16450pifl.doc 修正日期:99年8月9日 爲第94109064號中文說明書無劃線修正本 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種使用固體攝影裝置之影像感測器 之封裝工序者。 【先前技術】 使用固體攝影裝置之影像感測器，近年來廣泛的使用 於數位相機與攝影機。在以封裝此等影像感·之基板侧 為首之製造工序中，影像感測器表面之刮痕與飛塵之附著 直接影響攝影之可能性很高。在此，可以採取使用黏著膠 帶作為表面保護膠帶，藉黏合於影像感測器之受光部侧， 避免封裝及製造工序之刮痕與附著飛塵之手法。 另一方面，將影像感測器封褒於基板等時，迄今一直 使用著使用烙鐵將其端子部丨處、丨處的作焊錫連接封裝 之手法。近年來，隨著影像感測器之高晝質及高功能化， 由於端子數也飛躍的增加起來，所以使用端子一處、—處 烙，作焊錫連接封裝，需要花費很多時間而不實際。在此， ^多，用在影像感測器之端子部與封裝基板位置配合之狀 態’藉投入焊錫回焊爐作一次連接封裝之方法。 但是’焊錫回焊爐至少必須加溫至焊錫熔點以上之高 溫:若以保護上述為目的在黏合黏著膠帶之狀態實施加熱 回焊’則有可能因黏著膠帶基材之熱變形收縮而產生位置 偏，與剝離或因黏著膠帶材料之熱老化，退化物有可能反 而是巧染影像感測器的表面之原因。另外，在固體攝影裝 置之内部所使用之濾色器’由於也有可能因熱產生變性或 1332712 16450pifl.doc 爲第剛咖4號中文說明書無劃線修正本 修正日期:"年8月9日 破損，所以特別是·在170。(：以上之高溫之回焊處理也有其 困難。 從而，習知，在投入焊錫回焊爐之前一旦剝離保護膠 帶，則以160°C程度實施焊錫回焊，完成後重新修正黏合 保護膠帶。如此，在黏合黏著膠帶之狀態下，較難經過用 以焊錫回焊之較高加熱工序。 另外，使用黏著膠帶於表面保護用之工法，具有黏貼 與剝離之工序簡單之優點，相反的，因黏貼黏著膠帶時產 生之電荷之移動，黏著膠帶及黏附物帶電，剝離時伴隨放 電。最近隨著電子裝置的小型化、高積體化，謀求電路之 精密化，另一方面，對於電子裝置之放電之耐久性降低， 因膠帶剝離時之放電，引起所謂產生破壞電子裝置之現象。 【發明内容】 從而，本發明之目的係提供一種在使用固體攝影裝置 之影像感卿之封裝工序中，在影像制^之受光侧黏合 黏著膠帶之狀態HX作焊錫回焊，且在焊錫回焊中也可 以預先保護影像制器之受細之影像制H的封裝方法 及其使用的保護用黏著膠帶。 另外，本發明之目的在於提供一種在由影像感測器剝 離黏著膠帶之卫序中，具有防止因隨賴離時產生靜電及 起引於此之放電而破壞裝置之效果之表面保護黏著薄膜。 4本發明者們重複專心檢討解決前述課題之結果，看出 藉以下所述之封裝方法或使用黏著膠帶可以達成前述目 的。最後完成本發明。 7 1332712 16450pifl.doc 修正日期:99年8月9日 爲第94109064號中文說明書無劃線修正本 ，發明係一種影像感測器之封裝方法，係在使用固體 ^裝置之影像感測器之封裝卫序中，在影像感測器之受 黏合了使用聚醯亞胺作為基材構成材料，其外周之 ^部具有剝離用之突起部，並具有與影像感測器之端 ^姐與突起部的底部連結之邊部，而且由突起部的前 ，、，、吉於底部之侧部具有斜線狀、折線狀、曲線狀或組合 匕等之任-形狀之黏轉帶之狀態，藉加熱至17叱以 將衫像感測器之端子部與基板側作焊錫連接回焊。 若，據本發明’藉聚酿亞胺之較高耐熱性，不僅可以 ，著膝帶在焊錫回焊之高溫工序之顯著的熱變形與收 ^糟聚醒亞胺特有之較高遮紐與較·料度，亦可 ^制熱傳導至使用於固體攝影裝置中之滤色器。從而， 酿亞胺基材’不僅單單作為耐熱保鄉帶之作用效 由於也合㈣有抑咖賴影裝置㈣讀色器之熱 化，特定作股果，所以相實施在大科於丨赃之 兄分高溫之加熱工序。 膠帶至少使财綠料作為前述黏著 藉如此構成，可以提高耐熱性，而且可以容易實施剝 雕黏耆力之控制。 ，發明係一種影像感測器之封裝方法，係在使用固體 ^裝置之影像感測器之封裝工序中，在影像感測器之受 。卩側黏合了使用聚醯亞胺作為基材構成材料，在單面具 有點著層，在另外一面塗敷帶電防止劑，其外周之至少；; 8 1332712 16450pifl.doc 修正日期:99年8月9曰 爲第94109064號中文說明書無劃線修正本 部具有剝離用之突起部，並具有與影像感測器之端面平行 且與突起部的底部連結之邊部，而且由突起部的前端連妹 於底部之侧料有斜綠、折驗、曲·餘合此等: 任一形狀之黏著膠帶之狀態’藉加熱至17〇r以上，將影 像感測器之端子部與基板側作焊錫連接回焊。 若依據本發明，可以抑制黏著膠帶在焊錫回焊之高溫 工序之顯著的熱變形與收縮’也可以抑職料至使用於 ^體攝衫裝置巾之遽色ϋ。不僅單單作為耐熱保護膠帶之 ^效果，由於也合併具有抑制固體攝影裝置内部之遽色 2熱，化之特定作用效果’所以可以實施在17。。。以上 之充分面溫之加熱工序。 另外’藉塗敷帶電防止劑，除了使生產性提升之功能 =^可以抑讎帶剝離時因帶電產生靜電，防止破壞電 。制是，敷於基材背面，可以減輕帶電防止 劑附者、污染黏附物，可以謀求提升良率。 帶電3:係一種上述影像感測器之封裝方法，其中前述 帶電防止劑係以4級氨塩作為主劑。 非當述在影像感測器之封裝王序中防止產生靜電係 果。Μ ’制是在^高溫之麟要求之防止帶電效 工庠财們看出，加上H電防止效果，由封裳 塩作要求耐紐師紐之種種條件看，以4級氨 防:^劑之帶電防止劑非常適合於本發明之 目的之帶電 止破』電=置Τ以抑制膠帶剝離時產生之靜電，可以防 9 1332712 16450pifl.doc 修正日期:99年8月9曰 爲第9410卯64號中文說明書無劃線修正本 本發明係一種上述影像感測器之封裝方法，其中在前 述黏著^帶中，·在其外周之至少—部具有剝_之突起部。 黏著膠帶之黏貼及剝離，係在影像感測器之封裝中形 成重要之工序’且確實的要求之後不會產生附著物。在本 發明中’藉在其外周之至少_部具有祕用之突起部，在 檢查等之製作卫序完錢或使狀前，可以非常容易刺離 膠帶。此時，在影像感測器之封裝狀態中，以對黏著膠帶 鄰接之零件之封裝或錫焊等不造成障礙者較佳。 本發明係一種上述影像感測器之封裝方法，其中前述 黏著膝帶包覆影像感卿之受光部全部，而且黏ς於前述 受光部，使其外周部之至少—部具有由影像感測器之端面 至中心側之特定距離。 影像感測器的保護必須為全面的覆蓋受光部之膠帶 形狀’另-方面，在膠帶的外周部ΑΑ的突出於影像威測 盗的端面時，_詩_接之零件㈣裝或錫焊等造成 障礙。也就是，轉帶有必要全面賴技光部，而且 以最]者較佳。從*，上述突起部以外之黏著膠帶之外周 部以黏合於前述受光部，使其至少―部，最好是較多部分 具有由景>像感測器之端面至中心側之特定 本發明係一種上述影像感測器之封裝方法，其中 點著膠帶具有與影像感測器之端面平行，與前述/突起部^ 底部連結之邊部’而且由突起部的前端連結於底部之側= 具有斜線狀、折線狀'曲線狀或組合此等之任一形狀。 如上述，點著膠帶在檢查等之製作工序完成後或使用 1332712 16450pifl.doc 爲第94109064號中文說明書無劃線修正本 修正日期:99年8月9日 之前，以可以容易剝離者較佳。但是，在黏著膠帶之固定 必/頁要有特疋之黏者力，另一方面，黏著力若太強，當剝 離黏著膠帶時，由於恐有黏著劑殘留之虞慮，所以黏著力 之條件必須限制於特定之範圍。特別是，在設置有突起部 之黏著膠帶之剝離中，形成夾住拉起突起部，此時，由於 黏著膠帶很容易產生龜裂，所以在本發明中，藉由突起部 之前端連結於底部之侧部具有斜線狀、折線狀、曲線狀或 此等組合之任一形狀，看出可以由影像感測器圓滑的剝離 膠帶。 另外，影像感測器之端面與受光部之外周部之間，通 常距離非常短，所以在影像感測器之封裝中，黏著膠帶之 黏貼位置變得重要，即使自動黏貼時，也必須確認黏貼位 置。從而，藉與影像感測器之端面平行，與前述突起部之 底部連結之邊部之黏著膠帶，可以明確膠帶的黏貼位置， 所以可以正確且有效率的封裝影像感測器。 本發明係一種上述影像感測器之封裝方法，其中在前 述黏著膠帶中，在前述影像感測器之受光部之部分不設置 黏著層。 在本發明中，關於影像感測器之保護用黏著膠帶，係 藉用心於基材及黏著層，在黏合黏著膠帶之狀態謀求之一 貫工序者，進一步，提案出藉在對應於該黏著膠帶之受光 部^部分不設置黏著層，在零件封裝後之膠帶剝離時，使 黏著劑不殘存於黏附物表面，提升作業效率者。也就是， 在影像感卿之封裝工序中，在影像感聰之受光部:至 11 1332712 16450pifl.doc 修正日期:99年8月9日 爲第94109064號中文說明書無劃線修正本 少使用具有雜性之_作域材構成材料 ，而且在受光 部分在黏合*設置黏著層構造之黏著膠帶之狀態，藉經過 170 C以上之加熱工序，可以提供一種作業性、安全性、生 產性較高之影像感測器之封裝方法。 進-步’本發明係-種上述影像感測器之封裝方法， 其中170°C之前述基材之熱導率為5xl〇-4cal/cm.sec ^ 以下。 在作為固體攝影裴置使用之影像感測器，較多内藏有 濾色器者，也較多不耐封裝時之高溫。構成本發明之黏著 膠帶之基材之聚酿亞胺薄膜，熱導率也同耐熱性較低，由 於具有抑制熱傳導效果，不僅物理的保護影像感測器本 身’也有用於保護濾色器。 本發明係一種上述影像感測器之封裝方法，其中前述 黏著膠帶在施以180°C加熱1小時後之熱收縮率為丨以 下。 也就是’如上述，在影像感測器之封裝中，以基材的 收縮率較小者較佳，特別是包含在錫焊等之高溫領域之工 序之後’得到將在高溫條件下之基材的收縮率限制於上述 範圍較適合之見解，藉明確如此附加的條件，進一步提升 作業效率。 本發明係一種上述影像感測器之封裝方法，其中前述 黏著膠帶在施以18〇。(：加熱1小時後之黏著力為〇1〜 8.0N/19mm 寬。 也就是，在防止黏著膠帶之剝離，必須要有特定以上 12 1332712 16450pifl.doc 修正日期:99年8月9曰 爲第94109064號中文說明書無劃線修正本 之黏著力，另一方面在防止膠帶由黏附物剝離後之黏著層 之殘存，必須要有特定以下之黏著力。特別是，在包含高 溫領域之封裝工序時，得到將在高溫條件下之基材的收縮 率，制於上述範圍較適合之見解，藉料損及崎膠帶之 功能，在零件封裝後之膠帶剝離時，使黏著劑不殘存於黏 附物表面，提升作業效率。 ^本發明係一種使用於上述之影像感測器之封裝方法 的黏著膠帶’黏著膠帶㈣㈣亞胺作為基材構成材料且 其外，之至少一部具有剝離用之突起部，並且具有與影像 ^測器之端面平行且與突起部的底部連結之邊部而I由 突起部的前料結於底部摘部具#斜雜、折線狀 線狀或組合此等之任一形狀。 之 著 ^述之封裝方法，係要求保護影像感測器之表面 ，、不受異物之污染細傷’而且在錫焊等之加熱條件下 零件封裝工序中，不必進行膠帶之剝離亦可以作業 ，帶。在本發明’藉提供—種崎酿亞胺為基材， 触縮性、及黏著性之表面保護用之黏著穋帶， 之靜 滿足如此之要求。合併可以抑制膠帶剝離時產生 電，防止破壞電子裝置。 【發明之效果】 面 轉 置之據本發明，可以提供—種在固體攝影I 之狀緣可裝1序或檢查王料巾，在黏合黏著膠帶 接古: 貫工序，且一面保護影像感測器表面， 円作業性及生產性之影像感測器之封裝方法。另外 13 16450pifl.doc 爲第94109064號中文說明書無劃線修正本 修正日期:99年8月9日 塗敷帶電防止劑，徐了使生產性提升之功能外，可以抑制 膠帶剝離時因帶電產生之靜電，防止破壞電子裝置。合併 可以提供一種可以使用於如此影像感測器封裝時之具有熱 收縮性高、耐熱性優良之保護用黏著朦帶。 【實施方式】 以下’針對本發明之實施形態加以說明。 本發明之影像感測器之封裝方法，係在使用固體攝影 裝置之影像感測器之實施工序中’在影像感測器之受光部 侧’在黏合使用聚醯亞胺作為基材構成材料之黏著膠帶之 狀態，將影像感測器之端子部與基板側作焊錫連接回焊。 在此所謂使用固體攝影裝置之影像感測器，一般係指使用 透明樹脂與玻璃材料包裝稱為CCD(Charge Coupled Device)或 CMOS(Complementary MOS)之固體攝影裝置之 影像感測器。 另外’所s月該影像感測器之受光部側，係意味著受光 影像之感測器之表面侧，一般之影像感測器由於幾乎係為 了保護攝影裝置而加上透明樹脂與玻璃蓋等，所以實質上 包含在此等透明樹脂或玻璃蓋之表面黏合黏著膠帶。另 外’作為面至少宜保護相當於受光部之部分，但為了保護 即使覆蓋該部分以外之部分亦可。 本發明之黏著膠帶’基本上係由設置於膠帶基材及基 材的單面之黏著層所形成，但即使對黏著膠帶之基材黏合 脫模薄膜亦可。也就是’在至少一面透過黏著層將施以脫 模處理之脫模薄膜黏站於黏著膠帶之基材，亦可以保護黏 14 1332712 16450pifl .doc 修正日期:99年8月9曰 爲第94109064號中文說明書無劃線修正本 著層謀求影像感測·器表面之保護。又，如此由所封裝之影 像感測器’期望黏著谬帶在任意之階段可以剝離。 另外’藉塗敷帶電防止劑，除了使生產性提升之功能 外，可以抑制膠帶剝離時因帶電產生之靜電，可以防止破 壞電子元件。 關於使用於本發明之帶電防止劑，若具有可以抑制踢 ，剝離時產生之靜電者，則沒有_的聞。例如，可以 ，出者有使用水等之分散劑或任意之有機溶劑等，將4級 氨塩作為主劑者、無機鹽與金屬化合物(例如氧化第二錫等) 塗敷於基材之方法等。特別是，以4級氨塩作為主劑之帶 電防止劑，因對溶媒之溶解性、溶媒塗工性等之 便性，所以使用於本發明較佳。 另外，鑑於本發明之用途上、黏附物之固體攝影裝置 之添加成分之複印·污染’以在基材的背面側施以處理者 較佳。另外，在設置於黏著層的表面時，恐對黏著層與帶 電防止劑之相互特性帶來影響，所以不佳。 ^ 此時’在黏著踢帶外周之至少一部，以具有剝離用之 突起部較佳。具體的，如圖1之例示，在黏著膠帶3黏合 於影像感測器1之受光部2之狀態中，突起部3在黏著膠 帶3之一部形成突出影像感測器1之端面la之狀態。在如 此形態，影像感測器1安裝於基板，通過高溫之焊^回焊 實施處理之後’檢查影像感測器1之動作或封裝基板之功 能。在製作工序完成後或使用之前，藉自動或手&可以= 容易剝離黏著膠帶3。 15 1332712 16450pifl.doc 爲第94109064號中文說明書無劃線修疋本 修正曰期:99 年8月9曰 黏著膠帶3之黏貼位置，以其外周部之一部位於影 感測器1之^&面與受光部2之中間者較佳。也就是，以 著膠帶3之寬比受光部2之寬大，且比影像感測器i之^ 小者較佳。進一步’如圖1所繪示，除了突起部3a覆蓋之 影像感測器1之邊部lb之外，在黏著膠帶3之全部之 中，以位於影像感測器1之端面與受光部2之中間者 ° 藉黏著膠帶3可以全面的覆蓋受光部2，而且’在^2 ° 測器1包裝時，可以防止黏著膠帶朝周邊之構件覆=。二 疋，在景>像感測器1之基板等之包裝狀態中，具 周圍沒有其他封裝部分不需要焊接之空間時，若^ 之-部位於影像感靡丨之端面與受 /中= 夠，並不一定要要求全周者。 間就足 二著;=者有 ==Γ(Β)崎示之略長方形或影像感測器= 手動以可以夾持之有=的’ ΐ不問自動或 形狀亦可。圖（d)例示之方形與_之組合等之 部之概之底 1332712 16450pifl.doc 修正日期:99年8月9日 爲第9410卯64號中文說明書無劃線修正本 確保明確之黏貼位置，容易確認黏著。另外，影像感測器 1不是如圖1例示之方形，而是沒有角部之方形狀或長圓 狀與橢圓狀時，則以具有與構成其端面之邊部平行之相似 形狀之邊部者較佳。 進一步，在突起部3a中，由其前端3d連結於底部之 侧部3c，以具有斜線狀、折線狀、曲線狀或此等之組合之 任一形狀者較佳。當剝離黏著膠帶3時，由於最強之力對 突起部3a之中心線作用’所以在如圖2⑷之虛線所繪示 之形狀3e，恐會產生黏著膠帶3之龜裂或伴隨此黏著劑殘 存於受光部之虞慮。從而，侧部3c為剝離時可以 力之形狀者㈣合。具_雜若具有力的分散功能，則 不需要有特別的限制，可以舉出者例如如圖2(A)〜(D)所 繪示之侧部3c之形狀。也就是，藉將侧部3c之形狀作成 斜線狀(圖2(C))、折線狀(圖2(D))、曲線狀(圖2(A)及⑽ 或此等之組合(未圖示），在黏著膠帶3之剝離時，可以圓 滑的剝離辦卩3e。從而，接著可叫略鱗之力剝離突起 部3a全部，進一步，可以將包覆受光部2之膠帶之主要部 为’在剝離方向X之面内垂直方向上以略均等之力剝離。 