JP2006332419A - Adhesive tape for protecting solid-state imaging device and image sensor mounting method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape and image sensor mounting method using the same in which an adhesive tape is fabricated not to damage adhesion even under high-temperature conditions, concretely, solder reflowing can be performed in the state of sticking the adhesive tape on a photo-detecting side of an image sensor in an image sensor mounting process using a solid-state imaging device, and the photo-detecting side of the image sensor can be still protected even during the solder reflowing. <P>SOLUTION: An adhesive tape includes an adhesive layer on at least one side of a substrate, and the adhesive layer is formed using an adhesive agent which uses an acrylic copolymer as a main agent and into which a nitrogen-contained monomer is introduced. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an adhesive tape for protecting a solid-state imaging device and a mounting process of a video sensor using the same.

  In recent years, image sensors using solid-state imaging devices have been widely used in digital cameras, video cameras, and the like. In the manufacturing process including mounting of the image sensor on the substrate side, scratches on the surface of the image sensor and adhesion of dust are highly likely to directly affect imaging. In view of this, a technique is adopted in which an adhesive tape is used as a surface protection tape and is attached to the light receiving portion side of the image sensor to avoid scratches and dust from being attached in the mounting and manufacturing process.

  On the other hand, when mounting an image sensor on a substrate or the like, a technique has been used so far in which a terminal portion is soldered and mounted using a soldering iron. In recent years, with the increase in image quality and functionality of video sensors, the number of terminals has also increased dramatically. Therefore, soldering and mounting each terminal using a soldering iron requires a considerable amount of time and is a reality. Not right. Therefore, a method of connecting and mounting at a time by using a solder reflow furnace in a state where the terminal portion of the video sensor and the mounting substrate are aligned has been frequently used.

  However, the solder reflow furnace needs to be heated to a high temperature at least equal to or higher than the melting point of the solder. If the heat reflow is performed with the adhesive tape for the above protection attached, the displacement of the adhesive tape base material due to thermal deformation and shrinkage, or degradation due to the thermal deterioration of the adhesive tape material may appear on the surface of the image sensor. Conversely, it can cause contamination. In addition, since the color filter used inside the solid-state imaging device may be denatured or damaged by heat, the reflow process itself at a high temperature of 170 ° C. or higher is particularly difficult.

  Therefore, conventionally, the protective tape was once peeled off immediately before being put into the solder reflow furnace, the solder reflow was performed at about 160 ° C., and the protective tape was reapplied after the completion. Thus, it has been difficult to go through a high heating process for solder reflow in a state where the adhesive tape is still bonded.

  In addition, the demand for protective adhesive tapes that can be used not only in the above-mentioned image sensor mounting process but also in high-temperature conditions in various applications is high, while in conventional adhesive tapes, the adhesive function under high-temperature conditions changes, There is a problem that the bonding with the adherend becomes weak and easily peels off, or conversely, the bonding with the adherend becomes too strong and it becomes difficult to peel off.

  Furthermore, the method of using an adhesive tape for surface protection has the advantage that the steps of attaching and peeling are simple, but the adhesive tape and the adherend are not moved due to the movement of charges generated when the adhesive tape is attached. Charges and accompanies discharge during peeling. In recent years, with the miniaturization and high integration of electronic devices, the precision of circuits has been improved, but the resistance to discharge of electronic devices has decreased, and the phenomenon that electronic devices can be destroyed due to discharge at the time of tape peeling has occurred. ing.

  Accordingly, an object of the present invention is to produce an adhesive tape that does not impair the adhesive function even under high temperature conditions. Specifically, in the mounting process of a video sensor using a solid-state imaging device, the adhesive tape is attached to the light receiving side of the video sensor. To provide an adhesive tape that enables solder reflow while the tape is still bonded, and that can protect the light receiving side of the image sensor during solder reflow, and a mounting method of the image sensor used therefor is there. It is another object of the present invention to provide a surface-protective pressure-sensitive adhesive tape that is excellent in heat resistance, workability, and peelability by suppressing discharge during peeling.

  As a result of intensive studies, the present inventors have found that the object can be achieved by the following adhesive tape and a mounting method of a video sensor used therefor, and have completed the present invention.

  The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to the present invention is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on at least one side of a base material, and is formed of a pressure-sensitive adhesive in which an acrylic copolymer is a main ingredient and a nitrogen-containing monomer is introduced. It has an adhesive layer.

  Usually, adhesives such as adhesive tapes for protecting video sensor light receiving parts are based on acrylic copolymer polymers and additives such as resins, tackifiers, plasticizers, pigments, fillers, conductive agents, antistatic agents, etc. It consists of a crosslinking agent such as a polyfunctional epoxy compound or an isocyanate compound. The inventor of the present invention can increase the adhesive force in a high-temperature atmosphere to an adherend, particularly a highly polar metal or plastic, by introducing a nitrogen-containing monomer into the acrylic copolymer. I found. In particular, it has been found that a higher adhesion can be obtained for a nitrogen-containing monomer having a strong polarity. Therefore, by using such a pressure-sensitive adhesive as a highly heat-resistant substrate, it has become possible to produce a pressure-sensitive adhesive tape that does not impair the pressure-sensitive adhesive function even under high temperature conditions.

（式中、Ｒ_１ は水素基、または、メチル基、Ｒ_２ は炭素数２〜２０のアルキル基）
Ｂ＝（窒素原子分子量×モノマー分子量中に含まれる窒素原子数）×１００／モノマー分子量 ・・（式２） This invention is the said adhesive tape for solid-state imaging device protection, Comprising: The acrylic polymer represented by General formula 1 contains the adhesive polymer which contains a nitrogen-containing monomer 1-30 weight part as a structural component of the said adhesive. It is an adhesive tape, The nitrogen atom content ratio B calculated | required by the following Formula 2 of the said nitrogen containing monomer is 3-20, It is characterized by the above-mentioned.
[Chemical 1]

(Wherein R ₁ is a hydrogen group or a methyl group, and R ₂ is an alkyl group having 2 to 20 carbon atoms)
B = (nitrogen atom molecular weight × number of nitrogen atoms contained in monomer molecular weight) × 100 / monomer molecular weight (Formula 2)

  As described above, it has been found that the pressure-sensitive adhesive in which a nitrogen-containing monomer is introduced into the acrylic copolymer as the main component has a higher adhesive force in a high-temperature atmosphere, and the higher the polarity, the higher the adhesive force. For example, acrylic acid and methacrylic acid, which are typical polar monomers, can ensure high adhesive strength even in a high temperature atmosphere. However, when the polarity is too strong in the examination process of the present invention, it has been found that the pressure-sensitive adhesive tape after the heat treatment becomes too high and an adhesive tape that is difficult to peel off from the adherend may be obtained.

