JP2006236745A - Organic electroluminescence apparatus and its manufacturing method, and electronic apparatus and optical write head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic electroluminescence apparatus which obtains good sealability and can realize the compactification of the whole apparatus. <P>SOLUTION: The organic electroluminescence apparatus S includes a light emitting element 3 provided on a substrate 1, a sealing film 10 connected to the light emitting element 3 and overlying the light emitting element 3, a sealing member 20 connected to the substrate 1 and overlying the light emitting element 3, and a driver 30 provided in a sealing space 2 between the substrate 1 and the sealing member 20 and driving the light emitting element 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an organic electroluminescence (EL) device, a manufacturing method thereof, an electronic apparatus, and an optical writing head.

The organic EL device has a light emitting element having a structure in which a light emitting layer containing a light emitting material is sandwiched between an anode and a cathode electrode layer, and a hole injected from the anode side and an electron injected from the cathode side. The desired light is emitted by utilizing the phenomenon of recombination within the light emitting layer having the light emitting ability and light emission when losing from the excited state. Since a light emitting element is easily deteriorated by moisture, oxygen, etc. in the atmosphere, sealing is performed in the organic EL device in order to protect the light emitting element from the atmosphere. Patent Document 1 below discloses an example of a technique related to sealing.
JP 2004-265776 A

  In the conventional technique, a driving element (chip) for driving the light emitting element is mounted on the outside of the sealing plate of the substrate. However, with such a configuration, there is a possibility that the entire apparatus is increased in size.

  The present invention has been made in view of the above circumstances, and provides an organic electroluminescence device that can achieve good sealing performance and can achieve downsizing of the entire device, a manufacturing method thereof, an electronic apparatus, and an optical writing head. For the purpose.

  In order to solve the above problems, an organic electroluminescence device of the present invention includes a light emitting element provided on a substrate, a film connected to the light emitting element and covering the light emitting element, connected to the substrate, and the light emitting element. A sealing member that covers an element, and a driving element that is provided in a space between the substrate and the sealing member and drives the light emitting element are provided.

  According to the present invention, since the drive element is provided in the space between the substrate and the sealing member, the entire apparatus can be made compact. In addition, since the distance between the driving element and the light emitting element can be shortened, a connection portion that electrically connects the driving element and the light emitting element can be shortened, and the electrical connection to the light emitting element or the driving element can be shortened. The influence of noise can be suppressed. Moreover, since the light emitting element is sealed with the film and the sealing member, it is sealed well.

  The film may employ a configuration including an inorganic material. According to this, while being able to obtain favorable sealing performance, it is possible to realize downsizing of the entire apparatus.

  The film may include a structure containing silicon oxynitride. According to this, while being able to obtain favorable sealing performance, it is possible to realize downsizing of the entire apparatus.

  A configuration having a desiccant provided in the space can be employed. Thereby, good sealing performance can be maintained for a long time.

  The space may employ a configuration including a first space for disposing the light emitting element and a second space for disposing the driving element. According to this, the second space can be interposed between the first space in which the light emitting element is disposed and the external space, and it is possible to satisfactorily suppress moisture and the like from entering the first space from the external space. And high sealing performance can be obtained.

  A configuration having a desiccant provided in the second space can be employed. According to this, the environment (dry state) of the second space interposed between the first space and the external space can be maintained in a desired state, and moisture or the like enters the first space from the external space. Can be suppressed well, and high sealing performance can be obtained.

  The second space may be configured to surround the first space. According to this, it is possible to satisfactorily prevent moisture and the like from entering the first space from the external space, and high sealing performance can be obtained.

  Adopting a configuration in which the first space is provided to extend in the first direction, and the second space is provided at a position adjacent to the first space with respect to the second direction intersecting the first direction. Can do. In the case where the first space is formed with the first direction as the longitudinal direction, moisture or the like entering the first space from the external space is mainly the first space in the gap between the substrate and the sealing member. It is thought that it passes through the gap in the longitudinal part of the. Therefore, by providing the second space at a position adjacent to the first space with respect to the second direction intersecting the first direction, it is possible to satisfactorily suppress moisture and the like from entering the first space from the external space, High sealing performance can be obtained.

  An electronic apparatus according to the present invention includes the organic electroluminescence device described above.

  ADVANTAGE OF THE INVENTION According to this invention, a light emitting element can be sealed favorable and the electronic device which has a compact and desired performance can be provided.

