WO2008081696A1 - 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 - Google Patents

発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 Download PDF

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Publication number
WO2008081696A1
WO2008081696A1 PCT/JP2007/074031 JP2007074031W WO2008081696A1 WO 2008081696 A1 WO2008081696 A1 WO 2008081696A1 JP 2007074031 W JP2007074031 W JP 2007074031W WO 2008081696 A1 WO2008081696 A1 WO 2008081696A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
package
emitting device
manufacturing
molded body
Prior art date
Application number
PCT/JP2007/074031
Other languages
English (en)
French (fr)
Inventor
Masaki Hayashi
Original Assignee
Nichia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corporation filed Critical Nichia Corporation
Priority to EP07850551.8A priority Critical patent/EP2112697B1/en
Priority to PCT/JP2007/074031 priority patent/WO2008081696A1/ja
Priority to JP2008523467A priority patent/JP5277960B2/ja
Priority to US12/309,024 priority patent/US8217414B2/en
Priority to CN200780030989.9A priority patent/CN101507004B/zh
Publication of WO2008081696A1 publication Critical patent/WO2008081696A1/ja
Priority to US13/488,560 priority patent/US8440478B2/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B29C2045/0027—Gate or gate mark locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　中央に円形又は楕円形の凹部を有する樹脂成形体において、クラックの発生を抑制することができる発光装置を提供することを課題とする。発光素子（２）と、複数の外側面（１１）を有し、中央に凹部（１０ａ）を備えた第一樹脂成形体（１０）と、発光素子（２）に電気的に接続される第一リード（２０）及び第二リード（３０）と、凹部（１０ａ）に充填された第二樹脂成形体（４０）と、を有し、第一リード（２０）上に発光素子（２）が載置され、第二樹脂成形体（４０）の表面を発光面とする発光装置（１）であって、第一樹脂成形体（１０）の外側面（１１）に成形されるゲートを切削して得られたゲート痕（５０）が、凹部（１０ａ）の円断面の一点における法線の延長線上に、法線方向に向けて成形されていることを特徴とする。
PCT/JP2007/074031 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型 WO2008081696A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP07850551.8A EP2112697B1 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
PCT/JP2007/074031 WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
JP2008523467A JP5277960B2 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法及びパッケージの製造方法
US12/309,024 US8217414B2 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
CN200780030989.9A CN101507004B (zh) 2006-12-28 2007-12-13 发光装置、封装体、发光装置的制造方法、封装体的制造方法以及封装体制造用模具
US13/488,560 US8440478B2 (en) 2006-12-28 2012-06-05 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-356629 2006-12-28
JP2006356629 2006-12-28
PCT/JP2007/074031 WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/309,024 A-371-Of-International US8217414B2 (en) 2006-12-28 2007-12-13 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
US13/488,560 Division US8440478B2 (en) 2006-12-28 2012-06-05 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die

Publications (1)

Publication Number Publication Date
WO2008081696A1 true WO2008081696A1 (ja) 2008-07-10

Family

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PCT/JP2007/074031 WO2008081696A1 (ja) 2006-12-28 2007-12-13 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型

Country Status (6)

Country Link
US (2) US8217414B2 (ja)
EP (1) EP2112697B1 (ja)
JP (1) JP5277960B2 (ja)
KR (1) KR101026914B1 (ja)
CN (2) CN101507004B (ja)
WO (1) WO2008081696A1 (ja)

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US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
WO2011046084A1 (ja) 2009-10-15 2011-04-21 日亜化学工業株式会社 発光装置及びその製造方法
JP2011091311A (ja) * 2009-10-26 2011-05-06 Hitachi Chem Co Ltd 光半導体装置の製造方法、光半導体素子搭載用基板の製造方法及び光半導体装置
JP2011134902A (ja) * 2009-12-24 2011-07-07 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
US20120104427A1 (en) * 2009-01-14 2012-05-03 Chi Keung Chan Miniature surface mount device with large pin pads
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN103311402A (zh) * 2012-03-16 2013-09-18 日月光半导体制造股份有限公司 发光二极管封装以及承载板
WO2013137005A1 (ja) * 2012-03-13 2013-09-19 シャープ株式会社 発光装置およびバックライト装置
RU2537091C2 (ru) * 2009-10-29 2014-12-27 Нития Корпорейшн Светоизлучающее устройство и способ изготовления светоизлучающего устройства
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
JP2022121352A (ja) * 2021-02-08 2022-08-19 健策精密工業股▲ふん▼有限公司 リードフレーム構造及びその製造方法
KR102677856B1 (ko) * 2008-09-03 2024-06-25 니치아 카가쿠 고교 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법

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US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
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KR101501020B1 (ko) * 2014-02-17 2015-03-13 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
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CN106575695B (zh) * 2014-09-26 2020-01-21 东芝北斗电子株式会社 发光组件及发光组件的制造方法
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JP6729537B2 (ja) * 2017-11-20 2020-07-22 日亜化学工業株式会社 発光装置及びその製造方法
CN110875410A (zh) * 2018-08-30 2020-03-10 深圳市聚飞光电股份有限公司 Led支架及其制作方法、led发光器件、发光装置
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US20090289275A1 (en) 2009-11-26
CN101507004B (zh) 2011-04-20
KR101026914B1 (ko) 2011-04-04
US8217414B2 (en) 2012-07-10
CN101507004A (zh) 2009-08-12
US20120295374A1 (en) 2012-11-22
CN101944567A (zh) 2011-01-12
CN101944567B (zh) 2012-12-05
EP2112697B1 (en) 2020-01-22
KR20090028698A (ko) 2009-03-19
EP2112697A1 (en) 2009-10-28
JPWO2008081696A1 (ja) 2010-04-30
US8440478B2 (en) 2013-05-14
EP2112697A4 (en) 2011-05-11

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