JP2003272830A - Electric element sealing method, package, and display element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a tight sealing property of a package in order to prevent an electric element such as an organic EL element from being exposed to the open air. <P>SOLUTION: Resin 9' is applied so as to cover the whole part of the organic EL element 3 mounted on a base plate 2, afterwards, a metal sheet member 10 is adhered to the organic EL element 3 so as to cover the whole part of the organic EL element 3. Afterwards, the base plate is moved so that carrier gas can be blown toward the boundary part of the metal sheet member 10 and the base plate 2 in the direction of lamination. By the above, metal particles are deposited to and around the outer peripheral part of the metal sheet member 10, and a metallic sealing layer 8 is formed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric element encapsulation method for encapsulating an electric element, a package thereof, and a display element including the electric element and the package.

[0002]

2. Description of the Related Art In recent years, electric elements such as EL (Electro Luminescence) elements, liquid crystal elements, and semiconductor elements have been miniaturized. Such electrical devices are mainly manufactured on a glass substrate by photolithography, etching, chemical plating,
It is formed by stacking layers of various substances using various techniques such as vapor deposition and droplet application.

In order to protect the electric element formed on the glass substrate 102 from oxidation, dust, impact, outside air, etc., a so-called package as shown in FIG. 10 or 11 is applied to the electric element. As shown in FIG. 10, an organic EL element 101, which is an electric element, is formed on a substrate 102 and covered with a box-shaped sealing can 103. Sealing can 1
The inside of 03 is an internal space, and the sealing can 103 and the organic E
The L elements 101 are separated from each other. Also, the sealing can 103
Is adhered onto the substrate 102 with a resin 104.

The package of FIG. 11 has a laminated structure. That is, in this package, the resin 104 is deposited on the organic EL element 101 and the substrate 102, and the glass sealing plate 105 is bonded onto the resin 104.

[0005]

The resin 104 is inferior to the glass substrate 102, the sealing can 103, and the sealing plate 105 in the shielding property against oxygen and water, and the bonding property with glass is not sufficient. In the package, the sealing can 10
3 or the exposed side surface of the resin 104 located between the sealing plate 105 and the substrate 102, the sealing can 103 or the sealing plate 1
05 and the resin 104, the resin 104
Since the outside air may enter the package through a gap that may occur between the glass substrate 102 and the glass substrate 102, the organic EL element 101 is exposed to the outside air, and the organic EL element 101 is exposed to oxygen and moisture in the outside air. It may deteriorate. Therefore, an object of the present invention is to improve the sealing property of a package so that an electric element such as an organic EL element is not exposed to the outside air.

[0006]

In order to solve the above problems, the invention according to claim 1 provides an electrical device provided on a substrate (for example, substrate 2) as shown in FIGS. 3 to 5, for example. In an electric element sealing method for sealing an element (for example, an organic EL element 3), a resin forming step of forming a resin (for example, an adhesive resin 9 ′) so as to cover the entire electric element, and the entire electric element. A sheet material forming step of forming a sheet material (for example, a metal sheet material 10 or an inorganic material sheet material) on the resin so as to cover the substrate, and by spraying a carrier gas containing fine metal particles, the substrate and the sheet material. A metal seal layer forming step of forming a metal seal layer (for example, the metal seal layer 8) made of fine metal particles on the surface of the resin between.

The invention according to claim 3 is, for example, as shown in FIGS.
In an electric element sealing method for sealing an electric element (for example, an organic EL element 3) provided on a substrate (for example, the substrate 2), a resin (for example, A resin forming step of forming an adhesive resin 9 ') and a sheet material (for example,
A sheet material forming step of forming a metal sheet material 10 or an inorganic material sheet material) on the resin, and a resin seal layer (for example, a resin seal layer 27) on the surface of the resin between the substrate and the sheet material. A resin seal layer forming step of forming and a metal seal layer forming step of forming a metal seal layer (for example, metal seal layer 8) made of metal particles on the surface of the resin seal layer by spraying a carrier gas containing metal particles. And are included.