  An optical writing head according to the present invention includes the organic electroluminescence device described above, and irradiates light to a photosensitive member.

  ADVANTAGE OF THE INVENTION According to this invention, a light-emitting element can be sealed favorable and the optical writing head which has a compact and desired performance can be provided.

  The organic electroluminescence device manufacturing method of the present invention includes a first step of providing a light emitting element on a substrate, a second step of connecting a film to the light emitting element so as to cover the light emitting element, and the light emission on the substrate. In order to dispose the light emitting element and the driving element between the substrate and the sealing member by connecting a sealing member to the substrate and a third step of mounting a driving element for driving the element. And a fourth step of forming the space.

  According to the present invention, since the drive element is mounted on the substrate after the light-emitting element is sealed with the film, the light-emitting element can be prevented from being deteriorated even during the mounting operation of the drive element. And by connecting a board | substrate and a sealing member, it has favorable sealing performance and can manufacture the organic electroluminescent apparatus by which compactization is implement | achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Furthermore, the rotation directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
FIG. 1 is a side sectional view of the organic EL device according to the first embodiment. In FIG. 1, an organic EL device S is connected to a substrate 1, a light emitting element 3 provided on the substrate 1, a sealing film 10 connected to the light emitting element 3 and covering the light emitting element 3, and a substrate 1. A sealing member 20 that covers the light emitting element 3 (sealing film 10) and a driving element 30 that is provided in the sealing space 2 between the substrate 1 and the sealing member 20 and drives the light emitting element 3 are provided. . The light emitting element 3 and the driving element 30 are provided on the surface (active surface) 1A of the substrate 1, and a connecting portion (wiring) for electrically connecting the light emitting element 3 and the driving element 30 to the surface 1A of the substrate 1. Is provided. The sealing member 20 is connected to the substrate 1 via an adhesive 8 while forming a sealing space 2 for disposing the light emitting element 3 and the driving element 30 between the sealing member 20 and the substrate 1.

  The sealing member 20 is formed in a U shape that is downwardly viewed in cross section, and forms a sealing space 2 with the substrate 1. The sealing member 20 has a second region 42 that is bonded to the first region 41 of the substrate 1. The first region 41 is set outside the portion of the surface 1A of the substrate 1 where the light emitting element 3 is provided. The second region 42 is set on the lower end surface of the sealing member 20 and faces the first region 41. A sealing space for sealing the light emitting element 3 between the flat substrate 1 and the sealing member 20 by bonding the first region 41 and the second region 42 via the adhesive 8. 2 is formed.

  The light emitting element 3 includes an anode 4 formed on the surface 1 </ b> A of the substrate 1, a hole transport layer 5, a light emitting layer 6, and a cathode 7. The anode 4 of the light emitting element 3 provided in the sealed space 2 is electrically connected to the driving element 30 via a connection portion (wiring). Although not shown, the cathode 7 of the light emitting element 3 is also electrically connected to the driving element 30. Electric power including a drive signal is supplied from the drive element 30 to the anode 4 and the cathode 7 of the light emitting element 3. Further, a desiccant 9 called a getter agent is provided in the sealed space 2. The desiccant 9 is provided on the ceiling surface 20 </ b> B of the sealing member 20 facing the surface 1 </ b> A of the substrate 1. The desiccant 9 suppresses deterioration of the light emitting element 3 due to moisture and the like, and can maintain good sealing performance for a long time.

  The sealing film 10 is directly covered on the surface of the light emitting element 3. Here, the surface of the light emitting element 3 means a surface other than the region in contact with the substrate 1. The sealing film 10 is covered on the entire surface of the light emitting element 3, and the lower end portion of the sealing film 10 is connected to the substrate 1.

The sealing film 10 has a function of sealing the light emitting element 3 and suppresses moisture and the like from entering the light emitting element 3. The sealing film 10 includes an inorganic material. As a forming material for forming the sealing film 10, silicon oxynitride (SiON), silicon dioxide (SiO ₂ ), silicon nitride (SiN), or the like can be used.

  In FIG. 1, the surface of the light emitting element 3 is shown as having a single sealing film 10 made of an inorganic material. However, the sealing film has an adhesive function of an inorganic film and a synthetic resin. A plurality of organic films may be alternately stacked. Generation of cracks can be prevented by stacking a plurality of inorganic films and organic films. In addition, an inorganic film may be provided in multiple layers. In this case, for example, a film made of one kind of material such as silicon oxynitride may be provided in multiple layers, or a film made of different materials such as stacking silicon nitride and silicon dioxide may be provided in multiple layers. Also good. By making an inorganic film into a multilayer, the sealing performance with respect to the light emitting element 3 can be improved more.

