KR100627298B1 - Apparatus and method for joining an encapsulation glass of an organic light emitting display - Google Patents

Abstract

Provided are a bonding apparatus and a bonding method for bonding encap glass of an organic light emitting display device. In the present invention, an ultraviolet lamp is disposed on the upper side and the lower side of the encap glass, respectively, and the ultraviolet curing agent is cured at the upper side and the lower side using the ultraviolet rays generated by the ultraviolet lamp. The stage for supporting the encap glass is formed of a material capable of transmitting UV light so that ultraviolet rays generated from the ultraviolet lamp installed on the lower side can be irradiated to the ultraviolet curing agent through the encap glass on the upper side of the stage, and the encap glass is bonded to the substrate. In order to be able to do so, the stage is installed to be elevated.

OLED, UV, hardening, double, encap glass, encapsulation substrate,

Description

Encapsulating glass bonding apparatus and bonding method of organic light emitting display device {APPARATUS AND METHOD FOR JOINING AN ENCAPSULATION GLASS OF AN ORGANIC LIGHT EMITTING DISPLAY}

1 is a view showing a schematic configuration of an encap glass bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a process block diagram of a bonding method using the bonding apparatus of FIG. 1.

The present invention relates to a bonding apparatus and a bonding method for bonding the encap glass of the organic light emitting display, and more particularly, to a bonding apparatus and a bonding method for bonding the encap glass to the substrate by curing the ultraviolet curing agent.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include Liquid Crystal Display (LCD), Field Emission Display (FED), Plasma Display Panel (PDP) and Organic Light Emitting Display (PDP). Etc.

The organic light emitting diode display is a self-luminous display device that electrically excites an organic compound to emit light. The organic light emitting diode display may display an image by voltage driving or current driving N × M organic light emitting devices.

The organic light emitting diode has a diode characteristic and is also called an organic light emitting diode, which is composed of an anode electrode as a hole injection electrode, an organic thin film as a light emitting layer, and a cathode electrode as an electron injection electrode. Holes and electrons are injected into the organic thin film to emit light when an exciton in which holes and electrons are combined falls from an excited state to a ground state.

In addition, the light emitting layer has a multilayer structure including an electron transport layer (ETL) and a hole transport layer (HTL), and an electron injection layer (EIL) and a hole injection layer (Hole Injection layer). ; HIL) may be further included.

The organic light emitting diode display includes a substrate on which the organic light emitting diode is formed and an encap glass encapsulating the substrate.

In an active matrix type organic light emitting display device, a driving circuit unit including a plurality of thin film transistors is formed on the substrate, a planarization layer is formed on the driving circuit unit, and the organic light emitting element is a pixel on the planarization layer. A pixel defining layer (PDL) is formed to be separated from an adjacent device.

In the case of a passive matrix type organic light emitting display device, the substrate includes a stripe pattern anode electrode, an inter insulator exposing the anode electrode in a plurality of lattice patterns, and an interlayer insulating film. A cathode separator to be stacked, a light emitting layer and a cathode electrode stacked on the anode are formed.

The organic light emitting diode display having such a structure is easily deteriorated by moisture and oxygen.

Therefore, normally, both substrates are encapsulated by applying a sealant such as an ultraviolet curing agent to a substrate or an encap glass, and curing the ultraviolet curing agent using an ultraviolet curing apparatus.

An ultraviolet curing apparatus for bonding an encap glass of an organic light emitting display device typically includes a stage for supporting the encap glass in a liftable manner, an ultraviolet lamp provided on the upper side of the stage, and a mask disposed between the ultraviolet lamp and the encap glass. do.

The ultraviolet lamp is provided to cure the ultraviolet curing agent, and the mask is provided so as not to affect other parts except the portion to which the ultraviolet curing agent is applied.

Therefore, the encap glass is bonded to the substrate by aligning the encap glass coated with the ultraviolet curing agent on the stage with the substrate and the mask, and curing the ultraviolet curing agent by ultraviolet rays irradiated from the ultraviolet lamp.

By the way, according to the above-mentioned conventional ultraviolet curing device, since only one ultraviolet lamp is used to cure the ultraviolet curing agent, curing of the ultraviolet curing agent takes a long time and curing on the opposite side to the side where the ultraviolet lamp is installed. There is a problem that a difference occurs in the degree of sealing quality deterioration.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide an encap glass bonding apparatus and a bonding method of an organic light emitting display device which can shorten the curing time of the ultraviolet curing agent and improve the curing quality.

