view of a ninth alternative implementation of an electronic device.

17 includes a cross-sectional view of a tenth alternative embodiment of an electronic device.

18 includes a cross-sectional view of an eleventh alternative embodiment of an electronic device.

19 includes a cross-sectional view of a twelfth alternative embodiment of an electronic device.

20 includes a cross-sectional view of a thirteenth alternative embodiment of an electronic device.

FIG. 21 includes another cross-sectional view of a thirteenth alternative embodiment of the electronic device shown in FIG. 20.

22 includes a cross-sectional view of a fourteenth alternative embodiment of the electronic device.

23 includes a cross-sectional view of a fifteenth alternative embodiment of the electronic device.

24 includes a cross-sectional view of a sixteenth alternative embodiment of the electronic device.

25 includes a cross-sectional view of a seventeenth alternative embodiment of an electronic device.

26 includes a cross sectional view of an eighteenth alternative embodiment of an electronic device.

27 includes a top view of an encapsulation assembly.

28 includes a cross-sectional view of a ninth alternative implementation of an electronic device.

29 is a chart illustrating the rate at which barium film is consumed using various encapsulation techniques.

Barrier sheet; And

Barrier structure extending from the sheet (here,

The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device with an adhesive for bonding the encapsulation assembly to the device substrate; Barrier structure is not fused to the device substrate)

An encapsulation assembly for an electronic device having a substrate and an active region is provided. In one embodiment, the barrier structure is arranged to avoid direct contact with the electronic device substrate when the device is coupled to the encapsulation assembly.

Also,

A barrier sheet having a substantially flat surface; And

Barrier structure that extends from a flat surface (here,

The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device; Barrier structure is arranged to engage a sealing structure on the device substrate)

An encapsulation assembly for an electronic device having a substrate and an active region further comprising a sealing structure is provided.

Alternatively, add a barrier structure extending from the substrate and outside of the active region, including a barrier sheet having a substantially flat surface and a sealing structure, wherein the sealing structure is disposed to engage the barrier structure on the device substrate. An encapsulation assembly for an electronic device having a substrate is provided.

In another embodiment,

Barrier sheet; And

A barrier structure extending from the surface of the sheet, further comprising a heating element, wherein the barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device

An encapsulation assembly for an electronic device having a substrate and an active region is provided.

Also provided is an electronic device having such an encapsulation assembly.

The detailed description sets forth the definition and description of terms, followed by the electronic device structure.

1. Definition and explanation of terms

Before describing the details of the embodiments below, several terms are defined or explained. As used herein, when referring to the radiation-emitting electronic device, "activating" means providing the appropriate signal (s) to the radiation-emitting electronic device, such that radiation is emitted at the desired wavelength or wavelength spectrum. It is meant to mean.

The term "adhesive" is intended to mean a solid or liquid material capable of fixing the material by surface attachment. Examples of adhesives include organic and inorganic materials such as ethylene vinyl acetate, phenolic resins, (natural and synthetic) rubbers, carboxyl polymers, polyamides, polyimides, styrene-butadiene copolymers, silicones, epoxy, urethanes, acrylics, Isocyanates, polyvinyl acetates, polyvinyl alcohols, polybenzimidazoles, cements, cyanoacrylates, and those using mixtures and combinations thereof.

The term "ambient condition" is intended to mean the condition of the space in which a human exists. For example, the ambient conditions of a clean room in the microelectronics industry include a temperature of approximately 20 ° C., a relative humidity of approximately 40%, illumination of fluorescent light (with or without yellow filters), (from outside) Daylight members, and layered air flow.

The term "barrier material" is intended to mean a material that substantially prevents passage of contaminants of interest (eg, air, oxygen, hydrogen, organic vapor, moisture) under conditions where the final device is likely to be exposed. Examples of materials useful for producing barrier materials include, but are not limited to, glass, ceramics, metals, metal oxides, metal nitrides, and combinations thereof.

The term “barrier sheet” refers to one or more underlying layers of a barrier material, produced using any number of known techniques, such as spinning, extrusion, molding, hammering, casting, pressing, rolling, calendering, and combinations thereof. Or a sheet or layer, which may have an impregnating material. In one embodiment, the barrier sheet has a permeability of 10 ^-2 g / m ² / under 24 hr / atm. The barrier sheet can be of any material that has low permeability to gases and moisture and is stable at the processing and operating temperatures exposed. Examples of materials that can be used for the barrier sheet include, but are not limited to, glass, ceramics, metals, metal oxides, metal nitrides, and combinations thereof.

The term "pollutant" is intended to mean oxygen, air, water, organic vapor or other gaseous materials that can be destructive to sensitive areas of electronic devices, such as electrically active areas of organic light emitting displays.

The term "ceramic" refers to combustion, sintering, or sintering, or burned clay compositions forming inorganic materials, such as porcelain or bricks, and fusion of at least a portion of the refractory, during manufacture and subsequent use of, It is intended to mean inorganic compositions other than glass, which can be heat treated to cure the inorganic composition.

The term “encapsulation assembly” is intended to mean one or more structures that can be used to cover, surround and at least form a portion of a seal of one or more electronic devices in an electrically active region on a substrate from ambient conditions. In conjunction with a substrate comprising one or more electronic devices, the encapsulation assembly substantially protects some of such electronic device (s) from damage originating from a source external to the electronic device. In one embodiment, the lid may form the encapsulation assembly alone or in combination with one or more other objects.

The term "complement" is intended to mean one of two structures that complete one another. The two structures complementary to each other have a similar shape, for example triangular ribs that fit into triangular grooves.

The term “electron active region” is intended to mean a region of a substrate occupied by one or more circuits, one or more electronic devices, or combinations thereof from a plan view. For example, in organic light emitting displays, the electrically active region comprises a portion of a device having one or more electrodes and a luminescent material.

The term "electronic device" is intended to mean a collection of circuits, electronic elements, or combinations thereof, which collectively function when properly connected and supplied with the appropriate potential (s). The electronic device may comprise or be part of a system. Examples of electronic devices include displays, sensor arrays, computer systems, avionics, automobiles, cell phones, and many other consumer and industrial electronics.

The term “engaged” is intended to mean, for the second structure, inserting, interlocking, biting, placing, receiving, or performing any combination thereof.

The term “engagement groove” is intended to mean a channel in a structure (eg, a housing) and interlocks, snaps, receives, or performs any combination thereof.

The term “engagement rib” is intended to mean a ridge extending from a workpiece (eg, a substrate) and is inserted, interlocked, snapped, placed or received by another structure (eg, engagement groove).

The term "getter material" is intended to mean a material used to absorb, adsorb or chemically moor one or more unwanted materials such as water, oxygen, hydrogen, organic vapors and mixtures thereof. The getter material can be solid, paste, liquid, or vapor. One type of gettering material, or a mixture or combination of two or more materials may be used. Examples include any number of materials, such as inorganic molecular sieves, such as zeolites.

The term “glass” is intended to mean an inorganic material that is primarily silicon dioxide and may include one or more dopants to change its properties. For example, phosphorus-doped glass can be used to slow down or substantially stop the passage of mobile ions relative to undoped glass, and boron-doped glass can be used to achieve such It may lower the flow temperature of the material.