  As described above, the sealing film 10 is directly connected to the light emitting element 3 without forming a space between the sealing film 10 and the light emitting element 3. The sealing film 10 is provided so as to cover the entire surface of the light emitting element 3, and exhibits a desired sealing performance for the light emitting element 3.

  The driving element (chip) 30 is mounted on the surface 1A of the substrate 1. For the connection between the driving element 30 and the substrate 1, techniques such as chip on glass (COG) and chip size package (CSP) are used. The drive element 30 is provided in the sealing space 2 provided between the substrate 1 and the sealing member 20. The drive element 30 and the light emitting element 3 are electrically connected via a wiring (connection portion) (not shown) provided on the surface 1A of the substrate 1.

  The sealing member 20 blocks the intrusion of air including moisture and oxygen from the external space into the sealing space 2. The forming material for forming the sealing member 20 is not particularly limited as long as it has a desired sealing performance. For example, a material having a low moisture permeability such as glass, quartz, synthetic resin, or metal is used. Can do. As the glass, for example, soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, silica glass and the like can be used. As the synthetic resin, a transparent synthetic resin such as polyolefin, polyester, polyacrylate, polycarbonate, polyether ketone, or the like can be used. As the metal, aluminum, stainless steel, or the like can be used.

  The desiccant 9 is not particularly limited as long as it has a desired drying function (moisture absorption function) in the sealed space 2. For example, silica gel, zeolite, activated carbon, calcium oxide, germanium oxide, barium oxide, magnesium oxide, Phosphorus pentoxide, calcium chloride, or the like can be used.

  The adhesive 8 is provided over the entire first region 41 (or the second region 42). The adhesive 8 is not particularly limited as long as it can maintain a stable adhesive strength and has good airtightness. For the adhesive 8 of this embodiment, a photocurable epoxy resin that is cured by irradiation with ultraviolet light (UV) is used. Note that the adhesive 8 is not limited to a photocurable material, and may be a thermosetting material, or may be cured by mixing two or more different materials.

  The organic EL device S of the present embodiment is a so-called bottom emission mode in which light emitted from the light emitting element 3 is taken out from the substrate 1 side to the outside of the device. The substrate 1 is formed of a transparent or translucent material that can transmit light, for example, transparent glass, quartz, sapphire, or a transparent synthetic resin such as polyester, polyacrylate, polycarbonate, or polyetherketone.

  The anode 4 injects holes into the hole transport layer 5 by an applied voltage, and is formed of a transparent conductive film such as ITO (Indium Tin Oxide).

  The hole transport layer 5 is for transporting and injecting holes of the anode 4 to the light emitting layer 6, and a known material can be used. For example, polythiophene, polyaniline, polypyrrole, etc. can be used. More specifically, 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like can be used.

  The light emitting layer 6 has a function of generating fluorescence by combining holes injected from the anode 4 through the hole transport layer 5 and electrons injected from the cathode 7. As a material for forming the light emitting layer 6, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. For example, polyfluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinyl carbazole (PVK), polythiophene derivative, polymethylphenylsilane (PMPS) A polysilane such as can be used.

  Further, an electron transport layer may be provided between the light emitting layer 6 and the cathode 7. The electron transport layer serves to inject electrons into the light emitting layer 6. Materials for forming the electron transport layer include oxadiazole derivatives, anthraquinodimethane and its derivatives, benzoquinone and its derivatives, naphthoquinone and its derivatives, anthraquinone and its derivatives, tetracyanoanthraquinodimethane and its derivatives, fluorenone derivatives , Diphenyldicyanoethylene and derivatives thereof, diphenoquinone derivatives, metal complexes of 8-hydroxyquinoline and derivatives thereof, and the like can be used.

  The cathode 7 is a metal having a low work function that can efficiently inject electrons into the light emitting layer 6, such as aluminum (Al), magnesium (Mg), gold (Au), silver (Ag), calcium (Ca), and the like. It is made of a metal material.

  When a driving signal is supplied from the driving element 30 to the light emitting element 3, a current flows between the anode 4 and the cathode 7, the light emitting element 3 emits light, and light is emitted to the outer surface side of the transparent substrate 1. The

  Next, a method for manufacturing the organic EL device S having the above-described configuration will be described with reference to the schematic diagram shown in FIG. A part of the manufacturing process described below is performed under an inert gas atmosphere such as nitrogen gas or argon gas in order to prevent the optical element 3 from deteriorating.

