JP2000040585A - Organic el element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL element module which is hardly affected by a noise or the like generated by the EL element and heating generated by a driving electric circuit, an IC or the like even when a phase-down system is used, of which a life and the like are prevented from being deteriorated, for which a fraction defective of products is reduced, in which a trouble such as leakage of a sealing adhesive is hardly generated, in which adhesive strength is prevented from being deteriorated, for which airtightness is maintained for long time, which has mechanical strength to some extent, for which handling is easy, which is hardly affected by light, and of which malfunction is prevented. SOLUTION: This organic EL element module has an organic EL structure having one kind or more of an organic layer 12 concerned in at least luminous function between a pair of electrodes 11, 13 formed on a sustarte, and a sealing means for sealing the organic EL structure. The sealing means has an inside sealing body 3 arranged in the position nearest to the organic EL structure, and one or more of an outside sealing body 6 arranged outside the inside sealing body 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an organic EL device module having an organic EL structure using an organic material for a light emitting layer.

[0002]

2. Description of the Related Art An organic electroluminescence element (organic EL element) is a charge injection / recombination type EL using an organic material as a light emitting material, and is self-luminous, has high brightness, has a wide viewing angle, has low power consumption, and has a low voltage drive. Various applications are expected because they have features such as high efficiency and high efficiency. Among them, applications to various display devices have been attempted.

[0003] Since the organic EL element utilizes the light emitting action of an organic substance, there is a possibility that various emission colors (emission wavelengths) can be obtained by changing the molecular design of the organic substance. However, on the other hand, such an organic substance is easily oxidized or deteriorated by water vapor, oxygen, or a gas released from the sealant or the organic substance itself, so that the function as a light emitting element is easily damaged.

For this reason, when the organic EL element is applied to a display device or the like, considering self-luminance, high brightness, high viewing angle, low power consumption, It is important to maintain various characteristics such as voltage driving and high efficiency stably for a long period of time. Therefore, organic E
Since it is necessary to effectively prevent the L element from being exposed to various oxidizing and corrosive gases as described above and to protect the element from mechanical shocks, sealing using a hard member such as a glass material has conventionally been performed. Have been done.

FIG. 8 shows an organic EL having a conventional sealing structure.
3 shows an element module. In the illustrated organic EL element module, an organic EL structure 32 on a substrate 31 is covered with a sealing plate 33 made of glass, metal, or the like, and is fixed with an adhesive 44.
Here, the organic EL element 3 using water vapor is
In order to prevent the oxidation of No. 2, for example,
No. 81, a method of arranging a hygroscopic material, and a method of filling an inert liquid as described in JP-A-8-78159 are known. , The moisture absorbent 35 and the fluororesin-based porous thin film 3
6 shows an example fixed.

[0006] In addition, two or more layers described in Japanese Patent Application Laid-Open No. Hei 4-267097, in which a thin film is formed on an organic EL element and a photo-curable resin is applied on top of the thin film. There is also known a method of sealing with a method.

[0007] However, none of these are organic E
The sealing effect of the L element was insufficient, so that deterioration of the element could not be suppressed, and it was difficult to extend the life of the element.

On the other hand, focusing on a liquid crystal display (LCD),
Due to the growing demand for compact and highly reliable display modules, chip-on-glass (COG) and chip-size package (CSP) technologies must be used to directly mount an electric circuit or IC for driving on a glass substrate of a display device. Are increasing. Generally, an electric circuit or an IC to be COG-mounted or CSP-mounted is a bare chip, and after mounting, is sealed with a thermosetting resin or the like as described in, for example, JP-A-4-337317.

FIG. 9 shows a configuration example of a liquid crystal display module mounted with COG. The liquid crystal display module of the illustrated example has a pair of electrodes 41 and 42 and alignment films 43 and 4 on a substrate 31.
A liquid crystal display element having a liquid crystal 45 formed and arranged between the liquid crystal display elements is formed.
And a sealing member 47 for sealing. An electric circuit or an IC is provided on the substrate 31 outside the sealing plate.
And the like are fixed by a fixing resin 36. The upper electrode 42 is connected to the circuit pattern 34 on the substrate by a pad 47.

One of the pair of electrodes 41 and 42 is made of ITO.
Etc., or a metal such as aluminum, but can be processed at a fine pitch. Therefore, the number of contacts between the display device and the driving electric circuit or the IC, which are increasingly multi-terminal, can be reduced by the COG technology and the CSP technology, the processability can be improved, and the reliability can be improved.

[0011] In the future, it is conceivable that the organic EL element module will be modularized by mounting the driving device by COG mounting and CSP mounting. However, there are mainly the following problems.

(1) The organic EL element is formed by heat, organic solvent,
It is susceptible to water vapor, ultraviolet rays, etc., and deteriorates when exposed to these. For this reason, complete sealing from the external environment,
It is necessary to prevent the deterioration of the organic EL element and the shortening of the life.

(2) The wiring layout of the panel becomes complicated, and it becomes difficult to balance with the pin arrangement of the driving electric circuit element or IC to be used. In other words, the substrate on which the driving electric circuit element or IC is mounted by COG and CSP is
A transparent substrate such as glass on which an organic EL element is arranged,
It is a sealing substrate for sealing the organic EL element. If these substrates cannot be multilayered, it is extremely difficult to route wiring.

(3) It is necessary to devise the supply of the input and output signals of the driving electric circuit or IC and the power supply voltage. That is, due to the above-described problem of wiring routing, it is necessary to devise ways to supply input / output signals and power supply voltage. That is, the connection of the input / output signals and the power supply may be dispersed due to the problem of wiring routing, and the wiring becomes messy and easily affected by disturbance such as noise.

(4) Since the organic EL element is driven by current, noise generated by the organic EL element may cause a malfunction of a driving electric circuit or an IC. Above all,
In a CSP mounting in which a driving electric circuit element or an IC is mounted on a sealing substrate of an organic EL element, a face-down method is often used, and in particular, measures against noise are required.

(5) The characteristics of the organic EL element may be changed by the heat generated by the driving electric circuit or IC, and the life may be shortened. In particular, when the above-described face-down method is used, the sealing plate of the organic EL element also functions as a heat radiating plate in order to enhance the heat radiation effect of the driving electric circuit or IC. Therefore, some measures are required to prevent the life of the element from being shortened.

(6) The defect rate of a product in the case of modularization is represented by the product of the defect rate of an organic EL element and the defect rates of a control circuit including a driving electric circuit element or an IC, and a driving circuit. Therefore, a decrease in the yield of the display module is inevitable. For this reason, it is necessary to facilitate replacement of a driving electric circuit, a control circuit such as an IC, and circuit elements of the driving circuit, and to improve a yield rate.

(7) The sealing means of the organic EL element is generally formed by applying an adhesive onto a transparent electrode such as ITO (tin-doped indium oxide) or a thin metal film such as aluminum.
The sealing plate is bonded and fixed. In such a sealing method, there is a problem that the adhesive strength is reduced due to a problem such as wettability of the adhesive on the electrode, and the airtightness is reduced.

(8) In many cases, the strength of the organic EL element module alone is weak, and measures are required to compensate for this. That is, when an organic EL element capable of emitting light in a thin film is formed into a module, the substrate and the glass plate used for the sealing plate are often thin and weak in strength. For this reason,
In order to secure the mechanical strength at the time of transportation, adjustment, mounting, or after product mounting, a structure capable of securing some mechanical strength is required.

