WO2016172863A1 - 一种摄像头模组 - Google Patents

一种摄像头模组 Download PDF

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Publication number
WO2016172863A1
WO2016172863A1 PCT/CN2015/077746 CN2015077746W WO2016172863A1 WO 2016172863 A1 WO2016172863 A1 WO 2016172863A1 CN 2015077746 W CN2015077746 W CN 2015077746W WO 2016172863 A1 WO2016172863 A1 WO 2016172863A1
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Prior art keywords
camera
processor
camera module
sensors
camera sensors
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PCT/CN2015/077746
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English (en)
French (fr)
Inventor
黄剑锋
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华为技术有限公司
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Priority to CN201580005200.9A priority Critical patent/CN107005625B/zh
Priority to PCT/CN2015/077746 priority patent/WO2016172863A1/zh
Publication of WO2016172863A1 publication Critical patent/WO2016172863A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the field of camera technology, and in particular, to a camera module.
  • Each camera module contains a camera sensor and lens.
  • the two camera modules that are placed in a staggered manner use an FPC connection, which requires a high layout space for the printed circuit board (PCB) of the electronic device in which the camera module is mounted.
  • PCB printed circuit board
  • the embodiment of the invention provides a camera module for saving the PCB layout space and structural design space of the electronic device in the camera module, improving the flexibility of the camera module, and facilitating the performance enhancement of the camera module.
  • a first aspect of the embodiments of the present invention provides a camera module, including:
  • the two camera sensors are respectively soldered on both sides of the double-sided PCB board;
  • the two camera sensors, the double-sided PCB board, and the two lenses respectively provided for the two camera sensors are packaged in a camera camera module.
  • the first implementation manner of the first aspect of the embodiment of the present invention The double-sided PCB board is electrically connected to one end of the flexible circuit board FPC, and the other end of the FPC is mounted with a BTB connector.
  • the two camera sensors each include a first processor
  • the first processor is used to control the respective camera sensors and process the image data obtained by the respective camera sensors.
  • the camera sensor of the two camera sensors includes a second a processor, the second processor being electrically coupled to another camera sensor, the second processor for controlling the two camera sensors and processing image data obtained by the two camera sensors.
  • the two first processors of the two camera sensors are electrically connected, one of which is A processor is used as a first main controller, and the first main controller is configured to control a camera sensor where the first main controller is located and another first processor, and process image data obtained by the two camera sensors.
  • the two first processors of the two camera sensors one of the first processing As a second main controller, the second main controller is electrically connected to a camera sensor in which another first processor is located, and the second main controller is configured to control the two camera sensors and process the two Image data obtained by the camera sensor.
  • the camera module further includes:
  • the third processor being located outside the camera sensor, soldered on the double-sided PCB board, and the third processor and two of the two camera sensors respectively Electrical connection
  • the third processor is configured to control a first processor of the two camera sensors and process image data obtained by the two camera sensors.
  • the camera module further includes:
  • the third processor is located outside the camera sensor, is soldered on the double-sided PCB board, and the fourth processor is electrically connected to the two camera sensors respectively;
  • the fourth processor is configured to control the two camera sensors and process image data obtained by the two camera sensors.
  • the BTB connector installed on the FPC is connected to the BTB connector on the main board;
  • the main board includes a fifth processor, and the fifth processor is configured to control the two camera sensors and process image data obtained by the two camera sensors.
  • a second aspect of the embodiments of the present invention provides an electronic device, including:
  • a camera module provided by any one of the first aspect of the embodiments of the present invention to the eighth implementation of the first aspect.
  • the embodiment of the present invention has the following advantages: in the embodiment of the present invention, two camera sensors are directly soldered on two sides of a double-sided PCB board, and are directly packaged in a camera module, the camera Under the condition that the module has the function of capturing the picture before and after the electronic device, as a closed whole, it only needs to leave a mounting position for the camera module on the PCB board and the structure space of the electronic device, and does not need to consider the camera.
  • the module is coordinated with other devices in multiple locations, saving a lot of PCB layout space and structural design space, and since the two camera sensors are located in one camera module, it is convenient for material management, which is beneficial to improve the performance of the camera module. .
  • FIG. 1 is a schematic structural view of a camera module according to an embodiment of the present invention.
  • FIG. 2 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 3 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 4 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 5 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 6 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 7 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 8 is another schematic structural diagram of a camera module according to an embodiment of the present invention.
  • first, second, etc. may be used to describe various processors or host controllers in the embodiments of the invention, the processor or host controller should not be limited to these terms. These terms are only used to distinguish the processor or the main controller from each other.