  As shown in FIG. 2A, the light emitting element 3 is provided on the surface (active surface) 1 </ b> A of the substrate 1. The light emitting element 3 is provided on the substrate 1 using a predetermined method in the order of the anode 4, the hole transport layer 5, the light emitting layer 6, and the cathode 7. Although not shown in FIG. 2, wiring (connection portion) and the like are already formed on the surface 1 </ b> A of the substrate 1. After the cathode 7 of the light emitting element 3 is provided on the substrate 1, the sealing film 10 is coated on the light emitting element 3 by a predetermined method. In the present embodiment, after the cathode 7 is formed by the vacuum vapor deposition technique, the sealing film 10 is coated on the surface of the light emitting element 3 using the vacuum vapor deposition technique so as to be continuous. In addition, as a method of covering the light emitting element 3 with the sealing film 10, a method such as ion plating or sputtering (low temperature sputtering) may be used. Thereby, the sealing film 10 is connected to the surface of the light emitting element 3 so as to cover the light emitting element 3. By covering the surface of the light emitting element 3 with the sealing film 10 having a predetermined thickness, the light emitting element 3 is prevented from coming into contact with moisture or the like even during the manufacturing process of the organic EL device S. Can be sealed. Although it is difficult to seal the light emitting element 3 for a long time, the sealing film 10 has a sufficient sealing property in a relatively short period (for example, about several tens of days at room temperature) such as during the manufacturing process.

  As described above, when a plurality of inorganic films and organic films are stacked on the light emitting element 3, the inorganic film and the organic film are stacked on the light emitting element 3 by using a predetermined method. By doing so, even during the manufacturing process of the organic EL device S, the light emitting element 3 can be satisfactorily sealed by preventing the occurrence of cracks and the contact between the light emitting element 3 and moisture. .

  After the step of providing the light emitting element 3 and the sealing film 10 on the substrate 1 is completed, a predetermined mounting apparatus 50 for performing COG mounts the driving element 30 on the substrate 1 as shown in FIG. To do. At this time, the mounting apparatus 50 and the sealing film 10 (light emitting element 3) are not interfered with each other according to the size of the light emitting element 3, the size of the driving element 30, the shape of the mounting apparatus 50, and the like. 50, the driving element 30 is mounted at a position separated from the sealing film 10 by a predetermined distance D4.

  Next, as shown in FIG. 2C, the adhesive 8 is applied to the first region 41 of the substrate 1. When the adhesive 8 is applied on the substrate 1, a droplet discharge method can be used. In the droplet discharge method, a forming material for forming a material layer to be formed is made into a liquid material, and the liquid material is quantitatively discharged using a droplet discharge device such as a dispenser or an inkjet device. In this method, the forming material is applied to a desired region. The droplet discharge device applies the adhesive 8 to the first area 41 on the substrate 1 in a predetermined pattern. After the adhesive 8 is applied to the first region 41 of the substrate 1, the first region 41 of the substrate 1 and the second region 42 of the sealing member 20 including the desiccant 9 are bonded together via the adhesive 8. It is done. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). In this case, a mask that blocks light can be disposed at a predetermined position so that the light emitting element 3 is not irradiated with light for curing the adhesive 8. Thus, by connecting the sealing member 20 to the substrate 1, a sealing space 2 for arranging the light emitting element 3 and the driving element 30 is formed between the substrate 1 and the sealing member 20. In this way, the organic EL device S having the drive element 30 provided in the sealed space 2 is manufactured.

  In the case where a plurality of light emitting elements 3 and a sealing member 20 corresponding to the light emitting elements 3 are provided on one substrate 1, the substrate 1 is cut according to the light emitting elements 3 and the sealing member 20. A process is provided. The step of cutting the substrate 1 can be performed, for example, after the light emitting element 3 is coated with the sealing film 10. Since the light emitting element 3 is provided on the front surface 1A of the substrate 1, it is preferable to cut the substrate 1 from the back surface 1B side opposite to the front surface 1A. By doing so, it is possible to prevent inconvenience that debris and the like generated from the substrate 1 adhere to the sealing film 10 (light-emitting element 3) and the like along with the cutting operation. Further, when the substrate 1 is cut, the substrate 1 is cut while protecting the sealing film 10 (light emitting element 3) with a protective jig so as not to damage the sealing film 10 (light emitting element 3). It is desirable to do. Further, the step of cutting the substrate 1 can be performed, for example, after the drive element 30 is mounted on the substrate 1 or after the substrate 1 and the sealing member 20 are connected.