In order to achieve the above object, the present invention is to provide an ultraviolet lamp on the upper side and the lower side of the encap glass, respectively, and to cure the ultraviolet curing agent on the upper side and the lower side using the ultraviolet rays generated in the ultraviolet lamp, respectively. Provided is an encap glass bonding device.

In the practice of the present invention, the stage supporting the encap glass is formed of a material capable of transmitting ultraviolet rays so that ultraviolet rays generated from the ultraviolet lamp installed on the lower side can be irradiated to the ultraviolet curing agent through the encap glass on the upper side of the stage.

In addition, in order to be able to adhere the encap glass to the substrate, the stage may be installed to be elevated.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a view showing a schematic configuration of an encap glass bonding apparatus according to an embodiment of the present invention, Figure 2 is a process block diagram of the bonding method using the bonding apparatus of FIG.

Encapsulated glass bonding apparatus according to an embodiment of the present invention includes a chamber (10).

The encap glass 20 is used in an organic light emitting display device, and a desiccant is attached to one surface thereof.

A first ultraviolet lamp 30 is installed above the inside of the chamber 10, a first cooling device 40 is provided below the first ultraviolet lamp 30, and a lower part of the first cooling device 40 is provided. The first mask 50 is disposed.

Here, the first cooling device 40 is provided to prevent the degradation of the stability and characteristics of the organic light emitting device caused by the heat generated from the first ultraviolet lamp 30 and to shorten the lifespan. do.

A stage 60 supporting the encap glass 20 is provided below the first mask 50, and a substrate 20 ′ on which the organic light emitting elements are formed is provided between the encap glass 20 and the first mask 50. The second mask 50 ′, the second cooling device 40 ′, and the second ultraviolet lamp 30 ′ are sequentially disposed below the stage 60.

In this case, the stage 60 is made of a material capable of transmitting ultraviolet rays, for the purpose of allowing the ultraviolet curing agent to be cured by ultraviolet rays generated from the second ultraviolet lamp 30 '.

As the first and second ultraviolet lamps 30 and 30 ′, metal halide lamps irradiating ultraviolet rays having a wavelength band of about 200 to 400 nm may be used.

A method of bonding the encap glass of the organic light emitting diode display using the encap glass bonding apparatus having such a configuration is as follows.

First, the encap glass 20 coated with the UV curing agent is seated on the stage 60, and the substrate 20 ′ is seated on the upper side of the encap glass 20 with a slight distance from the UV curing agent. The substrate 20 ', the first and second masks 50, 50' are aligned by a mechanical alignment unit.

Subsequently, when the stage 60 is elevated to bond the encap glass 20 and the substrate 20 ', ultraviolet rays are generated from the first and second ultraviolet lamps 30 and 30' to cure the ultraviolet curing agent. .

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, in the embodiment of the present invention, the curing time of the ultraviolet curing agent can be shortened by curing the ultraviolet curing agent applied to the encap glass at the upper side and the lower side, and the curing quality of the ultraviolet curing agent can be uniformly cured. There is an effect that can be improved.

Claims (5)

A stage supporting an encap glass to which an ultraviolet curing agent is applied and made of a material capable of transmitting ultraviolet rays; A pair of ultraviolet lamps disposed above and below the stage, respectively, for generating ultraviolet rays for curing the ultraviolet curing agent; And A pair of masks disposed between the ultraviolet lamp and the stage so that the ultraviolet rays are irradiated only to the UV curing agent application site An encap glass bonding apparatus of an organic light emitting display device comprising a. The method of claim 1, The stage is encapsulated glass bonding apparatus of the organic light emitting display device is installed to be elevated. The method according to claim 1 or 2, The encapsulated glass bonding apparatus of the organic light emitting display device wherein the stage, the ultraviolet lamp and the mask are disposed in the chamber. The method of claim 3, wherein An encapsulated glass bonding apparatus of an organic light emitting display device having a cooling device disposed between the ultraviolet lamp and the mask. Applying an ultraviolet curing agent to at least one of the substrate or the encap glass; Disposing the substrate, the encap glass and the mask in an aligned state; Bonding the substrate and the encap glass; Irradiating ultraviolet rays from the upper side and the lower side of the substrate and the encap glass to cure the ultraviolet curing agent. Encap glass bonding method of an organic light emitting display comprising a.

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