  • the first processor may also be referred to as a second processor without departing from the scope of the embodiments of the invention.
  • the second processor may also be referred to as a first processor; likewise, second
  • the main controller may also be referred to as a third main controller or the like, which is not limited in this embodiment of the present invention.
  • an embodiment of a camera module in an embodiment of the present invention includes:
  • the camera sensor 102 and the camera sensor 103 are respectively soldered on both sides of the double-sided PCB board 101;
  • solder joint shown by the dot in FIG. 1 between the camera sensor 103 and the double-sided PCB board 101; in practical applications, if high precision is used
  • the welding technique such as patch welding, etc.
  • the solder joint may also be invisible or non-existent, and is not limited herein.
  • the camera sensor 102, the camera sensor 103, the lens 104 and the lens 105, and the double-sided PCB board 101 are packaged into a camera module 106, and the lens 104 is located above the camera sensor 102.
  • the lens 105 is located above the camera sensor 103.
  • two camera sensors 102 and 103 are directly soldered on one side.
  • the two sides of the PCB board 101 are directly packaged in a camera module 106.
  • the camera module 106 Under the condition of realizing the function of photographing the front and rear of the electronic device, the camera module 106 only needs to be in the PCB of the electronic device as a closed whole.
  • the board and the structure space leave a mounting position for the camera module 106, and it is not necessary to consider the coordination of the camera module with other devices in multiple locations, saving a large amount of PCB layout space and structural design space, and due to the two cameras.
  • the sensors 102 are all located in a camera module 106 for material management and to improve the performance of the camera module.
  • the double-sided PCB board 101 is electrically connected to one end of the flexible circuit board FPC201, and the other end of the FPC 201 is mounted with a BTB connector 202.
  • the BTB connector 202 is used to connect the camera module 106 to the main board of the electronic device.
  • the FPC 201 has high wiring density, light weight, thin thickness, and good bending property.
  • the utility model can be assembled in a three-dimensional space in a limited space, and the FPC201 is used to connect the BTB connector 202 and the camera module 106, thereby effectively saving the volume of the electronic device in which the camera module is mounted.
  • control of the two camera sensors in the camera module 106 can be performed in various manners, for example, the processor can be installed in the camera sensor, or the controller can be installed in the camera module. You can install the processor in the module and directly control the two camera sensors by using the processor on the motherboard. The following describes each of these situations:
  • one of the camera modules in the camera module shown in the embodiment corresponding to FIG. 1 or FIG. 2 102 includes a second processor 301 electrically coupled to another camera sensor (eg, camera sensor 103), as shown by dashed line 302, the second processor 301 is configured to control the two
  • the camera sensor processes and processes the image data obtained by the two camera sensors.
  • the electrical connection between the second processor 301 and another camera sensor indicated by the dashed line 302 is mainly used for transmitting control signals and image data. It can be understood that there are many ways to establish the electrical connection 302. For example, the electrical connection of the wires can be directly used, or the matching of the double-sided PCB board 101, the second processor 301, and the camera sensor 103 can be respectively set. Seam data There are many other ways to connect the interface, which is not limited here. It can be understood that the control of the camera sensor by the processor may specifically include controlling the opening and closing of the camera sensor, controlling the focus of the camera sensor, the aperture, etc., and controlling the camera sensor to perform some other common operations. limited.
  • the first camera sensor of the camera module 106 includes a second processor 302 for controlling two camera sensors, so that the two camera sensors in one camera module can work together.
  • the second processor 302 in the module directly processes the image data obtained by the two camera sensors, thereby improving the performance of the camera module.
  • the two camera sensors in the camera module shown in the embodiment corresponding to FIG. 1 or FIG. 2 respectively include the first A processor for controlling respective camera sensors and processing image data obtained by respective camera sensors.
  • the camera sensor 102 includes a first processor 401, the first processor 401 is configured to control the camera sensor 102 and process image data obtained by the camera sensor 102; the camera sensor 103 includes a first processor 402, A processor 402 is configured to control the camera sensor 103 and process image data obtained by the camera sensor 103.
  • each camera module in the camera module 106 has a separate first processor for controlling and data processing. Since the data is located in the same module, the data transmission delay is small, and the cameras can be improved. The response rate of the sensor increases the processing efficiency of the camera module.
  • the camera sensor may be an integrated circuit (IC). Therefore, the camera sensor includes a processor, and the processor is integrated in the integrated circuit of the camera sensor, for example, the present invention.