  As described above, the light emitting element 3 and the sealing film 10 are directly connected to each other without forming a space between the light emitting element 3 and the sealing film 10, and the sealing is performed between the substrate 1 and the substrate 1. Since the sealing member 20 that covers the light emitting element 3 (sealing film 10) while forming the space 2 is provided, the double sealing structure of the sealing film 10 and the sealing member 20 makes it possible for the light emitting element 3 to be favorable. The sealing performance can be obtained, and the entire organic EL device S can be made compact as compared with the configuration in which the sealing member connected to the substrate via the adhesive is provided in duplicate.

  In addition, since the mounting process for mounting the driving element 30 is performed after the light emitting element 3 is sealed with the sealing film 10, for example, the light emitting element 3 is in contact with moisture during the mounting process of the driving element 30. It is possible to prevent inconvenience such as.

  In the present embodiment, since the light emitting element 3 and the sealing film 10 are directly connected without forming a space between the light emitting element 3 and the sealing film 10, the sealing film 10 is provided, the drive element 30 can be mounted near the light emitting element 3 with good workability while suppressing interference between the mounting apparatus 50 and the sealing film 10 (light emitting element 3). And after mounting the drive element 30, by providing the sealing member 20, favorable sealing performance can be obtained, realizing compactization of the organic EL device S as a whole. That is, in the configuration in which the driving element 30 is provided outside the sealing member 20 as shown in FIG. 3 without providing the driving element 30 in the sealing space 2, the substrate 1 and the sealing member 20 are bonded to the adhesive 8. After connecting via the mounting device 50, the mounting device 50 is used to mount the drive element 30 on the substrate 1. In that case, in order to prevent the mounting device 50 and the sealing member 20 from interfering with each other, The drive element 30 is mounted at a position away from the sealing member 20 by a predetermined distance D4 ′. Since the sealing member 20 forms the sealing space 2 between the substrate 1 and the height D8 of the sealing member 20 is larger than the height D5 of the driving element 30, the driving element 30 is mounted. In this case, there is a high possibility that the mounting apparatus 50 and the sealing member 20 interfere with each other. Therefore, the predetermined distance D4 ′ needs to be larger than the predetermined distance D4 shown in FIG. 1 or the like according to the size of the sealing member 20, the size of the driving element 30, the shape of the mounting device 50, and the like. The possibility increases. When the distance D7 between the driving element 30 and the light emitting element 3 shown in FIG. 3 is increased along with the increase in the distance D4 ′, wiring (connecting portion) for electrically connecting the driving element 30 and the light emitting element 3 is formed. There is a possibility that the influence of electrical noise on the light emitting element 3 or the driving element 30 is increased. Further, the substrate 1 is provided with a light emitting region corresponding to the size of the light emitting element 3 and a non-light emitting region (frame region) that does not contribute to light emission around the light emitting region, but as the distance D7 increases. Thus, the ratio of the non-light emitting area per unit area of the substrate 1 is increased. If the non-light-emitting area is increased, the number of organic EL devices S that can be formed from one substrate 1 is reduced, leading to an increase in cost, or an organic EL device S having a small light-emitting area is formed. Arise. However, in the present embodiment, since the distance D7 (distance D4) can be sufficiently reduced, the above-described inconvenience can be suppressed. Although the distance D4 'shown in FIG. 3 is about 0.5 mm, the distance D4 shown in FIG. 1 and the like could be about 0.1 to 0.2 mm.

  Thus, by providing the driving element 30 in the sealing space 2, the distance D4 between the driving element 30 and the sealing film 10, and thus the distance D7 between the driving element 30 and the light emitting element 3 can be shortened. . Therefore, the light emitting area per unit area of the substrate 1 can be increased, and the entire organic EL device S can be made compact. In addition, since the connection portion (wiring) that electrically connects the driving element 30 and the light emitting element 3 can be shortened, the influence of electrical noise on the light emitting element 3 or the driving element 30 can be suppressed.

