JPH11297476A - Organic light-emitting element, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic light-emitting element of high reliability. SOLUTION: A glass substrate 1, a transparent electrode 2 for injecting holes on the surface of it, an insulation layer (support layer) 3 of silicon oxide or the like to surround plural micro-ranges, an organic hole transport layer 4, an organic light-emitting layer 5, a metal electrode layer 6 comprising silver- magnesium alloy for injecting electrons, and a silicon oxide layer 7 as a protective layer are sequentially formed, and another substrate 9 is disposed on the surface of this substrate via a thin resin layer 8. Since electric field is applied between a positive electrode and a negative electrode to emit light from the light-emitting layer 5, each microscopic light-emitting parts are separated from each other by the substrate and resin, so that the infiltration of moisture or the like in outer air is made difficult, thereby black points are less likely to be enlarged to achieve high reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention overcomes the drawbacks of conventional organic light-emitting devices, and in particular, suppresses the expansion of black spots to a certain level, thereby realizing high reliability and low cost. It relates to a manufacturing method.

[0002]

2. Description of the Related Art With the development of a highly information-oriented multimedia society, the development of flat display devices with low power consumption and high image quality has been activated. Non-emissive liquid crystal display elements have established their position with the feature of low power consumption, and their applications to portable information terminals and the like have been further enhanced. On the other hand, self-luminous display elements are less susceptible to external light and are easy to recognize indoors, so they can replace conventional CRTs and realize large-screen displays and ultra-high-definition displays that are difficult to realize with CRTs. The development of electroluminescent displays is becoming active.

[0003] In 1987, Tan et al. Adhered and formed a hole injecting electrode layer, an organic hole transporting layer, an organic electron transporting light emitting layer, and an electron injecting electrode layer on a substrate, so that organic light emitting at low voltage was obtained. Since the proposal of the EL device, (Reference: CWTa
ng et al. Appl.Phys. Lett.Vol.51, p.913 (198
7)) Research and development on organic EL displays are becoming more and more active. Recently, ELDs using such devices as character display devices and image display devices have been trial manufactured.

An outline of a conventional organic EL device proposed by Tan et al. Is shown in FIG. An anode 52 made of a transparent conductive thin film having a relatively large ionization potential such as indium tin oxide (ITO) and easy to inject holes is formed on a glass substrate 51. Next, the hole transport layer 54 and the electron transporting light emitting layer 55 are formed on almost the entire surface.
Are sequentially formed. A cathode 56 is formed on the surface of the metal layer having a relatively low work function such as a silver magnesium alloy (AgMg) and is easy to inject electrons. Further, the surface is covered with a protective layer 57, and a glass container 59 is provided on the element side, and the inside thereof is filled with an inert gas 60.
Filled with.

The light-emitting layer having an electron-transporting property generally has a lower work function than that of a metal. However, by using a metal having a low work function such as an AgMg alloy as a cathode, injection and transport of electrons are relatively reduced. Can be easily realized. Further, since the hole transport layer has a relatively large ionization potential, injection and transport of holes are relatively performed by using a material having a large ionization potential such as gold (Au) or indium tin oxide (ITO) as the anode. Can be easily realized. Thus, by applying a positive DC voltage to the anode with respect to the cathode, holes are injected from the anode (ITO) 52 into the hole transport layer, and electrons are injected from the cathode 56 into the electron transporting luminescent layer. Further, in the light emitting layer near the junction between the hole transporting layer and the electron transporting layer (light emitting layer), these are combined to form excitons to emit light 61. This light emission is observed through the transparent electrode and the substrate. Needless to say, light emission can also be obtained by bonding the hole transporting organic light emitting layer and the electron transporting organic layer and injecting and transporting holes and electrons.

This light emitting principle is similar to an inorganic light emitting diode formed of gallium arsenide or the like. By injecting electrons and holes into a compound semiconductor in which a PN junction is formed, electrons and positive electrons are injected near the junction. It can correspond to light emission caused by recombination of holes. The electron transport layer can be compared with an N-type compound semiconductor, and the hole transport layer can be compared with a P-type compound semiconductor.