又，斜線與折線之傾斜角、曲線之曲率等可以 :上，形狀、黏著膠帶3全部與突起部3a之形狀等任意 另外，黏著膠帶在影像感侧器之受光部 設置黏著層者較佳。乃是為了零件封聲 °刀 黏著劑不殘留於黏附物表面以提升作^ /帶剝離時， 录双罕之故0 17 16450pifl.doc 修正日期:99年8月9曰 爲第941〇9〇64號中文說明書無割線修正本 菩居1體二如圖3所繪示，可以舉出在基材4上形成黏 :層广在黏_中央之影像感測器之受光部之部 ^為了域寬a之未塗敷部分 t在之方法等。然而，黏著層5的形狀ί t上在衫像感心之找部之部分，若可以形成未塗 刀，則沒有特別的限制者，例如如圖4之例示，可以適用 形狀、（B)方形等任意形狀之觀之方法與(C) 狀之未塗敷部分之方法法、(D)軸蚊寬之傾斜 黏著劑塗敷^ 等種種方法。圖4斜線部分係繪示 且藉著：對== 表面不偏移’ 器表面之黏貼強度，一二受^ 基材需要使_亞胺作為 封裝工序中二:=離=條件下之零件 ㈣ί二f沒有特別限制為聚酿亞胺薄媒，但為了充分 £：：^ 好的疋大於等於2〇μπι之厚度者較佳。 、 右1 f外’基材為單獨之聚醯亞胺亦可，但即使為至少且 亞胺層積層之基材、與原材料含有聚酿亞 胺材科之薄膜亦可。另外，即使為含有任意之表面處理亞 1332712 16450pifl.doc 修正曰期:99年8月9日 爲第94109064號中文說明書無割線修正本 延伸處理、或可塑劑、添加劑者亦可。 ㈣有充分__導之效果， :巧土材為例如在17〇C之熱導率為 亞胺係熱導率同耐触加二 3本身之物理的保護，對封裳時之高溫可以麵 I黏著劑的材質等雖沒有特別之 舉出者有丙烯基系黏著劑、切系黏著劑等。特 最後完成封裝之後藉任意的調;著= 處理優良之黏著膠帶，可以說是-種特=之: 進一步’本發明之特徵是藉加熱至Α於等於m ，影像感·之端子部與基_作焊錫連翻焊 焊錫連接作封裝，具體的，在回谭爐處理ΐ 之最问>皿度最好超過17〇〇C 〇 之黏著層厚度期望為大於等於1阳且小於 等於1〇〇帅’較佳的是為大於等於3μπι且小於等於 更佳的是大於等於5μιη且小於等於30μπι 〇確佯黏荖居 對於基材的表面若猶微產生段差較有效，但小於 時’因表面保護踢帶之鬆他’有可能接觸到受光部分而 性也降低。另外’因加熱中之薄膜的熱收縮有可 犯產生黏著料之獅。在超過·μπι時，職著劑在膠 帶之切口加工及沖孔加工時可能變形，或膠帶點貼時之加 19 1332712 16450pifl.doc 爲第9410卯64號中文說明書無剴線修正# 修正日期:99年8月9曰 壓、輸送時等對膠帶之虔力及葬 之變形」黏著劑有可能點著於時之加熱，因黏著劑 也就疋，為了保護影像感測器， 特定之封裝上之強度，而且必須 膠帶必須有 黏合狀態，另外也需要有加工性:從測器調和之 帶，f測社罢矸山、'卜 從而’本發明之黏著膠 且有如此:菩展r出上述範圍為最適當範圍。從而，藉 „黏者層之厚度之黏著膠帶，可以提供 = …女全性、生產性較高之影像感測器之封裝方法。” 著膠:之二期望在實施18〇。。加熱1小時後之黏 著谬帶之熱收縮率為小於等於10%，較佳的是小於等於 之佳的是小於等於〇.3%以下。針對在高溫條件下 ^基材的收縮率’藉明確附加的條件，更為了提升作業效 率。在此稱為熱故縮率’係以黏著膠帶形態黏合於BA板， 在180°C之溫度條件下，放置丨小時之後之值形成基準值。 具體之熱收縮率之測定方法，係將黏著膠帶切成2〇随正 方丄黏貼於BA板，在180。〇之溫度條件下加熱，將其加16450pifl.doc Date of revision: August 9th, 1999 is the Chinese manual of No. 94109064. There is no slash correction. 9. Description of the Invention: Technical Field The present invention relates to an image sensor using a solid-state imaging device. Packaging process. [Prior Art] Image sensors using solid-state imaging devices have been widely used in digital cameras and video cameras in recent years. In the manufacturing process including the substrate side in which these image feelings are packaged, the possibility that the scratches on the surface of the image sensor and the flying dust directly affect the photographing is high. Here, it is possible to use an adhesive tape as a surface protective tape to adhere to the light receiving portion side of the image sensor, thereby avoiding scratches and dust adhering to the packaging and manufacturing processes. On the other hand, when the image sensor is mounted on a substrate or the like, a method of soldering and sealing the terminal portion and the solder joint using a soldering iron has been used. In recent years, with the high quality and high functionality of image sensors, the number of terminals has also increased dramatically. Therefore, it takes a lot of time and is not practical to use a terminal, a soldering, and soldering. Here, there is a method in which the terminal portion of the image sensor is matched with the position of the package substrate by a solder reflow furnace for one-time connection and packaging. However, 'the solder reflow oven must be heated to at least the high temperature above the melting point of the solder: if the heat-reflow is carried out in the state of bonding the adhesive tape for the purpose of protecting the above, there may be a positional deviation due to the thermal deformation shrinkage of the adhesive tape substrate. , and the peeling or heat aging due to the adhesive tape material, the degradation may be the reason for the surface of the image sensor. In addition, the color filter used in the interior of the solid-state imaging device may also be denatured due to heat or 1332712 16450 pifl.doc for the Chinese manual of No. 4 No-line correction. This revision date: "August 9 Broken, so especially at 170. (The above high temperature reflow treatment also has its difficulties. Therefore, it is known that once the protective tape is peeled off before being put into the solder reflow furnace, the solder reflow is performed at 160 ° C, and the adhesive protection tape is re-corrected after completion. In the state of bonding adhesive tape, it is difficult to pass the higher heating process for solder reflow. In addition, the method of using adhesive tape for surface protection has the advantages of simple process of bonding and peeling, and conversely, due to pasting. The movement of the electric charge generated when the adhesive tape is applied, the adhesive tape and the adhesive are charged, and the discharge is accompanied by discharge. Recently, with the miniaturization and high integration of the electronic device, the circuit is refined, and on the other hand, the discharge of the electronic device is performed. The durability is lowered, and the discharge occurs when the tape is peeled off, causing a phenomenon that the electronic device is broken. [Invention] Accordingly, an object of the present invention is to provide an image in a packaging process using a solid-state imaging device. The state of the light-receiving adhesive tape is made of solder reflow, and can also be pre-welded in solder reflow. A sealing method for protecting a fine image of an image maker H and a protective adhesive tape used therefor. Further, it is an object of the present invention to provide a guardian for peeling off an adhesive tape by an image sensor, which has a prevention factor A surface protective adhesive film that generates static electricity and causes the effect of damaging the device by the discharge of the device. 4 The inventors repeatedly focused on reviewing the results of the aforementioned problems, and saw that the packaging method described below or the use of adhesive tape was used. The above object can be achieved. Finally, the present invention is completed. 7 1332712 16450pifl.doc Date of revision: August 9, 1999 is the Chinese manual of No. 94109064 without a slash correction, the invention is a packaging method of an image sensor, which is used In the package of the image sensor of the solid device, the image sensor is bonded with a polyimide material as a base material, and the outer peripheral portion has a protrusion for peeling off, and has an image with the image. The side of the sensor is connected to the bottom of the protrusion, and the side of the protrusion is slanted, folded, or The state of the shape-shaped adhesive belt of the curved or combined 匕, etc., is heated to 17 叱 to solder the terminal portion of the shirt image sensor to the substrate side for soldering. If, according to the present invention, The higher heat resistance of the imine can not only be used, but also the significant thermal deformation of the knee band in the high-temperature process of solder reflow and the higher the matte and the material of the imine. The heat is transferred to the color filter used in the solid-state imaging device. Thus, the brewed imide substrate is not only used as a heat-resistant protective tape, but also because of the heat (heating) of the color-correcting