  In the present invention, as a result of further investigation, by using a pressure-sensitive adhesive polymer containing a predetermined amount of a monomer having a double bond copolymerizable with the acrylic monomer and having a nitrogen atom content ratio B in a predetermined range, It is possible to produce a pressure-sensitive adhesive tape that exhibits a predetermined adhesive force even under the surface, does not cause tape lifting, and can be easily peeled off from the adherend even after heat treatment.

  Here, the pressure-sensitive adhesive was an acrylic monomer represented by the above formula 1 and contained a monomer having a copolymerizable double bond, which was obtained by a nuclear magnetic resonance measurement method (NMR) described later. It can be specified by spectrum data or the like.

  Further, the “nitrogen atom content ratio B” refers to the content of nitrogen atoms in the monomer, and is defined to be distinguished from the nitrogen content in the polymer or the entire adhesive. A value obtained by a gel permeation chromatograph method (GPC) described later is used as a reference.

  The present invention is the above-mentioned pressure-sensitive adhesive tape for protecting a solid-state imaging device, wherein the pressure-sensitive adhesive polymer that is a constituent component of the pressure-sensitive adhesive is crosslinked with a crosslinking agent having a polyfunctional epoxy compound or an isocyanate compound. To do.

  In the properties of the pressure-sensitive adhesive, the cross-linking agent is greatly involved in addition to the selection and blending of the monomers. The present inventor has found that a cross-linking agent having a polyfunctional epoxy compound or an isocyanate compound is particularly preferable for maintaining the adhesive strength of the acrylic pressure-sensitive adhesive polymer under high temperature conditions. It was possible to produce an adhesive tape having the above adhesive strength and capable of easily peeling the tape from the adherend even after heat treatment.

  The present invention is the above-mentioned pressure-sensitive adhesive tape for protecting a solid-state imaging device, having an adhesive strength of 0.1 N / 19 mm or more in a heating atmosphere at 160 ° C., and after performing a heat treatment at 160 ° C. for 3 minutes. The adhesive strength is 7.0 N / 19 mm or less.

  That is, in order to prevent the peeling and lifting of the adhesive tape, an adhesive force of a predetermined level or higher is required. On the other hand, to prevent the adhesive from remaining after the tape is peeled from the adherend, the adhesive force is set to a predetermined level or lower. There is a need. In particular, in the case of including a mounting process in a high temperature region, it has been found that the adhesive strength of the adhesive tape under heating conditions is preferably within the above range. The working efficiency is improved without deteriorating the function of the tape and without leaving the adhesive on the surface of the adherend when the tape is peeled after mounting the components.

  The present invention is the above-mentioned pressure-sensitive adhesive tape for protecting a solid-state imaging device, characterized in that the pressure-sensitive adhesive layer has the pressure-sensitive adhesive layer on one side and an antistatic agent is applied on the other side.

  As described above, it is very important to prevent the generation of static electricity when the adhesive tape is peeled off. In the present invention, by applying an antistatic agent to the adhesive tape, in addition to the function of improving productivity, generation of static electricity at the time of tape peeling due to charging can be suppressed, and destruction of the electronic device can be prevented. In particular, by applying to the back surface of the base material, adhesion and contamination of the antistatic agent to the adherend can be reduced, and the yield can be improved.

  The present invention is the above-mentioned pressure-sensitive adhesive tape for protecting a solid-state imaging device, wherein the antistatic agent is mainly composed of a quaternary ammonium salt.

  As described above, it is very important to prevent the generation of static electricity in the image sensor mounting process and the like, and in particular, an antistatic effect after passing through a high temperature process is required. In addition to the general antistatic effect, the present inventor has developed an antistatic agent mainly composed of a quaternary ammonium salt from various conditions such as heat resistance and workability particularly required in the mounting process. It has been found that the antistatic agent is very suitable for the purpose. As a result, the generation of static electricity when the tape is peeled can be suppressed, and the electronic device can be prevented from being destroyed. The “quaternary ammonium salt” is formally referred to as “quaternary ammonium compound salt”, but in the present application, the description is unified as “quaternary ammonium salt”.

  The present invention is the above-described pressure-sensitive adhesive tape for protecting a solid-state imaging device, characterized in that a peeling protrusion is provided on at least a part of the outer periphery of the pressure-sensitive adhesive tape.

  Adhesion and peeling of the adhesive tape is an important operation or work in the mounting process of the image sensor and the like, and it is required to reliably and later not generate any deposits. In the present invention, by having a peeling protrusion on at least a part of the outer periphery, the tape can be peeled off very easily after the production process such as inspection after component mounting or just before use. At this time, it is preferable that the adhesive tape does not interfere with the mounting or soldering of adjacent components in the mounted state of the video sensor.

  In the solid-state imaging device protecting adhesive tape, the present invention has a side portion that is parallel to the end face of the video sensor and that is connected to the terminal bottom of the protruding portion, and a side portion that is connected to the terminal bottom from the tip of the protruding portion, It has a shape of any one of a diagonal line shape, a polygonal line shape, a curved line shape, or a combination thereof.

  As described above, it is preferable that the adhesive tape can be easily peeled off after the production process such as inspection or just before use. However, fixing the adhesive tape requires a predetermined adhesive strength, but if the adhesive strength is too strong, the adhesive may remain when the adhesive tape is peeled off. Limited to range. In particular, in the peeling of the adhesive tape provided with the protruding portion, the protruding portion is sandwiched and pulled up, and the adhesive tape is liable to crack at that time, and in the present invention, the leading end of the protruding portion is connected to the bottom. It has been found that the tape can be smoothly peeled off from the image sensor by having the side portion having any one of a diagonal line shape, a broken line shape, a curved line shape, or a combination thereof.

  Also, since the distance between the end face of the image sensor and the outer periphery of the light receiving unit is usually a very short distance, the mounting position of the adhesive tape is important in mounting the image sensor and is automatically applied. Even in such a case, it is necessary to confirm the pasting position. Accordingly, the adhesive tape having the side connected to the bottom end of the protrusion, which is parallel to the side forming the end face of the image sensor, can clarify the tape application position, so that it is accurate and efficient. The mounting of the video sensor can be ensured.

  The present invention is characterized in that, in the adhesive tape for protecting a solid-state imaging device, an adhesive layer is not provided on a portion of the image sensor that covers the light receiving portion.