[0007]

In an organic light emitting device, the organic EL medium used for the charge injection layer or the light emitting layer and the low work function material used as the cathode have low moisture resistance and oxidation resistance, so that the reliability is low. However, there remains a problem in the storage life as well as the operation life of the element. For example, simply leaving the element in the air causes a non-light-emitting portion called a black point to occur, deteriorating the display quality, and furthermore, the black point expands over time, and eventually the entire element stops emitting light. This was a very serious problem in practical use.

Although it is still unclear about the cause of the occurrence of black spots, dust adhered to the substrate surface during film formation, dust adhered after film formation, or at least local defects such as pinholes. Reacts with oxygen or moisture in the air as a nucleus, causing the organic layer or the cathode layer to peel off, and the peeled-off portion becomes a new defect, which further affects oxygen and water. In most cases, a black dot is steadily expanding around an initial point defect portion.

Although a measure to completely eliminate defects generated at the time of manufacturing in order to prevent the generation of black spots is conceivable, however, since the thickness of the organic thin film is as thin as about 0.1 μm, dust having a size substantially smaller than this is required. It is almost impossible to eliminate defects by removing the like. Therefore, an attempt has been made to prevent the black spot from expanding by coating the surface of the element with a resin or the like so that the organic layer and the cathode layer are not directly exposed to moisture or oxygen after the formation of the thin film. However, generally, resins made of organic substances have low solvent resistance, so that usable resins are limited, and almost no resins have sufficient moisture resistance for practical use. Therefore, as a result, as shown in the conventional example, the necessity arises to enclose the entire device in a completely sealed container. However, enclosing the entire element in a completely sealed container not only increases the manufacturing cost, but also increases the thickness and weight of the display element, which poses a major obstacle to realizing a thin, large-screen display. there were.

As described above, it is difficult to realize a highly reliable display with a conventional organic light emitting device, and it is extremely difficult to implement a low-cost color display.

The present invention overcomes such drawbacks of the conventional organic light-emitting device, and realizes a highly reliable and low-cost display device, particularly by suppressing the expansion of black spots to a certain level or less. .

[0012]

According to the present invention, there is provided a method for forming a plurality of substrates, wherein at least one is formed between two transparent substrates, and at least one of the substrates includes at least an anode layer, a light emitting layer made of an organic substance, and a cathode layer. In the organic light emitting device in which light is emitted from a light emitting layer of a certain pixel portion by current injection, a current non-injection region having a finer shape is formed inside the pixel on the substrate on which the light emitting layer is formed. And an organic light-emitting device, wherein the organic light-emitting device is in close contact with another protective substrate via a resin layer.

According to the present invention, an insulating layer having a minute shape is formed on a part of the surface of an electrode formed on a first substrate, and an organic thin film including a light emitting layer and another electrode are formed. A method for manufacturing an organic light emitting device, comprising: a process; and a process of disposing a second substrate to face the first substrate and filling a resin between the substrates.

[0014]

According to the first aspect of the present invention, at least one is formed between two transparent substrates,
At least an anode layer, a light-emitting layer made of an organic substance, and a plurality of layers including a cathode layer are formed on one substrate, and an organic light-emitting element in which light is emitted from a light-emitting layer in a certain pixel portion by current injection, An organic light emitting device, wherein a current non-injection region having a finer shape is formed inside a pixel on the substrate on which the light emitting layer is formed, and is closely bonded to another protective substrate via a resin layer. The element has the effect of realizing a highly reliable and low-cost display element.

According to a second aspect of the present invention, a support layer having a structure protruding above the substrate is formed in the current non-injection region, and the support layer and the other protective substrate are directly or via a resin layer. The organic light-emitting device according to claim 1, wherein the organic light-emitting device is in contact with the organic light-emitting device, and has an effect of realizing a highly reliable and low-cost display device.

According to a third aspect of the present invention, there is provided the organic light emitting device according to the second aspect, wherein the support layer is formed on a substrate on which a light emitting layer is formed. This has the effect of realizing a reliable, low-cost display element.

According to a fourth aspect of the present invention, there is provided the organic light emitting device according to the second aspect, wherein the support layer is formed on a substrate on which no light emitting layer is formed. This has the effect of realizing a reliable, low-cost display element.

