TW200613577A - Vacuum treatment device and method for producing optical disk - Google Patents
Vacuum treatment device and method for producing optical diskInfo
- Publication number
- TW200613577A TW200613577A TW094115933A TW94115933A TW200613577A TW 200613577 A TW200613577 A TW 200613577A TW 094115933 A TW094115933 A TW 094115933A TW 94115933 A TW94115933 A TW 94115933A TW 200613577 A TW200613577 A TW 200613577A
- Authority
- TW
- Taiwan
- Prior art keywords
- disk
- main chamber
- treatment device
- treated object
- shaped
- Prior art date
Links
- 238000009489 vacuum treatment Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 238000000151 deposition Methods 0.000 abstract 3
- 230000007246 mechanism Effects 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/265—Apparatus for the mass production of optical record carriers, e.g. complete production stations, transport systems
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004146416A JP4653418B2 (ja) | 2004-05-17 | 2004-05-17 | 真空処理装置および光ディスクの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200613577A true TW200613577A (en) | 2006-05-01 |
TWI332530B TWI332530B (zh) | 2010-11-01 |
Family
ID=35394175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115933A TW200613577A (en) | 2004-05-17 | 2005-05-17 | Vacuum treatment device and method for producing optical disk |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080251376A1 (zh) |
JP (1) | JP4653418B2 (zh) |
KR (1) | KR100832206B1 (zh) |
CN (1) | CN100532636C (zh) |
TW (1) | TW200613577A (zh) |
WO (1) | WO2005111262A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574341B (zh) * | 2010-12-29 | 2017-03-11 | 歐瑞康先進科技股份有限公司 | 真空處理設備及製造方法 |
TWI719762B (zh) * | 2018-12-18 | 2021-02-21 | 日商芝浦機械電子裝置股份有限公司 | 成膜裝置 |
TWI772769B (zh) * | 2019-03-28 | 2022-08-01 | 日商芝浦機械電子裝置股份有限公司 | 成膜裝置 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090294073A1 (en) * | 2006-03-01 | 2009-12-03 | Yoji Takizawa | Substrate processing apparatus |
JP4693683B2 (ja) * | 2006-03-31 | 2011-06-01 | ダブリュディ・メディア・シンガポール・プライベートリミテッド | 薄膜成膜方法、磁気記録媒体の成膜方法および磁気記録ディスクの製造方法 |
EP1953259B1 (en) * | 2007-02-02 | 2010-04-28 | Applied Materials, Inc. | Process chamber, inline coating installation and method for treating a substrate |
CN100582293C (zh) * | 2008-05-15 | 2010-01-20 | 东莞宏威数码机械有限公司 | 一种溅镀方法及溅镀设备 |
EP2230703A3 (en) | 2009-03-18 | 2012-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing apparatus and manufacturing method of lighting device |
CN102356697B (zh) | 2009-03-18 | 2014-05-28 | 株式会社半导体能源研究所 | 照明装置 |
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
CN101761635B (zh) * | 2009-12-23 | 2012-09-05 | 东莞宏威数码机械有限公司 | 真空传动装置 |
CN101831612B (zh) * | 2010-01-29 | 2012-05-02 | 东莞宏威数码机械有限公司 | 精准定位溅镀装置及其定位方法 |
EP2420588A1 (en) * | 2010-08-16 | 2012-02-22 | Applied Materials, Inc. | Thermal management of film deposition processes |
EP2423350B1 (en) * | 2010-08-27 | 2013-07-31 | Applied Materials, Inc. | Carrier for a substrate and a method for assembling the same |
JP5570359B2 (ja) * | 2010-09-10 | 2014-08-13 | キヤノンアネルバ株式会社 | ロータリージョイント、及びスパッタリング装置 |
DE102012100927A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Prozessmodul |
JP6033703B2 (ja) * | 2013-02-22 | 2016-11-30 | スタンレー電気株式会社 | 成膜装置 |
JP2015088694A (ja) * | 2013-11-01 | 2015-05-07 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP2016053202A (ja) * | 2014-09-04 | 2016-04-14 | 東京エレクトロン株式会社 | 処理装置 |
WO2017104826A1 (ja) * | 2015-12-17 | 2017-06-22 | 株式会社アルバック | 真空処理装置 |
KR101796647B1 (ko) * | 2016-05-03 | 2017-11-10 | (주)에스티아이 | 기판처리장치 및 기판처리방법 |
JP6966227B2 (ja) * | 2016-06-28 | 2021-11-10 | 芝浦メカトロニクス株式会社 | 成膜装置、成膜製品の製造方法及び電子部品の製造方法 |
RU2651838C2 (ru) * | 2016-09-08 | 2018-04-24 | Акционерное общество "КВАРЦ" | Заслонка |
JP7039224B2 (ja) * | 2016-10-13 | 2022-03-22 | 芝浦メカトロニクス株式会社 | 電子部品の製造装置及び電子部品の製造方法 |
JP6588418B2 (ja) * | 2016-12-07 | 2019-10-09 | 株式会社神戸製鋼所 | 成膜装置およびそれを用いた成膜物の製造方法、ならびに冷却パネル |