device. As a fruit, the phase is implemented in the heating process of the high temperature of the big brother in the big brother. The tape at least makes the green material as the above-mentioned adhesive, so that the heat resistance can be improved, and the control of the peeling adhesive force can be easily performed. The invention relates to a method for packaging an image sensor, which is subjected to an image sensor in a packaging process using an image sensor of a solid device. The side of the crucible is bonded with polyimine as a base material, which is layered on a single mask and coated with a charge inhibitor on the other side, at least on the outer circumference; 8 1332712 16450pifl.doc Date of revision: August, 1999 9曰为9494064号 Chinese manual without scribe line correction The main part has a protrusion for peeling, and has a side parallel to the end surface of the image sensor and connected to the bottom of the protrusion, and the front end of the protrusion is connected to the girl The side material at the bottom has a diagonal green, a folding test, a curved and a balance, etc.: The state of the adhesive tape of any shape 'by heating to 17 〇r or more, the terminal portion of the image sensor is soldered back to the substrate side. weld. According to the present invention, it is possible to suppress the significant thermal deformation and shrinkage of the adhesive tape in the high-temperature process of solder reflow, and it is also possible to suppress the use of the enamel for use in the body garment device. The effect of not only the heat-resistant protective tape alone, but also the effect of suppressing the heat of the ruthenium 2 inside the solid-state imaging device is also adopted. . . The above heating process with sufficient surface temperature. In addition, by applying the anti-static agent, in addition to the function of improving productivity, it is possible to suppress static electricity from being charged when the tape is peeled off, thereby preventing damage to electricity. The system is applied to the back side of the substrate to reduce the adhesion of the anti-static agent and contaminate the adherend, and to improve the yield. Charge 3: A method of encapsulating the above image sensor, wherein the above-mentioned charge preventing agent is a class 4 ammonia hydrazine as a main agent. It is not described in the package king of the image sensor to prevent the generation of static electricity. Μ 'The system is seen in the anti-charge effect of the high-temperature lining. It is seen that the H-electricity prevention effect is determined by the various conditions of the singer-resistant singer. The antistatic agent of the agent is very suitable for the purpose of the present invention. The electric charge is set to suppress the static electricity generated when the tape is peeled off, and can be prevented. 9 1332712 16450pifl.doc Amendment date: August 9th, 1999 is the 9410th The invention is a method of encapsulating the image sensor described above, wherein in the adhesive tape, at least a portion of the outer periphery thereof has a protrusion portion which is peeled off. The adhesion and peeling of the adhesive tape forms an important process in the packaging of the image sensor' and does not cause deposits after a certain requirement. In the present invention, by using at least a portion of the outer periphery thereof, there is a secret projection which can be easily detached from the tape before the inspection or the like is completed. At this time, in the package state of the image sensor, it is preferable that the package or soldering of the parts adjacent to the adhesive tape does not cause an obstacle. The present invention relates to a method for packaging the image sensor, wherein the adhesive knee cover covers all of the light receiving portions of the image sensor, and is adhered to the light receiving portion such that at least a portion of the outer peripheral portion thereof is provided by the image sensor. The specific distance from the end face to the center side. The protection of the image sensor must be a comprehensive cover of the shape of the tape of the light-receiving part. In other respects, when the outer peripheral portion of the tape protrudes from the end face of the image, the part (4) or soldering of the image is attached. Caused obstacles. That is to say, the transfer is necessary to rely on the technical department, and the best is better. From the outer peripheral portion of the adhesive tape other than the protruding portion, the light-receiving portion is bonded to the light-receiving portion so that at least a portion thereof, preferably a large portion, has a specific invention of the end surface to the center side of the image sensor A method of packaging the above image sensor, wherein the tape is provided with a side portion parallel to the end surface of the image sensor, coupled to the bottom portion of the protrusion/projection portion, and joined to the bottom side by the front end of the protrusion portion = It is a diagonal line, a line shape, a curved shape, or a combination of any of these shapes. As described above, after the completion of the manufacturing process such as inspection of the tape or the use of 1332712 16450pifl.doc for the Chinese manual No. 94109064, there is no slash correction. The date of revision: before August 9, 1999, it is preferable to be easily peeled off. However, in the fixation of the adhesive tape, there must be a special adhesive force. On the other hand, if the adhesive force is too strong, when the adhesive tape is peeled off, the adhesion condition may be due to fear of adhesive residue remaining. Must be limited to a specific range. In particular, in the peeling of the adhesive tape provided with the protrusions, the pull-up protrusions are formed to be sandwiched. In this case, since the adhesive tape is likely to be cracked, in the present invention, the front end of the protrusion is connected to the bottom. The side portions have a shape of a diagonal line, a fold line, a curve, or a combination of these, and a peeling tape which can be smoothed by the image sensor is seen. In addition, the distance between the end surface of the image sensor and the outer peripheral portion of the light receiving portion is usually very short. Therefore, in the package of the image sensor, the adhesive position of the adhesive tape becomes important, and even if it is automatically pasted, the adhesive must be confirmed. position. Therefore, the adhesive tape of the side portion which is connected to the bottom of the protrusion portion in parallel with the end surface of the image sensor can clarify the adhesion position of the tape, so that the image sensor can be packaged correctly and efficiently. The present invention is a method of packaging the image sensor described above, wherein in the adhesive tape described above, an adhesive layer is