According to a fifth aspect of the present invention, the thickness of the support layer is equal to or greater than the thickness of the organic layer.
And has an effect of realizing a highly reliable and low-cost display element.

According to a sixth aspect of the present invention, in the organic light emitting device according to the first aspect, the current non-injection region surrounds a minute current injection region. This has the effect of realizing a reliable, low-cost display element.

According to a seventh aspect of the present invention, there is provided the organic light emitting device according to the first aspect, wherein the size of the minute region is 100 μm or less. It has an effect of realizing a display element.

According to an eighth aspect of the present invention, the organic light-emitting device according to the first aspect of the present invention is characterized in that the substrate is a flexible substrate, and realizes a highly reliable and low-cost display element. It has the effect of doing.

According to a ninth aspect of the present invention, there is provided an organic thin film including a light emitting layer, a fine insulating layer formed on a part of the surface of the electrode formed on the first substrate, and the other electrode. And a process of further placing a second substrate opposite to the first substrate and filling a resin between the two substrates. And has the effect of realizing a highly reliable and low-cost display element.

According to a tenth aspect of the present invention, a planar electrode having a constant current non-injection region is formed on a first substrate, and an organic thin film including a light emitting layer and another electrode are formed. A process of forming a support layer on a portion of the second substrate corresponding to the current non-injection region, a process of placing the first substrate and the second substrate facing each other, and filling a resin between the substrates. This is a method for manufacturing an organic light-emitting device, which has the effect of realizing a highly reliable and low-cost display device.

The invention according to claim 11 is the organic light emitting device according to claim 9 or 10, wherein the resin is a liquid and the process of filling the resin between the substrates is a process utilizing a capillary phenomenon. The present invention relates to a method for manufacturing an element, and has an effect of realizing a highly reliable and low-cost display element.

According to a twelfth aspect of the present invention, there is provided the method for manufacturing an organic light emitting device according to the eleventh aspect, wherein the resin is an ultraviolet curable resin, and the resin is filled between the substrates and then cured. This has the effect of realizing a highly reliable and low-cost display element.

According to a thirteenth aspect of the present invention, the resin is a powdery solid and the process of filling the resin between the substrates utilizes a hot melting process. The present invention relates to a method for manufacturing an organic light-emitting device, and has an effect of realizing a highly reliable and low-cost display device.

(Embodiment 1) In FIG. 1, reference numeral 1 denotes a glass substrate. On the surface thereof, a transparent anode 2 made of indium tin oxide for injecting holes and an insulating layer of about 0.5 μm made of silicon oxide formed at least on the surface of the anode layer and having a plurality of fine holes. (Support layer)
3. Triphenyldiamine (TPD [N, N'-bis (3-methylphenyl)-) uniformly formed on the surface of the anode and the insulating layer.
From the hole transport layer 4 composed of (1,1′-biphenyl) -4,4′-diamine]) and similarly uniformly formed aluminum quinolinol complex (Alq [tris (8-hydroxyquino) aluminium]) An organic light emitting layer 5 having an electron transporting property, a cathode layer 6 made of a silver-magnesium alloy for injecting electrons, and a silicon oxide layer 7 as a protective layer are sequentially formed. Further, a second substrate 9 is provided so as to face the substrate on which these films are formed, and a resin is filled between these substrates to form a resin layer 8.
Are formed. When an electric field is applied between the anode 2 and the cathode 6, holes and electrons are injected from the respective electrodes into the organic light emitting layer. However, holes are not injected into the portion where the current blocking layer 3 is formed, and the current is blocked. Then, light is emitted from a plurality of minute regions corresponding to the minute current injection region 3 'on which this layer is not formed. Then, light 8 is emitted through the transparent anode 2 and the glass substrate 1.