The term "heating element" is intended to mean a structure that generates heat when a current passes through the structure or when the structure is exposed to radiation, such as electromagnetic radiation.

The term "seal" is intended to mean a structure (or combination of structures) that substantially prevents the passage of air, moisture, and other contaminants at ambient conditions.

The term “keying structure” is intended to mean one or more of the complementary structures that can be used to arrange two parts, such as an encapsulation assembly and a housing. In order to properly arrange the two parts, one keying structure can be engaged with the other keying structure.

The term “lid”, alone or in combination with one or more other objects, may be used to cover, wrap, or form at least a portion of a seal for one or more electronic devices within an electrically active region of the substrate from ambient conditions. It is meant to mean.

The term "metallic" is intended to mean containing one or more metals. For example, metallic coatings may include elemental metals alone, clads, alloys; Multiple layers of any combination of elemental metals, clads or alloys, or any combination thereof.

The term "perimeter" is intended to mean a closed curve surrounding the central area of the barrier sheet. The perimeter is not limited to any particular geometric shape.

The term "organic electronic device" is intended to mean a device comprising one or more semiconductor layers or materials. Organic electronic devices include: (1) devices that convert electrical energy into radiation (eg, light emitting diodes, light emitting diode displays, diode lasers, or lighting panels), and (2) devices that detect signals through electronic processes (eg, light). Detectors, photoinductive cells, photoresistors, optical switches, phototransistors, optical tubes, infrared (“IR”) detectors or biosensors, (3) devices that convert radiation into electrical energy (eg photovoltaic devices or solar cells) And (4) a device (eg, transistor or diode) comprising one or more electronic devices comprising one or more organic semiconductor layers.

The term "organic active layer" is intended to mean one or more organic layers, which may form a rectifying junction, alone or in contact with a homogeneous material, when one or more of the organic layers are present.

The term "rectified junction" refers to a junction in a semiconductor layer, or a junction formed by an interface between a semiconductor layer and a heterogeneous material, in which one type of charge carrier flows more easily through the junction in one direction than in the opposite direction. It is for. The pn junction is an example of a rectifying junction that can be used as a diode.

The term "sealing structure" is intended to mean a complementary structure to the barrier structure, but need not be its complement over a significant portion of the barrier structure. In each example a small dip or scoop is sufficient to make the complement to the rounded end of the semicircular barrier structure.

The term “structure”, alone or in combination with other patterned layer (s) or member (s), is intended to mean one or more patterned layers or members that form a unit that serves a purpose.

The term "substrate" is intended to mean a workpiece that may be rigid or flexible, and includes one or more layers of one or more materials, including but not limited to glass, polymer, metal or ceramic materials, or combinations thereof. Can be.

The term “substantially continuous” is intended to mean that the structure expands without breaking and forms closed geometrical elements (eg, triangles, rectangles, circles, loops, irregular shapes, etc.).

The term "transparent" is intended to mean radiation of a wavelength or spectrum of wavelengths, such as at least 70% transmission of visible light.

As used herein, the terms “containing”, “comprising”, “comprises”, “comprising”, “have”, “have”, or any other variations of expression are intended to encompass non-limiting inclusions. For example, a method, process, article, or apparatus that includes a series of elements is not necessarily limited to those elements, and may include other elements that are not unique or explicitly listed for such method, process, article, or apparatus. Also, unless expressly stated to the contrary, “or” indicates inclusive, ie, not exclusive. For example, condition A or B is met by any one of the following: A is positive (or present) and B is negative (or absent); A is negative (or absent) and B is positive (or present); Both A and B are positive (or present).

Also, "a negative one" or "an" is used to describe an element or component of the present invention. This is done merely for convenience and to give a general sense of the present invention. This expression should be read to include one or more than one, and the singular also includes the plural unless it is obvious that it is meant otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Methods and materials similar or equivalent to the methods and materials described herein can be used in the practice or testing of the present invention, suitable methods and materials are described below. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. In case of conflict, the present specification, including definitions, will control. In addition, the materials, methods, and examples are illustrative only and not intended to be limiting.

2. Electronic device structure

Electronic devices that may benefit from the use of the present invention include light emitting diodes, organic displays, photovoltaic devices, field emission displays, electrochemical displays, plasma displays, microelectromechanical systems, photonic devices, and other electronic devices using integrated circuits (e.g., This includes, but is not limited to, accelerometers, gyroscopes, motion sensors, and the like. Accordingly, the size of the encapsulation assembly can be very small and will vary depending on the type of electronic device being used together.

With reference to FIGS. 1-3, one embodiment of an electronic device has been described and generally denoted by 500. In one particular embodiment, the electronic device is an organic electronic device, but the electronic device may be any electronic device that includes an interior region that requires sealing. As shown in FIGS. 1-3, the electronic device 500 includes a substrate 502. An electrically active region 504 is built over the substrate 502. Electronic device 500 also includes encapsulation assembly 506. As shown in FIGS. 2 and 3, encapsulation assembly 506 includes a surface 508, and a barrier structure 510 that extends from surface 508 (of the barrier sheet). In one particular embodiment, the barrier structure 510 (of barrier material) is glass beads deposited on or otherwise formed on the surface of the encapsulation assembly 506. The barrier structure 510 has a thickness at its peak expansion that is the dimension that extends from the barrier sheet. The thickness may be a uniform thickness or may vary depending on the type of barrier sheet, the method of making the barrier sheet and barrier structure, and the type of device substrate to which the encapsulation assembly is finally attached. For example, barrier structure 510 may be created by first depositing a barrier material in one physical form (eg, paste or fluid), and then further processing the material to create a barrier structure. Or, it may be, for example, such that the barrier structure is produced separately from the barrier sheet, or by other techniques in which the barrier sheet 508 and the barrier structure 510 are manufactured together.

2 and 3 also show a loop, or inner region 512, of the inner region 512 in which the encapsulation assembly 506 can be created such that one or more layers 514 have, for example, a concave cavity or substantially flat. It can be formed with the inner region 512 on the barrier sheet 508, which can be deposited on the side of the). This region is shown as part of the shaped barrier sheet, but if the interior region is thick enough to cause the element 510 to be larger than the electrically active region to be encapsulated, it may be created by the use of the barrier structural element 510 itself. Can be. Layer 514 includes a getter material.

In another particular embodiment described in FIGS. 4 and 5, the encapsulation assembly 506 can be deposited at an adhesive 516 (more than one location; meanwhile, as shown with 520, one alternative embodiment). May be attached to the substrate 502 using different adhesive uses).

In one particular embodiment, as shown in FIG. 5, when the encapsulation assembly 506 is attached to the substrate 502 using the adhesive 516, the barrier structure 510 and the adhesive 516 are encapsulated ( A barrier 518 is established between the 506 and the substrate 502 to minimize the gap therebetween. When the device is encapsulated, the barrier structure does not fuse simultaneously to both the surface of the barrier sheet and the device substrate. Also, in one particular embodiment, the barrier structure 510 is less than 1 micron away from the substrate 502. Thus, the permeation path through the adhesive 516 is substantially narrowed, and water permeation through the adhesive 516 is substantially reduced.