CN108220905B (zh) * | 2018-01-05 | 2019-12-03 | 深圳市正和忠信股份有限公司 | 一种真空镀膜设备及其使用方法 |
CN110438473B (zh) * | 2019-09-06 | 2022-02-11 | 左然 | 一种化学气相沉积装置及方法 |
US11542604B2 (en) | 2019-11-06 | 2023-01-03 | PlayNitride Display Co., Ltd. | Heating apparatus and chemical vapor deposition system |
CN110629201A (zh) * | 2019-11-06 | 2019-12-31 | 錼创显示科技股份有限公司 | 加热装置及化学气相沉积系统 |
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US4331526A (en) * | 1979-09-24 | 1982-05-25 | Coulter Systems Corporation | Continuous sputtering apparatus and method |
US4874312A (en) * | 1985-03-11 | 1989-10-17 | Hailey Robert W | Heating and handling system for objects |
JPH07105345B2 (ja) * | 1985-08-08 | 1995-11-13 | 日電アネルバ株式会社 | 基体処理装置 |
US4917556A (en) * | 1986-04-28 | 1990-04-17 | Varian Associates, Inc. | Modular wafer transport and processing system |
DE3735284A1 (de) * | 1987-10-17 | 1989-04-27 | Leybold Ag | Vorrichtung nach dem karussell-prinzip zum beschichten von substraten |
KR0129663B1 (ko) * | 1988-01-20 | 1998-04-06 | 고다까 토시오 | 에칭 장치 및 방법 |
ATE208961T1 (de) * | 1988-05-24 | 2001-11-15 | Unaxis Balzers Ag | Vakuumanlage |
JPH0825151B2 (ja) * | 1988-09-16 | 1996-03-13 | 東京応化工業株式会社 | ハンドリングユニット |
JP3466607B2 (ja) * | 1989-09-13 | 2003-11-17 | ソニー株式会社 | スパッタリング装置 |
JP3083436B2 (ja) * | 1993-12-28 | 2000-09-04 | 信越化学工業株式会社 | 成膜方法およびスパッター装置 |
JP3398452B2 (ja) * | 1994-01-19 | 2003-04-21 | 株式会社ソニー・ディスクテクノロジー | スパッタリング装置 |
JP3043966B2 (ja) * | 1995-02-07 | 2000-05-22 | 株式会社名機製作所 | 光学的ディスク製品の製造方法 |
US5709785A (en) * | 1995-06-08 | 1998-01-20 | First Light Technology Inc. | Metallizing machine |
DE59611403D1 (de) * | 1995-10-27 | 2007-01-25 | Applied Materials Gmbh & Co Kg | Vorrichtung zum Beschichten eines Substrats |
US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
US6602348B1 (en) * | 1996-09-17 | 2003-08-05 | Applied Materials, Inc. | Substrate cooldown chamber |
JP4037493B2 (ja) * | 1997-10-28 | 2008-01-23 | 芝浦メカトロニクス株式会社 | 基板冷却手段を備えた成膜装置 |
DE19835154A1 (de) * | 1998-08-04 | 2000-02-10 | Leybold Systems Gmbh | Vorrichtung zur Beschichtung von Substraten in einer Vakuumkammer |
US6234788B1 (en) * | 1998-11-05 | 2001-05-22 | Applied Science And Technology, Inc. | Disk furnace for thermal processing |
JP2000144402A (ja) * | 1998-11-16 | 2000-05-26 | Matsushita Electric Ind Co Ltd | 成膜方法及び装置 |
US6277199B1 (en) * | 1999-01-19 | 2001-08-21 | Applied Materials, Inc. | Chamber design for modular manufacturing and flexible onsite servicing |
JP2001209981A (ja) * | 1999-02-09 | 2001-08-03 | Ricoh Co Ltd | 光ディスク基板成膜装置、光ディスク基板成膜方法、基板ホルダーの製造方法、基板ホルダー、光ディスクおよび相変化記録型光ディスク |
JP2001316816A (ja) * | 2000-05-10 | 2001-11-16 | Tokyo Electron Ltd | 基板冷却装置 |
US6932871B2 (en) * | 2002-04-16 | 2005-08-23 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
-
2004
- 2004-05-17 JP JP2004146416A patent/JP4653418B2/ja not_active Expired - Lifetime
-
2005
- 2005-05-16 KR KR1020067022164A patent/KR100832206B1/ko active IP Right Grant
- 2005-05-16 US US11/579,881 patent/US20080251376A1/en not_active Abandoned
- 2005-05-16 CN CNB2005800152925A patent/CN100532636C/zh active Active
- 2005-05-16 WO PCT/JP2005/008881 patent/WO2005111262A1/ja active Application Filing
- 2005-05-17 TW TW094115933A patent/TW200613577A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574341B (zh) * | 2010-12-29 | 2017-03-11 | 歐瑞康先進科技股份有限公司 | 真空處理設備及製造方法 |
TWI719762B (zh) * | 2018-12-18 | 2021-02-21 | 日商芝浦機械電子裝置股份有限公司 | 成膜裝置 |
TWI772769B (zh) * | 2019-03-28 | 2022-08-01 | 日商芝浦機械電子裝置股份有限公司 | 成膜裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20080251376A1 (en) | 2008-10-16 |
CN1954092A (zh) | 2007-04-25 |
KR100832206B1 (ko) | 2008-05-23 |
TWI332530B (zh) | 2010-11-01 |
WO2005111262A1 (ja) | 2005-11-24 |
JP4653418B2 (ja) | 2011-03-16 |
JP2005325428A (ja) | 2005-11-24 |
KR20070011397A (ko) | 2007-01-24 |
CN100532636C (zh) | 2009-08-26 |
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