(9) Generally, an electric circuit or IC mounted on a COG is a bare chip, and is easily affected by external light, particularly, infrared light. For this reason, it is necessary to take measures to prevent malfunction due to light.

[0021]

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic EL device module capable of maintaining a sufficient sealing effect, suppressing deterioration of the device and extending the life of the device.

Further, a multi-layer structure of a substrate on which driving electric circuit elements or ICs are mounted by COG and CSP can be realized, wiring can be easily routed, and input / output signals, power supply connections and the like can be dispersed. Organic E that can be compactly integrated
This is to realize an L element module.

Another object of the present invention is to realize an organic EL element module which is hardly affected by noise or the like generated by the organic EL element even when the phase-down method is used.

It is another object of the present invention to provide an organic EL element module which is hardly affected by heat generated by a driving electric circuit or an IC and can prevent a reduction in the life of the element.

In addition, when the module is modularized,
An object of the present invention is to realize an organic EL element module that facilitates replacement of circuit elements of a drive circuit and has a low product defect rate.

Another object of the present invention is to realize an organic EL element module in which a problem such as wettability of a sealing adhesive hardly occurs, an adhesive force is prevented from lowering, and airtightness can be maintained for a long time.

It is another object of the present invention to realize an organic EL element module that can be reduced in size and thickness.

Another object of the present invention is to realize an organic EL element module having a certain level of mechanical strength and easy to handle.

It is another object of the present invention to realize an organic EL element module which is hardly affected by light and can prevent malfunction.

[0030]

That is, the above object is achieved by the following constitutions. (1) Organic E having at least one or more organic layers involved in at least a light emitting function between a pair of electrodes formed on a substrate
An L-shaped structure, and sealing means for sealing the organic EL structure, wherein the sealing means is disposed at a position closest to the organic EL structure; An organic EL element module having one or more external sealing members disposed outside the body. (2) The organic EL according to the above (1), wherein a circuit for controlling and driving the organic EL structure is formed on any of the internal sealing body, the external sealing body, and the substrate between them.
Element module. (3) A connecting means is provided between the sealing means and the substrate, the connecting means electrically connecting a circuit inside the sealing means and an external circuit, and an airtightness inside the sealing means. The organic EL element module according to (1) or (2) above, wherein (4) The organic EL element module according to any one of the above (1) to (3), wherein the sealing means has a moisture absorbent inside. (5) The organic EL element module according to any one of the above (1) to (4), wherein the sealing means has an electromagnetic shield inside. (6) The organic EL element module according to any one of the above (1) to (5), wherein the outer sealing body or any one thereof has higher thermal conductivity than the inner sealing body. (7) The organic EL element module according to any one of the above (1) to (6), wherein the outer sealing body has a light-shielding property, or a member having a light-shielding property is arranged inside the sealing means. (8) The organic EL element module according to any one of the above (1) to (7), wherein the external sealing body or any one thereof is formed of a metal material. (9) The above (1) to (10) in which the entire thickness is 10 mm or less.
The organic EL element module according to any one of (8).

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION An organic EL element module according to the present invention comprises an organic EL structure having at least one or more organic layers involved in a light emitting function between a pair of electrodes formed on a substrate; A sealing means for sealing the EL structure, wherein the sealing means has an internal sealing body disposed at a position closest to the organic EL structure, and the internal sealing body inside. That is, it has one or two or more external sealing members arranged outside the inner sealing member with a predetermined space between them. Further, preferably, a circuit for controlling and driving the organic EL structure is formed on any of the inner sealing body, the outer sealing body, and the substrate between them,
Having a connecting means between the sealing means and the substrate, the connecting means electrically connecting a circuit inside the sealing means and an external circuit and maintaining airtightness inside the sealing means; It is.

The sealing means may include a moisture absorbing material, a light shielding member, a heat conductive member having a heat conductivity of 0.7 W / m · k or more, and an electromagnetic shield.

By forming the sealing means with an internal sealing body containing the organic EL structure and one or more external sealing bodies containing the internal sealing body, the organic EL structure The effect of sealing the body can be enhanced, the deterioration of the element can be suppressed, and the life of the element can be drastically improved.

Further, by forming a circuit for controlling and driving the organic EL structure on one of the inner sealing body, the outer sealing body, and the substrate between them, a driving electric circuit element or IC is formed. Etc. enables the multi-layer structure of the substrate on which COG mounting and CSP mounting are performed, and wiring routing is easy,
It becomes possible to consolidate compactly without dispersing input / output signals, connection of power supply, and the like. In addition, when a module is formed, replacement of circuit elements of the control circuit and the drive circuit becomes easy, and the defective rate of the product can be reduced.

Further, a connection means for electrically connecting a circuit inside the sealing means and an external circuit and maintaining airtightness inside the sealing means is provided between the sealing means and the substrate. In addition, problems such as wettability of the sealing adhesive hardly occur without impairing the sealing effect, preventing a decrease in adhesive strength and maintaining airtightness for a long period of time.

Further, by providing a hygroscopic material, a light shielding member, a heat conductive member having a heat conductivity of 0.7 W / m · k or more, and an electromagnetic shield inside the sealing means, deterioration of the element due to moisture, heat, light, etc. Damage and shortening of life can be prevented.

Further, the outer sealing body or any one thereof may have higher thermal conductivity than the inner sealing body. By setting the thermal conductivity of the outer sealing body higher than that of the inner sealing body, heat can be effectively diffused from the outer sealing body, and the organic EL in the inner sealing body can be diffused.
The structure can be protected from thermal stress. It is preferable that the thermal conductivity of the outer sealing body is generally higher than the thermal conductivity of glass preferably used as the inner sealing body. More specifically, 5 W / m · k or more, especially 10 W / m · k
Above, more preferably 150 W / m · k or more, the upper limit is not particularly limited,
Usually, it is about 250 W / m · k. In this case, a heat conductive member having better heat conductivity than air may be disposed between the outer sealing body and the inner sealing body (an electric circuit or an IC mounted on the inner sealing body). .

Further, by preferably setting the total thickness to 10 mm or less, particularly 2 to 7 mm, a small and thin organic EL element module can be realized. Can contribute to

As a material of the internal sealing body, a hard member such as glass, alumina, quartz, or the like, preferably having a flat plate shape or a U-shaped cross section and having a space capable of accommodating the organic EL structure therein, or a resin or the like is used. Materials. As the glass material, for example, a glass composition such as soda-lime glass, lead-alkali glass, borosilicate glass, aluminosilicate glass, and silica glass is preferable. As the resin material, an epoxy material, Teflon, silicon or the like is preferable. In particular, a hard member such as glass is preferable for the internal sealing body in order to protect the organic EL structure.

When a flat plate such as glass is used,
It is preferable to use a sealing adhesive and, if necessary, a spacer. In addition, metal may be used as the sealing material, but if necessary, an insulating coating on the surface, an insulating coating,
It is necessary to perform an insulation treatment by performing a surface treatment or the like. As a means for forming a concave portion having a U-shaped cross section in the sealing plate, the surfaces of the inner sealing body and the outer sealing body may be shaved by etching, sandblasting or the like.