With reference to FIGS. 6 and 7, an alternative implementation of an electronic device is shown, generally indicated at 1000. As illustrated in FIG. 6, the electronic device 1000 includes a substrate 1002. In addition, an electrically active region 1004 is built up on the substrate 1002. The electronic device 1000 also includes an encapsulation assembly 1006. As shown in FIGS. 6 and 7, encapsulation assembly 1006 includes a surface 1008 and a barrier structure 1010 attached to the surface 1008. In one particular embodiment, the barrier structure 1010 is glass beads deposited or otherwise formed on the surface of the encapsulation assembly 1006. 6 and 7 also show a heating element 1012 incorporated into the barrier structure 1010. In one particular embodiment, the heating element 1012 may optionally be heated. In one particular embodiment, the heating element 1012 may be made from a compound having silicon nitride and a refractory metal such as titanium, tungsten and tantalum, and the heating element 1012 may be heated when subjected to electromagnetic radiation. In another particular embodiment, the heating element may be a resistive wire that heats when a current is applied to it. In one particular embodiment, a source 1014 is included, and the source can selectively expose the heating element 1012 to electromagnetic radiation or electrical current. Heating may occur prior to assembly of the encapsulation assembly with the electronic device, or in some embodiments after assembly.

During assembly, the barrier structure 1010 can be placed between the substrate 1002 and the encapsulation assembly 1006 such that the barrier structure is parallel with the substrate 1002 and the encapsulation assembly 1006. Also, during assembly, electromagnetic radiation or electric current may be applied to the heating element 1012 to heat the heating element 1012. When the temperature of the heating element 1012 reaches the melting point of the barrier structure 1010, the barrier structure 1010 will melt and fuse with the substrate 1002 and / or encapsulation assembly 1006. Accordingly, a sealing seal can be formed between the substrate 1002 and the encapsulation assembly 1006 by the barrier structure 1010. In one particular embodiment, topical heat application to the barrier structure 1010 causes the electron active layer 1004 to melt the barrier structure 1010, as described herein, in other cases, and to form the substrate 1002 and encapsulation assembly. Can be substantially prevented from being damaged by heat or electromagnetic radiation necessary to fuse to 1006.

6 and 7 also show that the encapsulation assembly 1006 may include an interior region 1016 in which one or more layers 1018 may be deposited, such as a loop of the interior region 1016, or a side of the interior region 1016. Explain that they can be formed together. In one particular embodiment, layer 1018 comprises a getter material, such as one or more of the getter materials described herein. Although not illustrated in FIGS. 6-7, it is also envisioned that barrier structure 1010 may be deposited on the device substrate, and that optional gettering material is used in a manner otherwise indicated in the figures.

With reference to FIG. 8, one alternative implementation of an electronic device is shown and indicated at 1200. 8 illustrates an electronic device including a substrate 1202. In addition, an electrically active region 1204 is built up on the substrate 1202. The electronic device 1200 also includes an encapsulation assembly 1206. As shown in FIG. 8, encapsulation assembly 1206 includes a surface 1208 to which barrier structure 1210 can be attached. In one particular embodiment, the barrier structure 1210 is a glass bead that can be disposed between the surface 1208 of the encapsulation assembly 1200 and the substrate 1202. 8 also shows that a heating element 1212 can be incorporated into the surface 1208 of the encapsulation assembly 1204.

In one particular embodiment, when the barrier structure 1210 lies between the encapsulation assembly 1204 and the substrate 1202 in parallel with the encapsulation assembly 1204 and the substrate 1202, the heating element 1212 is formed with a barrier structure ( 1210). In addition, when the heating element 1212 is heated, the barrier structure 1210 may melt and fuse with the encapsulation assembly 1206 and the substrate to build a seal seal around the electrically active region 1204. Local heating associated with the heating element 1212 substantially reduces damage to the electrically active region 1204, caused by excess heat.

With reference to FIG. 9, an alternative implementation of an electronic device is shown, indicated at 1300. 9 illustrates an electronic device 1300 that includes a substrate 1302. An electrically active region 1304 is also built up on the substrate 1302. The electronic device 1300 also includes an encapsulation assembly 1306. As shown in FIG. 9, encapsulation assembly 1306 includes a surface 1308 to which barrier structure 1310 can be attached. In one particular embodiment, the barrier structure 1310 is a glass bead that can be disposed between the surface 1308 of the encapsulation assembly 1300 and the substrate 1302. 9 also shows that a heating element 1312 can be incorporated into the substrate 1302 around the electrically active region 1304.

In one particular embodiment, when the barrier structure 1310 lies between the encapsulation assembly 1304 and the substrate 1302 such that the barrier structure 1310 is in parallel with the encapsulation assembly 1304 and the substrate 1302, the heating element 1312 is a barrier structure 1310. ). In addition, when the heating element 1312 is heated, the barrier structure 1310 may melt and fuse with the encapsulation assembly 1306 and the substrate to build a seal seal around the electrically active region 1304.

10 and 11, an alternative implementation of an electronic device is shown and indicated at 1400. As shown in FIGS. 10 and 11, the electronic device 1400 includes a substrate 1402. An electrically active region 1404 is built up on the substrate 1402. The electronic device 1400 also includes an encapsulation assembly 1406. As shown in FIGS. 10 and 11, encapsulation assembly 1406 includes a surface 1408, and a barrier structure 1410 extending from surface 1408. In one particular embodiment, the barrier structure 1410 is a glass bead integrally formed with the encapsulation assembly 1406. In this example, the barrier structure 1410 can be made of the same or different material as the material used for the barrier sheet, can be produced using molding techniques, and can be any barrier structure profile desired. As described in FIG. 10, the thickness of barrier structure 1410 varies with its width. In one particular embodiment, encapsulation assembly 1406 may be attached to substrate 1402 using adhesive 1412. In one particular embodiment, when the encapsulation assembly 1406 is attached to the substrate 1402 using the adhesive 1412, as shown in FIG. 11, the adhesive 1416 and the barrier structure 1410 are encapsulated assembly 1406. ) And a sealing barrier 1418 between the substrate 1402.

12 illustrates another embodiment of an electronic device, generally indicated at 1600. As shown in FIG. 12, the electronic device 1600 includes a substrate 1602. An electrically active region 1604 is built up on the substrate 1602. The electronic device 1600 also includes an encapsulation assembly 1606. As shown in FIG. 12, encapsulation assembly 1606 includes a surface 1608 and a first keying barrier structure 1610 extending from the surface 1608. In one particular embodiment, the first keying barrier structure 1610 is a substantially continuous engagement rib that extends from the surface 1608 of the encapsulation assembly 1606. Also, the substantially continuous engagement ribs are formed integrally with the encapsulation assembly 1606 and have a substantially semicircular cross section. 12 also illustrates that the substrate 1608 includes a second keying barrier structure 1612 that is the complement of the first keying barrier structure 1610. In particular, second keying structure 1612 is a substantially continuous engagement groove sized and shaped to receive first keying barrier structure 1610. In one particular implementation, when the electronic device 1600 is assembled, the first keying barrier structure 1610 fits with the second keying structure 1612. Also, in one particular embodiment, the encapsulation assembly 1606 can be attached to the substrate 1602 by heating the region of the keying structure 1610, 1612, or an area around it to fuse the keying structures. . In another particular embodiment, the first keying barrier structure 1610 may be attached to the second keying structure 1612 using an adhesive.