In the invention of claim 1 or 3, a resin is formed as a sealing material on the electric element, and a sheet material is formed on the resin, so that the electric element is sealed by the resin and the sheet material. It Then, by spraying a carrier gas, a metal seal layer is formed. Since the metal seal layer is formed by spraying fine metal particles, the fine metal particles are tightly and firmly bound to each other. There is. Therefore, the metal seal layer has improved density, liquid-tightness, and airtightness, external air is prevented from entering through the interface between the metal seal layer and the substrate, and deterioration of the electric element is suppressed. Further, since the electric element is covered with the sheet material and the resin, even if the carrier gas is sprayed in the sealing step, the electric element is not contaminated or short-circuited by the carrier gas. In the invention according to claim 3, since the metal seal layer is formed after the resin seal layer is formed, the hermeticity is further improved and the deterioration of the electric element is suppressed.

According to a second aspect of the invention, in the electric element sealing method according to the first aspect, the sealing step is performed after chamfering an outer peripheral portion of the sheet material.
According to the second aspect of the invention, since the outer peripheral portion of the sheet material is chamfered, the fine metal particles are reliably deposited on the side surfaces of the sheet material and the resin when the fine metal particles are sprayed. That is, it is possible to prevent defective formation of the metal seal layer.

According to a fourth aspect of the present invention, for example, as shown in FIG. 1, a package (for example, a package) for sealing an electric element (for example, an organic EL element 3) provided on a substrate (for example, a substrate 2). In 4), a resin layer (for example, an adhesive resin layer 9) formed on the entire surface of the substrate and the electric element around the electric element, and formed on the resin layer so as to cover the entire electric element. A sheet material (for example, a metal sheet material 10 or an inorganic material sheet material), and a metal seal layer (for example, a metal seal layer 8) formed on the surface of the resin layer between the substrate and the sheet material, It is characterized by having.

According to a fifth aspect of the invention, for example, as shown in FIG. 8, a package (for example, a package) for sealing an electric element (for example, an organic EL element 3) provided on a substrate (for example, the substrate 2). 24), in a package for encapsulating an electric element provided on a substrate, a resin layer (for example, an adhesive resin layer 9) formed on the entire surface of the electric element and the substrate around the electric element, A sheet material (for example, a metal sheet material 10 or an inorganic material sheet material) formed on the resin layer and a surface of the resin layer between the substrate and the sheet material so as to cover the entire electric element. And a metal seal layer (for example, a metal seal layer 28) formed on the surface of the resin seal layer.

According to the fourth or fifth aspect of the present invention, by covering the surface of the resin layer relatively permeable to water and oxygen with a metal seal layer, it is possible to suppress the intrusion of water or oxygen into the electric element. At this time, as described in claim 6, if the metal seal layer is formed by depositing the metal fine particles by spraying a carrier gas containing the metal fine particles, the metal fine particles are tightly and firmly bound to each other. is doing.
Therefore, the metal seal layer has improved density, liquid-tightness, and air-tightness, and the outside air is prevented from entering through the interface between the metal seal layer and the substrate, so that the deterioration of the electric element is suppressed.

According to a seventh aspect of the present invention, as shown in FIG. 1 or 8, for example, the package according to any of the fourth to sixth aspects, the electric element, and the substrate are provided. The element includes a first electrode (for example, an anode electrode 5) formed on the substrate, an organic EL layer (for example, an organic EL layer 6) formed on the first electrode, and the organic EL.
Second electrode formed on the layer (for example, cathode electrode 7)
And an organic EL element including: and the organic EL layer emits light when a voltage is applied between the first electrode and the second electrode.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.

First Embodiment FIG. 1 shows a display element 1 to which the present invention is applied. As shown in FIG. 1, the display element 1 includes a substrate 2 having a light-transmitting property and an insulating property, an organic EL element 3 as an electric element formed on the surface of the substrate 2, and an organic EL element 3. It is a so-called bottom emission type display element including a package 4 for sealing and a back surface of the substrate 2 serving as a display surface.