  Further, by providing the drive element 30 in the sealing space 2 inside the sealing member 20, the sealing space 2 can be effectively used. Further, for example, deterioration of the drive element 30 can be prevented without molding the drive element 30 with a synthetic resin or the like. Since the drive element 30 does not have to be molded, the entire organic EL device S can be made more compact. In addition, when the sealing member 20 is made of metal, it can be expected that the drive element 30 is protected from external electromagnetic waves.

  Further, the coating accuracy when the sealing film 10 is coated on the light emitting element 3 is, for example, when the adhesive 8 is applied to the first region 41 of the substrate 1 in order to bond the substrate 1 and the sealing member 20 together. Since it may be rougher than the coating accuracy, when the double sealing structure is realized, the double sealing structure using the protective film 10 and the sealing member 20 is connected to the substrate via an adhesive. Compared to the configuration in which the sealing member is provided in duplicate, the manufacturing process of the organic EL device S can be simplified. Here, the coating accuracy when the protective film 10 is coated on the light emitting element 3 includes the variation accuracy of the film thickness of the protective film 10 and the positional accuracy with respect to the substrate 1 when the film is formed. Similarly, the application accuracy when applying the adhesive 8 to the first region 41 of the substrate 1 includes the variation accuracy of the thickness of the adhesive 8 and the positional accuracy with respect to the substrate 1 when applying the adhesive 8. .

  The manufacturing process of the organic EL device S is preferably performed in an inert gas atmosphere until the substrate 1 and the sealing member 20 are connected, but the surface of the light emitting element 3 is covered with the sealing film 10. Later, even when performed in a dry air atmosphere, for example, deterioration of the light-emitting element 3 due to moisture or the like can be suppressed.

  In addition, although the adhesive 8 of this embodiment is formed with the organic material, when low melting glass and a metal are used as the adhesive 8, the board | substrate 1 from the external space to the sealing space 2, the sealing member 20, and Since it is possible to satisfactorily suppress the intrusion of moisture and oxygen through the bonded portion, the desiccant 9 can be omitted.

Second Embodiment
Next, a second embodiment will be described with reference to FIGS. 4 is a side sectional view of the organic EL device according to the second embodiment, and FIG. 5 is a sectional view taken along line AA in FIG. A characteristic part of this embodiment is that a first space 2A for disposing the light emitting element 3 and a second space 2B for disposing the driving element 30 are disposed between the substrate 1 and the sealing member 2. It is in the point provided. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  4 and 5, the sealing member 20 has an inner peripheral wall 21 for forming the first space 2 </ b> A and the second space 2 </ b> B with the substrate 1. The inner peripheral wall 21 is provided so as to extend from the ceiling surface 20B of the sealing member 20 toward the substrate 1, and when viewed from a direction perpendicular to an XY plane parallel to the surface 1A of the substrate 1, It is formed in a letter shape. A lower end portion of the inner peripheral wall 21 that is a part of the sealing member 20 and the substrate 1 are connected via an adhesive 8. The sealing member 20 has an outer peripheral wall 22 that surrounds the inner peripheral wall 21, and the lower end portion of the outer peripheral wall 22 and the substrate 1 are connected via an adhesive 8. A first space 2A for disposing the light emitting element 3 is formed inside the inner peripheral wall 21, and a second space 2B for disposing the drive element 30 is provided between the inner peripheral wall 21 and the outer peripheral wall 22. Is formed. The first space 2A and the second space 2B are separated, the light emitting element 3 is provided on the substrate 1 in the first space 2A, and the drive element 30 is provided on the substrate 1 in the second space 2B. Yes. The second space 2B is provided outside the first space 2A so as to surround the first space 2A.

  A desiccant 9 is provided in the second space 2B. The desiccant 9 is provided on the ceiling surface 20B of the second space 2B.

  By providing the first space 2A for arranging the light emitting element 3 and the second space 2B for arranging the driving element 30 as the sealing space 2 between the substrate 1 and the sealing member 20, The second space 2 </ b> B can be interposed between the first space 2 </ b> A in which the light emitting element 3 is disposed and the external space outside the sealed space 2. Thereby, since the substantial distance (effective sealing length) of the flow path through which the gas (atmosphere) between the first space 2A provided with the light emitting element 3 and the external space passes can be increased, the external space Therefore, it is possible to satisfactorily prevent moisture and the like from entering the first space 2A and to obtain high sealing performance. Then, by providing the desiccant 9 in the second space 2B, the environment (dry state) of the second space 2B can be changed to a desired state, and moisture can be transferred from the external space to the first space 2A via the second space 2B. And the like can be satisfactorily suppressed and high sealing performance can be obtained. In this case, even if the desiccant 9 is not provided in the first space 2A, the environment (dry state) of the first space 2A can be maintained in a desired state. In addition to the second space 2B, by providing the desiccant 9 also in the first space 2A, a better sealing property can be realized.