  In the present invention, regarding the adhesive tape for protecting the image sensor, it is intended to perform an integrated process in a state where the adhesive tape is bonded by devising the base material and the adhesive layer, and further corresponds to the light receiving portion of the adhesive tape. By not providing the adhesive layer in the portion to be mounted, it has been devised that the working efficiency is improved without the adhesive remaining on the surface of the image sensor when the tape is peeled after the component mounting. In other words, in the mounting process of the image sensor, at least a heat-resistant film is used as the base material constituting the light receiving part side of the image sensor, and an adhesive tape having a structure in which an adhesive layer is not provided on the light receiving part is attached. By passing through a heating process at 170 ° C. or higher, it is possible to provide a mounting method for a video sensor with high workability, safety, and productivity.

  The present invention is a method for mounting a video sensor, wherein any one of the above-described adhesive tapes for protecting a solid-state imaging device is used for protecting a light receiving portion of the video sensor. That is, the present invention is a video sensor mounting method, and in the video sensor mounting process using a solid-state imaging device, the solid-state imaging device protecting adhesive tape is attached to the light-receiving portion of the video sensor. It is characterized by being attached to the light receiving part of the sensor.

  According to the above method, the conventional function is to protect the glass surface from contamination and scratches due to foreign matters during component transportation, and due to the heat resistance of the base material and the adhesive, The need for tape stripping can be eliminated. In addition, when a base material with a small shrinkage rate is selected, it is possible to prevent peeling due to thermal shrinkage of the adhesive tape, and it is possible to design a tape with a lower adhesive force than conventional tapes. During peeling, the pressure-sensitive adhesive is not left on the surface of the adherend, and the working efficiency is improved.

  Furthermore, when a base material having a high transmittance is selected, the inspection can be performed without peeling the tape even when performing an internal inspection after component mounting. Therefore, in the inspection process after mounting the components of the solid-state imaging device, the obstacle to the inspection process due to the attenuation of the transmittance due to the adhesive tape is reduced, and the inspection with the adhesive tape attached can be performed. As a result, a process such as re-sticking of the adhesive tape after the inspection becomes unnecessary. Moreover, also in processes such as post-inspection transport, safety is ensured by enabling shipment with the adhesive tape attached. Furthermore, productivity can be improved by enabling an integrated process with the adhesive tape attached.

  The present invention is a method of mounting an image sensor, which covers the entire light receiving unit and is attached to the image sensor so that at least a part of the outer periphery thereof has a predetermined distance from the end surface of the image sensor to the center side. It is characterized by matching.

  To protect a video sensor or the like having a light receiving portion, it is necessary to have a tape shape that covers the entire light receiving portion. On the other hand, if the outer periphery of the tape protrudes greatly from the end face of the video sensor, This may hinder mounting or soldering of adjacent parts. That is, the adhesive tape needs to cover the entire light receiving portion and is preferably as small as possible. Therefore, the outer peripheral portion of the adhesive tape other than the protrusions may be bonded to the light receiving portion so that at least a part thereof, preferably a large portion thereof, has a predetermined distance from the end face of the image sensor to the center side. preferable.

  As described above, according to the present invention, it is possible to produce an adhesive tape that does not impair the adhesive function even under high temperature conditions. Specifically, in the mounting process or inspection process of components of solid-state imaging devices, etc., the integrated process can be performed with the adhesive tape attached, thereby protecting the surface of the image sensor that is the adherend. However, it is possible to provide a video sensor mounting method with high workability, safety, and productivity. In addition to the function of improving productivity, the application of an antistatic agent can suppress the generation of static electricity when the tape is peeled off due to charging, thereby preventing the electronic device from being destroyed. In addition, it is possible to provide a protective adhesive tape that can be used when mounting such a video sensor, has high heat shrinkability, has an appropriate adhesive force, and has excellent visibility over the entire tape. Become.

Embodiments of the present invention will be described below.
The pressure-sensitive adhesive tape of the present invention is basically formed from a tape base material and a pressure-sensitive adhesive layer provided on at least one side of the base material.

  Moreover, the release film 3 may be bonded together with respect to the base material 1 of an adhesive tape so that it may illustrate in FIG. That is, the adhesive film affixed to the surface of the adherend (video sensor) by affixing the release film 3 having a release treatment on at least one surface to the base material 1 of the adhesive tape via the adhesive layer 2. The layer 2 can be protected, and as a result, the adherend can be protected.

  Here, the base material of the adhesive tape is not particularly limited as long as it is a film having heat resistance under a temperature condition of 160 ° C. For example, polyethylene terephthalate (PET) film, polyethylene naphthalate film (PEN), polyethersulfone (PES) film, polyetherimide (PEI) film, polysulfone (PSF) film, polyphenylene sulfide (PPS) film, polyetherether It is preferably made of a ketone (PEEK) film, a polyarylate (PAR) film, an aramid film, a polyimide film, or a liquid crystal polymer (LCP) film.

  In particular, by forming an adhesive tape for surface protection that has excellent heat resistance, heat shrinkability, and adhesiveness, it is possible to work without peeling the tape in the component mounting process under heating conditions. Considering the point, it is preferable to use a polyimide film as a constituent material of the substrate. In view of the shrinkage rate of the base material and the bonding to the image sensor, the base material is preferably made of a base material mainly composed of polyethylene naphthalate having both the heat resistance and the visibility at the time of bonding.

  The thickness of the adhesive tape is preferably at least 5 [mu] m or more in order to prevent breakage or tearing, and more preferably 10 to 100 [mu] m in view of suitable handling properties.

  The pressure-sensitive adhesive layer of the tape according to the present invention is determined by the above-described calculation formula [Formula 2] in a monomer having a double bond copolymerizable with the acrylic monomer represented by the above general formula [Formula 1]. A pressure-sensitive adhesive polymer for protecting a video sensor light-receiving part, which contains 1 to 30 parts by weight, preferably 2 to 20 parts by weight of a monomer having a nitrogen atom content ratio B of 3 to 20, can be used.

  By introducing a nitrogen-containing monomer into the acrylic copolymer, it is possible to increase the adhesive strength of the adherend in a high-temperature atmosphere, and to adjust the content of strongly polar nitrogen to an appropriate range. Is preferred. Specifically, when the nitrogen atom content ratio B with respect to the monomer is less than 3 or less than 1 part by weight with respect to the whole polymer, the tack is weak as an adhesive, which is particularly high during the process. In an atmosphere, it becomes easy to peel off, and the protective function of the adherend of the adhesive tape cannot be secured. Further, when the nitrogen atom content ratio B with respect to the monomer exceeds 20, or when the nitrogen atom content ratio exceeds 30 parts by weight with respect to the entire polymer, both of them are in a state where excessively strong nitrogen is present in the adhesive. Therefore, tack becomes strong as an adhesive, and the adhesive strength is remarkably increased in a high-temperature atmosphere, making peeling difficult.