The substrate 2 is made of a material having translucency and insulation such as borosilicate glass, quartz glass and other glasses. The organic EL element 3 includes an anode electrode 5, an organic EL layer 6, and a cathode electrode 7. The organic EL element 3 has a laminated structure in which an anode electrode 5, an organic EL layer 6 and a cathode electrode 7 are laminated in this order from the substrate 2 side.

The anode electrode 5 has translucency and conductivity. Further, the anode electrode 5 is preferably one that efficiently injects holes into the organic EL layer 6. For example, as the anode electrode 5, indium tin oxide (IT
O: Indium-Tin-Oxide), zinc-doped indium oxide (IZO), indium oxide (In2O3), tin oxide (SnO2), or zinc oxide (ZnO) as a main component.

The organic EL layer 6 is formed on the anode electrode 5. The organic EL layer 6 is, for example, the anode electrode 5
It may have a three-layer structure including a hole transport layer, a light emitting layer, and an electron transport layer in this order, or a two layer structure including a hole transport layer and a light emitting layer in order from the anode electrode 5. It may have a single-layer structure composed of layers, or may have another layer structure.

That is, the organic EL layer 6 has a function of injecting holes and electrons, a function of transporting holes and electrons, and a function of generating excitons by recombination of holes and electrons to emit light. The organic EL layer 6 is preferably an electronically neutral organic compound, so that holes and electrons are generated in the organic EL layer 6.
It is well-balanced and injected and transported. Note that an electron-transporting substance may be appropriately mixed in the light-emitting layer, a hole-transporting substance may be appropriately mixed in the light-emitting layer, an electron-transporting substance, and a hole-transporting substance. May be appropriately mixed with the light emitting layer.

A cathode electrode 7 is formed on the organic EL layer 6. The material of the cathode electrode 7 is a material having a low work function. Specific examples of the cathode electrode 7 include gold, silver, copper, aluminum, indium, magnesium, calcium, lithium, or barium, or an alloy or mixture containing at least one of these. Further, the cathode electrode 7 may have a laminated structure in which layers of various materials described above are laminated, and specifically,
Examples include a laminated structure in which a high-purity barium layer having a low work function and a high-purity aluminum layer are sequentially formed from the organic EL layer 6. Further, it is desirable that the cathode electrode 7 has a light-shielding property and also has a high reflectivity for the light emitted from the organic EL layer 6.

In the organic EL element 3 having the laminated structure as described above, when an electric field (voltage) is generated between the anode electrode 5 and the cathode electrode 7, a current flows in the organic EL layer 3.
At this time, holes are injected into the organic EL layer 3 from the anode electrode 5, and electrons are injected into the organic EL layer 3 from the cathode electrode 7. Then, holes and electrons are transported to the light emitting layer of the organic EL layer 3, recombination of holes and electrons in the light emitting layer generates excitons, and the excitons are phosphors in the organic EL layer 3. Is excited to emit light. Substrate 2 and anode electrode 5
Is transparent, light passes through the substrate 2 and the anode electrode 5, the back surface of the substrate 2 serves as a display surface, and the cathode electrode 7 has reflectivity, so that the display brightness is also high.

The package 4 comprises a metal seal layer 8, an adhesive resin layer 9, and a metal sheet material 10. When viewed in the stacking direction (when viewed from above), the adhesive resin layer 9 covers the entire surface of the organic EL element 3 except the terminal portion 5a of the anode electrode 5 and the terminal portion 7a of the cathode electrode 7, and the organic EL element 3 is formed. Formed on. Further, the adhesive resin layer 9 is an organic EL.
It is also formed on the substrate 2 around the element 3. The adhesive resin layer 9 is insulative, and is made of any one of a thermosetting molding material, a thermoplastic molding material, and a photocurable molding material in which a silica filler is added to an epoxy resin as a main component.

