CN108714727B - Device and method for calibrating tin wave height - Google Patents
Device and method for calibrating tin wave height Download PDFInfo
- Publication number
- CN108714727B CN108714727B CN201810483958.9A CN201810483958A CN108714727B CN 108714727 B CN108714727 B CN 108714727B CN 201810483958 A CN201810483958 A CN 201810483958A CN 108714727 B CN108714727 B CN 108714727B
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- tin
- soldering
- oxide layer
- photoelectric sensor
- wave
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 167
- 238000000034 method Methods 0.000 title claims description 11
- 238000005476 soldering Methods 0.000 claims abstract description 56
- 238000004140 cleaning Methods 0.000 claims abstract description 44
- 230000004907 flux Effects 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000003287 optical effect Effects 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 12
- 230000008054 signal transmission Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 2
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a device for calibrating the height of tin wave, which comprises a soldering tin furnace, wherein the soldering tin furnace is provided with at least one tin outlet nozzle, an oxide layer cleaning brush is positioned above the tin outlet nozzle and is arranged corresponding to the tin outlet nozzle; a soldering flux feeding device is filled with soldering flux and is connected with the oxide layer cleaning brush; the XY conveying platform is in driving connection with the soldering tin furnace; the Z-axis lifting device is arranged below the soldering tin furnace and is in driving connection with the soldering tin furnace; the first photoelectric sensor is positioned above the tin outlet nozzle and can send and receive photoelectric signals; the second photoelectric sensor is arranged on the same horizontal plane as the first photoelectric sensor and can send and receive photoelectric signals; the photoelectric signal sent by the first photoelectric sensor is mutually perpendicular to the second photoelectric sensor, and an intersection point is formed, so that the height, width, surface smoothness and surface overall morphology of the tin wave are detected; the invention achieves the aims of improving welding quality and improving productivity through the two photoelectric sensors and the oxide layer cleaning brush.
Description
Technical Field
The invention relates to the technical field of SMT welding equipment, in particular to a device and a method for calibrating the height of tin waves.
Background
SMT is a surface mount technology, known as surface mount or surface mount technology. Is one of the most popular techniques and technologies in the electronic assembly industry.
The circuit mounting technology is to mount no-pin or short-lead surface assembly components on the surface of a printed circuit board or the surface of other base plates, and to carry out welding assembly by reflow soldering or dip soldering and other methods.
The welding method adopted in SMT is selective wave soldering, and the height of the wave crest is set according to the size and type program of a device which is selectively soldered; therefore, the initial calibration value of the peak height is particularly important, in the prior art, a group of one-way calibration heights of the pair of radio eyes or mechanical measurement of the tin wave height are adopted, calibration deviation is caused due to instability of peak morphology, continuous tin and little tin or more tin are easy to occur during welding, correction is needed through secondary welding, and the quality and the productivity of products are required to be improved.
Improvements are therefore needed.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a device for calibrating the height of tin waves.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the device for calibrating the height of the tin wave comprises a soldering tin furnace, wherein at least one tin outlet nozzle and an oxide layer cleaning brush are arranged on the soldering tin furnace, are positioned above the tin outlet nozzle and are correspondingly arranged with the tin outlet nozzle and are used for cleaning an oxide layer at the tin outlet nozzle; a soldering flux feeding device is filled with soldering flux and is connected with the oxide layer cleaning brush so as to realize that the soldering flux is conveyed to the oxide layer cleaning brush; the XY conveying platform is in driving connection with the soldering tin furnace, and is used for driving the soldering tin furnace to move to the oxide layer cleaning brush and to perform relative movement with the oxide layer cleaning brush so as to clean the oxide layer; the Z-axis lifting device is arranged below the soldering tin stove and is in driving connection with the soldering tin stove, and is used for driving the soldering tin stove to move along the Z-axis direction; the first photoelectric sensor is positioned above the tin outlet nozzle and can send and receive photoelectric signals; the second photoelectric sensor is arranged on the same horizontal plane as the first photoelectric sensor and can send and receive photoelectric signals; the photoelectric signal sent by the first photoelectric sensor is mutually perpendicular to the second photoelectric sensor, and the photoelectric signal is provided with an intersection point, and the intersection point is used for detecting the height, width, surface smoothness and surface overall morphology of the tin wave.