The same material as the inner sealing member can be used for the outer sealing member, but a material having a higher thermal conductivity than the inner sealing member is preferable. Further, it is necessary to structurally cover the internal sealing body and form a large internal space. The external sealing body provided outside the internal sealing body may be provided in any number as long as it is one or more. It is preferable that a predetermined space is provided between the outer sealing body and the inner sealing body to enhance a sealing effect or to arrange a moisture absorbent, a heat conductive member, a circuit element, and the like.

It is preferable that the outer sealing body or any one thereof is formed of a metal material. By forming with a metal material, the thermal conductivity becomes good, the heat radiation effect is enhanced, and the sealing material can be made relatively inexpensive, and the workability and work efficiency at the time of sealing are excellent, and the production is advantageous. .

As a metal material used for the external sealing body, a simple metal such as Fe, Cu, Ni, Cr, Mo, Ti, or Al, or an alloy thereof can be used.
Among them, a simple metal such as Al, an aluminum alloy, an austenitic stainless steel (such as SUS304) can be preferably used. Further, forsterite-based ceramics or the like may be used, and a material which can be easily processed and has relatively good thermal conductivity is preferable. Further, the external sealing body may be provided with a surface-treated thin film as described above or a combination thereof.

The height of the inner sealing body and the outer sealing body may be adjusted to a desired height by using a spacer. Spacer materials include resin beads, silica beads,
Glass beads, glass fibers and the like are mentioned, and glass beads and the like are particularly preferable. The spacer is usually a granular material having a uniform particle size, but the shape is not particularly limited, and may be various shapes as long as it does not hinder the function as the spacer. As the size, the diameter in circle is 1 to 20 μm, more preferably 1 to 20 μm.
10 μm, particularly preferably 2 to 8 μm. The particle having such a diameter is preferably about 100 μm or less in grain length, and the lower limit is not particularly limited.
It is about μm.

When recesses are formed in the inner sealing body and the outer sealing body, the spacer may or may not be used. When used, the preferred size may be in the above range, but particularly preferably in the range of 2 to 8 μm.

The spacer may be previously mixed in the sealing adhesive or may be mixed during bonding. The content of the spacer in the sealing adhesive is preferably 0.01
-30 wt%, more preferably 0.1-5 wt%.

The adhesive is not particularly limited as long as it can maintain stable adhesive strength and has good airtightness, but it is preferable to use a cationic curing type ultraviolet curing epoxy resin adhesive. . When the external sealing body is a metal, the sealing plate can be fixed using projection welding, seam welding, cold welding, ultrasonic welding, arc welding, or the like.

As a method of forming a circuit on the inner sealing body and the outer sealing body, a circuit pattern is mask-deposited by a vapor deposition method or the like, or a desired pattern is obtained by etching after forming a conductor layer of Cu or the like. And a method of obtaining a conductor layer having a predetermined pattern by a thick film process. Then, the necessary circuit elements may be mounted on the formed circuit pattern by soldering or by bonding using a conductive paste.

When the circuit pattern formed on the inner sealing body and the outer sealing body is formed not only on the surface of the sealing body but also on the end face (side face), the pattern formed on the end face and the pattern on the substrate are changed. Can be easily connected. In order to facilitate connection with an Apple bond or the like, the end surface of the sealing plate may be formed in a tapered shape or may have a curvature of R (R). The taper angle is preferably 60 ° or less, and R may be a radius of 0.1 mm or more.

The circuit pattern preferably has at least one of Au, Al, and Cu. These metals have low resistance and can be easily formed into a desired pattern by any of thin film and thick film processes. Among them, Al is preferable in terms of cost and stability.

When the circuit pattern has Au, it is preferable to form the Au-containing layer alone by a thick film process or to form a multilayer structure having an Au layer by a vapor deposition method. In the case of a multi-layer structure, the metal contained therein is T
i / Ni / Cu / Au or Cr / Ni / Cu / A
u is preferably a multilayer film formed on the substrate in the order of u. Ti and Cr improve the adhesion to the substrate, Ni prevents diffusion between metal layers, and Cu has the effect of keeping the pattern resistance low. The circuit patterns (conductor layers) containing these metals may each contain about 1% by weight or less of impurities. When the circuit pattern is formed by the thick film method, the circuit pattern may contain a substance other than the metal necessary for the thick film method such as glass.

When the circuit pattern has Al, it is preferable to form the Al-containing layer alone by a vapor deposition method.

When the circuit pattern has Cu, it is preferable to form the Cu-containing layer alone by plating or to form a multilayer structure having a Cu layer by vapor deposition. In the case of a multilayer structure, the metal contained is Ti / Ni
/ Cu or a multilayer film formed on the substrate in the order of Cr / Ni / Cu.

The circuit formed on the inner sealing member, the outer sealing member, or the substrate therebetween is an organic EL structure, that is, at least a part of a circuit for driving the organic EL display main body. . This circuit is formed on the opposite side of the surface of the internal sealing body facing the organic EL structure, that is, on the surface exposed to the outside. By forming it outside, it is possible to prevent the organic EL structure from contacting or destroying the organic EL structure, and it is possible to prevent the internal gas from adversely affecting electronic components.

The sealing plate is sealed by using an adhesive resin or the like to prevent moisture from entering. The sealing gas is Ar,
An inert gas such as He or N ₂ is preferable. Further, the moisture content of the sealing gas is preferably 100 ppm or less, more preferably 10 ppm or less, and particularly preferably 1 ppm or less. Although there is no particular lower limit for this water content, it is usually 0.1
It is about ppm.

The substrate is not particularly limited as long as the organic EL element can be laminated thereon, but usually has a function as a display surface for taking out emitted light, and is therefore made of glass, quartz or resin. It is preferable to use a transparent or translucent material such as

The emission color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate. When the emitted light is not taken out, the substrate may be transparent or opaque. When the substrate is opaque, ceramics or the like may be used.

The size of the substrate is not particularly limited, but preferably has a maximum length, particularly a diagonal length of 10 to 350 m.
m, especially in the range of 30 to 300 mm. Maximum length is 1
There is no problem if the length is less than 0 mm or more than 350 mm, but the storage space is limited or the production becomes difficult.

The connecting means is provided between the sealing means and the substrate to electrically connect a circuit inside the sealing means to an external circuit and to maintain the airtightness inside the sealing means.
That is, by setting the portion other than the region having the connection means to the substrate surface having no structure, the adhesiveness is improved and the airtightness can be secured. Examples of such connection means include a connector, a terminal electrode, a terminal pin and the like, but a connector is preferable, and in particular, in consideration of a sealing effect and wettability with an adhesive, wetness with an adhesive such as glass is considered. A connector in which a metal conductor is embedded in an exterior member having excellent sealing properties and sealing effect is preferable.

The hygroscopic agent provided inside the sealing means is not particularly limited as long as it can exhibit a hygroscopic effect in the atmosphere inside the sealing means. For example, JP-A-9-148066 (Na ₂ O), potassium oxide (K ₂ O), calcium oxide (CaO), barium oxide (BaO), magnesium oxide (MgO), lithium sulfate (Li ₂ SO ₄₎
), Sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (S
O ₄ ) ₃ ), titanium sulfate (Ti (SO ₄ ) ₂ ), nickel sulfate (NiSO ₄ ), calcium chloride (CaCl ₂ )
₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium chloride (YCl
₃ ), copper chloride (CuCl ₂ ), cesium fluoride (Cs
F), tantalum fluoride (TaF ₅ ), niobium fluoride (N
bF ₅ ), calcium bromide (CaBr ₂ ), cerium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₂ ), magnesium bromide (MgBr)
_2), barium iodide (BaI _2), magnesium iodide (MgI _2), barium perchlorate (Ba (ClO _4)
2 ) and magnesium perchlorate (Mg (ClO ₄ ) ₂ ).