13 is another embodiment of an electronic device, indicated at 1700. In this particular embodiment, the electronic device 1700 includes a substrate 1702, and an electrically active region 1704 is built on the substrate 1702. The substrate also includes a substantially continuous engagement rib 1706 formed integrally with the substrate 1702. As illustrated in FIG. 13, the electronic device 1700 includes an encapsulation assembly 1708. 13 shows that the encapsulation assembly 1708 includes a surface 1710, in which a substantially continuous engagement groove 1712 is formed. In one particular embodiment, engagement rib 1706 and engagement groove 1712 both have a semicircular cross section.

14 illustrates another portion of an electronic device 1800 having a substantially continuous engagement rib 1802 that extends from the encapsulation assembly 1804 and may fit into a substantially continuous engagement groove 1806 formed in the substrate 1808. One embodiment is described. As shown in FIG. 14, engagement ribs 1802 and engagement grooves 1806 have a rectangular cross section.

With reference to FIG. 15, another embodiment of the electronic device 1900 is described, which extends from the substrate 1904 and substantially fits into the substantially continuous engagement groove 1906 formed in the encapsulation assembly 1908. And a continuous engagement rib 1902. As shown in FIG. 15, engagement ribs 1902 and engagement grooves 1906 have a rectangular cross section.

FIG. 16 extends from encapsulation assembly 2004 and has another side of electronic device 2000 having a substantially continuous engagement rib 2002 that may fit into a substantially continuous engagement groove 2006 formed in substrate 2008. An implementation example is described. As shown in FIG. 16, the engagement ribs 2002 and the engagement grooves 2006 have a triangular cross section.

With reference to FIG. 17, yet another embodiment of an electronic device 2100 is described, which extends from the substrate 2104 and substantially fits into the substantially continuous engagement groove 2106 formed in the encapsulation assembly 2108. Successive engagement ribs 2102. As shown in FIG. 17, the engagement ribs 2102 and the engagement grooves 2106 have a cross section that is triangular.

18 extends from encapsulation assembly 2204 and another one of electronic devices 2200 having substantially continuous engagement ribs 2202 that can fit into substantially continuous engagement grooves 2206 formed in substrate 2208. An implementation example is described. As shown in FIG. 18, the engagement ribs 2202 and the engagement grooves 2206 have a trapezoidal cross section.

With reference to FIG. 19, another embodiment of an electronic device 2300 is described, which extends from the substrate 2304 and is substantially capable of fitting a substantially continuous engagement groove 2306 formed in the encapsulation assembly 2308. A continuous engagement rib 2302. As shown in FIG. 19, engagement ribs 2302 and engagement grooves 2306 have a trapezoidal cross section.

20 and 21 extend from encapsulation assembly 2404, and a second, substantially expanding portion from substrate 2408 when encapsulation assembly 2404 engages with substrate 2408, as shown in FIG. 21. Another embodiment of an electronic device 2400 having a first, substantially continuous engagement rib 2402 that may surround the continuous engagement rib 2406 is described. As shown in FIG. 21, the engagement ribs 2402 and 2406 are complementarily shaped and have a triangular cross section.

With reference to FIG. 22, another embodiment of an electronic device 2600 is described, which extends from the encapsulation assembly 2604 and is substantially within or substantially within the substantially continuous engagement rib 2606 formed in the substrate 2608. And a substantially continuous engagement rib 2602, which may be substantially surrounded by. As shown in FIG. 22, the engagement ribs 2402 and 2406 are complementarily shaped and have a triangular cross section.

FIG. 23 substantially illustrates a second, substantially continuous engagement rib 2706 that extends from the encapsulation assembly 2704 and extends from the substrate 2708 when the encapsulation assembly 2704 engages the substrate 2708. Another embodiment of an electronic device 2700 having a first, substantially continuous engagement rib 2702 that can be enclosed is described. As shown in FIG. 23, engagement ribs 2702 and 2706 are complementarily shaped and have a rectangular cross section.

With reference to FIG. 24, another embodiment of an electronic device 2800 is described, which extends from the encapsulation assembly 2804 and is substantially within or substantially within the substantially continuous engagement rib 2806 formed in the substrate 2808. And a substantially continuous engagement rib 2802, which may be substantially surrounded by. As shown in FIG. 24, engagement ribs 2802 and 2806 are complementarily shaped and have a rectangular cross section.

25 surrounds a second, substantially continuous engagement rib 2906 that extends from the encapsulation assembly 2904 and extends from the substrate 2908 when the encapsulation assembly 2904 engages the substrate 2908. Another embodiment of an electronic device 2900 having a first, substantially continuous engagement rib 2902 that can be described is described. As shown in FIG. 25, engagement ribs 2902 and 2906 are complementarily shaped and have a trapezoidal cross section.

With reference to FIG. 26, another embodiment of the electronic device 3000 is described, which extends from the encapsulation assembly 3004 and is substantially within a substantially continuous engagement rib 3006 formed in the substrate 3008, or It includes a substantially continuous engagement rib 3002, which may be substantially surrounded by it. As shown in FIG. 26, the engagement ribs 3002 and 3006 are complementarily shaped.

Referring now to FIG. 27, an encapsulation assembly, denoted 3100, is illustrated in plan view. As shown in FIG. 27, encapsulation assembly 3100 includes an interior region 3102 surrounded by first barrier structure 3104 extending from the surface of encapsulation assembly 3100. The second barrier structure 3106 extends from the surface of the encapsulation assembly 3100 around the first barrier structure 3104. In one particular embodiment, each barrier structure 3104 and 3106 is an engagement rib, an engagement groove or a combination thereof. Also, in one particular embodiment, each barrier structure 3104 and 3106 may have a cross section that is semicircular, rectangular, triangular, trapezoidal or rectangular. As shown in FIG. 27, a first layer 3108 of getter material may be deposited on the surface of the encapsulation assembly 3102 in the interior region 3102. In addition, a second layer 3110 of getter material may be deposited on the surface of the encapsulation assembly 3100 between the inner region 3102 and the first barrier structure 3104. A third layer 3112 of getter material may be deposited on the surface of the encapsulation assembly 3100 that is between the first barrier structure 3104 and the second barrier structure 3106. Additionally, fourth layer 3114 of getter material may be deposited on the surface of encapsulation assembly 3100 around second barrier structure 3106.

In one particular embodiment, one of the structures 3104 and 3106 may be omitted from the configuration of the encapsulation assembly 3100. In addition, any combination of layers 3108, 3110, 3112, and 3114 of getter material may be omitted in the configuration of encapsulation assembly 3100.

