SG152277A1 - Mounting method for image sensor and adhesive tape used therefor - Google Patents

Mounting method for image sensor and adhesive tape used therefor

Info

Publication number
SG152277A1
SG152277A1 SG200902894-5A SG2009028945A SG152277A1 SG 152277 A1 SG152277 A1 SG 152277A1 SG 2009028945 A SG2009028945 A SG 2009028945A SG 152277 A1 SG152277 A1 SG 152277A1
Authority
SG
Singapore
Prior art keywords
image sensor
adhesive tape
mounting method
light receiving
state
Prior art date
Application number
SG200902894-5A
Inventor
Hitoshi Takano
Hiroyuki Kondo
Tadashi Terashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004223915A external-priority patent/JP2005341521A/en
Priority claimed from JP2004316112A external-priority patent/JP4116607B2/en
Priority claimed from JP2004329602A external-priority patent/JP4116613B2/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG152277A1 publication Critical patent/SG152277A1/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/10—Railings; Protectors against smoke or gases, e.g. of locomotives; Maintenance travellers; Fastening of pipes or cables to bridges
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/005—Piers, trestles, bearings, expansion joints or parapets specially adapted for portable or sectional bridges

Abstract

Provided is a mounting method for an image sensor capable of applying solder reflow in a state where an adhesive tape is adhered on the light receiving side of the image sensor in a mounting process for an image sensor using a solid-state image pick-up device and protecting the light receiving side of the image sensor even during solder reflow, and a protective adhesive tape used therefore. It is characterized by that an adhesive tape using a polyimide film as a base material is adhered on the light receiving section side of the image sensor and, by heating 170C or higher in the state, terminals of the image sensor are connected by solder reflow to a substrate side, and at least silicone material is used as a constituent of an adhesive agent for the adhesive tape.
SG200902894-5A 2004-04-28 2005-04-22 Mounting method for image sensor and adhesive tape used therefor SG152277A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004133868 2004-04-28
JP2004223915A JP2005341521A (en) 2004-04-28 2004-07-30 Mounting method of video sensor and adhesive tape used therefor
JP2004316112A JP4116607B2 (en) 2004-04-28 2004-10-29 Mounting method of image sensor and adhesive tape used therefor
JP2004329602A JP4116613B2 (en) 2004-04-28 2004-11-12 Mounting method of image sensor and adhesive tape used therefor

Publications (1)

Publication Number Publication Date
SG152277A1 true SG152277A1 (en) 2009-05-29

Family

ID=37149785

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200902894-5A SG152277A1 (en) 2004-04-28 2005-04-22 Mounting method for image sensor and adhesive tape used therefor

Country Status (3)

Country Link
KR (1) KR100922662B1 (en)
SG (1) SG152277A1 (en)
TW (1) TWI332712B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100346262C (en) * 2005-01-05 2007-10-31 英业达股份有限公司 Fan rotary speed control system and method
KR101606414B1 (en) * 2014-06-02 2016-03-28 (주)드림텍 Method of manufacturing home key module for mobile device
WO2017006604A1 (en) * 2015-07-08 2017-01-12 リンテック株式会社 Surface protective film

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974266A (en) * 1995-09-07 1997-03-18 Lintec Corp Semiconductor chip fixing adhesive agent tape and feeding method of semiconductor chip fixing adhesive
JP2002118243A (en) * 2000-10-10 2002-04-19 Shigeru Koshibe High integration light receiving device and its manufacturing method
JP3748799B2 (en) * 2001-10-11 2006-02-22 シチズン電子株式会社 Electronic component package and mounting method thereof
JP3946509B2 (en) * 2001-12-17 2007-07-18 リンテック株式会社 Adhesive tape

Also Published As

Publication number Publication date
TW200536135A (en) 2005-11-01
TWI332712B (en) 2010-11-01
KR100922662B1 (en) 2009-10-19
KR20060047532A (en) 2006-05-18

Similar Documents

Publication Publication Date Title
TW200603606A (en) System and method for mounting an image capture device on a flexible substrate
US6618937B2 (en) Method of assembling electronic applications and display devices
TW200608063A (en) Optical film with surface protective film and image display apparatus
WO2009099834A3 (en) Wafer level chip scale package and process of manufacture
TWI268572B (en) Film peeling method and film peeling device
SG137801A1 (en) Surface protection film peeling method and surface protection film peeling device
WO2010051106A3 (en) Methods for attaching flexible substrates to rigid carriers and resulting devices
TWI315256B (en) Film splicer and film carrier tape for mounting electronic components
TW200632506A (en) Camera module and its manufacturing process
WO2011137733A3 (en) Power supply module and packaging and integrating method thereof
EP2037493A3 (en) Method of mounting conductive ball and conductive ball mounting apparatus
EP1872695A3 (en) Adhesive mount for a leveling device and a leveling device
TW200739775A (en) Semiconductor-wafer processing method using fluid-like layer
TW200729372A (en) Apparatus and method for mounting electronic component
AU2003232013A8 (en) Conductive adhesive bonded semiconductor substrates for radiation imaging devices
WO2008008581A3 (en) An electronics package with an integrated circuit device having post wafer fabrication integrated passive components
WO2008112883A3 (en) Die attachment method with a covex surface underfill
EP1829639A4 (en) Solder precoating method and work for electronic device
SG152277A1 (en) Mounting method for image sensor and adhesive tape used therefor
WO2008111348A1 (en) Sheet-mounting device and its method
WO2008013769A3 (en) An apparatus for positioning and labeling an appendage in x-radiography
TW200642556A (en) Soldering method, electronic part, and part-exchanging method
TW200611356A (en) Display panel assembly apparatus and assembly method
JP2009166466A (en) Accessory attached with rhinestone
TW200718767A (en) Surface mounting method