  In addition, since the second space 2B of the present embodiment is provided so as to surround the first space 2A, it is possible to satisfactorily suppress the intrusion of moisture and the like from all directions surrounding the first space 2A, and high sealing. Stop performance can be obtained.

<Third Embodiment>
Next, a third embodiment will be described with reference to FIGS. 6 is a side sectional view of the organic EL device according to the third embodiment, and FIG. 7 is a sectional view taken along the line BB in FIG. The characteristic part of the present embodiment is provided such that the first space 2A extends in the first direction (Y-axis direction), and the second space 2B is in the first direction (Y-axis direction) with respect to the first space 2A. It is in the point provided in the position which adjoins regarding the 2nd direction (X-axis direction) which crosses.

  The organic EL device S of the present embodiment is formed in a substantially rectangular shape as a whole when viewed from a direction perpendicular to an XY plane parallel to the surface 1A of the substrate 1 with a predetermined direction (Y-axis direction) as a longitudinal direction. Has been. The organic EL device S formed in a substantially rectangular shape in plan view with the predetermined direction as the longitudinal direction can be suitably used for an optical writing head that irradiates light to a photosensitive member (photosensitive drum).

  The sealing member 20 has a partition wall 23 for forming the first space 2 </ b> A and the second space 2 </ b> B with the substrate 1. The partition wall 23 is provided so as to extend from the ceiling surface 20 </ b> B of the sealing member 20 toward the substrate 1. The partition wall 23 forms a first space 2A for arranging the light emitting element 3 and a second space 2B adjacent to the first space 2A. The first space 2A for arranging the light emitting element 3 is provided so as to extend in the Y-axis direction, and is formed in a substantially rectangular shape in plan view with the Y-axis direction as the longitudinal direction.

  The second space 2B is provided at a position adjacent to the first space 2A in the X-axis direction. In the present embodiment, the second space 2B is provided on each of the + X side (one side) and the −X side (the other side) of the first space 2A. In the following description, the second space 2B provided on the + X side of the first space 2A will be referred to as “right space 2Ba” as appropriate, and the second space 2B provided on the −X side of the first space 2A will be referred to as appropriate. , Referred to as “left space 2Bb”.

  Each of the right space 2Ba and the left space 2Bb is provided so as to extend in the Y-axis direction so as to correspond to the first space 2A, and is formed in a substantially rectangular shape in plan view with the Y-axis direction as the longitudinal direction. In the present embodiment, the right space 2Ba is smaller than the left space 2Bb, and the drive element 30 is provided in the left space 2Bb. The drive element 30 is not provided in the right space 2Ba. A desiccant 9 is provided on each ceiling surface 20B of the right space 2Ba and the left space 2Bb.

  When the first space 2A is formed with a predetermined direction (here, the Y-axis direction) as a longitudinal direction, moisture or the like that enters the first space 2A from the external space is between the substrate 1 and the sealing member 20. Of these gaps, it is considered that it mainly passes through the gap in the longitudinal portion of the first space 2A. More specifically, moisture or the like is a gap G1 between the outer peripheral wall 22 on the + X side of the sealing member 20 and the substrate 1, and between the outer peripheral wall 22 on the −X side of the sealing member 20 and the substrate 1. It is considered that it passes through the gap G2. Therefore, by providing the second space 2B (2Ba, 2Bb) at a position adjacent to the first space 2A in the X-axis direction, the gas between the first space 2A in which the light emitting element 3 is provided and the external space is provided. Since the substantial distance (effective sealing length) of the flow path through which (atmosphere) passes can be increased, the sealing effect can be enhanced. Thus, the second space 2B (2Ba, 2Bb) is provided at a position adjacent to at least the second direction (X-axis direction) with respect to the first space 2A having the first direction (Y-axis direction) as the longitudinal direction. Accordingly, it is possible to satisfactorily prevent moisture and the like from entering the first space 2A from the external space, and high sealing performance can be obtained.

  In the present embodiment, the second space 2B is provided on both sides of the first space 2A in the X-axis direction, but is provided so as to surround the first space 2A as in the second embodiment. Also good.