not provided in a portion of the light receiving portion of the image sensor. In the present invention, the adhesive tape for protecting the image sensor is based on the substrate and the adhesive layer, and is in the process of bonding the adhesive tape. Further, the proposal is based on the adhesive tape. The adhesive portion is not provided with an adhesive layer, and when the tape after the component is peeled off, the adhesive does not remain on the surface of the adhesive, and the work efficiency is improved. That is, in the image-sensing packaging process, in the image-sensing light-receiving part: to 11 1332712 16450pifl.doc Revision date: August 9, 1999 is the 94109064 Chinese manual without a slash correction. The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The packaging method of the sensor. The present invention relates to a method of encapsulating the image sensor described above, wherein the substrate at 170 ° C has a thermal conductivity of 5 x 1 〇 -4 cal/cm.sec ^ or less. In the image sensor used as a solid-state imaging device, many of the color filters are contained therein, and the temperature is high in the package. The polyimide film constituting the substrate of the adhesive tape of the present invention has a lower thermal conductivity than heat resistance, and has a function of suppressing heat conduction, and not only a physical protection image sensor itself but also a color filter. The present invention is a method of packaging the above image sensor, wherein the adhesive tape has a heat shrinkage ratio of less than 丨 after being heated at 180 ° C for 1 hour. That is, as described above, in the package of the image sensor, it is preferable that the shrinkage ratio of the substrate is small, particularly after the process in the high temperature field such as soldering, and the substrate which is to be obtained under high temperature conditions is obtained. The shrinkage rate is limited to the above-mentioned range of suitable views, and the additional efficiency is further improved by clarifying such additional conditions. The present invention is a method of packaging the above image sensor, wherein the adhesive tape is applied at 18 inches. (: The adhesion after heating for 1 hour is 〇1~ 8.0N/19mm wide. That is, in order to prevent the peeling of the adhesive tape, it is necessary to have a specific above 12 1332712 16450pifl.doc Amendment date: August 9th, 1999 The Chinese manual No. 94109064 does not have a scribe line to correct the adhesion of the present invention. On the other hand, in order to prevent the adhesive layer from being peeled off by the adhesive, it is necessary to have a specific adhesive force. In particular, when the packaging process in the high temperature field is included. The shrinkage rate of the substrate under high temperature conditions is obtained, and the above-mentioned range is more suitable. The function of the damaged material and the adhesive tape can prevent the adhesive from remaining on the surface of the adhesive when the tape is peeled off after the package is packaged. The present invention relates to an adhesive tape used in the above-described image sensor packaging method, an adhesive tape (4) (IV), an imine as a base material, and at least one of which has a protrusion for peeling off. And having a side portion parallel to the end surface of the image detector and connected to the bottom portion of the protrusion portion, and I is formed by the front portion of the protrusion portion at the bottom portion of the protrusion portion, a diagonal line, a line shape or a group Any of these shapes. The packaging method described above requires the surface of the image sensor to be protected from contamination by foreign matter, and it is not necessary to perform the part packaging process under heating conditions such as soldering. The peeling of the tape can also be carried out, and the adhesive tape of the surface protection of the invention is provided by the invention, and the combination of the adhesiveness and the adhesive surface protection meets such a requirement. When the tape is peeled off, electricity is generated to prevent damage to the electronic device. [Effects of the Invention] According to the present invention, the surface transposition can be provided in the form of a solid image I, or can be loaded with a 1st order or a check for a king towel, which is bonded to the adhesive tape. Ancient: The process of protecting the surface of the image sensor, and the method of packaging the image sensor for the workability and productivity. 13 16450pifl.doc is the Chinese manual No. 94109064 without a slash correction. Amendment date: 99 years On August 9th, the anti-static agent is applied, and the function of improving productivity can be suppressed, and the static electricity generated by the charging when the tape is peeled off can be suppressed, and the electronic device can be prevented from being damaged. A protective adhesive tape which has high heat shrinkability and excellent heat resistance when used in such an image sensor package. [Embodiment] Hereinafter, an embodiment of the present invention will be described. The image sensor of the present invention The packaging method is in the state in which the image sensor of the solid-state imaging device is used, and the image is adhered to the light-receiving portion of the image sensor by using the adhesive tape using the polyimide as the base material. The terminal portion of the sensor is soldered and reflowed to the substrate side. The image sensor using a solid-state imaging device generally refers to a package called transparent CCD (Charge Coupled Device) or CMOS (Complementary). MOS) Image sensor for solid state imaging devices. In addition, the side of the light receiving portion of the image sensor means the surface side of the sensor that receives the light image. In general, the image sensor is provided with a transparent resin and a glass cover for the purpose of protecting the image capturing device. Therefore, the adhesive tape is bonded to the surface of the transparent resin or the glass cover. Further, it is preferable that at least the portion corresponding to the light receiving portion is protected as a surface, but it is also possible to protect even a portion other than the portion. The adhesive tape 'of the present invention is basically formed of an adhesive layer provided on one side of the tape substrate and the substrate, but the release film may be adhered to the substrate of the adhesive tape. That is to say, 'the release film which is subjected to the release treatment on at least one side through the adhesive layer adheres to the substrate of the adhesive tape, and can also protect the adhesive 14 1332712 16450pifl. doc Date of revision: August 9th, 1999 is No. 94109064 The Chinese manual does not have a slash correction to protect the surface of the image sensor. Further, it