(Embodiment 2) In FIG. 3, reference numeral 31 denotes a glass substrate. On its surface, a transparent anode 32 made of indium tin oxide for injecting holes is divided and formed. Uniformly formed on the surface of the anode and the substrate,
Triphenyldiamine (TPD [N, N'-bis (3-methylphen
yl)-(1,1′-biphenyl) -4,4′-diamine]), and a uniformly formed aluminum quinolinol complex (Alq [tris (8-hydroxyquino) aluminium). ), A cathode layer 36 made of a silver-magnesium alloy for injecting electrons, and a silicon oxide layer 37 as a protective layer are sequentially formed. Further, a second substrate 39 on which a support layer 40 is formed is provided so as to face the substrate on which these films are formed, and a resin is filled between these substrates to form a resin layer 38. When an electric field is applied between the anode 32 and the cathode 36, holes and electrons are injected from the respective electrodes into the organic light-emitting layer. Emits light. Then, light 8 is emitted through the transparent anode 2 and the glass substrate 1.

[0029]

Next, specific examples of the present invention will be described.

Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a glass substrate. On the surface thereof, a transparent anode 2 made of indium tin oxide for injecting holes and an insulating layer of about 0.5 μm made of silicon oxide formed at least on the surface of the anode layer and having a plurality of fine holes. (Support layer)
3. Triphenyldiamine (TPD [N, N'-bis (3-methylphenyl)-) uniformly formed on the surface of the anode and the insulating layer.
(1,1'-biphenyl) -4,4'-diamine]) and a hole transport layer 4 composed of aluminum quinolinol complex (Alq [tris (8-hydroxyquino) aluminium]) which is also uniformly formed. An organic light emitting layer 5 having an electron transporting property, a cathode layer 6 made of a silver-magnesium alloy for injecting electrons, and a silicon oxide layer 7 as a protective layer are sequentially formed. Further, a second substrate 9 is provided so as to face the substrate on which these films are formed, and a resin is filled between these substrates to form a resin layer 8.
Are formed. When an electric field is applied between the anode 2 and the cathode 6, holes and electrons are injected from the respective electrodes into the organic light emitting layer. However, holes are not injected into the portion where the current blocking layer 3 is formed, and current is blocked. Then, light is emitted from a plurality of minute regions corresponding to the minute current injection region 3 'on which this layer is not formed. Then, light 8 is emitted through the transparent anode 2 and the glass substrate 1. In this organic light-emitting device, the light-emitting portion is formed of a plurality of minute regions adjacent to each other, so that it is observed to the naked eye that light is emitted almost uniformly.

Next, a method for manufacturing the organic light emitting device of the present invention will be described with reference to FIG. (A) 21 is a glass substrate. ITO on glass substrate
(Transparent electrode) 22 'is uniformly formed. A transparent electrode is formed by photolithography with a period of 500 μm and a width of 490.
It is divided into row electrodes 22 of μm.

(B) A 0.5 μm thick silicon oxide layer (SiO 2) 23 is formed as an insulating layer (support layer) on the entire surface.

(C) A plurality of micro holes 23 'arranged adjacent to each other are formed in the silicon oxide layer on the transparent electrode by photolithography. Here, the arrangement period of the micro holes is 50 μm, and the size of the micro holes is about 45 μm square.

(D) Next, triphenyldiamine (TPD [N, N'-bis (3-methylphenyl)-(1,1'-biph
enyl) -4,4′-diamine]) and an aluminum quinolinol complex (Alq [tris (8-hydroxyquin)).
o) An organic light emitting layer 25 made of aluminum]) is sequentially deposited. A column electrode 26 made of a silver-magnesium alloy for injecting electrons and having a period of 500 μm and a width of 400 μm is formed by a mask deposition method. Finally, a silicon oxide film is formed on the protective film 27.
As vapor deposition.

(E) Next, the glass substrate 29 is placed so as to face the substrate on which the organic thin film or the like is formed. (F) The inside of the substrate is filled with an ultraviolet curable resin by using a capillary phenomenon. The two substrates are brought into almost contact with each other by applying pressure. Then, the resin is cured by irradiating ultraviolet rays.

In the organic light emitting device formed as described above, the size of the display pixel is approximately 500 μm square because the size of the display pixel is substantially determined by the width of the row electrode and the column electrode. However, as described above, since the current injection region is divided into micropore regions of 50 μm or less, one pixel is also divided into a plurality of (80) light emitting units. However, since the individual dimensions of the divided light emitting portions are minute dimensions smaller than the limit that can be identified by the naked eye and are adjacent to each other, it is observed by the naked eye that light is emitted almost uniformly.