<Optical writing head>
FIG. 8 is a diagram showing an example in which the above-described organic EL device S is applied to an optical writing head (printer head) of an electrophotographic printer. In FIG. 8, an optical system 60 is provided above the substrate 1 of the organic EL device S, and a photosensitive drum (photoconductor) 61 is provided above the optical system 60. The organic EL device S irradiates the photosensitive drum 61 with light via the optical system 60. Light emitted from the substrate 1 of the organic EL device S is condensed on the photosensitive drum 61 through the optical system 60. Since the organic EL device S is made compact, the photosensitive drum 61 can be made small. Therefore, the entire electrophotographic printer can be made compact.

<Electronic equipment>
Next, an example of an electronic apparatus provided with the organic EL device S of the above embodiment will be described.
FIG. 9A is a perspective view illustrating an example of a mobile phone. In FIG. 9A, reference numeral 1000 denotes a mobile phone main body, and reference numeral 1001 denotes a display unit using the organic EL device S described above.

  FIG. 9B is a perspective view illustrating an example of a wristwatch-type electronic device. In FIG. 9B, reference numeral 1100 indicates a watch body, and reference numeral 1101 indicates a display unit using the organic EL device S described above.

  FIG. 9C is a perspective view illustrating an example of a portable information processing device such as a word processor or a personal computer. In FIG. 9C, reference numeral 1200 denotes an information processing apparatus, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus body, and reference numeral 1206 denotes a display unit using the organic EL device S described above.

  Since the electronic devices shown in FIGS. 9A to 9C include the organic EL device S of the above embodiment, a compact electronic device having desired performance can be provided.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the light emission of the light emitting element 3 is described by using an example of so-called bottom emission in which the light emission of the light emitting element 3 is emitted to the outer surface side through the substrate 1. It is also possible to use a so-called top emission type that is emitted from the cathode 7 side through the sealing member 20. In this case, as the sealing film 10, the sealing member 20, and the cathode 7, a transparent or translucent material capable of extracting light is used.

It is principal part sectional drawing which shows the organic electroluminescent apparatus which concerns on 1st Embodiment. It is a figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 1st Embodiment. It is a figure for demonstrating an example of the manufacturing method of an organic electroluminescent apparatus. It is principal part sectional drawing which shows the organic EL apparatus which concerns on 2nd Embodiment. FIG. 5 is a cross-sectional view taken along line AA in FIG. 4. It is principal part sectional drawing which shows the organic EL apparatus which concerns on 3rd Embodiment. FIG. 7 is a cross-sectional view taken along line B-B in FIG. 6. It is a figure for demonstrating the example which applied the organic EL apparatus to the optical writing head. It is a figure which shows an example of the electronic device provided with the organic EL apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Sealing space, 2A ... 1st space, 2B ... 2nd space, 3 ... Light emitting element, 9 ... Desiccant, 10 ... Sealing film, 20 ... Sealing member, 30 ... Between drive elements, R ... first region, S ... organic EL device

Claims (11)

A light emitting device provided on a substrate;
A film connected to the light emitting element and covering the light emitting element;
A sealing member connected to the substrate and covering the light emitting element;
An organic electroluminescence device comprising: a drive element that is provided in a space between the substrate and the sealing member and drives the light emitting element.   The organic electroluminescence device according to claim 1, wherein the film includes an inorganic material.   The organic electroluminescence device according to claim 1, wherein the film contains silicon oxynitride.   The organic electroluminescent device according to claim 1, further comprising a desiccant provided in the space.   The organic electroluminescence device according to claim 1, wherein the space includes a first space in which the light emitting element is disposed and a second space in which the driving element is disposed.   The organic electroluminescence device according to claim 5, further comprising a desiccant provided in the second space.   The organic electroluminescence device according to claim 5 or 6, wherein the second space is provided so as to surround the first space. The first space is provided to extend in a first direction;
The organic electroluminescence device according to claim 5, wherein the second space is provided at a position adjacent to the first space in a second direction intersecting the first direction.   The electronic device provided with the organic electroluminescent apparatus as described in any one of Claims 1-8.   An optical writing head comprising the organic electroluminescence device according to any one of claims 1 to 8 and irradiating light to a photosensitive member. A first step of providing a light emitting element on a substrate;
A second step of connecting a film to the light emitting element so as to cover the light emitting element;
A third step of mounting a driving element for driving the light emitting element on the substrate;
A fourth step of forming a space for disposing the light emitting element and the driving element between the substrate and the sealing member by connecting the sealing member to the substrate; Production method.

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