  • the first processor and the second processor are integrated circuit of the camera sensor, for example, the present invention.
  • the first processor 401 and the first processor 402 are included. Electrical connection, as indicated by dashed line 501.
  • One of the first processor 401 and the first processor 402 may be configured as a first main controller (eg, setting the first processor 401 as a first main controller), and the first main controller is configured to control the a camera sensor where the first master controller is located (for example, the camera sensor 102 where the first processor 401 is located) and another first processor (for example, the first processor 402), and processes the two camera sensors. Image data.
  • the first processor 401 is electrically connected to the first processor 402. If the first processor 401 is the first main controller, the first processor 401 can control the camera sensor 102 where it is located.
  • the first processor 402 can be indirectly controlled by sending a control signal to the first processor 402, and the first processor 401 as the first main controller can also receive the first processor.
  • the image data obtained by the camera sensor 103 transmitted by 402 is processed to process the image data obtained by the two camera sensors.
  • the electrical connection shown by the broken line 501 is mainly used to transmit control signals and image data. It can be understood that there are many ways to establish the electrical connection 501.
  • the electrical connection may be directly used, or the double-sided PCB 101, the first processor 401, and the first processor 402 may be respectively matched.
  • the seamless data connection interface can also have many other ways, which are not limited herein.
  • each camera sensor in the camera module 106 has a first processor that can control the respective camera sensors, and at the same time, two first processors are electrically connected, one of which serves as a main controller.
  • a first processor that can control the respective camera sensors, and at the same time, two first processors are electrically connected, one of which serves as a main controller.
  • the first processor as the first main controller controls another camera sensor by controlling another first processor.
  • the main controller can also directly control another camera sensor.
  • the first processor 401 and the first processor 402 acts as a second primary controller (eg, the first processor 401).
  • the first processor 401 as the second main controller is electrically connected to the camera sensor 103 where the other first processor 402 is located.
  • the second main controller 401 is used to control the two
  • the camera sensor processes and processes the image data obtained by the two camera sensors.
  • the electrical connection shown by the broken line 601 is mainly used for transmitting control signals and image data. It can be understood that there are many ways to establish the electrical connection 601. For example, the electrical connection can be directly used, or the first processing can be performed on the double-sided PCB 101 as the second main controller. A matching seamless data connection interface is set on the camera sensor (assumed to be the first processor 401) and another camera sensor (assumed to be the camera sensor 103), and there are many other ways, which are not used here. limited.
  • the second main controller no longer indirectly controls another camera sensor through another first processor, but directly connects to the camera sensor to directly control the camera sensor, thereby improving control efficiency.
  • the camera module shown in the embodiment corresponding to FIG. 4 further includes a third processor 701, the third processing.
  • the controller 701 is located outside the camera sensor 102 and the camera sensor 103, and is soldered on the double-sided PCB board 101.
  • the third processor 701 and the two first processors of the two camera sensors 102 and 103, respectively. 401 and 402 are electrically connected; as shown by the dashed line 702, the third processor 701 is electrically coupled to the first processor 401, and the third processor 701 is electrically coupled to the first processor 402 as indicated by the dashed line 703.
  • the electrical connections shown by the dashed line 702 and the dashed line 703 are mainly used to transmit control signals and image data. It can be understood that there are many ways to establish the electrical connection 701 or the electrical connection 703. For example, the electrical connection can be directly used, or the double-sided PCB 101, the processor 701, the first processor 401, and the A matching seamless data connection interface is set on a processor 402, and there are many other ways, which are not limited herein.
  • the processor 701 indirectly controls the two camera sensors by controlling the two first processors, so that the camera module can work flexibly in various ways, and each The controllers complete their work, the data processing speed is faster, and the overall performance of the camera module is improved.
  • the processor 701 controls the camera sensor indirectly by controlling the first processor. In practical applications, the processor 701 can also directly control the camera sensors:
  • the camera module shown in the corresponding embodiment of FIG. 1 , FIG. 2 or FIG. 4 further includes a fourth processor 801.
  • the fourth processor 801 is electrically coupled to the two camera sensors 102 and 103, respectively; as shown by the dashed line 802, the fourth processor 801 is electrically coupled to the camera sensor 102, as described by the dashed line 803, the fourth processor The 801 is electrically connected to the camera sensor 103.