It is preferable that the hygroscopic agent is disposed at least at two positions inside the inner seal and between the outer seal and the inner seal, or between the outer seal and the outer seal. By arranging the hygroscopic agent in two or more layers as described above, the organic EL structure can be strongly protected from moisture.

The heat conductive member disposed inside the sealing means is preferably one having better heat conductivity than gas such as air, and more than 0.7 W / m · k, particularly heat conductivity. Those having 1 to 10 W / m · k are preferred. As such a heat conductive member, for example, grease, oil compound, resin sheet for heat radiation, and the like using silicon resin or the like can be given.

The heat conducting member may be disposed at any position of the inner sealing member or the outer sealing member, but is preferably provided at a position where heat can be effectively diffused to the outside.
In this case, it is preferable to use the external sealing body as a heat sink as described later.

As the electromagnetic shield, various members conventionally used as electromagnetic shielding agents can be used. Specifically, Al, Ni, Cr, Co, Cu,
One or more metal thin films such as Zn, Sn, Fe, Ag, and Au, various magnetic materials such as ferrite, the above-described metal particles, and conductive coating films in which carbon particles and the like are dispersed in a resin. be able to.

The electromagnetic shield may be formed on the inner sealing body or the outer sealing body by direct sputtering, vapor deposition, coating, or the like, or may be formed on a film and adhered thereto. The thickness of these thin films is usually about 1 μm to 1 mm.

The electromagnetic shield is suitable for the purpose of use, for example, when preventing noise from the organic EL structure from leaking to the outside, or when protecting electronic components such as driving electric circuit elements or ICs from external noise. It is good to form in a suitable position.

Furthermore, the module itself formed by the inner sealing member and the outer sealing member may be integrated with a metal plate having a heat radiation function to enhance the heat radiation effect.

Next, a specific configuration of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing a first configuration example of the present invention. In the figure, an organic EL element module according to the present invention includes a lower electrode 11 formed on a substrate 1,
The organic EL device has an organic EL structure including an upper electrode 13 and an organic layer 12 involved in a light emitting function between the electrodes. here,
Normally, the lower electrode 11 is made of ITO as a hole injection electrode.
The upper electrode is formed of a low work function, low resistance metal thin film, etc. as an electron injection electrode. However, depending on the application, the reverse configuration or various deformations and improvements may be made. Have been added. In addition, the organic layer 12
Is composed of a functional thin film containing an organic substance involved in a light emitting function such as a hole injection transport layer, a light emitting layer, and an electron injection transport layer. The internal sealing body 3 is arranged so as to cover the organic EL structure, and is fixed and sealed by the adhesive 4. The inside of the internal sealing body 3, that is, the organic E
On the space side where the L structure is arranged, the moisture absorbent 5 is arranged so as to remove moisture in the space where the organic EL structure is arranged.

Outside the internal sealing body 3, an external sealing body 6 large enough to include the internal sealing body 3 is arranged, and fixed and sealed with an adhesive 7. On the inner side of the outer sealing body 6, that is, on the space side where the inner sealing body 3 is arranged,
The moisture absorbent 8 is arranged to remove moisture in the space where the internal sealing body 3 is arranged. in this way,
By arranging the moisture absorbent twice, the organic EL structure can be strongly protected from moisture, and the life of the organic EL structure can be significantly improved.

Further, the inner sealing body 3 and the outer sealing body 6
The lower electrode 1 is placed on the substrate in the space formed between
1 and the upper electrode 13 extend or are connected to this, a circuit is formed, and a circuit element 21 such as a control electric circuit element or an IC, a driving electric circuit element or an IC is arranged by CSG in this circuit. ing. Further, at least a part of the circuit is connected to a connection unit 9 and is connected to an external circuit, for example, a host computer, a remote control panel, a main control circuit, and the like via the connection unit 9. . The connection means 9 is composed of, for example, a connector or the like having a plurality of metal pieces serving as contact terminals on a glass base material (outer packaging material), has good wettability with an adhesive, is unlikely to cause a deterioration phenomenon of an adhesive effect, and It is made of a material having a high effect of blocking the external atmosphere. As a result, the outer sealing body 6 is fixed on a portion other than the connecting means 9 on a smooth surface having no terminals or the like, and the sealing effect is further improved.

FIG. 2 is a schematic sectional view showing a second configuration example of the present invention. In this example, the circuit component 21 mounted on the substrate 1 in the first configuration example is directly mounted on the internal sealing body 3 or CSP mounted.
For this reason, the circuit pattern (conductor) 2 is also provided on the internal sealing body 3.
2 are formed, and the conductor pattern 22 is
And the lower electrode 11 and the upper electrode 13 are extended or connected to a circuit connected thereto. In this case, the connection
Known means such as solder, apple bond, anisotropic conductive film, and anisotropic conductive resin adhesive can be used.
Other configurations are substantially the same as those of the first configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

FIG. 3 is a schematic sectional view showing a third configuration example of the present invention. In this example, in the first configuration example, C
The circuit element 21 that has been mounted by OG is directly mounted on the internal sealing body 3 or mounted by CSP. Further, the circuit element 21 is provided with an electromagnetic shield 23 that blocks electromagnetic waves generated from the organic EL structure. Formed and arranged. As a result, electromagnetic waves generated from the organic EL structure are cut off or attenuated, and circuit elements such as control electric circuit elements or ICs / drive electric circuit elements or ICs are protected. Note that an insulating film or the like may be formed on the electromagnetic shield 23 as necessary.

The electromagnetic shield 23 is formed on the surface of the inner sealing body 3 on the side of the outer sealing body 6 in the illustrated example.
It may be formed on the structure side. Also, the electromagnetic shield 23
And a wiring structure connectable to a frame ground or a ground terminal of the device. Other configurations are substantially the same as those of the first configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

FIG. 4 is a schematic sectional view showing a fourth configuration example of the present invention. In this example, in the first configuration example, C
The circuit element 21 mounted by OG is directly mounted on the internal sealing body 3 or mounted by CSP, and a heat conductive member 26 for releasing heat from the circuit element to the outside is formed and arranged.

That is, in FIG. 4, a circuit pattern 2 for driving the organic EL structure is provided on the internal sealing body 3.
2 and a circuit element 21 are mounted. This makes it difficult for heat generated from the circuit element 21 to be transmitted to the organic EL structure.
It can be protected from thermal stress during replacement or driving. Further, a heat conducting member 26 is formed and arranged between the circuit element 21 and the external sealing body 6, and the heat generated from the circuit element 21 is quickly transmitted to the external sealing body 6,
The diffusion of heat to the organic EL structure is prevented. This further protects the organic EL structure from thermal stress. Other configurations are substantially the same as those of the first configuration example, and the same components are denoted by the same reference numerals and description thereof will be omitted.