In the organic light-emitting device of the present invention, it is impossible to completely remove defects such as dusts in the manufacturing process as in the prior art. The occurrence of sunspots is inevitable. However, the organic layer and the cathode layer of each finely divided light emitting portion are almost completely shut off moisture and the like of the outside air by the resin layer, the substrate, and the support layer, so that the speed at which the black spot spreads is low. Moreover, even if it spreads, each light-emitting portion divided into minute regions is adjacent to black spots generated by peeling of the cathode because the support layer above the current non-injection region where current is not injected is in contact with the opposite substrate. It does not spread to the light emitting part. Therefore, even if a black spot occurs and expands, the spread is limited to a small light emitting region having a size or the vicinity thereof, and does not expand to the entire light emitting portion.

As a result, it is possible to suppress a large luminance deterioration due to the enlargement of the non-light emitting region as in the conventional case. In addition, although a non-light-emitting area black spot occurs and expands in a specific micro-light-emitting area, even if the non-light-emitting area expands, the area is limited to about 50 μm, which is the size of each micro-light-emitting section, so it can be visually observed It will not be done. Of course, when black spots are simultaneously generated in a plurality of light-emitting portions adjacent to each other, a non-light-emitting portion is observed with the naked eye, but this probability is extremely small and does not pose a practical problem.

Further, since the supporting layer is formed when the protective layer is brought into contact with the protective substrate via the resin layer, the light emitting portion does not come into direct contact with the protective substrate, so that no defect occurs during mounting.

As described above with reference to the embodiments, in the present invention, it is possible to realize a highly reliable display element with a relatively simple element configuration without taking complicated sealing means as in the prior art. Is possible.

In the embodiment, the thickness of the insulating layer is set to about 0.5
Although it was set to μm, it is not necessarily limited to this. However, since the pressure applied to the organic layer can be reduced by setting the thickness to at least the thickness of the organic layer in the process of bringing the first substrate and the second substrate into close contact with each other, the reliability and yield of the element can be improved. Can be. In the above embodiment, the arrangement period of the minute regions is 50 μm and the size is 45 μm.
Although it was set to μm, it is not necessarily limited to this, and both may be smaller than this. Further, the electrode structure has a matrix shape in which a plurality of row electrodes and a plurality of column electrodes are orthogonal to each other, but may have a segment shape including a plurality of divided electrodes and a common electrode.

On the other hand, in the above embodiment, the hole transporting layer made of TPD and the electron transporting light emitting layer made of Alq are used as the organic layers constituting the device, but are not necessarily limited to this material. Further, the light emitting layer may be interposed between the organic layer having an electron transporting property and the organic layer having a hole transporting property, and different organic dye materials may be added in order to enhance the luminous efficiency. Further, in addition to the carrier transport layer and the light emitting layer, a hole injection layer, an electron injection layer, and the like may be added. Further, in this embodiment, silicon oxide is used as the current block layer for dividing the light emitting region into minute regions. However, the present invention is not limited to this, and another insulating material may be used. In addition, although ITO is used for the anode and a silver-magnesium alloy is used for the cathode as the electrode material, it is obvious that the present invention is not necessarily limited to this.

In this embodiment, the light-emitting portion is structurally and electrically divided by forming the support layer as the light-emitting region separation layer. If they are separated from each other, the expansion of the black spot is suppressed.

Although a glass substrate is used in this embodiment, a greater effect can be exhibited when an element is formed on a flexible substrate or a large substrate. That is, in the conventional element structure, it is difficult to hold two flexible substrates or large substrates at uniform intervals, and the two substrates come into contact with each other at the time of element production or use, resulting in defects. Further, there is a very high possibility of expanding as a sunspot.

(Embodiment 2) The embodiment 1 is characterized in that the light emitting portion is separated by a current non-injection region constituted by an insulating layer (support layer) formed on the first substrate. Although the light-emitting element is described, a support layer may be formed over the second substrate.

Hereinafter, a light emitting device according to a second embodiment of the present invention will be described with reference to FIG.