  • the electrical connections shown by the dashed lines 802 and 403 are mainly used to transmit control signals and image data. It can be understood that there are various ways to establish the electrical connection 802 or the electrical connection 803. For example, the electrical connection of the wires can be directly used, or the double-sided PCB board 101, the fourth processor 801, the camera sensor 102, and the camera can be used. A matching seamless data connection interface is set on the sensor 103, and there are many other ways, which are not limited herein.
  • the fourth processor 801 is directly connected to the two camera sensors to control the two camera sensors, thereby reducing the level of the camera sensor cooperative work data transmission, and improving the camera module when the two camera sensors work together. Processing efficiency.
  • the camera sensor can be an IC. Therefore, the processor is located outside the camera sensor and soldered on the double-sided PCB board, indicating that the processor is not integrated on the IC of the camera sensor, but is soldered. On the double-sided PCB board in the camera module, for example, the third processor and the fourth processor in the present invention.
  • the processor is located in the camera module.
  • the camera module can also directly control the camera sensor by using the processor on the motherboard on which the camera module is installed, without installing a processor.
  • the BTB connector 202 mounted on the FPC 201 is connected to the BTB connector on the main board;
  • a fifth processor is included on the main board, and the fifth processor is configured to control the two camera sensors and process image data obtained by the two camera sensors.
  • the camera module does not include a processor, and directly controls the two camera sensors in the camera module and processes the image data by using the fifth processor on the motherboard, thereby simplifying the structure of the camera module and reducing the structure.
  • the cost of the camera module does not include a processor, and directly controls the two camera sensors in the camera module and processes the image data by using the fifth processor on the motherboard, thereby simplifying the structure of the camera module and reducing the structure. The cost of the camera module.
  • the embodiment of the invention further includes an electronic device in which the camera module described in any of the above embodiments is installed.