FIG. 5 is a schematic sectional view showing a fifth configuration example of the present invention. In this example, in the first configuration example, C
The circuit element 21 mounted by OG is mounted on the internal sealing body 3 by MCM (Multi Chip Module). That is, the control / driving electric circuit wiring 22 is formed on the internal sealing body 3 and the circuit element 21 is arranged to form an MCM, thereby realizing high-density mounting.

In this case as well, the electromagnetic shield in each of the above-described configuration examples may be formed to protect the circuit element 21 from electromagnetic waves, or a heat conductive member may be formed and arranged to reduce the organic EL structure from thermal stress. May be protected.

FIG. 6 is a schematic sectional view showing a sixth configuration example of the present invention. In this example, in the fifth configuration example, the external sealing body 6 is made of metal. By making the external sealing body a metal having good thermal conductivity in this manner, for example, as shown in the illustrated example, an MCM (Multi Chip Modul
e) Heat generated by the mounted control / drive electric circuit wiring 22 and circuit element 21 can be effectively released to the outside.

In this case, a heat sink (heat sink) may be further provided outside the external sealing body 6. Further, the inside may be filled with a heat conductive member such as silicon grease or silicon oil compound.

In each of the above configuration examples, the inner sealing body is
Although an example is shown in which one external sealing body is included and one external sealing body is included therein, a plurality of external sealing bodies may be provided, and a configuration in which a sealing body is further provided outside each of the above configuration examples. You may.

The circuit for driving the organic EL structure (display main body) has, for example, as shown in FIG. 7, a main control means 111 for giving data to be displayed on the display and data relating to the display. There is provided a display control means 112 for transmitting a scan electrode drive signal which is a signal for driving the scan electrode and the data electrode of the organic EL display according to the display data given from the means 111 and a data electrode drive signal. Further, it is connected to the display control means 112, and is used for expanding display data provided from the main control means 111 and the like into matrix data, bitmap data, etc., and display data for storing data of predetermined display contents and the like. Storage means 113
Scanning electrode driving means 114 for driving a scanning electrode and a data electrode of an organic EL structure (organic EL display main body) 116 by a scanning electrode driving signal and a data electrode driving signal from a display control means 112; 115.

The main control means 111 includes the organic EL structure 11
6, display data to be displayed, or designation of display data stored in the display data storage unit 113,
Gives timing and control data necessary for display.
The control means 111 can be generally constituted by a general-purpose microprocessor (MPU) and a control algorithm on a storage medium (ROM, RAM, etc.) connected to the MPU. The control means 11 includes CISC, RI
It can be used irrespective of the mode of the processor such as SC and DSP, and may be configured by a combination of logic circuits such as ASIC. In this example, the main control unit 111 is provided independently, but the display control unit 112,
It may be integrated with the control means of the device provided with the display.

The display control means 112 analyzes display data and the like provided from the main control means 111 and the like, searches data stored in the display data storage means 113 as necessary, and stores the display data on the organic EL display. Is converted into matrix data to be displayed at a predetermined position. That is, when the image (image or character) data to be displayed is dot data in pixel units of the organic EL element given at the intersection of each matrix, a signal for driving the scanning electrode and the data electrode giving the dot coordinates is provided. appear. In addition, driving in units of frames as described above, driving ratio (duty) control between the scanning electrodes and the data electrodes, and the like are also performed.

The display control means 112 includes, for example,
A processor or a complex logic circuit having a predetermined arithmetic function, a buffer for the processor or the like to exchange data with an external main control unit or the like, a timing signal to a control circuit,
A timing signal generating circuit (oscillation circuit) for giving a display timing signal and reading / writing to external storage means and a writing timing signal, a storage element control circuit for sending and receiving display data and the like from an external storage means, and reading from an external storage element Or a drive signal transmission circuit for transmitting display data, which is supplied from the outside or obtained by processing the data, as a drive signal, and stores data relating to a display function and a display to be externally supplied, control commands, and the like. It can be composed of various registers and the like.

The display data storage means 113 stores data (conversion table) for developing image data given from outside as matrix data on a display,
Data in which predetermined character data and image data are directly expanded into matrix data and the like are stored, and can be read (written) by designating a storage position (address) as necessary.
Such a display data storage means is a RAM (VR
AM), and a semiconductor storage element such as a ROM can be preferably mentioned, but the present invention is not limited to this, and a storage medium using light or magnetism may be used.

The scanning electrode driving means 114 and the data electrode driving means 115 drive the scanning electrodes and the data electrodes according to the scanning electrode driving signal and the data electrode driving signal given from the display control means 112. The organic EL element constituting the organic EL display is a light emitting element that emits light by current driving. Therefore, the scan electrode drive signal and the data electrode drive signal, which are usually given as voltage signals, are converted into signals of a predetermined current value, and the signals are supplied to predetermined scan electrodes and data electrodes for driving.

More specifically, a scan electrode and a data electrode at predetermined positions are driven by using a voltage-current conversion element having a necessary current capacity, an amplification element (power amplification), or the like. Examples of such a driving circuit include an open drain, an open collector circuit, a totem pole connection, a push-pull connection, and the like. A contact device such as a relay may be used as the voltage-current conversion element or the amplifying element. However, in consideration of high-speed operation and reliability, transistors, FETs, and semiconductors having functions equivalent to these are used. Elements are preferred. These semiconductor elements are
The scanning electrode and the data electrode are connected to either the power supply side or the ground side. Here, the power supply side and the ground side include not only a case where the power supply side and the ground side are directly connected to the power supply and the ground line, but also a case where the power supply side and the ground side are connected via elements such as a current limiting resistor, a protection device, and a regulator.

In the present invention, among the above circuit components, in particular, the display control means 112 and the display data storage means 11
3. It is preferable that the scanning electrode driving means 114 and the data electrode driving means 115 are formed as a circuit element and peripheral circuits in a portion between the internal sealing body and the external sealing body. Further, connection with other circuits is made by using a connection means such as a board connector or an FPC. In this case, the number of signal lines is usually sufficient to transfer data necessary for processing by a control means such as a processor, and the size of connectors and cables is small, and there is no need to use a cable with a large diameter, and reliability can be improved. The properties are also good.

The above circuit is merely an example of a circuit configuration for driving an organic EL structure (organic EL display main body), and other circuit configurations may be employed as long as they have equivalent functions. Further, the display control means, the scan electrode driving means, the data electrode driving means and the like may be completely integrated without being clearly divided. Although the above example mainly describes a simple matrix type display, a TFT or the like is used.
It may be an active matrix type display. Incidentally, these circuit devices are usually one type or two types.
It is configured as more than one kind of IC and its peripheral parts.

The organic EL structure of the present invention has, for example, scanning electrodes (electron injecting electrodes) and data electrodes (hole injecting electrodes) arranged in a matrix of at least a set on a substrate. It has a structure in which a hole injection / transport layer, a light emission and electron injection / transport layer, which is a layer, and a protective layer as required, are laminated, and a sealing plate such as glass is disposed thereon.

The circuit formed on the sealing plate is electrically connected to the circuit on the substrate by ball bonding or wire bonding, and is connected to a scanning electrode (electron injection electrode) and a data electrode (hole injection electrode), respectively. . This allows
The scanning electrode driving means (circuit) and the data electrode driving means (circuit) on the sealing plate are connected to the scanning electrode (electron injection electrode) and the data electrode (hole injection electrode).