is thus desired that the adhesive image tape of the packaged image sensor can be peeled off at any stage. Further, by applying the antistatic agent, in addition to the function of improving productivity, it is possible to suppress static electricity generated by charging when the tape is peeled off, and it is possible to prevent the electronic component from being damaged. Regarding the charge preventing agent used in the present invention, if it has an electrostatic charge that can be suppressed from being kicked or peeled off, there is no smell. For example, a method in which a fourth-stage ammonia hydrazine is used as a main component, an inorganic salt, and a metal compound (for example, oxidized second tin) is applied to a substrate by using a dispersing agent such as water or an optional organic solvent. Wait. In particular, a charge inhibitor which uses a grade 4 ammonia hydrazine as a main component is preferred for use in the present invention because of its solubility in a solvent and solvent coatability. Further, in view of the use of the present invention, copying and contamination of the additive component of the solid-state imaging device of the adhesive is preferably applied to the back side of the substrate. Further, when it is provided on the surface of the adhesive layer, there is a fear that the mutual characteristics of the adhesive layer and the charge preventing agent are affected, which is not preferable. ^ At this time, at least one portion of the outer periphery of the adhesive band is preferably provided with a projection for peeling off. Specifically, as shown in FIG. 1 , in a state where the adhesive tape 3 is adhered to the light receiving portion 2 of the image sensor 1 , the protrusion 3 forms a state of protruding the end face la of the image sensor 1 at one portion of the adhesive tape 3 . . In this manner, the image sensor 1 is mounted on the substrate, and the function of the image sensor 1 or the function of the package substrate is checked after the processing is performed by high-temperature soldering. After the production process is completed or before use, the adhesive tape 3 can be easily peeled off by automatic or hand & 15 1332712 16450pifl.doc For the Chinese manual No. 94109064, there is no underline repair. The revised period: August 9th, 1999, the adhesive position of the adhesive tape 3, with one of the outer peripheral portions located in the shadow sensor 1 & The middle of the face and the light receiving portion 2 is preferred. That is, it is preferable that the width of the tape 3 is wider than that of the light receiving portion 2 and smaller than that of the image sensor i. Further, as shown in FIG. 1 , in addition to the side lb of the image sensor 1 covered by the protrusion 3 a , in the entire adhesive tape 3 , the end surface of the image sensor 1 and the light receiving unit 2 are located. The intermediate person can fully cover the light receiving portion 2 by the adhesive tape 3, and 'when the package 2 is packaged, the adhesive tape can be prevented from covering the peripheral member. In the package state of the substrate, such as the substrate of the sensor 1, when there is no space in the package where no other package parts are required to be soldered, if the portion of the image is located at the end face of the image and the receiving/medium = Enough, you don't have to ask for the whole week. There is a gap between the two; = = = Γ (Β) Qiqiu slightly rectangular or image sensor = manual can be clamped with = ' ΐ do not ask automatically or shape can also be. Figure (d) illustrates the combination of the square and the _, etc. The bottom of the section is 1332712 16450pifl.doc Revision date: August 9, 1999 is the 9410卯64 Chinese manual without a slash correction to ensure a clear paste position, Easy to confirm adhesion. Further, the image sensor 1 is not a square as illustrated in FIG. 1, but has a square shape having no corners or an elliptical shape and an elliptical shape, and is similar to a side having a similar shape parallel to the side portion constituting the end surface thereof. good. Further, in the projection 3a, the side portion 3c whose bottom end 3d is coupled to the bottom portion is preferably a shape having a diagonal line shape, a polygonal line shape, a curved shape or a combination of the above. When the adhesive tape 3 is peeled off, since the strongest force acts on the center line of the projection 3a, the shape 3e shown by the broken line in Fig. 2(4) may cause cracking of the adhesive tape 3 or may remain with the adhesive. Considered by the light department. Therefore, the side portion 3c is a shape that can be deformed at the time of peeling. There is no need to have any particular limitation as long as it has a forceful dispersion function, and for example, the shape of the side portion 3c as shown in Figs. 2(A) to (D). That is, the shape of the side portion 3c is formed in a diagonal shape (Fig. 2(C)), a polygonal line shape (Fig. 2(D)), a curved shape (Fig. 2(A) and (10) or a combination thereof (not shown). When the adhesive tape 3 is peeled off, the handle 3e can be smoothly peeled off. Thus, the protrusion 3a can be peeled off by a slight scale, and further, the main portion of the tape covering the light receiving portion 2 can be 'in the The peeling direction X is peeled off in a direction of a slight uniform force in the vertical direction. Further, the inclination angle of the oblique line and the fold line, the curvature of the curve, and the like may be any other shape, such as the shape and the adhesive tape 3 and the shape of the protrusion 3a. It is better to set the adhesive layer on the light-receiving part of the image sensor side. It is for the part sealing sound. The knife adhesive does not remain on the surface of the adhesive to improve the peeling of the tape. The recording is double and the result is 0 17 16450pifl. Doc Date of revision: August 9th, 1999, No. 941〇9〇64 Chinese manual without secant correction This Bodhi 1 body 2 is shown in Figure 3, which can be described as forming a sticky layer on the substrate 4: The part of the light-receiving part of the image sensor of the viscous _ is the method of the uncoated part t of the domain width a, etc. Further, the shape of the adhesive layer 5 is on the portion of the shirt-like sensation portion, and if an uncoated knife can be formed, there is no particular limitation. For example, as illustrated in Fig. 4, the shape, (B) square, etc. can be applied. Various methods such as the method of arbitrarily shaped view and the method of (C) uncoated portion, (D) the coating of tilting adhesive of the mosquito width of the shaft, etc. The oblique line of Fig. 4 is shown by: = The surface does not shift the adhesion strength of the surface of the device. The substrate needs to be made of _imine as the second part of the packaging process: = part of the condition under the condition (4) ί2f is not particularly limited to the polyaniline thin medium. However, in order to be sufficient, the thickness of 疋 疋 is greater than or equal to the thickness of 2 〇 μm. Preferably, the right 1 f outer substrate may be a single polyimine, but even if it is at least an imide layer. The material and the raw material contain the film of the polyaniline material. In addition, even if it contains any surface treatment, the sub-1332712 16450pifl.doc has a modified period: August 9th, 1999 is the 94112064 Chinese manual without secant revision. Extension treatment, or plasticizers, additives can also be. (4) There is sufficient __ guidance effect Fruit, : Qiao soil material is, for example, a thermal conductivity of 17 〇C, the thermal conductivity of the imide system is the same as the physical protection of the anti-contact 2, and the material of the adhesive can be used for the high temperature of the seal. There are no particular mentions of propylene-based adhesives, sizing adhesives, etc.. After the final completion of the package, the use of any adjustment; with = treatment of excellent adhesive tape, can be said to be - special =: Further 'the invention The feature is that by heating to Α equal to m, the terminal portion of the image sense is connected with the base _ solder for soldering, for example, the most important thing in the processing of the simmering furnace is > 17 The thickness of the adhesive layer of 〇〇C 期望 is desirably 1 or more and less than or equal to 1 〇〇 '. Preferably, it is 3 μm or more and more preferably 5 μm or more and 30 μπι or less. It is more effective to produce a step difference on the surface of the substrate, but when it is smaller than 'the loose surface of the surface protection kick band', it is possible to contact the light receiving portion and the property is also lowered. In addition, there is a lion that can cause adhesives due to heat shrinkage of the film during heating. When it exceeds μμιη, the occupational agent may be deformed during the slitting and punching of the tape, or when the tape is attached, 19 1332712 16450pifl.doc is the Chinese manual No. 9410卯64 Revision No. # Correction date # Revision date: On August 9th, 1999, the pressure on the tape and the deformation of the tape were changed. The adhesive may be heated at the time, because the adhesive is also rubbed, in order to protect the image sensor, the specific package The strength, and the tape must be bonded, and also need to have processability: from the tape of the detector, f test society to smash the mountain, 'Bu and thus' the adhesive of the invention and there is such: The range is the most appropriate range. Therefore, by means of the adhesive tape of the thickness of the adhesive layer, it is possible to provide a packaging method for the image sensor which is full-featured and productive." Glue: The second is expected to be implemented 18〇. . The heat shrinkage rate of the adhesive tape after heating for 1 hour is 10% or less, preferably less than or equal to 3% or less. For the high-temperature conditions, the shrinkage rate of the substrate is improved by the additional conditions. Here, the heat shrinkage rate is bonded to the BA plate in the form of an adhesive tape, and the value after standing for one hour at a temperature of 180 ° C forms a reference value. The specific method for measuring the heat shrinkage rate is to cut the adhesive tape into 2 pieces and stick it to the BA plate at 180 degrees. Heat it under the temperature conditions, add it
熱前後之膠帶尺寸，使用投影機(mitsutoyo製：PR0FILE PROJECTOR PJ_H300F)針對MD方向及TD方向之任一方 向加以測定。又，所謂BA板，係指依照JIS「BA加工」， 在BA5號作表面加工之SUS3〇4板（日本金屬（股份公司） 製BA5號加工SUS304)。 另外，在本發明中，實施18(TC加熱1小時後之黏著 膠帶之黏著力’以〇1〜8.0N/19mm寬較佳，另外，以〇 2N 〜5.0N/19mm寬更佳’進一步以〇 3〜4.〇N/19mm寬最佳。 20 1332712 16450pifl.doc 修正曰期:99年8月9曰 爲第94109064號中文說明書無劃線修正本 超過8.0N/19mm之黏著力，膠帶由黏附物剝離工序上較困 難，且有可能使黏著層殘存於黏附物表面。若低於 0.1N/19mm，則因加熱中之薄膜之熱收縮有可能產生黏著 膠帶之剝離。在此所謂黏著力係以依據jIS z〇237測定之 值作為基準。 另外，使用脫模薄膜於黏著膠帶時，脫模薄膜即使使 用，知之任何一種皆可。具體的，在與脫模薄膜之基材的 黏著層之接合面，可以使用脫模塗層，例如形成矽^者。 作為脫模薄膜之基材，可以舉出者有如玻璃紙之紙^、與 由聚乙烯、聚丙烯、聚酯等所形成之樹脂薄膜。 、 體攝影裝置之尺寸作加王衬。.加工方法，若為可以 另外’本黏著膠帶其用途即使例如因應作為對象之固 保持均一的形狀’ 著劑不殘留於加卫剖面部之_ 雖沒有特獅，但#於生產性以打孔加工。/ 【實施例】The tape size before and after the heat was measured in either of the MD direction and the TD direction using a projector (manufactured by Mittoyoyo: PR0FILE PROJECTOR PJ_H300F). In addition, the BA board is a SUS3〇4 board (BA5 No. SUS304 manufactured by Nippon Metal Co., Ltd.) which is surface-treated in accordance with JIS "BA processing". Further, in the present invention, the implementation of 18 (the adhesion of the adhesive tape after 1 hour of heating by TC is preferably 〇1 to 8.0 N/19 mm width, and further preferably 〇2N to 5.0 N/19 mm wide' further) 〇3~4.〇N/19mm width is best. 20 1332712 16450pifl.doc Correction period: August 9th, 1999 is the 94109064 Chinese manual without scribe line correction over 8.0N/19mm adhesion, tape by The adhesive peeling process is difficult, and the adhesive layer may remain on the surface of the adhesive. If it is less than 0.1 N/19 mm, the adhesive film may be peeled off due to heat shrinkage of the film during heating. It is based on the value measured in accordance with jIS z〇 237. In addition, when the release film is used for the adhesive tape, the release film can be used for any purpose, specifically, the adhesive layer on the substrate of the release film. As the bonding surface, a release coating may be used, for example, as a substrate for the release film, such as a paper made of cellophane, and a resin formed of polyethylene, polypropylene, polyester, or the like. Film, the size of the body photography device for the king .. processing method, if it can be used in addition to the 'adhesive tape, even if it is used as a target to maintain a uniform shape', the agent does not remain in the Guardian section _ although there is no special lion, but #production is to play Hole processing. / [Examples]
們个贫听之實施例、評估方法。 <評估方法> 估。依據上雜”叙㈣，崎下叙項目進行評 (1)加熱後之膠帶形狀We are a poor example and evaluation method. <Evaluation method> Estimation. According to the above-mentioned Miscellaneous (four), the Qia Xia project evaluates (1) the shape of the tape after heating
