JP2020068334A - Electronic component, manufacturing method thereof, and mounting method of electronic component - Google Patents

Abstract

To provide an electronic component having an opening, in which a protective film can be easily attached so as to close the opening, and the protective film can be easily peeled off, a manufacturing method thereof, and a mounting method of the electronic component.SOLUTION: An electronic component 10 with a protective film 1 attached to the surface includes a chip component 5 mounted inside the electronic component, a package portion 2 having an opening 4 through which at least a part of the chip component is exposed or communicates with the outside, and the protective film 1 includes a sticking portion 1b that covers at least the opening of the package surface, and a gripping portion 1a that faces the package surface and that includes a portion that does not adhere to the package surface. The open end of the gripping portion extends outside the end of the electronic component.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component, a method of manufacturing the electronic component, and a method of mounting the electronic component. Particularly, in an electronic component having an opening exposed to the outside in a state where a chip component such as a sensor element is packaged, an electronic component with a protective film that closes the opening, a method for manufacturing the same, and a method for mounting the electronic component are disclosed. is there.

  In recent years, demand for various sensors has increased due to mounting in communication devices such as smartphones and tablet terminals, mounting in health care devices such as pedometers and activity monitors, and an increase in sensors for in-vehicle or industrial devices. It is expanding and various sensors are being developed. For example, as a humidity sensor, in addition to the conventional resistance type, a capacitance type sensor that can be widely used as an ambient temperature range has been developed. In the pressure sensor, a semiconductor strain gauge is formed on the surface of the diaphragm, and the resistance type is dependent on the change in electrical resistance due to the piezoresistive effect that occurs when the diaphragm is deformed by pressure. Capacitive sensors have been developed that form capacitors to be placed and measure changes in electrostatic capacitance caused by deformation of movable electrodes due to pressure.

  Such a humidity sensor, a pressure sensor, or the like has a sensor element placed in a package formed of ceramic, resin, or the like, and has an opening for exposing or communicating at least a part of a detection unit for measuring a physical quantity to the outside. A package structure is adopted (for example, Patent Document 1).

  When mounting an electronic component having such an opening on a mounting board, various problems occur. For example, when mounting an electronic component on a mounting board, solder is generally used, and it is necessary to perform high-temperature processing for melting the solder. At that time, volatile components are released as outgas from the flux used together with the solder, and the entire electronic component is exposed to the outgas. There is a problem that the performance of the sensor is deteriorated by the outgas adhering to the sensor element exposed in the opening of the electronic component.

  Therefore, for example, a method is adopted in which a protective film is attached to the opening of the electronic component to close the opening. For example, as shown in FIG. 7, by closing the opening 18 of the electronic component 20 with a heat-resistant protective film 19 such as a polyimide film, a structure is adopted in which outgas does not enter the electronic component 20.

JP, 2010-203857, A

  In the conventionally proposed electronic component 20 with a protective film as shown in FIG. 7, it is necessary to peel off the protective film 19 after mounting on a mounting board. At that time, in order to make it easier to grip the protective film 19, a part of the protective film is longer than the electronic component 20. However, the protective film 19 having such a structure needs to be attached to each electronic component, which is a cause of deterioration of productivity.

  Therefore, the present invention can easily attach a protective film to an electronic component having an opening so as to close the opening, and can efficiently attach the protective film to a plurality of electronic components, which is excellent in productivity. It is an object of the present invention to provide an electronic component and a manufacturing method thereof. Furthermore, it is an object of the present invention to provide an electronic component mounting method capable of easily peeling off the protective film by improving the sticking structure of the protective film and maintaining the same gripping property as the conventional one.

  In order to achieve the above object, the electronic component according to claim 1 of the present application is an electronic component in which a protective film is attached to the surface, and a chip component mounted inside the electronic component and at least a part of the chip component are externally disposed. From a package portion having an opening that is exposed or in communication, a sticking portion that closes at least the opening portion of the package portion surface, and a grip portion that includes a portion that faces the package portion surface and that does not adhere to the package portion surface. The protective film is provided, and the open end portion of the grip portion extends outside the end portion of the electronic component.