In a further technical scheme, the first photoelectric sensor comprises an X-direction optical signal emitter and an X-direction signal receiver which are respectively arranged at the left side and the right side of the soldering tin stove, and the second photoelectric sensor comprises a Y-direction optical signal emitter and a Y-direction signal receiver which are respectively arranged at the front side and the rear side of the soldering tin stove; the optical signals emitted by the X-direction optical signal emitter and the optical signals emitted by the Y-direction optical signal reflector are mutually perpendicular and have intersection points.
In a further technical scheme, the oxide layer cleaning brush is a stainless steel brush.
In a further technical scheme, the device comprises a brush fixing frame, wherein the oxide layer cleaning brush is fixedly or movably inserted into the brush fixing frame, and a descending device in driving connection with the brush fixing frame is arranged above the brush fixing frame so as to drive the brush fixing frame and the oxide layer cleaning brush to descend and contact with the tin outlet nozzle.
Another object of the invention is to provide a calibration method for calibrating the tin wave height device.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a detection method of a device for detecting tin waveform state,
the method comprises the following steps:
A. detecting a tin wave state, before starting operation, spraying tin waves by the tin outlet nozzle, driving the tin soldering furnace to move to the position right below a signal intersection point of the first photoelectric sensor and the second photoelectric sensor by the XY conveying platform, driving the tin soldering furnace to move along the Z-axis direction by the Z-axis lifting device, enabling the tin waves to gradually intersect with the signal intersection point, measuring the surface state of the tin waves by the first photoelectric sensor and the second photoelectric sensor, and sending the surface state of the tin waves to the control system to be compared with the standard state of the tin waves;
B. c, cleaning a tin outlet, if the detection result in the step A is NG, driving a tin soldering furnace to move to the position of the oxide layer cleaning brush by an XY conveying platform, enabling the tin outlet to be in contact with the oxide layer cleaning brush, then driving the tin soldering furnace to move left and right by the XY conveying platform to perform relative friction with the oxide layer cleaning brush, cleaning an oxide layer at the position of the tin outlet, and then executing the step A until the tin waveform state detection result is OK;
C. and (3) calibrating the height of the tin wave, if the detection result in the step A is OK, closing the tin wave at the tin outlet nozzle, driving the tin outlet nozzle to slowly move along the Z axis direction towards the signal intersection point by the Z axis lifting device, recording the current position as a zero point T by the system when the signal transmission is not blocked by the tin outlet nozzle, and then feeding back no signal to the system by the first photoelectric sensor and the second photoelectric sensor, and finally, recording the current position as the zero point T according to the required tin wave height T 1 The Z-axis lifting device drives the soldering tin stove to move downwards along the Z-axis direction for a distance T 1 The soldering furnace is opened, the tin wave is sprayed out, and the power of the sprayed tin wave is automatically adjusted, so that the tin wave height is adjusted until the tin wave just does not block the optical signal, and the system automatically calibrates the tin wave height;
D. and C, repeating the step C for a plurality of times to finish different tin wave heights required by the process.
By adopting the structure, compared with the prior art, the invention has the following advantages: the invention is composed of two groups of photoelectric sensors which are vertically opposite to each other and an oxide layer cleaning brush, so that the automatic cleaning function of a tin nozzle is ensured when the initial stability of the tin wave height and the calibration are unsuccessful until the calibration is successful; the aims of improving welding quality, reducing secondary welding and improving productivity are achieved.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram showing morphological alignment of tin waves according to the present invention;
FIG. 3 is a schematic view of the structure of the oxide layer cleaning brush of the present invention;
FIG. 4 is a schematic diagram of the highly calibrated action of the present invention.
Detailed Description
The following are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention.
As shown in fig. 1 and 3, a device for calibrating the height of tin wave comprises a soldering tin furnace 1, wherein the soldering tin furnace 1 is provided with at least one tin outlet nozzle 11, and an oxide layer cleaning brush 3 is positioned above the tin outlet nozzle 11 and is arranged corresponding to the tin outlet nozzle 11 and used for cleaning an oxide layer at the tin outlet nozzle 11; the oxide layer cleaning brush 3 is a stainless steel brush; a flux feeding device 4 which is filled with flux and is connected with the oxide layer cleaning brush 3 to realize the flux to be conveyed to the oxide layer cleaning brush 3; the XY conveying platform is in driving connection with the soldering tin furnace 1 and is used for driving the soldering tin furnace 1 to move to the position of the oxide layer cleaning brush 3 and to perform relative movement with the oxide layer cleaning brush 3 so as to clean an oxide layer; the Z-axis lifting device 2 is arranged below the soldering tin stove 1, is in driving connection with the soldering tin stove 1 and is used for driving the soldering tin stove 1 to move along the Z-axis direction; the first photoelectric sensor is positioned above the tin outlet nozzle 11 and can send and receive photoelectric signals; the second photoelectric sensor is arranged on the same horizontal plane as the first photoelectric sensor and can send and receive photoelectric signals; the photoelectric signal sent by the first photoelectric sensor is mutually perpendicular to the second photoelectric sensor, and the photoelectric signal is provided with an intersection point, and the intersection point is used for detecting the height, width, surface smoothness and surface overall morphology of the tin wave.