放置1小時後之膠帶形狀。 21 1332712 16450pifl.doc 修正日期:99年8月9曰 爲第94109064號中文說明書無割線修正本 (2) 膠帶剝離後之玻璃表面之狀態 以目視確認膠帶剝離後之玻璃表面之狀熊。 (3) 放電量 ~ 將夥帶之黏著面黏合於玻璃面後，放置3〇分鐘後測 定剝離黏著膠帶時之放電量。放電量之測定如以下進 行。 (3-1)使同軸電纜連接於高速剝離試驗機之前端剝離 面之上部’對於剝離面設置成以相同速度移動。 (3-2)進一步，藉使同軸電纜連接於示波管器，測定剝 離時產生之電磁波之值。 (3-3)將各黏著膠帶切成2〇mm寬，黏貼於玻璃面，安 裝於前述之裝置。 (3-4)之後’稭剝離角度18〇。〇、剝離速度5mm/min測 定時，將所觀測之電磁波之值作為放電值。 (3·5)將其測定之電磁波頂峰之最大值定義為放電值。 (4) 剝離性 係在CCD包裝之表面玻璃黏合下述實施例·比較例 之樣品後’將此投入最高溫度l8〇〇Cx5秒(也包含預熱等的 回焊爐投入時間約90秒)之焊錫回焊爐，朝基板封裝後之 剝離的容易性。 <實施例1> 在聚醯亞胺（東菱杜邦製KAPUTON100H :厚度 25μπι ’ 在 170C之熱導率約為 4.1><10_4cal/cm . sec°C)上 塗敷厚度1 Ομιη之矽系黏著劑(東菱DAUKONINGU公司製 22 1332712 16450pifl.doc 修正日期:99年8月9日 爲第94109064號中文說明書無割線修正本 SD-4580)作成黏著膠帶，使其黏合於CCD包裝之表面玻 璃。將此投入最南溫度180 Cx5秒(包含預熱等之回焊爐之 投入時間約為90秒)之焊錫回焊爐，朝基板作封裝。又， 封裝完成後剝離膠.帶。 結果，膠帶剝離後之表面無法確認割痕與附著異物， 另外可以確認作為CCD之正常動作。 <實施例2> 在由厚度25μιη之聚醯亞胺（東菱杜邦製 KAPUTON100H)所形成之基材上，將4級氨垣 (KORUKOTO(股份公司）製NR-121X)塗敷於黏著膠帶之 基材的背面側。之後，在其相反面塗敷丙烯基系黏著劑之 溶液’加以乾燥’作成厚度形成ΙΟμιη之黏著劑層之黏著 膠帶。 曰 將該黏著膠帶施以180°C加熱1小時程度之後，依據 JIS Z0237測定黏著力為2.5N/19mm’熱收縮率為〇 1%。 另外，膠帶之剝離無法確認，放電量之最大值為5〇mV。 <實施例3> 如上述圖2(A)所繪示，黏著膠帶由iimmxl2mm方形 之包覆部分經過R=2(mm)之圓弧形狀之側部，除了突出 長度具有4mm之突起部之錐形狀之外，製作了與實施例i 同樣之黏著膠帶。使該膠帶黏合於CCD封裝之表面玻璃， 與實施例1 一樣’投入180°C之焊錫回焊爐朝基板作封裝。 之後，由膠帶之突起部剝離膠帶時，膠帶不會切斷可 以容易的由突起部剝離。膠帶剝離後之CCD封裝之玻璃 23 1332712 16450pifl.doc 爲第9410卯64號中文說明書無劃線修正本 修正日期:99年8月9曰 表面無法確關痕_著異物，Place the tape shape after 1 hour. 21 1332712 16450pifl.doc Date of revision: August 9th, 1999 无 No. 94109064 Chinese manual without secant correction (2) Status of glass surface after tape peeling Visually confirm the shape of the glass surface after the tape is peeled off. (3) Discharge amount ~ After the adhesive surface of the tape was bonded to the glass surface, the discharge amount was measured after peeling the adhesive tape for 3 minutes. The amount of discharge was measured as follows. (3-1) The coaxial cable was connected to the upper portion of the peeling surface before the high-speed peeling tester. The peeling surface was set to move at the same speed. (3-2) Further, by connecting the coaxial cable to the oscilloscope, the value of the electromagnetic wave generated at the time of peeling is measured. (3-3) Each adhesive tape was cut into a width of 2 mm, adhered to the glass surface, and mounted on the above apparatus. (3-4) After the 'stalk peeling angle 18 〇. 〇, peeling speed 5mm / min measurement, the value of the observed electromagnetic wave as the discharge value. (3·5) The maximum value of the electromagnetic wave peak measured is defined as the discharge value. (4) Peelability is applied to the surface of the CCD package after bonding the samples of the following examples and comparative examples. This is put into the maximum temperature of l8 〇〇 C x 5 seconds (including the reflow furnace input time of preheating, etc., about 90 seconds). The solder reflow oven is easy to peel off after packaging the substrate. <Example 1> A bismuth system having a thickness of 1 Ομιη was coated on a polyimine (a KAPUTON 100H manufactured by Toh DuPont DuPont: thickness 25 μm ' at a thermal conductivity of 170 C at a temperature of about 4.1 < 10_4 cal/cm . sec ° C). Adhesive (Dongling DAUKONINGU, Inc. 22 1332712 16450pifl.doc Revision date: August 9, 1999, No. 94109064 Chinese manual without secant correction SD-4580) Adhesive tape is applied to the surface glass of the CCD package. This was put into a solder reflow furnace of the southernmost temperature of 180 Cx for 5 seconds (injection time of about 90 seconds for a reheating furnace such as preheating), and packaged toward the substrate. Also, the tape is peeled off after the package is completed. As a result, it was impossible to confirm the cut marks and the foreign matter adhering to the surface after the tape was peeled off, and it was confirmed that the CCD was normally operated. <Example 2> A grade 4 ammonia oxime (NR-121X manufactured by KORUKOTO Co., Ltd.) was applied to an adhesive tape on a substrate formed of a polyimide of a thickness of 25 μm (KAPUTON 100H manufactured by Tosoh DuPont). The back side of the substrate. Thereafter, a solution of the acryl-based adhesive was applied to the opposite side and dried to form an adhesive tape having a thickness of 黏μηη.将该 After the adhesive tape was heated at 180 ° C for 1 hour, the adhesive strength was determined to be N 1% according to JIS Z0237 of 2.5 N/19 mm'. In addition, the peeling of the tape was not confirmed, and the maximum amount of discharge was 5 〇 mV. <Example 3> As shown in Fig. 2(A) above, the adhesive tape is passed through the side portion of the circular arc shape of R = 2 (mm) by the covering portion of the iimm x 12 mm square, except that the protruding length has a projection of 4 mm. An adhesive tape similar to that of Example i was produced in addition to the tapered shape. The tape was bonded to the surface glass of the CCD package, and was placed in a solder reflow oven of 180 ° C toward the substrate as in the first embodiment. Thereafter, when the tape is peeled off from the protruding portion of the tape, the tape can be easily peeled off by the projection without being cut. The glass of the CCD package after the tape is peeled off 23 1332712 16450pifl.doc The Chinese manual No. 9410卯64 has no scribe correction. Date of revision: August 9th, 1999 曰 The surface cannot be confirmed.
之正常動作。‘ 4从確認作為CCD <實施例4> 如上述之圖2(C)所繪示，黏著膠帶由 之包覆部分，經過在兩端外側各具 mm〉 lb"3f ^ ：：mNormal action. ‘4 from confirmation as CCD <Example 4> As shown in Fig. 2(C) above, the adhesive tape is covered by the portion, and each side has mm > lb"3f ^ ::m
帶之突 =形狀之外，製作了 樣之黏者膠帶。使該膠帶黏合於cCD 與實施例1 一樣，投入180。「之度 .裝之表面玻璃， .,. C之知錫回焊爐朝基板作封裝。 之後，由膠帶之突起部剝離职; =的由突起部制離。膠帶剝離後之’二帶:!= 之iiJT到痕與附著異物，另外可以確認作為ccd <比較例1> 為5 5tH 2rm之尼龍(東菱公司製6尼龍：熱傳導度約 菇.5 10 Cal/Cm.see，c)’ 除了使用塗敷 J彈=率為2._/cm之橡膠系黏著劑之黏著膠帶之 卜，與實施例1同樣進行。 其結果，因科之熱收縮絲合部分產生位置偏移， ’曰在剝離之面熱老化之黏著劑殘留污染了表面。另外， ，焊之溫度’CCD内部之濾、色器有可能破損，所以CCD 不身也無法正常作動。 <比較例2> 在黏著膠帶除了未塗敷4級氨塩之外，可以得到以與 24 16450pifl.doc 修正日期:99年8月9曰 爲第94109064號中文說明書無剌線修正本 實施例2同樣之方法製作之黏著膠帶。 將該黏著膠帶施以180¾加熱1小時程度之後，依據 JIS Z0237測定黏著力為2.5N/19mm，熱收縮率為0.1%。 另外，雖無法確認膠帶之剝離，但可以確認放電400mV。 <比較例3> 在黏著膠帶之黏著層之背面，除了塗敷4級氨塩之 外，可以得到以與實施例2同樣方法製作之黏著膠帶。 將該黏著膠帶施以180°C加熱1小時程度之後，依據 JIS Z0237測定黏者力為2.5N/19mm，熱收縮率為0.1%。 另外’雖無法確認膠帶之剝離，但可以確認放電35〇mV。 〈比較例4> 除了突起部之側部具有直角狀之底部形狀(如圖2(A) 之虛線所繪示之形狀3e)之外，製作了與實施例4同樣之 黏著膠帶。使該膠帶黏合於CCD封裝之表面玻璃，與實 施例1同樣投入180°C之焊錫回焊爐朝基板作封裝。 之後，由膠帶之突起部剝離膠帶時，由突起部底部之 角的部分產生龜裂膠帶被切斷，無法容易的由突起部剝離 膠帶全部。 <參考例1-1 > 在由厚度25μιη之聚乙烯萘所形成之基材上，將4極 氨鹽(korukoto(股份公司）製NR_ 121X)塗敷於點著朦帶之 基材的貪面側。之後，在其相反面塗敷丙烯基系黏著劑之 溶液，加以乾燥，作成厚度形成10μιη之黏著劑層之粘著 膠帶。 25 1332712 16450pifl.doc 爲第94109064號中文說明書無劃線修正本 修正曰期:99年8月9日 將該黏著膠帶施以180。(：加熱1小時程度之後，依據 JIS Z0237測定黏著力為2 〇N/19mm，熱收縮率為〇15 %，在黏著膠帶500nm之光透過率為86.0%。另外，膠帶 之剝離無法確認，放電量之最大值為5〇mV。 <參考例1-2> 在黏著膠帶之黏著層之背面，除了不塗敷4極氨鹽之 外’可以得到以與參考例M同樣之方法製作之黏著膠帶。 將該黏著膠帶施以18(rc加熱丨小時程度之後，依據 JIS Z0237測定黏著力為2 〇N/19mm，熱收縮率為〇15 %，在該黏著膠帶5〇〇nm之光透過率為88 〇%。另外，雖 無法確認膠帶之剝離，但可以確認放電 400mV 〇 <參考例1-3 > 除了使用聚乙稀蔡(東菱rumiraS-10#38)作為使用於 黏著膠帶之基材之外’可以得到以與參相同樣之方 =製作之黏著膠帶。將該黏著膠帶施以18〇〇c加熱 1小時 程度之後，依據JIS Z0237測定黏著力為l.5N/19mm，熱 ^縮率為1.3%，在該黏著膠帶5〇〇nm之光透過率為9〇 〇 %。另外，放電量之最大值雖為5〇mV，但可以確認黏著 膠帶之浮起。 <參考例2-1 > +在由厚度2μιη之聚乙烯萘所形成之基材上，丙烯基系 黏著劑之溶液，將寬l〇mm之塗敷部與寬1〇mm之未塗敷 ，相互塗敷成條紋狀，加以乾燥，製作厚度形成5μιη之黏 著層之黏著膠帶。將該黏著膠帶以20mm寬切口成未塗敷 26 1332712 16450pifl.doc 爲第94109064號中文說明書無割線修正本 修正日期:99年8月9日 部分變成膠帶之中央得到黏著膠帶。變成圖3之a = 10mm、b=5mih之黏著膠帶。 將該黏著膠帶施以180°C加熱1小時程度之後，依據 HS Z0237測定黏著力為丨〇N/19mm，熱收縮率為0.15 %。加熱後之膠帶形狀係無法確認由膠帶之玻璃面之浮 起·剝離。 <參考例2-2 > 除了將丙烯基系黏著劑之熔液塗敷成條紋狀之外，可 以得到以與參考例2-1同樣之方法製作之黏著膠帶。 將該黏著膠帶施以180¾加熱1小時程度之後，依據 JIS Z0237測定黏著力為2 〇N/19mm，熱收縮率為〇15 %。加熱後之膠帶可以確認異物來自膠帶剝離後之玻璃表 面之黏著劑。 〈結論> 依據以上結果，可以提供一種抑制剝離時之放電，使 用於耐熱性、作雜、賴祕财之CCD封裝成 之表面保護黏著膠帶。 【圖式簡單說明】 圖二係繪示朝本發明之黏著膠帶之影像感側器之黏合 狀態之圖。 圖2係繪示例示本發明之黏著勝帶之形狀之說明圖。 帶之發明之黏著劑不塗敷部分之黏著膠 圖4係繪料有本發明之㈣财线科之黏著膠 27 1332712 16450pifl.doc 修正日期:99年8月9日 爲第94109064號中文說明書無劃線修正本 帶之其他構成之說明圖。 