  The method of manufacturing an electronic component according to claim 2 of the present application includes a package portion having an opening through which at least a part of the chip component mounted inside is exposed or communicated with the outside, and the protective film is provided so as to close the opening. Is a method of manufacturing an electronic component that is attached to the surface of the package portion, the step of forming an attaching portion that closes the opening and the grip portion in the protective film, and a step of forming a plurality of aggregates of the electronic component. With the protective film on each surface of the aggregate, the sticking portion closes the opening, the gripping portion floats from the surface of the package portion, and the open end of the gripping portion is an end of the electronic component. A step of sticking so as to extend to the outer side, and cutting a part of the protective film and a part of the package part of the aggregate to which the protective film is stuck Characterized in that it comprises a step of singulating more the electronic component.

  The method of manufacturing an electronic component according to claim 3 of the present application is characterized in that the step of forming a plurality of aggregates of the electronic component is a step of forming a plurality of aggregates in which the electronic components are arranged in a row. To do.

  According to a fourth aspect of the present invention, there is provided an electronic component mounting method, which includes a package part having an opening through which at least a part of a chip part is exposed or communicated with the outside, and a protective film is formed on the surface of the package part so as to cover the opening. Is a mounting method for mounting an electronic component affixed to a mounting substrate, after mounting the electronic component on the mounting substrate, when peeling off the protective film, while floating from the package surface, the open end is the electronic It is characterized by including a step of peeling the protective film by gripping the protective film of a gripping portion that extends to the outside of the end of the component.

  Since the electronic component of the present invention closes the opening of the electronic component with the protective film, the sensor element or the like is exposed to the outgas even when the outgas emitted from the flux or the like is generated by the high temperature treatment when mounted on the mounting substrate. As a result, the performance of the chip component will not be degraded.

  Further, according to the method of manufacturing an electronic component of the present invention, since the protective film can be efficiently attached to the surface of the electronic component assembly including a plurality of electronic components, a highly productive manufacturing method can be realized. Becomes

  Further, when the electronic component assembly is singulated, even if a dicing method using a dicing saw is adopted, since the opening is blocked by the protective film, cutting scraps and the like generated during singulation It is possible to prevent water and the like from entering the inside of the electronic component through the opening, and it is possible to realize a manufacturing method that does not deteriorate the quality of the electronic component.

  Furthermore, according to the method for mounting an electronic component of the present invention, since a part of the protective film attached to the surface of the electronic component is formed so as to float above the surface of the electronic component, for example, the protective film is surely formed at the tip of the tweezers. The protective film can be easily removed from the electronic component by gripping and pulling up.

It is a figure explaining the electronic component of the Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the Example of this invention. It is a figure explaining the manufacturing method of the electronic component of the Example of this invention. It is a figure explaining the mounting method of the electronic component of the Example of this invention. It is a figure explaining the conventional electronic component.

  According to the present invention, when an electronic component having an opening is mounted on a mounting board, by blocking the opening of the electronic component with a protective film, the influence of outgas emitted from flux or the like can be reliably prevented. Furthermore, since the grip of the protective film attached to the surface of the electronic component is formed so as to rise from the surface of the electronic component, after mounting the electronic component on the mounting board, for example, the tip of the tweezers can be used to ensure that part of the grip is The protective film can be easily peeled from the electronic component by grasping and pulling up. An embodiment of the present invention will be described in detail with respect to its structure, manufacturing method, and mounting method, taking an electronic component including a sensor element such as a humidity sensor and a pressure sensor as an example.

Examples of the present invention will be described.
FIG. 1 shows a cross-sectional view of the electronic component 10. The electronic component 10 has the sensor chip 5 (chip component) mounted therein. Electrode pads are formed on the surface of the sensor chip 5 and are connected to the leads 3 by metal wires 6. The opening 4 is provided so that the sensor portion (not shown) of the sensor chip 5 is exposed from the sealing resin 2 (package portion). Further, on the front surface side of the sealing resin 2 provided with the openings 4, the protective film 1 is attached via the adhesive layer 8. The protective film 1 of the present invention is bent from the bent portion 7, and is divided into a gripping portion 1a without the adhesive layer 8 and a sticking portion 1b on which the adhesive layer 8 is formed, with the bent portion 7 sandwiched therebetween. The gripping portion 1 a is formed so as to float above the surface of the sealing resin 2 from the bent portion 7, and is not bonded to the surface of the electronic component 10. On the other hand, the sticking portion 1b is adhered to the surface of the sealing resin 2 to close the opening 4. Further, the end portion of the grip portion 1a has a length extending outward from the end portion of the electronic component 10, and has a length sufficient for gripping. In addition, when the gripping portion 1 a is lifted from the surface of the sealing resin 2, the gripping portion 1 a does not always have to be in a position protruding from the end of the electronic component 10.