The metal sheet material 10 is covered with the adhesive resin layer 9 so as to cover the entire organic EL element 3.
Glued on. Seen in the stacking direction, metal sheet material 1
0 covers the entire surface of the adhesive resin layer 9 and
It is provided on the top, and the thickness is basically 0.1mm-1mm
Is. The metal sheet material 10 shields a gas such as oxygen, neon, argon or nitrogen, and has conductivity. Since the metal sheet material 10 is adhered to the organic EL element 3 by the adhesive resin layer 9, the organic EL element 3 is protected from electrical disturbance such as static electricity, and
The organic EL element 3 is prevented from being contaminated by the carrier gas at the time of packaging described later.

When viewed in the stacking direction, the metal seal layer 8 is formed so as to surround the organic EL element 3. That is, as viewed in the stacking direction, the metal seal layer 8 is deposited on the outer peripheral portion of the metal sheet material 10 and also on the substrate 2 around the metal sheet material 10. Therefore, the metal sealing material 8 is formed in close contact with the surface of the side portion of the adhesive resin layer 9. The metal seal layer 8 has conductivity, and for example, Ni, Fe, Cr, Co, Au, Ag, A
It is a single metal such as 1, Cu, Pd, etc., or a mixture of one or more of these. The metal seal layer 8 has a particle size of 0.1 μm
It is formed by spraying metal fine particles of ˜0.01 μm.

The metal seal layer 8 is formed by a film forming apparatus as shown in FIG. The film forming apparatus includes a generation chamber 61 in which metal fine particles are formed, a film formation chamber 62 in which the metal seal layer 8 is formed, a transfer pipe 63 connecting the generation chamber 61 and the film formation chamber 62, and a transfer pipe 63. Extra particle exhaust pipe 64
A nozzle 65 provided at the tip of the transfer tube 63, a heater 66 provided in the film forming chamber 62 and on which the substrate 2 is set, and a positioning mechanism for positioning the substrate 2 set on the heater 66. An evacuation system 67 for bringing the film forming chamber 62 to a vacuum pressure and a carrier gas (for example,
Inert gas such as He and Ar, reducing gas such as H or N2
And a heating source 69 arranged in the generation chamber 61, and the like.

A method of manufacturing the package 4 and a method of sealing the organic EL element 3 will be described. First, as shown in FIG. 3, the adhesive resin 9 ′ is applied to the entire surface of the organic EL element 3 formed on the substrate 2, and the entire organic EL element 3 is covered with the adhesive resin 9 ′. At the stage of applying the adhesive resin 9 ',
The adhesive resin 9'is deposited so that the organic EL element 3 is included in the outer edge of the adhesive resin 9'in a plan view. At this time, the terminal portion 5a of the anode electrode 5 and the cathode electrode 7
The terminal portion 7a is exposed to the outside of the adhesive resin 9 '.
Then, as shown in FIG. 4, the organic EL element 3 is seen in a plan view.
A metal sheet material 10 having a larger area is covered over the entire organic EL element 3, and the metal sheet material 10 and the organic E element 3 are covered with an adhesive resin 9 '.
The L element 3 is bonded. When the adhesive resin 9'is solidified, the adhesive resin 9'becomes the adhesive resin layer 9, and the organic EL element 3
And the metal sheet material 10 is fixed.

Next, the substrate 2 to which the metal sheet material 10 is adhered is set on the heater 66 of the film forming apparatus. Then, the carrier gas purified and circulated by the carrier gas 68 is supplied to the generation chamber 61 at a pressure of several 100 kPa, and the film exhaust chamber 67 is vacuumed by the vacuum exhaust system 67 (1.3 × 10 ³ Pa). To Furthermore, the metal material (Ni, Fe, Cr, Co, Au,
A simple metal such as Ag, Al, Cu, or Pd, or a mixture of one or two or more thereof) is heated by the heating source 69 to be evaporated. As a result, the evaporated metal material collides with carrier gas molecules, is cooled, and becomes fine particles, which is the carrier pipe 63.
Is sucked into.