【主要元件符號說明】 1 :影像感測器 la :端面 lb :邊部 2 :受光部 3 :黏著膠帶 3a :突起部 3b :邊部 3c :側部 3d :前端 4 :基材 5 :黏著層 X :中心線 28In addition to the shape of the belt, the adhesive tape is made. The tape was bonded to the cCD in the same manner as in Example 1, and was put into 180. "The degree of surface glass, .,. C knows that the tin reflow furnace is packaged toward the substrate. After that, it is peeled off by the protrusion of the tape; = is separated by the protrusion. The tape is stripped after the 'two bands: != iiJT to the mark and attached foreign matter, and it can be confirmed as ccd <Comparative Example 1> Nylon of 5 5tH 2rm (6 nylon made by Dongling Co., Ltd.: thermal conductivity about mushroom. 5 10 Cal/Cm.see, c) 'In the same manner as in Example 1, except that the adhesive tape of the rubber-based adhesive having a coating J-ball ratio of 2._cm was used. As a result, the positional shift of the heat-shrinkable yarn-bonding portion was caused, '黏The surface of the adhesive that is thermally aged on the peeling surface contaminates the surface. In addition, the temperature of the soldering inside the CCD may be damaged, so the CCD does not work properly. <Comparative Example 2> Adhesive The adhesive tape can be obtained in the same manner as in the second embodiment except that the tape is not coated with the grade 4 ammonia hydrazine, and the same method as in the second embodiment of the present invention. After applying the adhesive tape to 1803⁄4 for 1 hour, according to JIS Z023 7 The adhesive strength was measured to be 2.5 N/19 mm, and the heat shrinkage rate was 0.1%. Further, although peeling of the tape could not be confirmed, it was confirmed that the discharge was 400 mV. <Comparative Example 3> On the back surface of the adhesive layer of the adhesive tape, except for coating In addition to the grade 4 ammonia hydrazine, an adhesive tape prepared in the same manner as in Example 2 was obtained. After the adhesive tape was heated at 180 ° C for 1 hour, the viscosity was measured to be 2.5 N / 19 mm according to JIS Z0237, heat. The shrinkage rate was 0.1%. In addition, although the peeling of the tape was not confirmed, it was confirmed that the discharge was 35 〇 mV. <Comparative Example 4> The side portion of the protrusion portion had a right-angled bottom shape (as shown by the dotted line in Fig. 2(A) An adhesive tape similar to that of Example 4 was produced except for the shape 3e) shown in Fig. 4. The tape was bonded to the surface glass of the CCD package, and was placed in a 180 °C solder reflow furnace in the same manner as in Example 1 to be packaged. Thereafter, when the tape is peeled off from the protruding portion of the tape, the crack tape is cut off from the corner of the bottom portion of the protrusion, and the tape cannot be easily peeled off by the protrusion. <Reference Example 1-1 > In thickness 25 μm Formed by polyethylene naphthalene On the substrate, a 4-pole ammonia salt (NR_121X manufactured by Korukoto Co., Ltd.) was applied to the greedy side of the substrate on which the tape was placed. Thereafter, a solution of the acryl-based adhesive was applied to the opposite side. , dried, and formed into an adhesive tape having a thickness of 10 μm of an adhesive layer. 25 1332712 16450pifl.doc No. 94109064 Chinese manual without a slash correction This revision period: August 9th, 1999, the adhesive tape is applied 180 . (: After heating for 1 hour, the adhesion was 2 〇N/19 mm according to JIS Z0237, the heat shrinkage was 〇15%, and the light transmittance at the adhesive tape of 500 nm was 86.0%. The maximum value is 5 〇 mV. <Reference Example 1-2> In the back surface of the adhesive layer of the adhesive tape, except that the 4-pole ammonia salt is not applied, an adhesive which is produced in the same manner as in Reference Example M can be obtained. The adhesive tape is applied to 18 (the temperature of rc is 丨hour, the adhesion is 2 〇N/19 mm according to JIS Z0237, the heat shrinkage is 〇15%, and the light transmittance at the adhesive tape is 5 〇〇nm. In addition, although the peeling of the tape could not be confirmed, it was confirmed that the discharge was 400 mV 〇 <Reference Example 1-3 > In addition to the use of Polyethylene Tsai (Dongling rumira S-10 #38) as the adhesive tape In addition to the substrate, an adhesive tape made in the same manner as the reference phase can be obtained. After the adhesive tape is heated at 18 ° C for 1 hour, the adhesion is measured according to JIS Z0237 to be 1.5 N / 19 mm, heat. The shrinkage rate is 1.3%, and the light transmittance of the adhesive tape at 5 〇〇 nm is 9. In addition, the maximum value of the discharge amount is 5 〇 mV, but the floating of the adhesive tape can be confirmed. <Reference Example 2-1 > + On a substrate formed of polyethylene naphthalene having a thickness of 2 μm A solution of a propylene-based adhesive, which is coated with a coating of 1 mm wide and 1 mm wide, is applied to a stripe shape, and dried to form an adhesive tape having a thickness of 5 μm. The adhesive tape is not coated with a 20mm wide slit. 26 1332712 16450pifl.doc is the 94112064 Chinese manual without secant correction. This correction date: August 9th, 1999, the part becomes the adhesive tape at the center of the tape. Adhesive tape of 10 mm and b=5 mih. After the adhesive tape was heated at 180 ° C for 1 hour, the adhesive force was measured as 丨〇N/19 mm according to HS Z0237, and the heat shrinkage rate was 0.15%. It was not possible to confirm the lifting and peeling of the glass surface of the tape. <Reference Example 2-2 > The same procedure as in Reference Example 2-1 was obtained except that the melt of the propylene-based adhesive was applied in a stripe shape. Adhesive tape made by the method. After heating at 1803⁄4 for 1 hour, the adhesion was 2 〇N/19 mm and the heat shrinkage was 〇15% according to JIS Z0237. The heated tape confirmed the adhesion of the foreign matter from the glass surface after the tape was peeled off. According to the above results, it is possible to provide a surface protection adhesive tape which is used for heat dissipation, miscellaneous, and CCD packaging. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a view showing the bonding state of the image sensor side of the adhesive tape of the present invention. Fig. 2 is an explanatory view showing the shape of the adhesive tape of the present invention. The adhesive of the invention is not coated with a part of the adhesive. Fig. 4 is a paint of the invention (4) The adhesive of the financial line 27 1332712 16450pifl.doc Date of revision: August 9, 1999 is the Chinese manual No. 94109064 An illustration of the other components of the tape is corrected by scribing. [Description of main component symbols] 1 : Image sensor la : End face lb : Edge 2 : Light receiving section 3 : Adhesive tape 3a : Projection 3b : Side 3c : Side 3d : Front end 4 : Substrate 5 : Adhesive layer X: centerline 28