TW200603606A - System and method for mounting an image capture device on a flexible substrate - Google Patents

System and method for mounting an image capture device on a flexible substrate

Info

Publication number
TW200603606A
TW200603606A TW094117720A TW94117720A TW200603606A TW 200603606 A TW200603606 A TW 200603606A TW 094117720 A TW094117720 A TW 094117720A TW 94117720 A TW94117720 A TW 94117720A TW 200603606 A TW200603606 A TW 200603606A
Authority
TW
Taiwan
Prior art keywords
image capture
capture device
mounting
flexible circuit
circuit substrate
Prior art date
Application number
TW094117720A
Other languages
English (en)
Other versions
TWI262710B (en
Inventor
Harpuneet Singh
Nicholas E Brathwaite
Bhret R Graydon
Original Assignee
Flextronics Int Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flextronics Int Usa Inc filed Critical Flextronics Int Usa Inc
Publication of TW200603606A publication Critical patent/TW200603606A/zh
Application granted granted Critical
Publication of TWI262710B publication Critical patent/TWI262710B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
TW094117720A 2004-06-25 2005-05-30 System and method for mounting an image capture device on a flexible substrate TWI262710B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/877,816 US7714931B2 (en) 2004-06-25 2004-06-25 System and method for mounting an image capture device on a flexible substrate

Publications (2)

Publication Number Publication Date
TW200603606A true TW200603606A (en) 2006-01-16
TWI262710B TWI262710B (en) 2006-09-21

Family

ID=35505254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117720A TWI262710B (en) 2004-06-25 2005-05-30 System and method for mounting an image capture device on a flexible substrate

Country Status (8)

Country Link
US (1) US7714931B2 (zh)
EP (1) EP1774453B1 (zh)
JP (3) JP2008504739A (zh)
CN (1) CN101432759B (zh)
AT (1) ATE542364T1 (zh)
CA (1) CA2571345C (zh)
TW (1) TWI262710B (zh)
WO (1) WO2006012139A2 (zh)

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JP5877595B2 (ja) 2016-03-08
EP1774453A2 (en) 2007-04-18
US7714931B2 (en) 2010-05-11
CN101432759A (zh) 2009-05-13
JP2015080253A (ja) 2015-04-23
CA2571345C (en) 2013-09-24
JP2008504739A (ja) 2008-02-14
ATE542364T1 (de) 2012-02-15
TWI262710B (en) 2006-09-21
WO2006012139A3 (en) 2009-05-14
EP1774453B1 (en) 2012-01-18
EP1774453A4 (en) 2009-12-23
CA2571345A1 (en) 2006-02-02
JP5764781B2 (ja) 2015-08-19
JP2012235509A (ja) 2012-11-29
US20050285973A1 (en) 2005-12-29
WO2006012139A2 (en) 2006-02-02

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