The fine metal particles sucked into the carrier pipe 63 are
As shown in FIG. 2, it blows out from the nozzle 65 at a speed of several hundred m / s or more and collides with the substrate 2 and the metal sheet material 10 set on the heater 66. At this time, while moving the substrate 2 by the positioning mechanism, the carrier gas containing the fine metal particles is continuously or intermittently sprayed from the nozzle 65.
The substrate 2 is moved by the positioning mechanism so that the carrier gas is blown toward the boundary between the metal sheet material 10 and the substrate 2 when viewed in the stacking direction. Thereby, the metal sheet material 1
The metal seal layer 8 is formed by depositing metal fine particles on the outer peripheral portion of 0 and its periphery.

The fine metal particles are the substrate 2 and the metal sheet material 10.
As shown in FIG. 5, the formed metal seal layer 8 is composed of fine metal particles that are densely and strongly bonded to each other, and are deposited particularly strongly. Excellent adhesion with a certain metal sheet material 10. Therefore, the metal seal layer 8 has excellent conductivity and thermal conductivity, and has improved density, liquid tightness and air tightness. As described above, the metal seal layer 8 includes the side surface of the adhesive resin layer 9 exposed from the periphery of the metal sheet material 10, the interface between the metal sheet material 10 and the adhesive resin layer 9, and the substrate 2 and the adhesive resin. By covering the interface with the layer 9 with the metal seal layer 8, it is possible to prevent oxygen and water from entering the organic EL element 3 through the gaps and the side surfaces at these interfaces, and to prevent the deterioration of the organic EL element 3. It can be suppressed.

Further, since the metal sheet material 10 is adhered to the organic EL element 3 in advance and the carrier gas containing the fine metal particles is jetted, the organic EL element 3 is not directly exposed to the carrier gas. Therefore, the organic EL element 3 is not damaged by the collision of the metal fine particles. Moreover, since the metal sheet material 10 has a shielding property against the carrier gas, the organic EL element 3 is not contaminated by the carrier gas.

The metal seal layer 8 is formed by a chemical plating method,
Unlike the vacuum vapor deposition, metallikon method, etc., it is formed by simply ejecting metal fine particles at high speed. Therefore,
Unlike the chemical plating method, the process of forming the metal seal layer 8 does not have the trouble of using and adjusting the chemical solution, and there is no problem of the metal sheet material 10 or the organic EL element 3 being contaminated by the chemical solution. The layer formation rate is not slow as in the vacuum deposition method. Even when compared with the metallikon method, the metal sheet material 10 and the organic E
The L element 3 or the substrate 2 will not be damaged.

In addition, the organic EL element 3 is the metal sheet material 10
Is covered with the metal seal layer 8 on the outer peripheral portion.
Thus, the organic EL element 3 is protected from electrical disturbance such as static electricity. Moreover, since the insulating adhesive resin layer 9 is interposed between the metal sheet material 10 and the metal seal layer 8 and the organic EL element 3, the organic EL element 3 is not electrically short-circuited.

By the way, since the metal fine particles are sprayed on the outer peripheral portion of the metal sheet material 10, as shown in FIG. 6, the metal fine particles are deposited like a tip 11 at the ridge angle of the outer edge of the metal sheet material 10, Further, it sometimes happens that the metal fine particles that are deposited like the ridges 12 on the substrate 2 and are hindered by the tips 11 are not deposited on the side surface of the adhesive resin layer 9 and the notches 13 are formed. Therefore, as shown in FIG. 7, when the chamfered portion 14 is formed on the outer edge of the metal sheet material 10 by removing the ridge angle of the outer edge of the metal sheet material 10, the notch 13 as shown in FIG. 6 is not formed. The chamfered portion 14 may be chamfered with a corner or may be a curved chamfer. The outer edge of the metal sheet material 10 may be chamfered when the metal sheet material 10 is formed, after the metal sheet material 10 is formed, or at any time before the metal fine particles are sprayed.