The organic EL structure is as follows. The light emitting layer has a hole (hole) and electron injection function,
They have a transport function and a function of generating excitons by recombination of holes and electrons. It is preferable to use a relatively electronically neutral compound for the light emitting layer.

The hole injecting and transporting layer has a function of facilitating the injection of holes from the hole injecting electrode, a function of stably transporting holes, and a function of preventing electrons.
The electron injection transport layer has a function of facilitating injection of electrons from the electron injection electrode, a function of stably transporting electrons, and a function of preventing holes. These layers increase and confine holes and electrons injected into the light emitting layer, optimize the recombination region, and improve luminous efficiency.

The thickness of the light emitting layer, the thickness of the hole injecting and transporting layer, and the thickness of the electron injecting and transporting layer are not particularly limited, and vary depending on the forming method.
It is preferable that the thickness be in the range of 10 to 300 nm.

The thickness of the hole injecting and transporting layer and the thickness of the electron injecting and transporting layer depend on the design of the recombination / light emitting region, but may be about the same as the thickness of the light emitting layer or about 1/10 to 10 times. When the hole or electron injection layer and the transport layer are separated from each other, it is preferable that the injection layer has a thickness of 1 nm or more and the transport layer has a thickness of 1 nm or more. At this time, the upper limit of the thickness of the injection layer and the transport layer is usually about 500 nm for the injection layer and 500 nm for the transport layer.
It is about. Such a film thickness is the same when two injection / transport layers are provided.

The light emitting layer of the organic EL device contains a fluorescent substance which is a compound having a light emitting function. Examples of such a fluorescent substance include, for example, JP-A-63-26469.
No. 2 discloses at least one compound selected from compounds such as quinacridone, rubrene, and styryl dyes. Also, Tris (8
Quinolinol derivatives such as metal complex dyes having 8-quinolinol or a derivative thereof as a ligand, such as (quinolinolato) aluminum; tetraphenylbutadiene, anthracene, perylene, coronene, and 12-phthaloperinone derivatives. Further, phenylanthracene derivatives described in JP-A-8-12600 (Japanese Patent Application No. 6-110569), tetraarylethene derivatives described in JP-A-8-12969 (Japanese Patent Application No. 6-114456), and the like are described. Can be used.

Further, it is preferable to use in combination with a host substance capable of emitting light by itself, and it is preferable to use it as a dopant. In such a case, the content of the compound in the light emitting layer is 0.01 to 20% by weight, and more preferably 0.1 to 20% by weight.
It is preferably 1 to 15% by weight. When used in combination with a host substance, the emission wavelength characteristics of the host substance can be changed, light emission shifted to a longer wavelength becomes possible, and the luminous efficiency and stability of the device are improved.

The host substance is preferably a quinolinolato complex, and more preferably an aluminum complex having 8-quinolinol or a derivative thereof as a ligand. Such an aluminum complex is disclosed in JP-A-63-26469.
No. 2, JP-A-3-255190, JP-A-5-7073
3, JP-A-5-258859, JP-A-6-2158
No. 74 and the like.

Specifically, first, tris (8-quinolinolato) aluminum, bis (8-quinolinolato) magnesium, bis (benzo {f} -8-quinolinolato) zinc, bis (2-methyl-8-quinolinolato) aluminum Oxide, tris (8-quinolinolato) indium,
Tris (5-methyl-8-quinolinolato) aluminum, 8-quinolinolatolithium, tris (5-chloro-
8-quinolinolato) gallium, bis (5-chloro-8-
Quinolinolato) calcium, 5,7-dichloro-8-quinolinolatoaluminum, tris (5,7-dibromo-
8-hydroxyquinolinolato) aluminum and poly [zinc (II) -bis (8-hydroxy-5-quinolinyl) methane].

Other host materials are disclosed in
Phenylanthracene derivative described in JP-A-12600 (Japanese Patent Application No. 6-110569) and JP-A-8-1296
No. 9 (Japanese Patent Application No. 6-114456) is also preferable.

The light emitting layer may also serve as an electron injection / transport layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. These fluorescent substances may be deposited.

The light emitting layer is preferably a mixed layer of at least one kind of hole injecting and transporting compound and at least one kind of electron injecting and transporting compound, if necessary.
Further, it is preferable that a dopant is contained in the mixed layer. The content of the compound in such a mixed layer is preferably 0.01 to 20% by weight, more preferably 0.1 to 15% by weight.

In the mixed layer, a carrier hopping conduction path is formed, so that each carrier moves in a polarly advantageous substance and carrier injection of the opposite polarity is less likely to occur, so that the organic compound is less likely to be damaged. This has the advantage that the element life is extended. Further, by including the above-described dopant in such a mixed layer, the emission wavelength characteristics of the mixed layer itself can be changed, the emission wavelength can be shifted to a longer wavelength, and the emission intensity is increased, The stability of the device can be improved.

The hole injecting / transporting compound and the electron injecting / transporting compound used in the mixed layer may be selected from the compounds for the hole injecting / transporting layer and the compounds for the electron injecting / transporting layer described below, respectively. Among them, compounds for the hole injection transport layer include amine derivatives having strong fluorescence,
For example, it is preferable to use a triphenyldiamine derivative which is a hole transport material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring.

As the compound capable of injecting and transporting electrons, it is preferable to use a quinoline derivative, furthermore a metal complex having 8-quinolinol or a derivative thereof as a ligand, particularly tris (8-quinolinolato) aluminum (Alq3). It is also preferable to use the above-mentioned phenylanthracene derivatives and tetraarylethene derivatives.

As the compound for the hole injecting and transporting layer, an amine derivative having strong fluorescence, for example, a triphenyldiamine derivative which is the above-described hole transporting material, a styrylamine derivative, or an amine derivative having an aromatic condensed ring is used. Is preferred.

The mixing ratio in this case depends on the respective carrier mobility and carrier concentration. In general, the weight ratio of the compound of the hole injecting and transporting compound / the compound having the electron injecting and transporting function is 1/99 to less. 99/1, more preferably 10/90 to 90/10, particularly preferably 20/80
It is preferable to set it to about 80/20. The thickness of the mixed layer is preferably equal to or greater than the thickness of one molecular layer and less than the thickness of the organic compound layer. Specifically, the thickness is preferably 1 to 85 nm, more preferably 5 to 85 nm.
６０60 nm, particularly preferably 5-50 nm.

As a method of forming a mixed layer, co-evaporation in which evaporation is performed from different evaporation sources is preferable. However, when the vapor pressures (evaporation temperatures) are the same or very close, the mixed layers are previously mixed in the same evaporation board. Alternatively, it can be deposited. In the mixed layer, it is preferable that the compounds are uniformly mixed, but in some cases, the compounds may exist in an island shape. The light-emitting layer is generally formed to a predetermined thickness by vapor-depositing an organic fluorescent substance or by dispersing and coating the resin in a resin binder.

The hole injecting and transporting layer is described in, for example,
JP-A-3-295695, JP-A-2-191694, JP-A-3-792, JP-A-5-234681
JP, JP-A-5-239455, JP-A-5-5-2
JP-A-99174, JP-A-7-126225, JP-A-7-126226, JP-A-8-100172
Various organic compounds described in JP-A No. 06509555 A1 and the like can be used. For example, a tetraarylbendicine compound (triaryldiamine or triphenyldiamine: TPD), an aromatic tertiary amine,
Examples include hydrazone derivatives, carbazole derivatives, triazole derivatives, imidazole derivatives, oxadiazole derivatives having an amino group, and polythiophene. These compounds may be used alone or in combination of two or more. When two or more kinds are used in combination, they may be stacked as separate layers or mixed.