28 illustrates another embodiment of an encapsulation assembly, denoted 4100, described in cross section. Inner region 4102 is created by barrier structure 4104 disposed to be outside of device active region 4120. Interior region 4102 includes getter material 4108. An adhesive that couples the encapsulation assembly to the device 4122 is not shown.

From these figures, when the device is encapsulated, the barrier structure may be located on the barrier sheet such that it is outside of the electrically active area and may be located on the peripheral edge of the barrier sheet, directly adjacent to or more than the edge of the edge. It will be appreciated that it can. Spacers are not needed to remove the encapsulation assembly from the substrate of the device, but such spacers can optionally be used if desired.

In each of the embodiments described herein, the seal constructed between the encapsulation assembly and the device substrate substantially reduces the seal penetration of contaminants, compared to the encapsulation technique using an adhesive as the primary sealing element, while the barrier structure provides the barrier surface and the device substrate. Improve manufacturing options over sealing elements that are fused or sintered to all.

In one embodiment using a heating element (see, eg, element 1012 in FIG. 7), if the glass containing material is heated to desire a barrier structure with glass particles, both the barrier sheet, or both the barrier sheet and the device substrate Can be fused to.

In some implementations, the barrier structure is disposed to allow contact with the device substrate; In other embodiments, the barrier structure is arranged to disallow contact; In still other embodiments, the barrier structure is positioned to be within 1 micron of the device substrate when encapsulation is complete. In these embodiments, the transmission of contaminants has been found to be acceptable in many applications, and the choice of adhesive is primarily a factor other than the adhesive penetration rate of the contaminants, such as, for example, adhesive strength, UV durability, environmental issues , Price, ease of application, and adhesive quality. In some embodiments, it has been found that, for example, the assembly illustrated in FIG. 28 can be used to encapsulate the pixelated monochromatic organic light emitting diode (using glass barrier structure, epoxy adhesive and zeolite getter material). Results from environmental tests (60 ° C./85% relative humidity, and 85 ° C. and 85% relative humidity showed unexpected results: after 1000 hours of exposure under a first set of conditions, no measurable pixel shrinkage was seen, and When tested under 2 tests, after 1000 hours of exposure to test conditions, less than 5% pixel shrinkage was observed.

In one embodiment, the barrier structure has a permeability of 10 ^-2 g / m ² / under 24 hr / atm made of a barrier material. In a further embodiment, the barrier structure has a permeability of 10 ^-2 g / m ² / under 24 hr / atm. In one embodiment, the barrier structure has from about 10 ^-6 g / m ² / under 24 hr / atm for gas and moisture permeability of at room temperature. In one embodiment, the barrier material is inorganic.

In one embodiment, the barrier structure is made of a material selected from glass, ceramics, metals, metal oxides, metal nitrides, and combinations thereof. In one embodiment, the barrier material comprises a non-sealing base with a coating of barrier material. In one embodiment, the barrier structure has a thickness equal to the thickness of the device's electrically active display element (eg, feature 504 of FIG. 3, feature 1004 of FIG. 7, or feature of FIG. 9). (Corresponds to 1304).

In one embodiment, the barrier material is glass and is applied as a glass frit composition. The term "glass frit composition" as used herein is intended to mean a composition comprising glass powder dispersed in an organic medium. After the glass frit composition is applied to the barrier sheet, it is solidified and densified to form a glass structure. As used herein, the term “solidification” is used to prevent unacceptable electrodeposition of the composition to an undesired position, or damage caused by storing a surface containing solidified frit compositions (eg, by layering). Dry enough to stabilize the prepared frit composition. The term "densification" refers to the composition of the composition, in order to drain off substantially all volatiles, including but not limited to liquid media, and also to cause fusion of glass powder particles and adhesion to the surface of the barrier sheet to which the composition is applied It means heating or reheating. Volatilize (burn out) the organic material in the layer of the assembly and sinter any glass-containing material in the layer, thereby oxidizing or inert atmospheres such as air, nitrogen or argon for a temperature and time sufficient to densify the thick film layer. Densification can be carried out at. As densified, the transmittance of the glass is reduced. In one embodiment, the glass is fully densified. In one embodiment, densification is determined by the transparency of the glass, with full transparency indicating sufficient densification.

Glass frit compositions are known and many commercial materials are available. In one embodiment, the glass powder comprises 1 to 50% Si0 ₂ , 0 to 80% B ₂ 0 ₃ , 0 to 90% Bi ₂ 0 ₃ , 0 to 90% PbO, 0 to 90% P ₂ 0 by weight. ₅ , 0-60% Li ₂ O, 0-30% Al ₂ 0 ₃ , 0-10% K ₂ 0, 0-10% Na ₂ 0 and 0-30% MO, wherein M is Ba, Sr, Ca, Zn, Cu, Mg, and mixtures thereof). The glass may contain several different oxide components. For example, Zr0 ₂ and GeO ₂ may be partially incorporated into the glass structure.

The high content of Pb, Bi or P in the glass provides a very low softening point which allows the glass frit composition to densify below 650 ° C. This glass does not crystallize during densification because these elements tend to provide good stability of the glass and high solid solubility of other glass elements.

Other glass modifiers or additives may be added to modify the glass properties for better compatibility with a given substrate. For example, the coefficient of thermal expansion ("TCE") of the glass can be adjusted by the relative content of other glass components in the low softening point glass.

Additional examples of suitable glass powders include PbO, Al ₂ 0 ₃ , Si0 ₂ , B ₂ 0 ₃ , ZnO, Bi ₂ 0 ₃ , Na ₂ 0, Li ₂ 0, P ₂ 0 ₅ , NaF, CdO and MO ( Wherein O is oxygen and M is selected from Ba, Sr, PB, Ca, Zn, Cu, Mg, and mixtures thereof). For example, the glass may comprise 10 to 90 wt% PbO, 0 to 20 wt% Al ₂ 0 ₃ , 0 to 40 wt% Si0 ₂ , 0 to 15 wt% B ₂ 0 ₃ , 0 to 15 wt% ZnO, 0 to 85 wt% Bi ₂ 0 ₃ , 0 to 10 wt% Na ₂ 0, 0 to 5 wt% Li ₂ O, 0 to 45 wt% P ₂ 0 ₅ , 0 to 20 wt% NaF, and 0 to 10 wt% CdO It may include. The glass is 0 to 15 wt% PbO, 0 to 5 wt% Al ₂ 0 ₃ , 0 to 20 wt% Si0 ₂ , 0 to 15 wt% B ₂ 0 ₃ , 0 to 15 wt% ZnO, 65 to 85 wt% Bi ₂ 0 ₃ , 0 to 10 wt% Na ₂ 0, 0 to 5 wt% Li ₂ 0, 0 to 29 wt% P ₂ 0 ₅ , 0 to 20 wt% NaF and 0 to 10 wt% CdO . The glass may be ground in a ball mill to provide powder sized particles (in one embodiment, the powder size is 2 to 6 microns).