[Second Embodiment] In the first embodiment, the side surface of the adhesive resin layer 9 exposed from the periphery of the metal sheet material 10, the metal sheet material 10 and the adhesive resin layer 9 are separated from each other. Although the interface between them and the interface between the substrate 2 and the adhesive resin layer 9 are covered with the metal seal layer 8, the invasion of oxygen and water into the organic EL element 3 inside is suppressed. In the embodiment, the side surfaces and the gaps of the interface of the adhesive resin layer 9 are covered with a resin seal layer, and the resin seal layer is covered with a metal seal layer for sealing.

FIG. 8 shows a display element 20 according to the second embodiment. The display element 20 includes a substrate 2, an organic EL element 3, and a package 24. Since the substrate 2 and the organic EL element 3 have the same configurations as those in the case of the first embodiment, detailed description thereof will be omitted.

The package 24 includes a resin seal layer 27,
A metal seal layer 28, an adhesive resin layer 9, and a metal sheet material 10 are provided. Adhesive resin layer 9 and metal sheet material 1
No. 0 has the same configuration as in the case of the first embodiment described above, and detailed description thereof will be omitted.

The resin seal layer 27 is formed so as to surround the organic EL element 3 when viewed in the stacking direction. That is, as viewed in the stacking direction, the resin seal layer 27 is formed on the outer peripheral portion of the metal sheet material 10 and on the substrate 2 around the metal sheet material 10. Therefore, the resin seal layer 27 is provided on the side surface of the adhesive resin layer 9 exposed from the periphery of the metal sheet material 10, the metal sheet material 1.
It covers the interface between 0 and the adhesive resin layer 9, and the interface between the substrate 2 and the adhesive resin layer 9. The resin seal layer 27 basically has an insulating property and contains, for example, epoxy as a main component.

When viewed in the stacking direction, the metal seal layer 28 is also formed so as to surround the organic EL element 3. That is, as viewed in the stacking direction, the resin seal layer 27 is formed on the entire surface and is formed on the substrate 2 around the resin seal layer 27. Further, the metal seal layer 28 is formed on the metal sheet material 10 so as to protrude from the resin seal layer 27. The metal seal layer 28 has the resin seal layer 2 between them.
7 is substantially the same as the metal seal layer 8 of the first embodiment except that the metal seal layer 28 is formed on the side surface of the adhesive resin layer 9, the metal sheet material 10 and the resin. Interface between the seal layer 27, the substrate 2 and the resin seal layer 2
It covers the interface with 7 and protects this part from the ingress of water and oxygen.

A method of manufacturing the package 24 and a method of sealing the organic EL element 3 will be described. As in the case of the first embodiment, the adhesive resin 9 ′ is applied to the organic EL element 3 so as to cover the entire organic EL element 3, and the organic EL element 3 is formed.
The metal sheet material 10 is adhered to the organic EL element 3 with the adhesive resin 9 ′ so as to cover the whole (FIGS. 3 and 4). Then
With a dispenser device, a resin is applied to the boundary portion between the metal sheet material 10 and the substrate 2 in plan view, and the applied resin is solidified to form the resin seal layer 27 (FIG. 9). At this time, the resin seal layer 27 is formed on the side surface of the adhesive resin layer 9 exposed from the periphery of the metal sheet material 10, the metal sheet material 10.
It is applied so as to cover the interface between the adhesive resin layer 9 and the substrate 2, and the interface between the substrate 2 and the adhesive resin layer 9. Then, using the film forming apparatus of FIG. 2 in substantially the same manner as in the first embodiment,
The fine metal particles are ejected from the nozzle 65. At this time, the substrate 2 is moved by the positioning mechanism so that the carrier gas is blown toward the resin seal layer 27. As a result, metal fine particles are deposited on the entire surface of the substrate 2 and the resin seal layer 27 around the resin seal layer 27 as viewed in the stacking direction to form the metal seal layer 28. At this time, the metal seal layer 28 is formed so as to cover the side surface of the adhesive resin layer 9, the interface between the metal sheet material 10 and the resin seal layer 27, and the interface between the substrate 2 and the resin seal layer 27. It