In FIG. 3, reference numeral 31 denotes a glass substrate.
On its surface, a transparent anode 32 made of indium tin oxide for injecting holes is divided and formed. Triphenyldiamine (TPD [N, N'-bis (3-methylphenyl)-(1,1'-biphen) is uniformly formed on the surface of the anode and the substrate.
yl) -4,4'-diamine]), and a uniformly formed aluminum quinolinol complex (Alq
An electron transporting organic light emitting layer 35 made of [tris (8-hydroxyquino) aluminum]), a cathode layer 36 made of a silver-magnesium alloy for injecting electrons, and a silicon oxide layer 37 as a protective layer are sequentially formed. ing. Further, a second substrate 39 on which a support layer 40 is formed is provided so as to face the substrate on which these films are formed, and a resin is filled between these substrates to form a resin layer 38. Anode 32
When an electric field is applied between the electrode and the cathode 36, holes and electrons are injected from the respective electrodes into the organic light emitting layer. However, holes are not injected in the current non-injection portion 33, and eventually a plurality of minute electrodes on which the anode is formed are formed. The area emits light. Then, the light 8 is emitted through the transparent anode 32 and the glass substrate 31. In this organic light-emitting device, the light-emitting portion is formed of a plurality of minute regions adjacent to each other, so that it is observed to the naked eye that light is emitted almost uniformly.

Next, a method for manufacturing the organic light emitting device of the present invention will be described with reference to FIG. (A) 41 is a glass substrate. ITO on glass substrate
(Transparent electrode) 42 'is uniformly formed.

(B) The transparent electrode is divided into row electrodes 42 having a period of 500 μm and a width of 490 μm by photolithography, and a current non-injection portion 43 is formed.

(C) Next, triphenyldiamine (TPD [N, N'-bis (3-methylphenyl)-(1,1'-biph
enyl) -4,4'-diamine]), and an aluminum quinolinol complex (Alq [tris (8-hydroxyqu
ino) aluminum]) are sequentially formed by vapor deposition. A column electrode 46 made of a silver-magnesium alloy and having a period of 500 μm and a width of 400 μm for injecting electrons is formed by a mask evaporation method. Finally, a silicon oxide film is formed as a protective film 47 by vapor deposition.

(D) Next, a resist layer (about 1 μm) serving as a support layer is formed on the glass substrate 48.

(E) Then, the resist is processed into a minute shape by photolithography to form a support layer.

(F) Then, this substrate is placed so as to face the first substrate on which an organic thin film or the like is formed. (G) The inside of the substrate is filled with an ultraviolet curable resin by utilizing a capillary phenomenon. The two substrates are brought into almost contact by applying pressure therebetween. Then, the resin is cured by irradiating ultraviolet rays.

In the organic light-emitting device of the present invention, as in the prior art, it is impossible to completely remove defects such as dust in the manufacturing process. Occurs. However, since the organic layer and the cathode layer of each light emitting portion are almost completely shut off moisture and the like of the outside air by the resin layer, the substrate and the support layer, the speed at which the black spot spreads is low. In addition, even if it spreads, the black spot does not spread in the current non-injection region (current block region) where current is not injected. Therefore, even if a black spot is generated and expanded, the spread is limited to a small light emitting region of a size and does not affect an adjacent light emitting portion.

In the embodiment, the thickness of the support layer is set to about 0.5 μm, but is not limited to this. However, since the pressure applied to the organic layer can be reduced by setting the thickness to at least the thickness of the organic layer in the process of bringing the first substrate and the second substrate into close contact with each other, the reliability and yield of the element can be improved. Can be.

As described above with reference to the embodiments, in the present invention, it is possible to realize a highly reliable display element with a relatively simple element configuration without taking complicated sealing means as in the related art. Is possible.

Although the electrode structure has a matrix shape in which a plurality of row electrodes and a plurality of column electrodes are orthogonal to each other, it may have a segment shape including a plurality of divided electrodes and a common electrode.

On the other hand, in the above embodiment, the hole transport layer made of TPD and the electron transporting light emitting layer made of Alq are used as the organic layers constituting the device, but the material is not necessarily limited to this material.

The light emitting layer may be interposed between the organic layer having an electron transporting property and the organic layer having a hole transporting property, and different organic dye materials may be added to enhance the luminous efficiency. . Further, in addition to the carrier transport layer and the light emitting layer, a hole injection layer, an electron injection layer, and the like may be added.