When the hole injecting and transporting layer is divided into a hole injecting layer and a hole transporting layer, a preferable combination can be selected from the compounds for the hole injecting and transporting layer. At this time, it is preferable to laminate the compounds in order from the hole injecting electrode (ITO or the like) with the smallest ionization potential. Further, it is preferable to use a compound having a good thin film property on the surface of the hole injection electrode. Such a stacking order is the same when two or more hole injection transport layers are provided. With such a stacking order, the driving voltage is reduced, and the occurrence of current leakage and the occurrence and growth of dark spots can be prevented. In addition, in the case of forming an element, since a thin film of about 1 to 10 nm can be made uniform and pinhole-free because evaporation is used,
Even if a compound having a small ionization potential and having absorption in the visible region is used for the hole injection layer, it is possible to prevent a change in the color tone of the emission color and a decrease in efficiency due to reabsorption. The hole injecting and transporting layer can be formed by vapor deposition of the above compound in the same manner as the light emitting layer and the like.

The electron injecting / transporting layer includes a quinoline derivative such as an organometallic complex having 8-quinolinol such as tris (8-quinolinolato) aluminum (Alq3) or a derivative thereof as a ligand, an oxadiazole derivative, a perylene derivative, or the like. A pyridine derivative, a pyrimidine derivative, a quinoxaline derivative, a diphenylquinone derivative, a nitro-substituted fluorene derivative, or the like can be used. The electron injection / transport layer may also serve as the light emitting layer. In such a case, it is preferable to use tris (8-quinolinolato) aluminum or the like. The electron injecting and transporting layer may be formed by vapor deposition or the like, similarly to the light emitting layer.

When the electron injecting and transporting layer is divided into an electron injecting layer and an electron transporting layer, a preferable combination can be selected from the compounds for the electron injecting and transporting layer. At this time, it is preferable to stack the compounds in descending order of the electron affinity value from the electron injection electrode side. Such a stacking order is the same when two or more electron injection / transport layers are provided.

The hole injecting and transporting layer, the light emitting layer and the electron injecting and transporting layer can be formed by forming a uniform thin film.
It is preferable to use a vacuum deposition method. When vacuum deposition is used, the amorphous state or the crystal grain size is 0.1 μm
The following homogeneous thin film is obtained. If the crystal grain size exceeds 0.1 μm, non-uniform light emission occurs, the driving voltage of the device must be increased, and the hole injection efficiency is significantly reduced.

The conditions for vacuum deposition are not particularly limited.
The degree of vacuum is 0 ^-4 Pa or less, and the deposition rate is 0.01 to 1 nm /
It is preferable to set it to about sec. Further, it is preferable to form each layer continuously in a vacuum. If they are formed continuously in a vacuum, impurities can be prevented from adsorbing at the interface between the layers, so that high characteristics can be obtained. Further, the driving voltage of the element can be reduced, and the occurrence and growth of dark spots can be suppressed.

In the case where a plurality of compounds are contained in one layer when the vacuum evaporation method is used for forming each of these layers, it is preferable to co-deposit each boat containing the compounds by individually controlling the temperature.

Further, in addition to the organic layer, the organic EL structure has a substrate and a functional thin film such as a hole injection electrode or an electron injection electrode formed on the substrate so as to sandwich the organic layer.

As the electron injection electrode, a substance having a low work function is preferable. For example, K, Li, Na, Mg, La, C
e, Ca, Sr, Ba, Al, Ag, In, Sn, Z
It is preferable to use a single metal element such as n or Zr, or a two-component or three-component alloy system containing them for improving the stability. As an alloy system, for example, Ag · Mg (A
g: 0.1 to 50 at%), Al.Li (Li: 0.01)
１２12 at%), In · Mg (Mg: 50 to 80 at%),
Al.Ca (Ca: 0.01 to 20 at%) and the like. Note that the electron injection electrode can also be formed by an evaporation method or a sputtering method.

The thickness of the electron injecting electrode thin film may be a certain thickness or more for sufficiently injecting electrons.
The thickness is preferably 1 nm or more, more preferably 3 nm or more. The upper limit is not particularly limited, but the thickness may be generally about 3 to 500 nm. An auxiliary electrode or a protection electrode may be further provided on the electron injection electrode.

The pressure during the deposition is preferably 1 × 10 ⁻⁸ to 1
The heating temperature of the evaporation source is 100 to 1400 ° C. for a metal material and 100 to 50 ° C. for an organic material at × 10 ⁻⁵ Torr.
About 0 ° C. is preferable.

The hole injection electrode is preferably a transparent or translucent electrode for extracting emitted light. As the transparent electrode, ITO (tin-doped indium oxide), IZO
(Zinc-doped indium oxide), ZnO, SnO ₂ , I
Examples include n ₂ O ₃ , and preferably ITO (tin-doped indium oxide) and IZO (zinc-doped indium oxide). ITO usually contains In ₂ O ₃ and SnO in a stoichiometric composition, but the amount of O may slightly deviate from this. When transparency is not required, the hole injection electrode may be made of a known opaque metal material.

The hole injection electrode has an emission wavelength band, usually 3
50-800 nm, especially 80% light transmittance for each emitted light.
%, Particularly preferably 90% or more. The emitted light is usually extracted through the hole injection electrode,
When the transmittance is low, the light emission itself from the light emitting layer is attenuated, and the luminance required for the light emitting element tends not to be obtained. However, when the emitted light is extracted from only one side, it is sufficient that the emitted light is at least 80% of the emitted light on the side opposite to the extraction side. When taking out light from both sides, it is sufficient that the light emission is 80% or more for each emitted light.

The thickness of the hole injecting electrode may be a certain value or more so as to sufficiently inject holes, and is preferably 5 or more.
The range is preferably from 0 to 500 nm, more preferably from 50 to 300 nm. The upper limit is not particularly limited, but if the thickness is too large, there is a fear of peeling or the like. If the thickness is too small, there is a problem in the film strength at the time of manufacturing, the hole transport ability, and the resistance value.

This hole injection electrode layer can be formed by a vapor deposition method or the like.
It is preferable to form by the C sputtering method.

After forming each layer of the organic EL structure, the Si
Inorganic materials O _X such as Teflon, a protective film may be formed using an organic material such as fluorocarbon polymers containing chlorine.
The protective film may be transparent or opaque, and the thickness of the protective film is about 50 to 1200 nm. The protective film can be formed by a general sputtering method, a vapor deposition method,
It may be formed by an ECVD method or the like.

The light emission color may be controlled by using a color filter film, a color conversion film containing a fluorescent substance, or a dielectric reflection film on the substrate.

The organic EL structure is driven by a direct current or a pulse, and can be driven by an alternating current. The applied voltage is usually about 2 to 30V.

The organic EL element module of the present invention can be used not only as a display, but also as various optical devices such as an optical pickup used for memory read / write, a relay device in an optical communication transmission line, and a photocoupler. It can be used for application devices.