  Here, it can be specified by spectral data obtained by NMR that the pressure-sensitive adhesive is an acrylic monomer represented by the above formula 1 and contains a monomer having a copolymerizable double bond. .

<Measurement conditions of nitrogen atom content ratio B>
(1) Measuring device: NMR measuring device (manufactured by JEOL Ltd., JEOL EX-400)
(2) Indicator: ¹³ C
(3) Measurement procedure: After the adhesive of the sample was swollen with chloroform and the adhesive was collected, chloroform was removed by heating to obtain an adhesive. NMR measurement of the obtained adhesive was performed.
The “nitrogen atom content ratio B” is based on the value obtained by the following gel permeation chromatography (hereinafter referred to as “GPC”).

<Measurement conditions of nitrogen atom content ratio B>
(1) Measuring device: GPC measuring device (manufactured by TOSOH, HLC-8120GPC)
(2) Packing agent: TSKgel (Column: TSKgel GMH-H (S) × 2)
(3) Solvent: Tetrahydrofuran (THF)
(4) Measurement procedure: The sample is air-dried, adjusted to a 1.0 (g / L) THF solution, and allowed to stand overnight. This solution was filtered through a 0.45 μm membrane filter, and GPC measurement was performed on the filtrate.

  Specific monomers constituting the acrylic polymer include methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isinonyl group, isodecyl group, dodecyl group, lauryl group, tridecyl group, bentadecyl group, hexadecyl group. Group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl group, and usually acrylic acid alkyl ester such as acrylic acid or methacrylic acid having an alkyl group having 20 or less carbon atoms, acrylic acid, methacrylic acid, icotanic acid , Hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, N-methylolacrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate Le, vinyl acetate, and styrene, isoprene, butadiene, isobutylene, and vinyl ethers.

  Moreover, the monomer whose nitrogen atom content ratio B calculated | required by the said Formula 1 is 3-20 is suitable, and acrylyl morpholine, N-vinyl- 2-pyrrolidone, cyclohexyl maleimide, phenyl maleimide as the specific monomer N, N-dimethylacrylamide, N, N-diethylacrylamide, N-isopropylacrylamide, N-acryloylpyrrolidone, N-acryloylpiberidine, N-acryloylpyrrolidine and the like.

  Further, these acrylic pressure-sensitive adhesive polymers can contain an appropriate crosslinking agent. For example, an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine-based compound, a chelate-based crosslinking agent and the like are examples.

  Furthermore, as necessary, various additives such as a filler, an anti-aging agent, a pigment, a dye, and a silane coupling agent can be added as necessary.

  The thickness of the adhesive layer of the adhesive tape is 1 μm or more and 100 μm or less, preferably 3 μm or more and 50 μm or less, more preferably 5 μm or more and 30 μm or less. In order to secure the adhesive layer, it is effective if even a slight level difference is generated on the surface of the base material. However, if it is less than 1 μm, it may be damaged by contact with the light receiving part due to the bending of the surface protection tape. Also decreases. Further, the adhesive tape may be peeled off due to heat shrinkage of the film being heated. If it exceeds 100 μm, deformation of the adhesive during slitting and punching of the tape, or pressure applied to the tape at the time of attaching the tape, pressure on the tape during transportation, and deformation of the adhesive due to heating during mounting Due to this, there is a possibility that an adhesive is applied to the light receiving portion.

  In other words, in order to protect the image sensor, it is required to have a predetermined mounting strength as an adhesive tape, and it is necessary to maintain a state of bonding in harmony with the image sensor, and workability is also in demand. Therefore, the pressure-sensitive adhesive tape of the present invention has been found that the above range is the optimum range as a result of actual measurement. Therefore, it is possible to provide a video sensor mounting method with high workability, safety, and productivity by using an adhesive tape having such an adhesive layer thickness.

  When using a release film for the pressure-sensitive adhesive tape of the present invention, any known release film may be used. For example, the release film may be separated from the bonding surface of the release film with the pressure-sensitive adhesive layer. A mold coat layer, for example, a layer on which a silicone layer is formed can be used. Examples of the substrate for the release film include paper materials such as glassine paper and resin films made of polyethylene, polypropylene, polyester, and the like.

  In addition to the function of improving productivity, the application of an antistatic agent can suppress the generation of static electricity when the tape is peeled off due to charging, thereby preventing the electronic device from being destroyed.

  The antistatic agent used in the present invention is not particularly limited as long as it has an effect of suppressing the generation of static electricity when the tape is peeled off. For example, a method using a quaternary ammonium salt as a main component, a method of applying an inorganic salt or a metal compound (for example, stannic oxide) to a substrate using a dispersion medium such as water or an arbitrary organic solvent, etc. Can be mentioned. In particular, an antistatic agent mainly composed of a quaternary ammonium salt is preferable for use in the present invention because of its ease of handling such as solubility in a solvent and solvent coating property.

  In view of the application of the present invention, in view of transfer / contamination of the additive component to the solid-state imaging device as the adherend, it is preferable to perform the treatment on the back side of the substrate. Moreover, when it provides in the surface of an adhesion layer, there exists a possibility of affecting the mutual characteristic of an adhesion layer and an antistatic agent, and it is unpreferable.

  Moreover, this adhesive tape may be processed according to the use, for example, the size of the target solid-state imaging device. The processing method is not particularly limited as long as it is a method that maintains a uniform shape and does not leave a pressure-sensitive adhesive in the processed cross section, but punching is preferable in view of productivity.

<Mounting method of image sensor using adhesive tape>
In the mounting process of the video sensor using the solid-state imaging device, the terminal portion of the video sensor is soldered and reflowed to the substrate side in a state where the adhesive tape is bonded to the light receiving portion side of the video sensor. The image sensor using the solid-state imaging device here is an image sensor obtained by packaging a solid-state imaging device generally called CCD (Charge Coupled Device) or CMOS (Complementary MOS) using a transparent resin or a glass material. is there.

  The light receiving part side of the image sensor means the surface side of the sensor that receives the image, and a general image sensor may be covered with a transparent resin or a glass cover to protect the imaging device. For the most part, the adhesive tape is substantially bonded to the surface of the transparent resin or the cover glass. Moreover, as for the surface, at least a portion corresponding to the light receiving portion may be protected, but other portions may be covered for protection.

  At this time, it is preferable to have a protrusion for peeling on at least a part of the outer periphery of the adhesive tape. Specifically, as illustrated in FIG. 2, in a state where the adhesive tape 6 is bonded to the light receiving portion 5 of the adherend (video sensor) 4, the protrusion 6 a is formed on a part of the adhesive tape 6. The end face 4a is protruded. In such a form, the video sensor 4 is attached to the substrate, and after passing through high-temperature solder reflow and mounting processing, the operation of the video sensor 4 or the function of the mounting substrate is inspected. The adhesive tape 6 can be peeled off very easily automatically or manually after the production process is completed or immediately before use.