The glasses described herein are produced by conventional glass making techniques. For example, the glass can be manufactured as follows. For the preparation of 500 to 2000 grams of glass frit, the components were weighed and then mixed in the desired fractions and heated in a bottom-loading furnace to form a melt in a platinum alloy crucible. The heating temperature depends on the material and can be carried out at a peak temperature (1100 to 1400 ° C.) and also for a time to make it liquid and homogeneous overall. The glass melt was quenched by an inverted rotating stainless steel roller to form a 10-20 mil thick glass platelet. The glass platelets obtained were then milled to form a powder with a 50% volume distribution set to 2 to 5 microns, but the particle size may vary depending on the end use of the encapsulation assembly. The glass powder was then formulated with a thick film composition (or "paste") with filler and glass medium. The glass powder is present in the glass frit composition in an amount of about 5 to about 76 percent by weight relative to the total composition comprising the glass and the organic medium. In one embodiment, the organic medium contains water. In one embodiment, the organic medium comprises an ester alcohol.

The organic medium in which the glass is dispersed consists of an organic polymeric binder dissolved in a volatile organic solvent and optionally dissolved materials such as plasticizers, mold release agents, dispersants, stripping agents, antifoaming agents and wetting agents.

The solid may be mixed with the organic medium by mechanical mixing to form a pasty composition called "paste", having the consistency and rheology suitable for printing. A wide variety of liquids can be used as the organic medium and water can be included in the organic medium. The organic medium should be one in which the solids can be dispersed with moderate stability. The rheological properties of the media should be such that they provide good application properties for the composition. Such properties include the dispersion of solids with moderate stability, good application of the composition, moderate viscosity, thixotropy, moderate wetting ability of the substrate and solids, good drying rate, good combustion properties, and dry film strength sufficient to withstand rough handling. Included. In one embodiment, the organic medium comprises one suitable polymer and one or more solvents.

In certain embodiments, the polymer used in the organic medium is ethyl cellulose, ethyl hydroxyethyl cellulose, wood resin, mixture of ethyl cellulose and phenolic resin, polymethacrylate of lower alcohol, monobutyl ether of ethylene glycol monoacetate , Or mixtures thereof.

The most widely used solvents found in thick film compositions are ethyl acetate, and terpenes such as alpha- or beta-terpineol, or these, and kerosene, dibutylphthalate, butyl carbitol, butyl carbitol acetate, hex Mixtures of styrene glycol and other high boiling alcohols and alcohol esters such as isobutyl alcohol and 2-ethyl hexanyl. In addition, volatile liquids may be included in the vehicle to promote rapid curing after application on the substrate. In one embodiment, the medium is selected from ethylcellulose and β-terpineol. Various combinations of these and other solvents are formulated to achieve the desired viscosity and volatility requirements. Water can also be used as part of the organic medium.

The ratio of the organic medium in the thick film composition to the glass frit solids in the dispersion depends on the method of applying the paste and the type of organic medium used, but may vary. Usually, to obtain a good coating, the dispersion will contain 50 to 80 weight percent glass frit and 20 to 50 weight percent vehicle. Within this limit, it is desirable to use the lowest possible amount of binder tangent solids in order to reduce the amount of organic material that must be removed by pyrolysis and to provide a better particle filling that provides reduced shrinkage upon combustion. The content of the organic medium is selected to provide suitable consistency and rheology for casting, printing, such as screen printing or inkjet printing, molding, stencil printing, extrusion, or coating by spraying, brushing, syringe-dispersion, doctor blading, or the like. do.

For screen printing, the screen mesh size controls the thickness of the deposited material. In one embodiment, the screen used for screen printing has a mesh size of 25 to 600; In one embodiment, the mesh size is between 50 and 500; In one embodiment, the mesh size is between 200 and 350; In another embodiment, the mesh size is between 200 and 275; In another embodiment, the mesh size is between 275 and 350. For reference, the mesh size can have a variety of wire sizes that can alter the film formed during the printing process. The smaller the mesh size, the thinner the deposition, as with large screen wire sizes.

For reference, for the screen mesh size, the following table is provided. Two categories of screen mesh sizes are US Sieve series and Tyler equivalents (sometimes called Tyler mesh size or Tyler standard sieve series). The mesh aperture size for this scale is shown in the table below, providing an indication of the particle size. The mesh number system is a measure of how many openings exist per straight inch in the screen. The US sieve size differs from the Tyler screen size in that it is an arbitrary number.

Note: The table is from AZoM.com.

The deposited glass frit composition is dried to remove volatile organic media and solidify. Solidification can be carried out by any conventional means. In one embodiment, the composition is heated in an oven at about 100-120 ° C., but the temperature may vary depending on the softening point of the glass used and the type of getter material used (when using the getter material). In addition, other techniques may be used to heat the glass frit without substantially heating the barrier sheet. The solidified material is then densified, if desired. For example, densification can be performed by any conventional means and can be done as part of one heating cycle immediately after solidification heating, or as two or more separate heating cycles, with some degree of cooling between the heatings. Can be achieved with or without. In some embodiments, the glass frit composition is densified when heated at 400 to 650 ° C. in a box furnace or in a standard thick film conveyor belt furnace with a programmed heating cycle to form a combusted article.

When glass is used to create the barrier structure, the final thickness of the barrier structure formed from the glass frit composition may vary depending on the deposition method, glass content, and percent solids in the composition.

In one embodiment, the barrier material is glass fiber. The glass fibers can be placed on the barrier sheet and then heated to fuse and adhere to the barrier sheet, thereby forming a glass structure as well. Any of the glass compositions discussed above for glass fibers can be used.

In one embodiment, the barrier material is a metal. Nearly all metals have low gas and moisture permeability required. Thus, any metal may be used as long as it is stable to the atmosphere and adheres to the barrier sheet. In one embodiment, the metal is selected from Groups 3 to 13 of the Periodic Table of Elements. The IUPAC water system is used throughout, in which the family from the periodic table of elements is numbered from 1 to 18 from left to right (CRC Handbook of Chemistry and Physics, 81st edition, 2000). In one embodiment, the metal is selected from Al, Zn, In, Sn, Cr, Ni, and combinations thereof.

The metal can be applied by any conventional deposition technique. In one embodiment, the metal is applied by vapor deposition through a mask. In one embodiment, the metal is applied by sputtering.

The barrier material may be applied in one layer or in more than one layer to achieve the desired thickness and geometry. For example, the glass frit composition can be applied in multiple layers by a continuous screen-printing step. The compositions in the different layers can be the same or different.

In one embodiment, the barrier structure is created by using a suitable barrier material applied in a continuous manner without breaking. Alternatively, one additional barrier structure can be created by varying its location on the surface of the barrier sheet, and such multiple structures can optionally have breaks in the barrier structure pattern if desired (ie, the device Not one continuous feature around the entire active area of the

However, even if it is three-dimensional, the periphery may appear as a line of material around the outer portion of the major surface of the barrier sheet, or just so that it is just around the periphery of the active area of the device. It has no gaps or openings and defines the area of the barrier sheet to be sealed to the substrate of the electronic device. In one embodiment, the encapsulation assembly is disposed so that when the device is sealed, the barrier structure is not in direct contact with the substrate of the device.