[0129]

EXAMPLE An ITO transparent electrode (hole injection electrode) was formed on a glass substrate by sputtering to a thickness of about 100 nm. The obtained ITO thin film was patterned and etched by a photolithographic technique to form a hole injection electrode layer constituting a 240 × 320 dot (pixel) pattern.

After the surface of the substrate on which the ITO transparent electrode, electrode wiring, and the like are formed is subjected to UV / O ₃ cleaning, a mask for vapor deposition is mounted, and the substrate is fixed to a substrate holder of a vacuum vapor deposition apparatus. The pressure was reduced.

Evaporating polythiophene to a thickness of 10 nm,
A hole injecting layer was formed, and then N,
N'-diphenyl-N, N'-m-tolyl-4,4'-
Diamino-1,1'-biphenyl (hereinafter referred to as TPD)
Evaporation was performed to a thickness of 5 nm to form a hole transport layer. Further, while maintaining the reduced pressure, tris (8-quinolinolato) aluminum (hereinafter, Alq3) was deposited to a thickness of 50 nm to form an electron injection transport / light emitting layer.

Then, while maintaining the reduced pressure, the EL element structure substrate was transferred from the vacuum evaporation apparatus to the sputtering apparatus, and the AlLi electron injection electrode (Li concentration: 7.2 at%) was formed at a sputtering pressure of 1.0 Pa to a thickness of 50 nm. Then, a film was formed. At that time, Ar was used as a sputtering gas, the input power was 100 W, the size of the target was 4 inches in diameter, and the distance between the substrate and the target was 90 mm. Further, while maintaining the reduced pressure, the EL
The element substrate was transferred to another sputtering apparatus, and the Al protective electrode was set to 200 nm by DC sputtering using an Al target.
Was formed to a thickness of The mask was removed when all film formation was completed.

Finally, a glass sealing plate was attached, and organic E
L display. At this time, one having only the inner sealed body (Comparative Sample 1), one having only the inner sealed body and having a moisture absorbent (zeolite) disposed therein (Comparative Sample 2), and simply having the inner sealed body and the outer sealed body Stopper with double sealing (Sample 1), with a hygroscopic agent disposed only inside the double sealing inner sealing body (Sample 2), Inside of double sealing outer sealing body (Sample 3), in which the moisture absorbent was disposed both inside and inside the double-sealed inner sealed body and the outer sealed body (Sample 4).

Each of the obtained organic EL devices was heated at a temperature of 60 ° C.
Continuous driving was performed at a current density of 10 mA / cm ² under an acceleration condition of 95% humidity, the non-light-emitting area ratio of each pixel was observed, and those exceeding 30% were judged to be defective and evaluated.

As a result, all the pixels of Comparative Sample 1 were defective in less than 500 hours, and Comparative Sample 2 was defective in less than 500 hours. On the other hand, the sample of the present invention is sample 1
No defective pixel could be confirmed even after 500 hours or more, Sample 2 had passed 1000 hours or more, Sample 3 had passed 1000 hours or more, and Sample 5 had passed 2000 hours or more.

[0136]

As described above, according to the present invention, it is possible to realize an organic EL device module capable of maintaining a sufficient sealing effect, suppressing deterioration of the device and extending the life of the device.

Further, a multi-layer structure of a substrate on which the driving electric circuit elements or ICs are mounted by COG and CSP is enabled, wiring is easy, and input / output signals, connection of power supply, etc. are not dispersed. Organic E that can be compactly integrated
An L element module can be realized.

In addition, it is possible to realize an organic EL element module which is hardly affected by noise or the like generated by the organic EL element even when the phase down method is used.

Further, it is possible to realize an organic EL element module which is hardly affected by heat generated by a driving electric circuit or an IC and can prevent a reduction in the life of the element.

Further, when the module is modularized, a control circuit,
It is possible to easily replace the circuit element of the drive circuit and to realize an organic EL element module with a low product defect rate.

Further, it is possible to realize an organic EL element module in which a problem such as wettability of the sealing adhesive does not easily occur, a decrease in adhesive strength can be prevented, and airtightness can be maintained for a long period of time.

Further, an organic EL element module having a certain level of mechanical strength and easy to handle can be realized.

Further, it is possible to realize an organic EL element module which is hardly affected by light and can prevent malfunction.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a first configuration example of the present invention.

FIG. 2 is a schematic sectional view showing a second configuration example of the present invention.

FIG. 3 is a schematic sectional view showing a third configuration example of the present invention.

FIG. 4 is a schematic sectional view showing a fourth configuration example of the present invention.

FIG. 5 is a schematic sectional view showing a fifth configuration example of the present invention.

FIG. 6 is a schematic sectional view showing a sixth configuration example of the present invention.

FIG. 7 is a block diagram showing a configuration example of a circuit for driving the organic EL structure of the present invention.

FIG. 8 is a schematic sectional view showing a configuration example of a display module using a conventional organic EL element.

FIG. 9 is a schematic sectional view showing a configuration example of a liquid crystal display module mounted with CSG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 3 Internal sealing body 4 Sealing adhesive 5 Hygroscopic agent 6 External sealing body 7 Sealing adhesive 8 Hygroscopic agent 9 Connecting means 11 Lower electrode 12 Organic layer 13 Upper electrode 21 Circuit element 22 Circuit pattern 23 Electromagnetic Shield 26 Heat conduction member

Continued on the front page (72) Inventor Mitsunari Suzuki 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Yoshihiro Saito 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Shiro Nakagawa 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Osamu Onitsuka 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Hiroshi Yamamoto 1-1-13 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Shun 1-13-1, Nihonbashi, Chuo-ku, Tokyo Inside FTD term (reference) 3K007 AB00 AB05 AB06 AB13 AB14 AB18 BA06 BB00 BB01 BB05 BB06 CA01 CC05 DA00 DA01 DB03 EB00 FA01 GA00

Claims (9)

[Claims] An organic EL structure having at least one or more organic layers involved in a light emitting function between a pair of electrodes formed on a substrate, and a sealing unit for sealing the organic EL structure. Wherein the sealing means comprises: an internal sealing member disposed at a position closest to the organic EL structure; and one or more external sealing members disposed outside the internal sealing member. An organic EL element module comprising: 2. The organic electroluminescent device according to claim 1, wherein a circuit for controlling and driving an organic EL structure is formed on one of the inner sealing body, the outer sealing body, and the substrate between them. EL element module. 3. A connecting means between the sealing means and the substrate, the connecting means electrically connecting a circuit inside the sealing means and an external circuit, and a connection inside the sealing means. 3. The organic EL element module according to claim 1, wherein the module maintains airtightness. 4. The organic EL element module according to claim 1, further comprising a moisture absorbent inside said sealing means. 5. The organic EL element module according to claim 1, further comprising an electromagnetic shield inside said sealing means. 6. The external sealing body, or any one thereof, has a higher thermal conductivity than the internal sealing body.
The organic EL element module according to any one of the above. 7. The organic EL element module according to claim 1, wherein the external sealing body has a light-shielding property, or a member having a light-shielding property is disposed inside the sealing means. 8. The organic EL element module according to claim 1, wherein the external sealing body or any one thereof is formed of a metal material. 9. The method according to claim 1, wherein the total thickness is 10 mm or less.
An organic EL device module according to any one of items 1 to 8,