  It is preferable that a part of the outer peripheral portion of the adhesive tape 6 is attached between the end face 4 a of the video sensor 4 and the light receiving portion 5. That is, the width of the adhesive tape 6 is preferably larger than the width of the light receiving unit 5 and smaller than the width of the video sensor 4. Furthermore, as shown in FIG. 2, in all the outer peripheral portions of the adhesive tape 6 except the side portion 4 b of the video sensor 4 covered by the protrusion 6 a, it may be intermediate between the end face 4 a of the video sensor 4 and the light receiving portion 5. preferable. The light receiving unit 5 can be covered entirely with the adhesive tape 6, and the cover of the adhesive tape on the peripheral members can be prevented when the image sensor 4 is mounted. However, in the mounted state of the image sensor 4 such as the substrate, if there is a space around the substrate where there is no other mounting portion and does not require soldering, a part of the outer peripheral portion is the end surface of the image sensor 4 and the light receiving portion. It is sufficient if it is in the middle of 5, and is not necessarily required for the entire circumference.

  Moreover, the shape of the adhesive tape 6 is illustrated in FIG. As shown in FIG. 3A, there are a case where a protrusion 6a is provided on one side of a substantially square, a substantially rectangular shape as shown in FIG. 3B, or a shape that matches the shape of the video sensor 4.

  The shape of the protrusion 6a is not particularly limited, but a shape that can be clamped regardless of whether it is automatic or manual is preferable. Further, a shape that can be easily processed is preferable. For example, squares such as those shown in FIGS. 3A and 3B can be cited, but a semicircular shape or a trapezoidal shape as illustrated in FIG. 3C, or as illustrated in FIG. A shape such as a combination of a square and a trapezoid is also possible.

  At this time, the vicinity of the protruding portion 6a is connected to the bottom of the protruding portion 6a so as to be parallel to the end surface 4a of the image sensor 4 as shown in FIG. 2, more precisely, the side portion 4b constituting the end surface 4a. It is preferable to have the side part 6b. A clear pasting position can be secured, and confirmation of adhesion becomes easy. In addition, when the image sensor 4 is not a square as illustrated in FIG. 2 but a square shape without an angular portion, an oval shape, or an elliptical shape, the image sensor 4 has a similar shape parallel to the side portion constituting the end face. It is preferable to have a side part.

  Furthermore, in the protrusion 6a, it is preferable that the side part 6c connected from the front end 6d to the terminal bottom has one of a diagonal line shape, a polygonal line shape, a curved line shape, or a combination thereof. When the pressure-sensitive adhesive tape 6 is peeled off, the strongest force acts on the center line of the protrusion 6a. Therefore, in the shape 3e as shown by the broken line in FIG. There is a risk of causing the adhesive to remain on the surface. Therefore, it is preferable that the side portion 6c has a shape capable of achieving the dispersion of force at the time of peeling. The specific shape is not particularly limited as long as it has a force distribution function, but examples thereof include the shape of the side portion 6c as shown in FIGS. That is, the shape of the side portion 6c is a slanted line shape (FIG. 3C), a broken line shape (FIG. 3D), a curved line shape (FIGS. 3A and 3B), or a combination thereof (not shown). ), The side portion 6c can be smoothly peeled off when the adhesive tape 6 is peeled off. Accordingly, the entire protrusion 6a can be peeled off with a substantially equal force, and the main part of the tape covering the light receiving portion 5 is peeled off with a substantially uniform force in the in-plane vertical direction of the peeling direction X. Can do. The inclination angle of the oblique line or the broken line, the curvature of the curve, and the like can be arbitrarily set depending on the shape of the video sensor 4, the entire adhesive tape 6, the shape of the protrusion 6a, and the like.

  Moreover, it is preferable that an adhesive tape does not provide an adhesive layer in the part applied to the light-receiving part of a video sensor. This is because the pressure-sensitive adhesive does not remain on the surface of the adherend when the tape is peeled after component mounting, and the work efficiency is increased.

  Specifically, as illustrated in FIG. 4, when the adhesive layer 2 is formed on the base material 1, an uncoated portion with a width a is formed at a portion of the adhesive tape that covers the light receiving portion of the video sensor. In addition, a method of forming a pressure-sensitive adhesive tape 2 by forming a pressure-sensitive adhesive layer 2 having a width b at both ends can be given. However, the shape of the pressure-sensitive adhesive layer 2 is not particularly limited as long as an uncoated portion can be formed in a portion that is applied to the light receiving portion of the image sensor. For example, as shown in FIG. A method of providing a hollow shape of an arbitrary shape such as a circular shape, (B) square shape, (C) a method of forming the adhesive layer 2 at the four corners of the substrate 1, and (D) an inclined uncoated portion having a predetermined width. It is possible to apply various methods, such as a method for forming the film. The shaded part in FIG. 4 shows the adhesive application part.

  By the above method, the adhesive layer 2 is formed so as not to be biased with respect to the surface of the image sensor and to secure a deposition area. Can be prevented.

  The pressure-sensitive adhesive tape of the present invention has an adhesive strength in a 160 ° C. atmosphere of 0.1 N / 19 mm or more, preferably 0.2 N / 19 mm or more when measured according to JIS Z0237, and at 160 ° C. It is desired that the adhesive strength after carrying out the heat treatment for 3 minutes is 7.0 N / 9 mm or less, preferably 5.0 N / 19 mm or less.

  When the adhesive strength in an atmosphere at 160 ° C. is less than 0.1 N / 19 mm, there is a possibility that the tape end face will float during solder reflow. Also, when the adhesive strength after heat treatment at 160 ° C. for 3 minutes exceeds 7.0 N / 19 mm, it is difficult to remove the tape from the adherend in the process, and the adhesive layer remains on the adherend surface. There is a possibility to make it.

  The heat shrinkage rate of the base material of the pressure-sensitive adhesive tape in the present invention is preferably 1.0% or less, more preferably 0.5% or less when heated at 150 ° C. for 30 minutes. This is to prevent peeling due to heat shrinkage. The value measured according to JIS C2318 is a standard for the heat shrinkage here.