In one embodiment, the barrier sheet comprises glass. Most of the glass will have a transmission of about 10 ^-10 g / m ² / under 24 hr / atm. In one embodiment, the glass is selected from borosilicate glass and soda lime glass. In one embodiment, the barrier sheet is substantially planar. In one embodiment, the barrier sheet has a substantially planar outer edge with a shaped interior. In one embodiment, the barrier sheet is rectangular. In one embodiment, the barrier sheet has a thickness in the range of 0.1 mm to 5.0 mm.

In one embodiment, as shown in FIG. 1, the perimeter 2 has a rectangular shape around the outer edge of the barrier sheet 1, as in the window frame. In one embodiment, the periphery of the barrier material has a circular shape. In one embodiment, the periphery of the barrier material has an irregular shape adapted to complement a particular substrate of the electronic device.

The barrier structure itself may have different geometric shapes. The edges can be straight, narrow or bent. The upper end may be flat or inclined. In one embodiment, the geometry of the top of the barrier structure is designed to engage its complement of the relevant compartment of the substrate. For example, they can be combined in tongue and groove arrangements.

The barrier structure may have any width and thickness that would provide protection from contaminants such as hydrogen and oxygen gas, and moisture, and the device or other application in which the encapsulation assembly will be used. In one embodiment, the barrier structure has a width in the range of 10 to 5000 microns and a thickness in the range of 5 to 500 microns. In one embodiment, the barrier structure has a thickness of about 7 microns. In one embodiment, the barrier structure has a width of 500 to 2000 microns, and a thickness in the range of 50 to 100 microns. Thickness can be achieved through the use of more than one structure.

In one embodiment, two or more consecutive deposited patterns of the barrier structure material (eg, the active area of the device around the periphery) are applied to form two or more structures on the barrier sheet. The materials used to create the structure may be the same or different, and the shape and dimensions of the structure may be the same or different. In one embodiment, the structure from the barrier sheet is made from the same material and has the same shape.

To use the encapsulation assembly, one or more adhesives are applied to the barrier structure (s), barrier sheet, substrate of the electronic device, or any combination thereof. If the adhesive is only applied to the substrate of the electronic device, it must be deposited in such a way that the substrate and barrier sheet are bonded together. In one embodiment, the adhesive is applied to the bottom and outer edges of the barrier structure. In another embodiment, an adhesive is applied to the substrate of the electronic device. When selecting an adhesive in consideration of whether the barrier structure is attached to the device substrate or whether the barrier structure is on the device substrate, the adhesive should bond the barrier structure to the barrier sheet.

The advantages of certain embodiments can be appreciated. That is, by using a suitably designed barrier structure, it is possible to use an amount of adhesive smaller than the required amount. Additionally, due to the smaller area where the adhesive contaminant permeation rate is appropriate, it is possible to select one or more adhesives from numerous adhesive compositions.

In one embodiment, when the glass barrier structure is used, the adhesive is a UV curable epoxy. Such materials are known and widely available. Other adhesive materials can be used as long as they have sufficient adhesion and mechanical strength.

In one embodiment, an electronic device having a barrier sheet to which a barrier structure encapsulation assembly is attached is provided by applying a suitable adhesive to a substrate of the electronic device. Other properties of the substrate are mainly governed by the requirements of the electronic device. For example, in an organic light emitting diode display device, the substrate is mainly transparent, thereby transmitting the generated light. The substrate can be of materials that can be rigid or flexible, including, for example, glass, ceramics, metals, polymeric films, and combinations thereof. In one embodiment, the substrate comprises glass. In one embodiment, the substrate is flexible. In one embodiment, the substrate comprises a polymeric film.

In one embodiment, the encapsulation assembly is placed on a substrate of the electronic device. This assembly step can be performed under normal ambient conditions or under control conditions, including reduced pressure or inert atmosphere, as required or desired by the electronic device to which it is applied.

In one embodiment, the barrier sheet also has a getter material applied to the sheet. In one embodiment, when the assembly of the device is completed, the getter material is deposited on the surface of the barrier sheet to be between the barrier structure and the active area of the device. If desired, optional additional sites of gettering material may be deposited.

The getter material may be in the form of frits, pellets, wafers or films. In one embodiment, the co-pending application US Linked No. 10/712670 and US provisional application No. As disclosed in 60/519139, the getter material is applied to the barrier sheet as part of a thick film paste composition. In one embodiment, when the encapsulation assembly is used with the device, at least a portion of the getter material is deposited outside of the device active area to create a cavity over the active area in the device.

In one embodiment where the getter material is deposited on the barrier sheet, the getter material can be optionally activated in a step separate from the manufacture of the encapsulation assembly itself and also before the encapsulation assembly is applied to the device. Thus, when the encapsulation assembly is used in the manufacture of the device, the getter material can be activated later, so that the encapsulation assembly can be stored for a long time under normal storage conditions. In such implementations, once the getter material is activated, the encapsulation assembly can be maintained in a controlled environment and in a manner such that the performance capacity of the getter material is not consumed prematurely.

In one embodiment, improved device life was observed when the organic light emitting diode display device was encapsulated using the encapsulation assembly shown in FIG. 28.

The following examples illustrate the use of glass as a structural material applied to a glass barrier sheet for use as an encapsulation assembly for an organic light emitting diode display.

Examples 1 to 3

A series of silicate glass compositions found to be suitable as barrier materials in the novel process are shown in Table 1. All glasses were prepared by mixing the raw materials and then melting them in a platinum crucible at 1100-1400 ° C. The resulting melt was stirred and quenched on the surface of an inverted rotating stainless steel roller or by pouring into a water tank. Prior to forming the glass powder prepared for the present invention as a paste, it was adjusted to an average size of 2 to 5 microns by wet or dry milling using an alumina ball medium. The wet slurry after milling was dried in a hot air oven and coagulated by a sieving process.

Glass composition (% by weight) Example # One 2 3 SiO ₂ 7.1 15.8 14.81 Al ₂ O ₃ 2.1 2.6 0.82 Bi ₂ O ₃ 69.8 81.6 B ₂ O ₃ 8.4 11.83 CaO 0.5 ZnO 12.0 6.58 PbO 65.96

Examples 4-6

Based on a mixture of Texanol ^® solvents (ester alcohols (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate) and ethyl cellulose resin, sold by Eastman Chemical Co.) Glass frit compositions were prepared by mixing the organic medium and glass Table 2 shows examples of compositions The changes in solvent content can be used to adjust paste viscosity and film thickness for different deposition methods.

The glass frit composition was printed on a glass sheet of soda-lime silicate substrate using a 200 mesh screen, dried at 120 ° C. for solvent evaporation, and then at a peak temperature of 450 to 550 ° C. for 1-2 hours in a box furnace. By burning, a glass structure was formed on the glass sheet. Some samples were also processed at 550 ° C. for 1 hour using a conveyor furnace with a heating / cooling profile of 3-6 hours. The printing / burning steps were repeated to produce thicker structures if necessary. The burn thickness of the single printed glass structure ranged from 10 microns to 25 microns, depending on the paste viscosity and screen mesh size.