In this embodiment, silicon oxide is used as the current block layer for dividing the light emitting region into minute regions. However, the present invention is not limited to this, and another insulating material may be used.

Although ITO is used for the anode and a silver-magnesium alloy is used for the cathode as an electrode material, it is obvious that the present invention is not necessarily limited to this.

[0062]

As described above with reference to the embodiments, in the present invention, a highly reliable display element can be realized with a relatively simple element structure without taking complicated sealing means as in the prior art. It is possible to

As shown in the above embodiments, the present invention overcomes the drawbacks of the conventional organic electroluminescent device and provides a highly reliable and high-definition self-luminous flat panel display device which is not available in the past. This is an industrially significant effect.

[Brief description of the drawings]

FIG. 1 is a sectional view of an organic light emitting device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing process of the organic light emitting device according to the first embodiment of the present invention.

FIG. 3 is a sectional view of an organic light emitting device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a manufacturing process of the organic light emitting device according to the second embodiment of the present invention.

FIG. 5 is a diagram showing a schematic structure of a conventional organic light emitting device.

[Explanation of symbols]

 1, 21 Glass substrate 2, 22 Anode (ITO) 3, 23 Support layer (insulating layer) 4, 24 Hole transport layer 5, 25 Light emitting layer 6, 26 Cathode (AgMg) 7, 27 Protective layer 8, 28 Resin layer 9, 29 Substrate 23 "Micropore 31, 41 Glass Substrate 32, 42 Anode (ITO) 33, 43 Support Layer (Insulating Layer) 34, 44 Hole Transport Layer 35, 45 Light Emitting Layer 36, 46 Cathode (AgMg) 37, 47 Protective layer 38, 50 Resin layer 39, 48 Substrate 40, 49 Support layer

Claims (13)

[Claims] At least one is formed between two transparent substrates, and a plurality of layers including at least an anode layer, a light-emitting layer made of an organic substance, and a cathode layer are formed on one of the substrates. In the organic light emitting device in which light is emitted from the light emitting layer of a certain pixel portion by the injection of a current, a current non-injection region having a finer shape is formed inside the pixel on the substrate on which the light emitting layer is formed, and the other protection An organic light-emitting device, which is in close contact with a substrate via a resin layer. 2. A current non-injection region, wherein a support layer having a structure protruding above a substrate is formed, and the support layer is in contact with another protective substrate directly or via a resin layer. The organic light emitting device according to claim 1, wherein 3. The organic light emitting device according to claim 2, wherein the support layer is formed on a substrate on which the light emitting layer is formed. 4. The organic light-emitting device according to claim 2, wherein the support layer is formed on a substrate on which no light-emitting layer is formed. 5. The organic light emitting device according to claim 2, wherein the thickness of the support layer is equal to or greater than the thickness of the organic layer. 6. The organic light emitting device according to claim 1, wherein the current non-injection region has a structure surrounding a minute current injection region. 7. The organic light emitting device according to claim 6, wherein the size of the minute region is 100 μm or less. 8. The organic light emitting device according to claim 1, wherein the substrate is a flexible substrate. 9. A process for forming a microscopic insulating layer on a part of the surface of an electrode formed on a first substrate, and further forming an organic thin film including a light emitting layer and another electrode;
Further, a second substrate is disposed so as to face the first substrate,
And a process of filling a resin between two substrates. 10. A process of forming a planar electrode having a constant current non-injection region on a first substrate, forming an organic thin film including a light emitting layer, and another electrode.
A process of forming a support layer on a portion of the second substrate corresponding to the current non-injection region, a process of placing the first substrate and the second substrate facing each other, and filling a resin between the substrates. A method for manufacturing an organic light emitting device. 11. The method according to claim 9, wherein the resin is a liquid, and the process of filling the resin between the substrates is a process utilizing a capillary phenomenon. 12. The method for manufacturing an organic light emitting device according to claim 11, wherein the resin is an ultraviolet curable resin, and after the resin is filled between the substrates, the resin is cured. 13. The method according to claim 9, wherein the resin is a powdery solid, and the process of filling the resin between the substrates uses a heat melting process.