  Furthermore, in the present invention, the heat shrinkage rate of the adhesive tape after heating at 180 ° C. for 1 hour is 1.0% or less, more preferably 0.5% or less, and further preferably 0.3% or less. It is hoped that. This is to further improve the working efficiency by clarifying additional conditions regarding the shrinkage ratio of the base material under high temperature conditions. The heat shrinkage referred to here is based on the value after bonding to a BA plate in the form of an adhesive tape and leaving it at 180 ° C. for 1 hour. A specific method for measuring the heat shrinkage rate is to cut an adhesive tape into 20 mm square, affix to a BA plate, heat under a temperature condition of 180 ° C., and measure the size of the tape before and after the heating by a projector (manufactured by Mitutoyo: Both MD direction and TD direction were measured using PROFILE PROJECTOR PJ-H3000F). The BA plate refers to a SUS304 plate (BA5 finish SUS304 manufactured by Nippon Metal Co., Ltd.) surface-finished to BA5 in accordance with JIS “BA finish”.

  Moreover, in this invention, it is preferable that the adhesive force of the adhesive tape after implementing a heating at 180 degreeC for 1 hour is 0.1-8.0N / 19mm width, Moreover, 0.2N-5.0N / A width of 19 mm is more preferable, and a width of 0.3 N to 4.0 N / 19 mm is even more preferable. When the adhesive strength exceeds 8.0 N / 19 mm, it is difficult to remove the tape from the adherend in the process, and the adhesive layer may remain on the adherend surface. This is because the adhesive tape may peel off due to heat shrinkage. The adhesive force here is based on a value measured according to JIS Z0237.

  In addition, in the adhesive tape which uses as a main component the polyethylene naphthalate etc. which have visibility, it is preferable that a light transmittance is 50% or more, More preferably, it is desired that it is 70% or more. This is because, even when optically inspecting the interior after component mounting, the optical tape can be inspected without peeling of the adhesive tape by securing the light transmittance of the adhesive tape to a predetermined value or more. Here, the light transmittance means light transmittance in the visible light region, and means a light transmittance in the wavelength range of 400 to 700 nm. In the present invention, any transmittance in this wavelength region is preferably 50% or more. This is because, when the transmittance is less than 50%, it is difficult to confirm the connection process or the like of the solid-state imaging device via the adhesive tape. The light transmittance here is based on the value measured by the following measurement method.

<Measurement method of light transmittance>
(1) Measuring apparatus: spectrophotometer (manufactured by Shimadzu Corporation, MPS-2000)
(2) Measurement range: Wavelength range of 400 nm to 700 nm (3) Sample size: Cut to an appropriate size for the measuring device (4) Measurement of the adhesive tape was performed from the adhesive side. In addition, about the measurement of a base material, it measured from the side in which an adhesive was apply | coated or exists.

In order to have a sufficient effect of suppressing heat conduction to the color filter, it is desirable that the substrate has a heat conductivity of, for example, 170 ° C. of 5 × 10 ⁻⁴ cal / cm · sec · ° C. or less. For example, when using adhesive tape with a base material with high heat resistance and low thermal conductivity, such as polyimide film, in addition to physical protection of the image sensor itself, protect the color filter against high temperatures during mounting. Is possible.

  Examples and the like specifically showing the configuration and effects of the present invention will be described below. In addition, it cannot be overemphasized that this invention is not limited to this Example and evaluation method.

[Examples based on Evaluation Method 1]
<Evaluation method 1>
About Example 1 and 2, and Comparative Examples 1-3, the following item was evaluated about the tape produced according to each conditions.
(1) Adhesive strength after heating and tape floating condition After the samples of the above-mentioned examples and comparative examples were bonded to the glass surface, the adhesive strength under a temperature condition of 160 ° C. was measured according to JIS Z0237. The condition of the tape was observed.
Further, the adhesive strength after the heat treatment at 160 ° C. for 3 minutes and the handling property of the tape peeling from the adherend were evaluated.

<Example 1>
Uniformly blend 100 parts of copolymer polymer consisting of ethyl acrylate-ethyl acrylate 2-ethylhexyl-hydroxyethyl acrylate-N-vinyl pyrrolidone (70 parts-30 parts-5 parts-10 parts), 3 parts isocyanate crosslinker and toluene. The mixed and dissolved coating solution was applied and dried on a support substrate (PET # 25) to obtain an adhesive tape. The nitrogen atom content ratio B at this time was 14.1.

<Example 2>
100 parts of a copolymer polymer consisting of ethyl acrylate-ethyl acrylate 2-ethylhexyl-hydroxyethyl acrylate-phenylmaleimide (70 parts-30 parts-5 parts-10 parts), 3 parts of an isocyanate cross-linking agent and toluene are mixed uniformly. The dissolved coating solution was applied and dried on a support substrate (PET # 25) to obtain an adhesive tape. The nitrogen atom content ratio B at this time was 8.1.

<Comparative Example 1>
Supports a coating solution in which 2 parts of an isocyanate crosslinking agent, 4 parts of an epoxy crosslinking agent and methyl ethyl ketone are uniformly mixed and dissolved in 100 parts of a copolymer of butyl acrylate-acrylic acid (100 parts-5 parts) An adhesive tape was obtained by applying and drying on a substrate (PET # 25).

<Comparative Example 2>
Copolymer polymer consisting of ethyl acrylate-ethyl acrylate 2-ethylhexyl-hydroxyethyl acrylate-acrylic acid (70 parts-30 parts-5 parts-3 parts), isocyanate-based crosslinking agent 1.5 parts, rosin phenolic adhesive A coating solution in which 3 parts of the imparting agent and toluene were uniformly mixed and dissolved was applied and dried on a support substrate (PET # 38) to obtain an adhesive tape.

<Comparative Example 3>
A coating solution prepared by uniformly mixing and dissolving 2 parts of an isocyanate-based crosslinking agent and toluene in 100 parts of a copolymer polymer consisting of butyl acrylate-acrylonitrile-hydroxyethyl acrylate (100 parts-5 parts-5 parts) An adhesive tape was obtained by applying and drying on a material (PET # 25). The nitrogen atom content ratio B at this time was 26.4.

<Result>
The evaluation results are summarized in Table 1 for the pressure-sensitive adhesive tape produced by the above method.

The pressure-sensitive adhesive tapes according to Examples 1 and 2 were excellent in pressure-sensitive adhesive force at 160 ° C., and the tape did not float, so that the light receiving part could be protected even during solder reflow. Moreover, it had the characteristic that a tape can be easily peeled from an adherend after heat treatment.
On the other hand, in the pressure-sensitive adhesive tapes according to Comparative Examples 1 and 2, the tape end face was lifted in an atmosphere at 160 ° C., and in Comparative Examples 2 and 3, the pressure-sensitive adhesive strength after heat treatment was high. Re-peeling was difficult. Furthermore, in Comparative Example 3, there was a problem that the adhesive remained due to cohesive failure during peeling.