  • the functional units in the various embodiments of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated unit is implemented in the form of a software functional unit and sold as a standalone product Or when used, it can be stored in a computer readable storage medium.
  • the technical solution of the present invention which is essential or contributes to the prior art, or all or part of the technical solution, may be embodied in the form of a software product stored in a storage medium.
  • a number of instructions are included to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

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Abstract

一种摄像头模组，用于在节省camera模组占用电子设备的PCB布局空间和结构设计空间，提高camera模组使用灵活性的同时，为camera模组性能增强提供便利。摄像头模组包括：一个双面印制电路板PCB板（101），两个摄像头传感器（102、103）和两个镜头（104、105）；该两个摄像头传感器（102、103）分别焊接在该双面PCB板（101）的两面上；该两个摄像头传感器（102、103）、该双面PCB板（101），以及分别为该两个摄像头传感器（102、103）配备的两个镜头（104、105），都封装在一个camera摄像头模组（106）中。

Description

一种摄像头模组 技术领域
本发明涉及摄像技术领域，尤其涉及一种摄像头模组。
背景技术
现在带摄像功能的电子设备很多，特别是智能手机以及平板电脑，而绝大部分智能手机都有前后两个摄像头(camera)模组，每个camera模组中包含有一个摄像头传感器和镜片。
目前大部分camera模组采用柔性电路板(FPC)设计，camera模组通过FPC一端的板对板(Board to Board，BTB)连接器与主板的BTB连接器相连。一种实现电子设备前后两个camera功能的方式是在FPC上错开放置两个camera模组，相比于单独的两个前后分开放置的camera模组，它能节省一个BTB接口。
然而，因错开放置的两个camera模组采用一个FPC连接，该方式对安装该camera模组的电子设备的印制电路板(Printed Circuit Board，PCB)布局空间要求较高，对于该电子设备的结构设计限制较多，使得camera模组使用不灵活。
发明内容
本发明实施例提供了一种摄像头模组，用于在节省camera模组占用电子设备的PCB布局空间和结构设计空间，提高camera模组使用灵活性的同时，为camera模组性能增强提供便利。
本发明实施例第一方面提供了一种摄像头模组，包括：
一个双面印制电路板PCB板，两个摄像头传感器和两个镜头；
所述两个摄像头传感器分别焊接在所述双面PCB板的两面上；
所述两个摄像头传感器、所述双面PCB板，以及分别为所述两个摄像头传感器配备的所述两个镜头，都封装在一个camera摄像头模组中。
结合本发明实施例的第一方面，本发明实施例第一方面的第一种实现方式 中，所述双面PCB板与柔性电路板FPC的一端电连接，所述FPC的另一端安装有一个BTB连接器。
结合本发明实施例的第一方面或第一方面的第一种实现方式，本发明实施例第一方面的第二种实现方式中，所述两个摄像头传感器中均含有第一处理器，所述第一处理器用于控制各自的摄像头传感器并处理各自的摄像头传感器得到的图像数据。
结合本发明实施例的第一方面或第一方面的第一种实现方式，本发明实施例第一方面的第三种实现方式中，所述两个摄像头传感器的其中一个摄像头传感器中含有第二处理器，所述第二处理器与另一个摄像头传感器电连接，所述第二处理器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
结合本发明实施例第一方面的第二种实现方式，本发明实施例第一方面的第四种实现方式中，所述两个摄像头传感器中的两个第一处理器电连接，其中一个第一处理器作为第一主控制器，所述第一主控制器用于控制该第一主控制器所在的摄像头传感器和另一个第一处理器，并处理所述两个摄像头传感器得到的图像数据。
结合本发明实施例第一方面的第二种实现方式，本发明实施例第一方面的第五种实现方式中，所述两个摄像头传感器中的两个第一处理器，其中一个第一处理器作为第二主控制器，所述第二主控制器与另一个第一处理器所在的摄像头传感器电连接，所述第二主控制器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
结合本发明实施例第一方面的第二种实现方式，本发明实施例第一方面的第六种实现方式中，所述摄像头模组中还包括：
第三处理器，所述第三处理器位于所述摄像头传感器外，焊接在所述双面PCB板上，所述第三处理器分别与所述两个摄像头传感器中的两个第一处理器电连接；
所述第三处理器，用于控制所述两个摄像头传感器中的第一处理器并处理所述两个摄像头传感器得到的图像数据。