The second embodiment can also provide the package 24 having an improved hermeticity as compared with the conventional one, that is, the same effect as that of the first embodiment can be obtained. In the second embodiment as well, as in the case of the first embodiment, the outer peripheral portion of the metal sheet material 10 may be chamfered.

[Applications] The present invention is not limited to the above-described embodiments, and various improvements and design changes may be made without departing from the spirit of the present invention.

For example, when the carrier gas containing fine metal particles is sprayed, the substrate 2 is heated by the heater 66 to a maximum of about 20.
You may heat to 0 degreeC. Even if the substrate 2 is heated to this extent, the organic EL element 3 is not thermally damaged, and the adhesion between the metal seal layer 8 or the metal seal layer 28 and the substrate 2 is further improved.

Instead of the metal sheet material 10, an inorganic material sheet material such as glass or ceramics may be adhered to the organic EL element 3 with the adhesive resin layer 9. Further, instead of the metal sheet material 10, a composite sheet material of an organic material sheet material and a metal sheet material 10 or a composite sheet material of an organic material sheet material and an inorganic material sheet material is bonded to the organic EL element 3 by an adhesive resin layer 9. You may. By the way, if the metal sheet material 10, the organic material sheet material, the inorganic material sheet material or the composite material sheet material is translucent, it is possible to provide a so-called top emission type display element. In the case of the example, the surface of the metal sheet material 10 is the display surface. In this case, the adhesive resin layer 9 is made of a material having a light-transmitting property (for example,
Epoxy resin) and the stacking order of the organic EL elements 3 is reversed (that is, the cathode electrode 7, the organic EL layer 6, and the anode electrode 5 are stacked in this order from the substrate 2).

Further, not only one organic EL element but also two or more organic EL elements may be collectively sealed in one package 4 or package 24. For example, a plurality of organic EL elements are arranged in a matrix of m rows and n columns (m and n are integers of 1 or more) on the surface of the substrate 2, and then an adhesive resin is applied so as to cover all the organic EL elements. 9'is applied and the metal sheet material 10 is adhered so as to cover all the organic EL elements. After that, the resin seal layer 27 and the metal seal layer 28 or the metal seal layer 8 may be formed as in the above-described respective embodiments. Of course, in this case, each organic EL element becomes a pixel, but a switching circuit (composed of one or a plurality of TFTs) provided for each pixel and driving the organic EL element of the pixel is also provided in the adhesive resin layer 9. The covered so-called active matrix organic EL element may be sealed in the package 4 or the package 24.

Further, what is sealed by the package 4 or the package 24 is not limited to the organic EL element as long as it is an electric element formed on the surface of the substrate 2. For example, a liquid crystal element including two counter electrodes and a liquid crystal layer sandwiched between the counter electrodes may be sealed in the package 4 or the package 24, or a field effect transistor may be sealed in the package 4 or the package 24. May be done.

[0046]

According to the present invention, since the metal seal layer is formed by spraying the metal fine particles, the metal fine particles are densely and firmly bound to each other. Therefore,
The metal seal layer has improved density, liquid tightness and air tightness. Furthermore, by spraying fine metal particles,
Since the metal fine particles are deposited on the substrate, the adhesion between the metal seal layer and the substrate is very high. Therefore, outside air is prevented from entering through the interface between the metal seal layer and the substrate, and deterioration of the electric element is suppressed. Further, since the sheet material is adhered to the electric element, even if the carrier gas is blown in the sealing step, the electric element is not contaminated by the carrier gas.

[Brief description of drawings]

FIG. 1 (a) is a cross-sectional view of a display element to which the present invention is applied, and FIG. 1 (b) is a plan view of the display element.