In this scheme, the first photoelectric sensor includes an X-direction optical signal emitter 5 and an X-direction signal receiver 6 respectively disposed on the left and right sides of the solder pot 1, and the second photoelectric sensor includes a Y-direction optical signal emitter 7 and a Y-direction signal receiver 8 respectively disposed on the front and rear sides of the solder pot 1; the optical signals emitted by the X-direction optical signal emitter 5 and the optical signals emitted by the Y-direction optical signal reflector 7 are perpendicular to each other and have an intersection point.
In this scheme, still include brush mount 31, the fixed or activity of oxide layer clearance brush 3 inserts locates brush mount 31, and the top of brush mount 31 sets up the decline device 32 of drive connection with it to realize that drive brush mount and oxide layer clearance brush 3 descend, contact with play tin mouth 11.
Working principle:
before welding operation, firstly detecting tin wave form, the XY conveying platform drives the tin soldering furnace 1 to move to the position right below the signal intersection point of the first photoelectric sensor and the second photoelectric sensor, the Z-axis lifting device 2 drives the tin soldering furnace 1 to move along the Z-axis direction, so that tin waves gradually intersect with the signal intersection point, the system converts received intermittent signals into width W and height H parameters of the tin waves as the tin waves at the tin outlet nozzle 11 block the signals of the first photoelectric sensor and the second photoelectric sensor, compares the width W and the height H parameters with standard parameters stored in the system, judges whether the current tin waves are qualified or not, feeds back OK results if the current tin waves are qualified, feeds back NG results if the current tin waves are unqualified, and sends the results to a user in a report mode; as shown in fig. 2, the first graph is a parameter graph of a standard tin wave, the second graph is a tin wave parameter graph fed back in real time, the third graph is a comparison graph of the first graph and the second graph, and fig. 2 is a parameter pattern when the detection result is NG.
If the tin wave form detection result is NG, the XY conveying platform drives the tin soldering furnace 1 to move to the position of the oxide layer cleaning brush 3, the tin outlet nozzle 11 is contacted with the oxide layer cleaning brush 3, then the XY conveying platform drives the tin soldering furnace 1 to move left and right to perform relative friction with the oxide layer cleaning brush 3, and after the oxide layer at the tin outlet nozzle 11 is cleaned, tin wave form detection is performed again until the detection result is OK.
If the result of tin waveform state detection is OK, a tin wave height calibration step is carried out, at the moment, the tin wave at the tin outlet nozzle 11 is closed, the tin wave is not sprayed any more, the Z-axis lifting device 2 drives the tin outlet nozzle 11 to slowly move along the Z-axis direction towards the signal intersection point, when the tin outlet nozzle 11 just does not block signal transmission, the first photoelectric sensor and the second photoelectric sensor do not feed back signals to the system, the system records that the current position is zero T, and then the current position is T according to the required tin wave height 1 The Z-axis lifting device 2 drives the solder tin furnace 1 to move downwards along the Z-axis direction for a distance T 1 The soldering furnace is opened, the tin wave is sprayed out, and the power of the sprayed tin wave is automatically adjusted, so that the tin wave height is adjusted until the tin wave just does not block the optical signal, and the system automatically calibrates the tin wave height; and according to the production requirement, a plurality of tin wave heights can be calibrated repeatedly.
The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.