结合本发明实施例的第一方面至第一方面的第二种实现方式中任一种实 现方式，本发明实施例第一方面的第七种实现方式中，所述摄像头模组中还包括：
第四处理器，所述第三处理器位于所述摄像头传感器外，焊接在所述双面PCB板上，所述第四处理器分别与所述两个摄像头传感器电连接；
所述第四处理器，用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
结合本发明实施例第一方面的第一种实现方式，本发明实施例第一方面的第八种实现方式中，所述FPC上安装的BTB连接器与主板上的BTB连接器相连；
所述主板上包含有第五处理器，所述第五处理器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
本发明实施例第二方面提供了一种电子设备，包括：
本发明实施例的第一方面至第一方面的第八种实现方式中任一种所提供的摄像头模组。
从以上技术方案可以看出，本发明实施例具有以下优点：本发明实施例中，将两个摄像头传感器直接焊接在一个双面PCB板的两面，并且直接封装在一个camera模组中，该camera模组在实现同时具有拍摄电子设备前后画面的功能的条件下，作为一个封闭的整体，只需要在电子设备的PCB板和结构空间上为该camera模组留下一个安装位，不需要考虑camera模组在多个位置与其他器件的协调，节省了大量的PCB布局空间和结构设计空间，并且由于两个摄像头传感器均位于一个camera模组中，便于物料管理，有利于提高camera模组的性能。
附图说明
图1为本发明实施例中摄像头模组一个结构示意图；
图2为本发明实施例中摄像头模组另一个结构示意图；
图3为本发明实施例中摄像头模组另一个结构示意图；
图4为本发明实施例中摄像头模组另一个结构示意图；
图5为本发明实施例中摄像头模组另一个结构示意图；
图6为本发明实施例中摄像头模组另一个结构示意图；
图7为本发明实施例中摄像头模组另一个结构示意图；
图8为本发明实施例中摄像头模组另一个结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
应当理解，尽管在本发明实施例中可能采用术语第一、第二等来描述各个处理器或主控制器，但处理器或主控制器不应限于这些术语。这些术语仅用来将处理器或主控制器彼此区分开。例如，在不脱离本发明实施例范围的情况下，第一处理器也可以被称为第二处理器，类似地，第二处理器也可以被称为第一处理器；同样的，第二主控制器也可以被称为第三主控制器等等，本发明实施例对此不做限制。
请参阅图1，本发明实施例中摄像头模组一个实施例包括：
双面PCB板101，摄像头传感器102和摄像头传感器103，以及镜片104和镜片105；
该摄像头传感器102与摄像头传感器103分别焊接在该双面PCB板101的两面上；
可以理解的是，摄像头传感器102与双面PCB板101之间，摄像头传感器103与双面PCB板101之间可以有图1中圆点所示的焊点；在实际应用中，若采用高精度的焊接技术(例如贴片焊接等)或其他的电子元件贴合技术，该焊点也可以不可见或不存在，此处不作限定。
将所述摄像头传感器102，所述摄像头传感器103，所述镜片104和所述镜片105以及所述双面PCB板101封装成一个camera模组106，所述镜片104位于所述摄像头传感器102之上，所述镜片105位于所述摄像头传感器103之上。
本发明实施例中，将两个摄像头传感器102和103直接焊接在一个双面 PCB板101的两面，并且直接封装在一个camera模组106中，该camera模组106在实现同时具有拍摄电子设备前后画面的功能的条件下，作为一个封闭的整体，只需要在电子设备的PCB板和结构空间上为该camera模组106留下一个安装位，不需要考虑camera模组在多个位置与其他器件的协调，节省了大量的PCB布局空间和结构设计空间，并且由于两个摄像头传感器102均位于一个camera模组106中，便于物料管理，有利于提高camera模组的性能。
如图2所示，作为本发明实施例中摄像头模组另一个实施例，上述双面PCB板101与柔性电路板FPC201的一端电连接，所述FPC201的另一端安装有一个BTB连接器202。
可以理解的是，本实施例中，该BTB连接器202用于将该camera模组106接入电子设备的主板，该FPC201由于其配线密度高、重量轻、厚度薄、弯折性好的特点，能在有限的空间内作三度空间的组装，采用FPC201连接BTB连接器202与camera模组106，有效节省了安装该camera模组的电子设备的体积。
在实际应用中，对上述camera模组106中两个摄像头传感器的控制可以采用多种不同的方式，例如可以将处理器安装在摄像头传感器中，也可以将控制器安装在camera模组中，还可以不在模组中安装处理器，直接采用主板上的处理器对这两个摄像头传感器进行控制，下面分别对这几种情况进行具体描述：
可选的，请参阅图3，作为本发明实施例中摄像头模组另一个实施例，上述图1或图2对应的实施例所示的摄像头模组中的其中一个摄像头传感器(例如为摄像头传感器102)中含有第二处理器301，该第二处理器301与另一个摄像头传感器(例如为摄像头传感器103)电连接，如虚线302所示，该第二处理器301用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
需要说明的是，虚线302所示的第二处理器301与另一个摄像头传感器之间的电连接主要用于传输控制信号与图像数据。可以理解的是，具体的建立电连接302的方式有很多种，例如可以直接采用导线电连接，也可以在该双面PCB板101、第二处理器301、摄像头传感器103上分别设置匹配的无缝数据 连接接口，还可以有很多其他的方式，此处不作限定。可以理解的是，处理器对摄像头传感器的控制，具体可以包括控制摄像头传感器的开启和关闭，控制摄像头传感器的取图焦距、光圈等产生，还可以控制摄像头传感器进行一些其他常用操作，此处不作限定。