FIG. 2 is a drawing showing an apparatus for depositing a metal seal layer.

3 is a drawing for explaining a step of sealing an organic EL element, FIG. 3 (a) is a sectional view, and FIG.
(B) is a plan view.

FIG. 4 is a cross-sectional view for explaining a step of sealing an organic EL element.

5 is a drawing for explaining a step of sealing an organic EL element, FIG. 5 (a) is a sectional view, and FIG.
(B) is a plan view.

FIG. 6 is a cross-sectional view showing the vicinity of the outer edge of the organic EL element.

FIG. 7 is a cross-sectional view showing the vicinity of the outer edge of the organic EL element.

8A is a cross-sectional view of a display element of another example, and FIG. 8B is a plan view of the display element.

FIG. 9 shows an organic EL device in the display element of the another example.
It is sectional drawing for demonstrating the process of sealing an element.

FIG. 10 is a cross-sectional view showing a package for sealing a conventional organic EL element.

FIG. 11 is a sectional view showing a package for sealing a conventional organic EL element.

[Explanation of symbols]

1 display element 2 substrates 3 Organic EL element (electric element) 4 packages 5 Anode electrode 7 Cathode electrode 8 Metal seal layer 9 Adhesive resin layer (resin layer) 9'Adhesive resin (resin) 10 Metal sheet material (sheet material) 14 Chamfer 20 display elements 24 packages 27 Resin seal layer 28 Metal seal layer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsuyoshi Ozaki             5 Casio, 2951 Ishikawa-cho, Hachioji-shi, Tokyo             Computer Hachioji Research Institute F-term (reference) 3K007 AB11 AB12 AB13 BB01 BB02                       DB03 FA02

Claims (7)

[Claims] 1. An electric element sealing method for sealing an electric element provided on a substrate, comprising: a resin forming step of forming a resin so as to cover the entire electric element; and a sheet so as to cover the entire electric element. A sheet material forming step of forming a material on the resin and spraying a carrier gas containing metal fine particles to form a metal seal layer made of metal fine particles on the surface of the resin between the substrate and the sheet material. And a metal seal layer forming step. 2. After chamfering the outer peripheral portion of the sheet material,
The electrical element sealing method according to claim 1, wherein the metal seal layer forming step is performed. 3. An electric element sealing method for sealing an electric element provided on a substrate, comprising: a resin forming step of forming a resin so as to cover the entire electric element; and a sheet so as to cover the entire electric element. Sheet material forming step of forming a material on the resin, resin sealing layer forming step of forming a resin sealing layer on the surface of the resin between the substrate and the sheet material, and spraying a carrier gas containing metal fine particles Thus, a metal seal layer forming step of forming a metal seal layer made of fine metal particles on the surface of the resin seal layer is included. 4. A package for encapsulating an electric element provided on a substrate, wherein a resin layer formed on the entire surface of the electric element and the substrate around the electric element and the entire electric element are covered. A package comprising: a sheet material formed on the resin layer; and a metal seal layer formed on a surface of the resin layer between the substrate and the sheet material. 5. A package for encapsulating an electric element provided on a substrate, comprising: a resin layer formed on the entire surface of the electric element and the substrate around the electric element, and covering the entire electric element. A sheet material formed on the resin layer, a resin seal layer formed on the surface of the resin layer between the substrate and the sheet material, and a metal seal layer formed on the surface of the resin seal layer When,
A package characterized by having. 6. The package according to claim 4, wherein the metal seal layer is formed by depositing metal fine particles by spraying a carrier gas containing the fine metal particles. 7. A package according to any one of claims 4 to 6, comprising the electric element and the substrate, wherein the electric element includes a first electrode formed on the substrate,
An organic EL layer formed on the first electrode;
An organic EL element comprising a second electrode formed on an L layer, wherein the organic EL layer emits light when a voltage is applied between the first electrode and the second electrode. And display device.