  When manufacturing an electronic component having such a structure, first, as shown in FIG. 2, an electronic component assembly 11 is formed. 2 (a) is a top view of the electronic component assembly 11, and FIG. 2 (b) is the electronic component assembly 11 divided with the back side of the electronic component assembly 11 as the front surface and attached to the protective tape 13. 2C is a top view of a state in which a plurality of electronic component assemblies 11 (a) and 11 (b) are formed, and FIG. 2 (c) is an electronic component assembly 11 ( It is sectional drawing of a) and 11 (b). As shown in FIGS. 2B and 2C, a plurality of electronic component assemblies in which two electronic components separated by a cutting groove 12 obtained by cutting and removing a part of the sealing resin 2 and the lead 3 are arranged in a row. 11 (a) and 11 (b) are formed. As shown in FIG. 2C, the surface of the sensor chip 5 is exposed to the outside of the sealing resin 2 through the opening 4. However, since the process of forming the cutting groove 12 protects the dicing tape or the like. A plurality of electronic component aggregates 11 (a) and 11 (b) can be formed with the tape 13 covering the opening 4. Note that, in FIG. 2B, a connecting bar and the like of the lead frame exposed from the sealing resin 2 are omitted.

  Subsequently, another protective tape 14 is attached to the back side of the electronic component assemblies 11 (a) and 11 (b), and then the protective tape attached to the front side of the electronic component assemblies 11 (a) and 11 (b). 13 is peeled off. As a result, as shown in FIG. 3, the opening 4 is exposed without displacement.

  Subsequently, the protective film 1 is attached to the surface of each of the electronic component assemblies 11 (a) and 11 (b). As shown in FIG. 4A, the protective film 1 has a length that can close the openings 4 of the two electronic components formed in each of the electronic component assemblies 11 (a) and 11 (b). The adhesive layer 8 is formed. The protective film 1 can be formed as follows. First, a heat-resistant film made of polyimide resin or the like is prepared, cut into a predetermined size using a mold, and a bent portion 7 extending in the longitudinal direction is formed, and the bent portion 7 is used as a boundary to attach the grip portion 1a. The part 1b is formed. Next, the adhesive layer 8 is selectively formed on the adhesive surface of the sticking portion 1b (the surface that adheres to the electronic component assemblies 11 (a) and 11 (b)). At this time, the adhesive layer 8 is not formed on the surface of the grip portion 1a. The adhesive layer 8 is formed of a pressure sensitive adhesive such as a silicone resin type or an acrylic resin type. Here, the adhesive layer 8 preferably has water resistance so that the protective film 1 does not peel off in the individualizing step described later, and further, outgas is not generated in the mounting step.

  Next, the protective film 1 is attached by pressure-bonding the adhesive layer 8 formed on the attaching portion 1b to the surface side of the electronic component assembly 11 (a), 11 (b) in which the opening 4 is formed. When the protective film 1 is attached, as shown in FIG. 4 (b), the electronic component assembly 11 (a) is attached above the attaching portion 1b of the protective film 1 attached on the electronic component assembly 11 (b). It suffices to attach the protective films 1 in order so that the grip portions 1a of the different protective films 1 to be attached overlap. According to this sticking method, even if the protective films 1 longer than the respective lengths in the lateral direction of the electronic component assemblies 11 (a) and 11 (b) are stacked and stuck, the electronic component assembly 11 (a) is stuck. The gripping portion of the attached protective film 1 is not adhered to the protective film 1 attached to the electronic component assembly 11 (b), and the opening 4 is closed by the protective film 1.

Then, the electronic component assembly 11 is divided into individual pieces. The surface of the electronic component assembly 11 opposite to the surface having the opening 4 and exposing the sealing resin 2 and the leads 3 is already attached to a protective tape 14 such as a dicing tape.
The dicing saw 15 is in a direction orthogonal to the cutting groove 12 formed previously as shown in FIG. 5, and is made to travel from the sticking portion 1b side of the protective film 1 to the gripping portion 1a side as shown by an arrow in the figure, The protective film 1, the sealing resin 2, the protective tape 14, and a part of the lead frame (not shown) are cut and removed to separate them. The gripping portion 1a is formed so as to float above the surface of the electronic component assembly 11 (a), 11 (b). The grip portion 1a can be reliably cut by pressing and temporarily fixing. Further, by making the rotating direction of the dicing saw 15 down-cut from the top to the bottom with respect to the traveling direction of the dicing saw 15, the gripping portion 1a is securely pressed against the electronic component assemblies 11 (a) and 11 (b). Can be cut into The dotted line in FIG. 5 indicates the left end 16 of the sticking portion 1b of the protective film 1 stuck on the electronic component assembly 11 (b), and the chain double-dashed line indicates the area to be cut by the dicing saw 15.