本发明实施例中，camera模组106中其中第一个摄像头传感器中包含有第二处理器302，对两个摄像头传感器进行控制，使得在一个camera模组中的这两个摄像头传感器能协同工作，且模组中的第二处理器302直接对两个摄像头传感器得到的图像数据进行处理，提高了camera模组的性能。
可选的，请参阅图4，作为本发明实施例中摄像头模组另一个实施例，上述图1或图2对应的实施例所示的摄像头模组中的两个摄像头传感器中均含有第一处理器，该第一处理器用于控制各自的摄像头传感器并处理各自的摄像头传感器得到的图像数据。例如，其中，摄像头传感器102中含有第一处理器401，第一处理器401用于控制该摄像头传感器102并处理该摄像头传感器102得到的图像数据；摄像头传感器103中含有第一处理器402，第一处理器402用于控制该摄像头传感器103并处理该摄像头传感器103得到的图像数据。
本实施例中，camera模组106中每个摄像头模组都有单独的第一处理器对其进行控制和数据处理，由于位于同一个模组中，数据传输时延较小，能提高各摄像头传感器的响应速率，从而提高了camera模组的处理效率。
需要说明的是，在实际应用中，摄像头传感器可以为一个集成电路(integrated circuit，IC)，因此，摄像头传感器中含有处理器，表示该摄像头传感器的集成电路中集成有该处理器，例如本发明中的第一处理器和第二处理器。
可选的，请参阅图5，作为本发明实施例中摄像头模组另一个实施例，上述图4对应的实施例所示的摄像头模组中，该第一处理器401和第一处理器402电连接，如虚线501所示。第一处理器401和第一处理器402中的一个可以为设定为第一主控制器(例如设定第一处理器401为第一主控制器)，该第一主控制器用于控制该第一主控制器所在的摄像头传感器(例如为第一处理器401所在的摄像头传感器102)和另一个第一处理器(例如为第一处理器402)，并处理所述两个摄像头传感器得到的图像数据。
可以理解的是，第一处理器401与第一处理器402电连接，若该第一处理器401为第一主控制器，该第一处理器401除了可以控制自身所在的摄像头传感器102，还可以通过发送控制信号给第一处理器402，从而间接的对第一处理器402所在的摄像头传感器103进行控制，同时该作为第一主控制器的第一处理器401还可以接收第一处理器402发送的摄像头传感器103得到的图像数据，从而对两个摄像头传感器得到的图像数据进行处理。
需要说明的是，虚线501所示的电连接主要用于传输控制信号与图像数据。可以理解的是，具体的建立电连接501的方式有很多种，例如可以直接采用导线电连接，也可以在该双面PCB板101、第一处理器401和第一处理器402上分别设置匹配的无缝数据连接接口，还可以有很多其他的方式，此处不作限定。
本实施例中，camera模组106中每个摄像头传感器中都有一个第一处理器可以对各自的摄像头传感器进行控制，同时，两个第一处理器之间电连接，其中一个作为主控制器，除了对自身所在的摄像头传感器进行控制，还可以通过控制另一个第一处理器对另一个摄像头传感器进行控制，使得camera模组的工作方式更加灵活，在实际应用中可以根据具体功能或用户需求进行选择，提高了camera模组与用户的交互性能。
上面实施例中，作为第一主控制器的第一处理器通过控制另一个第一处理器对另一个摄像头传感器进行控制，在实际应用中，主控制器也可以直接对另一个摄像头传感器进行控制：
请参阅图6，作为本发明实施例中摄像头模组另一个实施例，上述图4对应的实施例所示的摄像头模组中，该第一处理器401和第一处理器402中，其中一个第一处理器作为第二主控制器(例如为第一处理器401)。作为该第二主控制器的第一处理器401，与另一个第一处理器402所在的摄像头传感器103电连接，如虚线601所示，该第二主控制器401用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
需要说明的是，虚线601所示的电连接主要用于传输控制信号与图像数据。可以理解的是，具体的建立电连接601的方式有很多种，例如可以直接采用导线电连接，也可以在该双面PCB板101、作为第二主控制器的第一处理 器(假设为第一处理器401)和另一个第一处理器所在的摄像头传感器(假设为摄像头传感器103)上分别设置匹配的无缝数据连接接口，还可以有很多其他的方式，此处不作限定。
本实施例中，第二主控制器不再间接的通过另一个第一处理器控制另一个摄像头传感器，而是直接与该摄像头传感器电连接，直接对该摄像头传感器进行控制，提高了控制效率。
可选的，请参阅图7，作为本发明实施例中摄像头模组另一个实施例，上述图4对应的实施例所示的摄像头模组中，还包括第三处理器701，该第三处理器701位于所述摄像头传感器102和摄像头传感器103外，焊接在所述双面PCB板101上，该第三处理器701分别与所述两个摄像头传感器102和103中的两个第一处理器401和402电连接；如虚线702所示，该第三处理器701与第一处理器401电连接，如虚线703所述，该第三处理器701与第一处理器402电连接。
需要说明的是，虚线702和虚线703所示的电连接主要用于传输控制信号与图像数据。可以理解的是，具体的建立电连接701或电连接703的方式有很多种，例如可以直接采用导线电连接，也可以在该双面PCB板101、处理器701、第一处理器401和第一处理器402上分别设置匹配的无缝数据连接接口，还可以有很多其他的方式，此处不作限定。
可以理解的是，本实施例中，该处理器701通过对两个第一处理器的控制来间接的对两个摄像头传感器进行控制，使得camera模组可以采用各种方式灵活的工作，且每个控制器完成各自的工作，数据处理速度更快，整体提高了camera模组的性能。