The printed glass frit composition burned densely and showed good adhesion with the glass sheet. No cracks or blisters were observed on the surface of the burned structure. The thickness uniformity of the barrier structure after combustion was maintained within ± 2 microns regardless of the paste composition.

Compositions Used for Screen Printing Glass Binder Structures: Composition (% by Weight) Example # 4 5 6 Glass # One One One Glass 79.1 78.3 76.0 Surfactants 0.4 0.4 0.4 Binder resin 1.3 1.3 1.3 menstruum 19.2 20.0 22.3

Example 7

In this example, a coating of barium metal was used to simulate the moisture and air sensitivity of the electronic device.

A thick barium coating of 300 angstroms was deposited on a 0.7 mm thick glass substrate. The substrate was encapsulated using a glass frit barrier structure (1 mm wide x 80 micron thick) made of glass # 1 of Table 1 and burned onto a 0.7 mm thick glass sheet as barrier sheet. Two sheets were joined using a UV curable epoxy. Similar samples were prepared without the glass frit barrier structure. Visual observation showed that the sample with the glass barrier structure better protected the barium film from oxygen in water and air than the sample without the glass barrier structure. The visual observation was quantified by measuring and plotting the electrical resistance of the 300-angstrom barium film between adjacent electrodes as a function of time placing the package in a 60 ° C./90% RH environment. Water that has permeated the package through the epoxy seal reacts chemically with the barium coating, resulting in different film resistance. As can be seen from the accompanying chart as FIG. 29, this information illustrates the use of getter material is optional.

Claims (30)

Barrier sheet; And Barrier structure extending from the sheet (here, The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device with an adhesive for bonding the encapsulation assembly to the device substrate; Barrier structure is not fused to the device substrate) An encapsulation assembly for an electronic device having a substrate and an active region, comprising. The encapsulation assembly of claim 1, wherein the barrier structure comprises a barrier material selected from the group consisting of glass, ceramics, metallic materials, or a combination thereof. The encapsulation assembly of claim 1, further comprising a getter material deposited on the barrier sheet and disposed so as to be outside of the device active area when the device is coupled to the encapsulation assembly but exposed to the device active area. A barrier sheet having a substantially flat surface; And Barrier structure that extends from a flat surface (here, The barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device; Barrier structure is arranged to engage a sealing structure on the device substrate) An encapsulation assembly for an electronic device having a substrate and an active region, the substrate further comprising a sealing structure. The assembly of claim 4, further comprising a getter material deposited on the barrier sheet and positioned to be outside of the device active area when the device is coupled to the encapsulation assembly but exposed to the device active area. The assembly of claim 4 wherein the barrier structure is arranged to have substantially direct contact with the sealing structure on the device substrate. 5. The assembly of claim 1 or 4, further comprising an adhesive in the barrier structure, wherein the adhesive is deposited in an amount and position sufficient to bond the assembly to the device. And a barrier sheet having a substantially flat surface and a sealing structure, wherein the sealing structure is disposed to engage the barrier structure on the substrate of the electronic device. The assembly of claim 1 or 4, wherein the barrier structure comprises a glass material. Barrier structure; And Heating element in contact with the barrier structure A seal for an electronic device having a substrate, comprising: a. The method of claim 10, wherein the heating element is disposed on a surface of the encapsulation assembly that is parallel to the barrier structure, the heating element is allowed to heat the barrier structure, and then the barrier structure is fused to seal the seal between the encapsulation assembly and the device substrate. Room to build at least some. The chamber of claim 11, wherein after heating the heating element fuses the barrier structure to the encapsulation assembly and the device substrate. A barrier sheet sized to cover an electrically active region of the organic electronic device; And First keying structure (here, The first keying structure is disposed to bind to the second keying structure of the substrate, The second keying structure is the complement of the first keying structure; The combination of the first and second keying structures may form at least a portion of the sealing seal) Encapsulating assembly for an organic electronic device, comprising. The encapsulation assembly of claim 13, wherein the encapsulation assembly is transparent. 15. The encapsulation assembly of claim 14, wherein the shape of the first keying structure is substantially semi-circular, triangular, rectangular, or frustum shaped. The encapsulation assembly of claim 15, wherein the first keying structure comprises a substantially continuous engagement rib. 17. The encapsulation assembly of claim 16, further comprising a getter material positioned along the surface and disposed to expose the electron active region. A substrate comprising an electrically active region of an organic electronic device; An encapsulation assembly covering the electrically active region, wherein the encapsulation assembly includes a barrier surface in contact with the device substrate; And A barrier structure comprising a barrier material, wherein the barrier structure is attached to the barrier surface and substrate of the encapsulation assembly, the barrier structure being less than 1 micron away from the device substrate. Electronic device comprising a. 19. The organic electronic device of claim 18 further comprising an adhesive in contact with the barrier structure and the device substrate. The organic electronic device of claim 19, wherein the barrier material comprises glass, ceramic, metallic material, or a combination thereof. The organic electronic device of claim 20, wherein the encapsulation assembly further comprises a getter material exposed to the electron active region. A substrate having a barrier structure extending from the substrate and outside of the active region, including a barrier sheet having a substantially flat surface and a sealing structure, wherein the barrier sheet is disposed to engage the barrier structure on the device substrate. Encapsulation assembly for an electronic device. An electronic device comprising the encapsulation assembly of claim 22. Forming an encapsulation assembly comprising a barrier sheet and a barrier structure extending from the sheet; Applying the adhesive to at least one of the barrier structure and the substrate; Bonding the barrier structure to the substrate such that the electronic device is surrounded by the encapsulation assembly And sealing the electronic device on the substrate. The method of claim 24, wherein the barrier structure comprises a sealing material selected from glass, ceramics, metals, metal oxides, metal nitrides, and combinations thereof. The method of claim 25, wherein the barrier structure is formed from a glass frit composition. 27. The method of claim 26, further comprising solidifying and densifying the glass frit composition. The glass frit composition of claim 26, wherein the glass frit composition comprises PbO, Al ₂ 0 ₃ , Si0 ₂ , B ₂ 0 ₃ , ZnO, Bi ₂ 0 ₃ , Na ₂ 0, Li ₂ O, P ₂ 0 ₅ , NaF, CdO and A glass powder comprising at least one of MO, wherein O is oxygen and M is selected from Ba, Sr, Pb, Ca, Zn, Cu, Mg, and mixtures thereof. Barrier sheet; And A barrier structure extending from the surface of the sheet, further comprising a heating element, wherein the barrier structure is arranged to substantially seal seal the electronic device when used over the electronic device An encapsulation assembly for an electronic device having a substrate and an active region, comprising. The electronic device of claim 1, wherein the electronic device is a light emitting diode, a light emitting diode display, a laser diode, a photodetector, a photoinductive cell, a photoresistor, an optical switch, a phototransistor, an electrochemical display. , Phototubes, IR-detectors, photovoltaic devices, solar cells, light sensors, transistors, field emission displays, plasma displays, microelectromechanical systems, photons, electronics using integrated circuits, accelerometers, gyroscopes, motion sensors, or diodes An encapsulation assembly selected from.

Images