[Examples based on Evaluation Method 2]
<Evaluation method 2>
About Examples 3-9 and Comparative Examples 4-8, the following item was evaluated about the tape produced according to each condition.
(1) Shape of tape after heating The shape of the tape after the samples of the above-mentioned examples and comparative examples were bonded to the glass surface and left for 1 hour at a temperature of 180 ° C.
(2) Discharge amount After the adhesive surface of the tape was bonded to the glass surface, the discharge amount was measured when the adhesive tape was peeled off after standing for 30 minutes. The discharge amount was measured as follows.
(2-1) A coaxial cable is connected to the top of the tip peel surface of the high-speed peel tester and installed so as to move at the same speed with respect to the peel surface.
(2-2) Further, the value of electromagnetic waves generated at the time of peeling was measured by connecting a coaxial cable to an oscilloscope.
(2-3) Each pressure-sensitive adhesive sheet is cut into a width of 20 mm, pasted on a glass surface, and set in the apparatus.
(2-4) Then, the value of the electromagnetic wave observed when measured at a peeling angle of 180 ° and a peeling speed of 5 mm / min is defined as a discharge value.
(2-5) The maximum value of the measured electromagnetic wave peak is defined as the discharge value. In addition, the determination of whether the discharge is good or bad is based on a discharge amount of 100 mV, with 100 mV or less being good and a case where it exceeds 100 mV being regarded as bad.
(3) Peelability Ease of peeling after the samples of the following examples and comparative examples were bonded to the glass surface and left for 1 hour at 180 ° C.
(4) Visibility assuming internal optical inspection after package formation A box with a height of 5 mm is formed with an acrylic plate, and a semiconductor element that has undergone a wiring process is placed therein. And the adhesive tape was stuck on the acrylic board upper part, and the presence or absence of the connection of the semiconductor element in an acrylic board was confirmed through the tape. The effect was confirmed by visual observation of five people. The evaluation criteria were classified in the following three stages.
○: A device that can clearly confirm the presence or absence of the wiring process.
Δ: The wire connection process can be barely confirmed.
X: The connection process cannot be confirmed.

<Example 3>
On the base material made of polyethylene naphthalate having a thickness of 25 μm (thermal shrinkage ratio of base material 0.4%: 150 ° C.-30 minutes), an acrylic pressure-sensitive adhesive solution was applied and dried, and the thickness was 10 μm. An adhesive tape having an adhesive layer was prepared.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, the thermal shrinkage was 0.15%, and the adhesive tape was 400 to 700 nm. The light transmittance of each was 50% or more (average 88.0%).

<Example 4>
A quaternary ammonium salt (NR-121X manufactured by Colcoat Co., Ltd.) is applied to the back side of the adhesive tape substrate on a substrate made of polyethylene naphthalate having a thickness of 25 μm. Thereafter, an acrylic adhesive solution was applied to the opposite surface and dried to prepare an adhesive tape having an adhesive layer having a thickness of 10 μm.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, the thermal shrinkage was 0.15%, and the adhesive tape was irradiated at 500 nm. The transmittance was 86.0%.

<Example 5>
A quaternary ammonium salt (NR-121X manufactured by Colcoat Co., Ltd.) is applied on the back side of the base material of the adhesive tape on a base material made of polyimide having a thickness of 25 μm (Kapton 100H manufactured by Toray DuPont). Thereafter, an acrylic adhesive solution was applied to the opposite surface and dried to prepare an adhesive tape having an adhesive layer having a thickness of 10 μm.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.5 N / 19 mm, and the heat shrinkage rate was 0.1%.

<Example 6>
An adhesive tape produced in the same manner as in Example 4 was obtained except that an adhesive layer having a thickness of 30 μm was formed.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 3.0 N / 19 mm, and the thermal shrinkage was 0.15%.

<Example 7>
As shown in FIG. 3A, the adhesive tape is a tape having a protruding portion with a protruding length of 4 mm from a covered portion of 11 mm × 12 mm square, passing through an arc-shaped side portion of R = 2 (mm). An adhesive tape similar to that in Example 3 was prepared except that the shape was changed.

<Example 8>
As shown in FIG. 3 (C) described above, the adhesive tape is opened from the 6 mm × 7 mm square covering portion by 1 mm to the outside of both ends (3b and 3f in FIG. 3 (C) are 1 mm). A pressure-sensitive adhesive tape similar to that of Example 3 was prepared, except that a tape-like shape having a protruding portion with a protruding length of 2.5 mm was passed through the inclined side portion.

<Example 9>
On a substrate made of polyethylene naphthalate having a thickness of 25 μm, an acrylic adhesive solution is applied in a stripe shape alternately with a 10 mm wide coated portion and an uncoated portion with a 10 mm width, and dried to a thickness of 5 μm. An adhesive tape having an adhesive layer was prepared. This adhesive tape was slit with a width of 20 mm so that the uncoated portion was in the center of the tape to obtain an adhesive tape. The pressure-sensitive adhesive tape has a = 10 mm and b = 5 mm in FIG.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 1.0 N / 19 mm and the thermal shrinkage was 0.15%.

<Comparative example 4>
An adhesive tape produced in the same manner as in Example 4 was obtained except that the quaternary ammonium salt was not applied to the back surface of the adhesive layer of the adhesive tape.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, the thermal shrinkage was 0.15%, and the adhesive tape was measured at 500 nm. The light transmittance was 88.0%.

<Comparative Example 5>
An adhesive tape produced by the same method as in Example 5 was obtained except that the quaternary ammonium salt was not applied to the adhesive tape.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.5 N / 19 mm, and the heat shrinkage rate was 0.1%.

<Comparative Example 6>
An adhesive tape produced in the same manner as in Example 5 was obtained except that a quaternary ammonium salt was applied to the back surface of the adhesive layer of the adhesive tape.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.5 N / 19 mm, and the heat shrinkage rate was 0.1%.

<Comparative Example 7>
An adhesive tape similar to that of Example 7 was prepared except that the side portion of the protrusion had a right-angled bottom shape (shape 3e as shown by the broken line in FIG. 3A).

<Comparative Example 8>
An adhesive tape produced in the same manner as in Example 9 was obtained except that the acrylic adhesive solution was not applied in a stripe shape.
After the adhesive tape was heated at 180 ° C. for about 1 hour, the adhesive strength measured according to JIS Z0237 was 2.0 N / 19 mm, and the thermal shrinkage was 0.15%.