上面实施例中，处理器701通过对第一处理器进行控制间接的控制摄像头传感器，在实际应用中，处理器701也可以直接对个摄像头传感器进行控制：
请参阅图8，作为本发明实施例中摄像头模组另一个实施例，图1，图2或图4中任一个对应的实施例所示的摄像头模组中，还包括第四处理器801，该第四处理器801分别与所述两个摄像头传感器102和103电连接；如虚线802所示，该第四处理器801与摄像头传感器102电连接，如虚线803所述，该第四处理器801与摄像头传感器103电连接。
需要说明的是，虚线802和虚线803所示的电连接主要用于传输控制信号与图像数据。可以理解的是，具体的建立电连接802或电连接803的方式有很多种，例如可以直接采用导线电连接，也可以在该双面PCB板101、第四处理器801、摄像头传感器102和摄像头传感器103上分别设置匹配的无缝数据连接接口，还可以有很多其他的方式，此处不作限定。
本实施例中，第四处理器801直接与两个摄像头传感器电连接，对两个摄像头传感器进行控制，减少了摄像头传感器协同工作数据传输的层级，提高了两个摄像头传感器协同工作时camera模组的处理效率。
需要说明的是，在实际应用中，摄像头传感器可以为一个IC，因此，处理器位于摄像头传感器外，焊接在双面PCB板上，表示处理器没有集成在该摄像头传感器的IC上，而是焊接在camera模组中的双面PCB板上，例如本发明中的第三处理器和第四处理器。
上面实施例中，处理器均位于camera模组中，在实际应用中，camera模组也可以不安装处理器，直接使用安装该camera模组的主板上的处理器对摄像头传感器进行控制，可选的，作为本发明实施例中摄像头模组另一个实施例，上述图2对应的实施例所示的摄像头模组中，FPC201上安装的BTB连接器202与主板上的BTB连接器相连；
主板上包含有第五处理器，该第五处理器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
本实施例中，camera模组中不包含处理器，直接使用主板上的第五处理器对camera模组中的两个摄像头传感器进行控制并处理图像数据，简化了camera模组的结构，降低了camera模组的成本。
本发明实施例还包括一种电子设备，该电子设备中安装有上述任一个实施例中所述的摄像头模组。
在本发明各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售 或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (10)

  1. 一种摄像头模组，其特征在于，包括：
    一个双面印制电路板PCB板，两个摄像头传感器和两个镜头；
    所述两个摄像头传感器分别焊接在所述双面PCB板的两面上；
    所述两个摄像头传感器、所述双面PCB板，以及分别为所述两个摄像头传感器配备的所述两个镜头，都封装在一个camera摄像头模组中。
  2. 根据权利要求1所述的摄像头模组，其特征在于，所述双面PCB板与柔性电路板FPC的一端电连接，所述FPC的另一端安装有一个板对板BTB连接器。
  3. 根据权利要求1或2所述的摄像头模组，其特征在于，所述两个摄像头传感器中均含有第一处理器，所述第一处理器用于控制各自的摄像头传感器并处理各自的摄像头传感器得到的图像数据。
  4. 根据权利要求1或2所述的摄像头模组，其特征在于，所述两个摄像头传感器的其中一个摄像头传感器中含有第二处理器，所述第二处理器与另一个摄像头传感器电连接，所述第二处理器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
  5. 根据权利要求3所述的摄像头模组，其特征在于，所述两个摄像头传感器中的两个第一处理器电连接，其中一个第一处理器作为第一主控制器，所述第一主控制器用于控制该第一主控制器所在的摄像头传感器和另一个第一处理器，并处理所述两个摄像头传感器得到的图像数据。
  6. 根据权利要求3所述的摄像头模组，其特征在于，所述两个摄像头传感器中的两个第一处理器，其中一个第一处理器作为第二主控制器，所述第二主控制器与另一个第一处理器所在的摄像头传感器电连接，所述第二主控制器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
  7. 根据权利要求3所述的摄像头模组，其特征在于，所述摄像头模组中还包括：
    第三处理器，所述第三处理器位于所述摄像头传感器外，焊接在所述双面PCB板上，所述第三处理器分别与所述两个摄像头传感器中的两个第一处理 器电连接；
    所述第三处理器，用于控制所述两个摄像头传感器中的第一处理器并处理所述两个摄像头传感器得到的图像数据。
  8. 根据权利要求1至3中任一项所述的摄像头模组，其特征在于，所述摄像头模组中还包括：
    第四处理器，所述第三处理器位于所述摄像头传感器外，焊接在所述双面PCB板上，所述第四处理器分别与所述两个摄像头传感器电连接；
    所述第四处理器，用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
  9. 根据权利要求2所述的摄像头模块，其特征在于，所述FPC上安装的BTB连接器与主板上的BTB连接器相连；
    所述主板上包含有第五处理器，所述第五处理器用于控制所述两个摄像头传感器并处理所述两个摄像头传感器得到的图像数据。
  10. 一种电子设备，其特征在于，包括：
    权利要求1至9中任一项所述的摄像头模组。
PCT/CN2015/077746 2015-04-29 2015-04-29 一种摄像头模组 WO2016172863A1 (zh)

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