  By this individualizing step, individual electronic components are individualized. In the individualizing step, since the opening 4 is closed by the sticking portion 1b, it is possible to prevent cutting chips generated from cutting water, sealing resin, leads, or the like from entering the opening 4. be able to.

  Next, a mounting method for mounting the electronic component 10 in which the opening 4 is covered with the protective film 1 on the mounting board using solder paste or the like will be described. According to a general method for manufacturing an electronic component, after a solder paste is formed on the connection electrode portions formed on the leads 3 and the mounting substrate, the solder is melted by using a reflow device to form a solder connection. During this high-temperature heat treatment, volatile components are emitted as outgas from the flux contained in the solder paste, but since the electronic component 10 closes the opening 4 with the protective film 1, the volatile component may enter the opening 4. It is possible to prevent the deterioration of the performance of the chip component.

  Then, the protective film 1 is peeled off from the electronic component 10 mounted on the mounting board. As shown in FIG. 6, the protective film 1 can be easily peeled from the electronic component 10 by grasping the grasping portion 1a with the tip portion of the tweezers 17 or the like and then pulling it up. In this embodiment, since the grip portion 1a has a structure that continues to the surface of the electronic component 10, it is possible to shorten the dimension extending from the surface of the electronic component while sufficiently securing the dimension of the grip portion 1a.

  Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to the above embodiments. For example, although the bent portion 7 is formed on the protective film 1 only at one place, a plurality of bent portions may be formed as long as the opening 4 is closed. Alternatively, the bent portion 7 may not be formed.

  The adhesive layer 8 may be formed by any method as long as it covers the opening 4 with the protective film 1. In this embodiment, the adhesive layer 8 is formed on the entire surface of the attaching portion 1b, but the adhesive layer 8 may not be formed in the region corresponding to the opening 4.

  Further, the case where the sensor chip is mounted inside the electronic component has been described, but the present invention is not limited to this, and an electronic device in which an opening is formed so that the sensor chip mounted inside is exposed or communicates It can be applied to parts.

1: protective film, 1a: gripping portion, 1b: pasting portion, 2: sealing resin, 3: lead, 4: opening portion, 5: sensor chip, 6: metal wire, 7: bent portion, 8: adhesive layer, 10: Electronic component, 11: Electronic component assembly, 12: Cutting groove, 13, 14: Protective tape

Claims (4)

For electronic parts with a protective film attached to the surface,
A chip component mounted inside the electronic component,
At least a portion of the chip component is a package portion having an opening exposed or communicating with the outside,
A sticking part that closes at least the opening of the package part surface, and the protective film comprising a gripping part that faces the package part surface and that does not adhere to the package part surface,
The electronic component, wherein the open end of the grip portion extends to the outside of the end of the electronic component. At least a part of the chip component mounted inside is provided with a package portion having an opening exposed or communicating with the outside,
A method of manufacturing an electronic component, wherein a protective film is attached to the surface of the package portion so as to close the opening,
A step of forming a sticking portion and a holding portion that close the opening in the protective film;
Forming a plurality of assemblies of the electronic components,
The sticking portion closes the opening on each surface of the aggregate of the protective film, the gripping portion floats from the surface of the package portion, and the open end of the gripping portion is more than the end of the electronic component. A step of sticking so as to extend to the outside,
Manufacture of an electronic component, characterized by including a step of cutting a part of the protective film and a part of the package portion of the assembly to which the protective film is attached to separate the electronic component into the electronic components. Method.   The method of manufacturing an electronic component, wherein the step of forming the plurality of aggregates of the electronic component is a step of forming a plurality of columns of the electronic component arranged in a row. At least a part of the chip component is provided with a package portion having an opening exposed or communicating with the outside,
A mounting method for mounting an electronic component having a protective film attached on the surface of the package to cover the opening on a mounting board,
After peeling the protective film after mounting the electronic component on a mounting board, the protective film of the gripping portion that floats from the surface of the package portion and has an open end extending to the outside of the end of the electronic component. A method for mounting an electronic component, comprising the step of peeling the protective film by gripping.

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