Claims (4)
1. The utility model provides a device of demarcating tin wave height, includes the soldering tin stove, is equipped with at least one play tin mouth on the soldering tin stove, its characterized in that:
the oxide layer cleaning brush is positioned above the tin outlet nozzle and is arranged corresponding to the tin outlet nozzle and is used for cleaning the oxide layer at the tin outlet nozzle;
a soldering flux feeding device is filled with soldering flux and is connected with the oxide layer cleaning brush so as to realize that the soldering flux is conveyed to the oxide layer cleaning brush;
the XY conveying platform is in driving connection with the soldering tin furnace, and is used for driving the soldering tin furnace to move to the oxide layer cleaning brush and to perform relative movement with the oxide layer cleaning brush so as to clean the oxide layer;
the Z-axis lifting device is arranged below the soldering tin stove and is in driving connection with the soldering tin stove, and is used for driving the soldering tin stove to move along the Z-axis direction;
the first photoelectric sensor is positioned above the tin outlet nozzle and can send and receive photoelectric signals;
the second photoelectric sensor is arranged on the same horizontal plane as the first photoelectric sensor and can send and receive photoelectric signals;
the photoelectric signal sent by the first photoelectric sensor is mutually perpendicular to the second photoelectric sensor, and an intersection point is formed, and the intersection point is used for detecting the height, width, surface smoothness and surface overall morphology of the tin wave;
the calibration method of the tin wave height device comprises the following steps:
A. detecting a tin wave state, before starting operation, spraying tin waves by the tin outlet nozzle, driving the tin welding furnace to move to the position right below a signal intersection point of the first photoelectric sensor and the second photoelectric sensor by the XY conveying platform, driving the tin welding furnace to move along the Z-axis direction by the Z-axis lifting device so that the tin waves gradually intersect with the signal intersection point, measuring the surface state of the tin waves by the first photoelectric sensor and the second photoelectric sensor, and transmitting the surface state of the tin waves to a control system to be compared with the standard state of the tin waves;
B. c, cleaning a tin outlet, if the detection result in the step A is NG, driving a tin soldering furnace to move to the position of the oxide layer cleaning brush by an XY conveying platform, enabling the tin outlet to be in contact with the oxide layer cleaning brush, then driving the tin soldering furnace to move left and right by the XY conveying platform to perform relative friction with the oxide layer cleaning brush, cleaning an oxide layer at the position of the tin outlet, and then executing the step A until the tin wave form detection result is OK;
c, calibrating the height of the tin wave, if the detection result in the step A is OK, the tin wave at the tin outlet nozzle is closed, the Z-axis lifting device drives the tin outlet nozzle to slowly move along the Z-axis direction towards the signal intersection point, when the tin outlet nozzle just does not block signal transmission, the system records the current position as a zero point T when no signal is fed back to the system by the first photoelectric sensor and the second photoelectric sensor, then, according to the T1 of the required tin wave height, the Z-axis lifting device drives the tin soldering furnace to downwards move by a distance T1 along the Z-axis direction, the tin soldering furnace is opened, the tin wave is ejected, and the power of the ejected tin wave is automatically regulated, so that the tin wave height is regulated until the tin wave just does not block the optical signal, and the system automatically calibrates the tin wave height;
D. and C, repeating the step C for a plurality of times to finish different tin wave heights required by the process.
2. The device for calibrating the height of a tin wave according to claim 1, wherein: the first photoelectric sensor comprises an X-direction optical signal emitter and an X-direction signal receiver which are respectively arranged at the left side and the right side of the soldering tin stove, and the second photoelectric sensor comprises a Y-direction optical signal emitter and a Y-direction signal receiver which are respectively arranged at the front side and the rear side of the soldering tin stove; the optical signals emitted by the X-direction optical signal emitter and the optical signals emitted by the Y-direction optical signal reflector are mutually perpendicular and have intersection points.
3. A device for calibrating the height of a tin wave according to claim 1 or 2, characterized in that: the oxide layer cleaning brush is a stainless steel brush.
4. A device for calibrating the height of a tin wave according to claim 1 or 2, characterized in that: the device comprises a hairbrush fixing frame, wherein an oxide layer cleaning brush is fixedly or movably inserted into the hairbrush fixing frame, and a descending device in driving connection with the hairbrush fixing frame is arranged above the hairbrush fixing frame so as to drive the hairbrush fixing frame and the oxide layer cleaning brush to descend and contact with a tin outlet nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810483958.9A CN108714727B (en) | 2018-05-19 | 2018-05-19 | Device and method for calibrating tin wave height |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810483958.9A CN108714727B (en) | 2018-05-19 | 2018-05-19 | Device and method for calibrating tin wave height |
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| Publication Number | Publication Date |
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| CN108714727A CN108714727A (en) | 2018-10-30 |
| CN108714727B true CN108714727B (en) | 2023-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810483958.9A Active CN108714727B (en) | 2018-05-19 | 2018-05-19 | Device and method for calibrating tin wave height |
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Families Citing this family (1)
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| CN113523475B (en) * | 2020-04-22 | 2022-09-27 | 英业达科技有限公司 | Tin wave height measuring system and method |
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| CN108714727A (en) | 2018-10-30 |
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