<Result>
(1) Shape of tape after heating Regarding Examples 3 to 9 and Comparative Examples 4 to 8 using polyethylene naphthalate as a base material, no lifting / peeling from the glass surface of the tape was confirmed.
(2) Discharge amount While 400 mV discharge was confirmed in the configurations of Comparative Examples 4 and 5, and 350 mV discharge was confirmed in the configuration of Comparative Example 6, a quaternary ammonium salt was applied to the back side of the substrate. In the configurations of Examples 4 and 5, the discharge amount was 50 mV.
(3) Peelability When the peelability from the glass surface was confirmed after heating at 180 ° C. for about 1 hour, about the adhesive tape of Example 9, there was a foreign matter derived from the adhesive on the glass surface after tape peeling. Although it was not confirmed, in Comparative Example 8, a foreign substance derived from the pressure-sensitive adhesive was confirmed on the glass surface after tape peeling. Further, for Examples 7 and 8, the tape could be easily peeled off without being cut, but for Comparative Example 7, the tape was broken due to a crack at the corner of the bottom of the protrusion, The entire tape could not be easily peeled from the protrusion.
(4) Visibility Table 2 describes the results of studies on the internal visibility after the package is formed.

(5) Summary From the above results, it was possible to provide a surface protective adhesive tape used in molding a CCD package excellent in heat resistance, releasability, and visibility by suppressing discharge during peeling.

[Examples based on Evaluation Method 3]
<Evaluation method 3>
About Example 10 and Comparative Example 9, the following item was evaluated about the tape produced according to each condition.
(1) Shape of the tape after heating The shape of the tape after the samples of the above-mentioned Examples and Comparative Examples were bonded to the glass surface and left for 1 hour at a temperature of 180 ° C.
(2) The state of the glass surface after tape peeling The state of the glass surface after tape peeling was confirmed visually.
(3) Peelability After the samples of the following examples and comparative examples were bonded to the surface glass of the CCD package, they were placed at a maximum temperature of 180 ° C. for 5 seconds (the reflow furnace was charged for about 90 seconds including residual heat) ) Easiness of peeling after being put into the solder reflow oven and mounted on the substrate.

<Example 10>
As shown in FIG. 3 (C) described above, the adhesive tape is opened from the 6 mm × 7 mm square covering portion by 1 mm to the outside of both ends (3b and 3f in FIG. 3 (C) are 1 mm). A pressure-sensitive adhesive tape similar to that of Example 5 was produced, except that a tape-like shape having a protruding portion with a protrusion length of 2.5 mm was passed through the inclined side portion.
This tape was attached to the surface glass of the CCD package, put into a 180 ° C. solder reflow furnace, and mounted on the substrate.
Thereafter, when the tape was peeled off from the protruding portion of the tape, it could be easily peeled off from the protruding portion without breaking the tape. The surface of the CCD package after the tape was peeled was not confirmed to be scratched or adhered foreign matter, and normal operation as a CCD was confirmed.

<Comparative Example 9>
An adhesive tape similar to that of Example 10 was produced except that the side portion of the protrusion had a right-angled bottom shape (shape 3e as shown by the broken line in FIG. 3A).
This tape was bonded to the surface glass of the CCD package, and was put into a 180 ° C. solder reflow furnace in the same manner as in Example 10 and mounted on the substrate.
Thereafter, the tape was peeled off from the protruding portion of the tape. As a result, a crack occurred from the corner portion of the bottom end of the protruding portion, and the tape was cut off, and the entire tape could not be easily peeled off from the protruding portion.

<Summary of results>
From the above results, it was possible to provide a surface protective pressure-sensitive adhesive tape used in molding a CCD package having excellent heat resistance, workability, and peelability while suppressing discharge during peeling.

Explanatory drawing which illustrates the adhesive tape which concerns on this invention. Explanatory drawing which shows the bonding state to the video sensor of the adhesive tape which concerns on this invention. Explanatory drawing which illustrates the shape of the adhesive tape which concerns on this invention. Explanatory drawing which shows the fundamental structure of the adhesive tape which has an adhesive non-application part of this invention. Explanatory drawing which shows the other structure of the adhesive tape which has an adhesive non-application part in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3 Release film 4 Adhering body (video sensor)
4a End face 4b Side part 5 Covering part (light receiving part)
6 Adhesive tape 6a Protrusion 6b Side 6c Side 6d Tip X Center line

Claims (11)

  An adhesive tape having an adhesive layer on at least one side of a substrate, the adhesive tape comprising an acrylic copolymer as a main ingredient and an adhesive layer containing a nitrogen-containing monomer, for protecting a solid-state imaging device Adhesive tape. A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive polymer containing 1 to 30 parts by weight of a nitrogen-containing monomer in the acrylic monomer represented by the general formula 1,
The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to claim 1, wherein the nitrogen atom content ratio B determined by the following formula 2 of the nitrogen-containing monomer is 3 to 20.
[Chemical 1]

(Wherein R ₁ is a hydrogen group or a methyl group, and R ₂ is an alkyl group having 2 to 20 carbon atoms)
B = (nitrogen atom molecular weight × number of nitrogen atoms contained in monomer molecular weight) × 100 / monomer molecular weight (Formula 2)   The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to claim 1 or 2, wherein the pressure-sensitive adhesive polymer as a constituent component of the pressure-sensitive adhesive is crosslinked with a crosslinking agent having a polyfunctional epoxy compound or an isocyanate compound.   Adhesive strength under a heating atmosphere at 160 ° C. is 0.1 N / 19 mm or more, and an adhesive strength after performing heat treatment at 160 ° C. for 3 minutes is 7.0 N / 19 mm or less The adhesive tape for solid-state imaging device protection in any one of Claims 1-3.   The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive tape has the pressure-sensitive adhesive layer on one side and an antistatic agent is applied on the other side.   6. The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to claim 5, wherein the antistatic agent is mainly composed of a quaternary ammonium salt.   The pressure-sensitive adhesive tape for protecting a solid-state imaging device according to claim 5, wherein a protrusion for peeling is provided on at least a part of the outer periphery of the pressure-sensitive adhesive tape.   In the adhesive tape, the side having a side parallel to the end face of the image sensor and connected to the terminal bottom of the protrusion, and the side connected from the tip of the protrusion to the terminal bottom is a slanted line, a polygonal line, a curved line, or The adhesive tape for protecting a solid-state imaging device according to any one of claims 5 to 7, wherein the adhesive tape has any one of these shapes.   The adhesive tape for protecting a solid-state imaging device according to any one of claims 5 to 8, wherein an adhesive layer is not provided in a portion of the adhesive tape that covers the light receiving portion of the video sensor.   A mounting method for an image sensor, wherein the adhesive tape for protecting a solid-state imaging device according to claim 5 is used for protecting a light receiving portion of the image sensor.   11. The image sensor according to claim 10, wherein the image sensor is attached to the image sensor so as to cover the entire light receiving unit and to have a predetermined distance from the end surface of the image sensor to the center side of at least a part of the outer periphery thereof. How to implement

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