JP2010114382A - Semiconductor device and its mounting method - Google Patents

Semiconductor device and its mounting method Download PDF

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Publication number
JP2010114382A
JP2010114382A JP2008288026A JP2008288026A JP2010114382A JP 2010114382 A JP2010114382 A JP 2010114382A JP 2008288026 A JP2008288026 A JP 2008288026A JP 2008288026 A JP2008288026 A JP 2008288026A JP 2010114382 A JP2010114382 A JP 2010114382A
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translucent member
protective tape
semiconductor device
sealing resin
base
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Shinya Marumo
伸也 丸茂
Yoshiki Takayama
義樹 高山
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which removal of adhesion material residue after a surface protection tape is peeled is not required. <P>SOLUTION: The semiconductor device is provided with a package 21 having a base 21A and a frame 21B arranged at a peripheral edge of the base 21A, a semiconductor chip 11 loaded on the base 21A, a translucent member 16 bonded to the semiconductor chip 11, sealing resin 31 with which the frame 21 is filled so that it surrounds the translucent member 16, and the protection tape 41 fixed by an adhesion material 42 so that it covers the upper faces of the translucent member 16 and sealing resin 31. The adhesion material 42 is installed except for a part covering an upper face of the translucent member 16 in the protection tape 41. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、半導体装置及びその実装方法に関し、特に実装工程等において表面の保護が必要な半導体装置及びその実装方法に関する。   The present invention relates to a semiconductor device and a mounting method thereof, and more particularly to a semiconductor device that requires surface protection in a mounting process and the like and a mounting method thereof.

固体撮像装置等を用いた、イメージセンサは、近年ビデオカメラ及びスチルカメラ等の電子機器に広く用いられている。はんだ実装等の組立工程においてイメージセンサの表面にダストが付着すると、撮像品質に影響を与えるおそれがある。このため、イメージセンサの表面に保護用の粘着テープを貼り付け、イメージセンサの表面へのダストの付着を防止している。   In recent years, image sensors using solid-state imaging devices have been widely used in electronic devices such as video cameras and still cameras. If dust adheres to the surface of the image sensor in an assembly process such as solder mounting, the imaging quality may be affected. For this reason, a protective adhesive tape is attached to the surface of the image sensor to prevent dust from adhering to the surface of the image sensor.

高温に曝されるはんだ実装工程等においても確実にイメージセンサの表面を保護し、剥離の際にイメージセンサを傷つけることがないように、粘着テープを貼り付けるための粘着材の検討がなされている（例えば、特許文献１を参照。）
特開２００６−３３２４１９号公報 Adhesive materials for sticking adhesive tape have been studied so that the surface of the image sensor is reliably protected even during solder mounting processes exposed to high temperatures, and the image sensor is not damaged during peeling. (For example, see Patent Document 1.)
JP 2006-332419 A

しかしながら、イメージセンサの表面から粘着テープを剥離する際に、イメージセンサ側に粘着材が全く残存しないようにすることは不可能である。粘着材がイメージセンサの光が入射する部分に残存すると、撮像品質を悪化させてしまう。このため、粘着テープを剥離した後、有機溶剤を用いて粘着材の残渣を拭き取り除去する工程が必須である。粘着材の残渣の除去及び除去確認の検査工程は、イメージセンサの実装工程のコストを増大させる大きな要因である。   However, when the adhesive tape is peeled from the surface of the image sensor, it is impossible to prevent the adhesive material from remaining on the image sensor side. If the adhesive material remains in the part where the light of the image sensor is incident, the imaging quality is deteriorated. For this reason, after peeling an adhesive tape, the process of wiping off and removing the residue of an adhesive material using an organic solvent is essential. The inspection process for removing the adhesive material residue and confirming the removal is a major factor that increases the cost of the image sensor mounting process.

粘着材の残渣の問題は、イメージセンサだけでなく光学デバイスを用いた他の半導体装置及び光学デバイス以外を用いた半導体装置にも共通である。   The problem of adhesive residue is common not only to image sensors, but also to other semiconductor devices using optical devices and semiconductor devices using devices other than optical devices.

本発明は、前記の問題を解決し、表面保護テープを剥離した後の粘着材残渣の除去が不要な半導体装置を実現できるようにすることを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems and to realize a semiconductor device that does not require removal of an adhesive material residue after peeling off a surface protective tape.

前記の目的を達成するため、本発明は半導体装置を、保護テープの透光部材の上面を覆う部分には粘着材が設けられていない構成とする。   In order to achieve the above object, the present invention has a semiconductor device in which an adhesive material is not provided on a portion of the protective tape that covers the upper surface of the translucent member.

具体的に、本発明に係る第１の半導体装置は、基体と該基体の周縁部に設けられた枠体とを有するパッケージと、基体の上に搭載された半導体チップと、半導体チップと接着された透光部材と、透光部材を囲むように枠体内に充填された封止樹脂と、透光部材及び封止樹脂の上面を覆うように粘着材により固定された保護テープとを備え、粘着材は、保護テープにおける透光部材の上面を覆う部分を除いて設けられていることを特徴とする。   Specifically, a first semiconductor device according to the present invention includes a package having a base and a frame provided at a peripheral portion of the base, a semiconductor chip mounted on the base, and a semiconductor chip bonded thereto. A translucent member, a sealing resin filled in the frame so as to surround the translucent member, and a protective tape fixed with an adhesive material so as to cover the top surfaces of the translucent member and the sealing resin. The material is provided except for a portion of the protective tape that covers the upper surface of the light-transmissive member.

第１の半導体装置は、粘着材が、保護テープにおける透光部材の上面を覆う部分を除いて設けられている。このため、透光部材の上面に粘着材が付着することがない。従って、保護テープを剥離した後に粘着材の残渣を除去するための拭き取り工程が不要であり、工程の簡略化及び実装に要するコストの削減が可能となる。また、拭き取り工程の不良により粘着材が残存し、光学特性が劣化するおそれもない。   In the first semiconductor device, the adhesive material is provided except for a portion that covers the upper surface of the translucent member in the protective tape. For this reason, an adhesive material does not adhere to the upper surface of the translucent member. Therefore, a wiping process for removing the residue of the adhesive material after removing the protective tape is not necessary, and the process can be simplified and the cost required for mounting can be reduced. Further, the adhesive material remains due to a defect in the wiping process, and there is no possibility that the optical characteristics deteriorate.

本発明の半導体装置において、保護テープは、透光部材の上面を覆う部分と封止樹脂の上面を覆う部分との境界領域に切れ込み部を有していてもよい。このような構成とすることにより、透光部材の保護が終了した後に保護テープにおける透光部材の上面を覆う部分だけを除去することができる。   In the semiconductor device of the present invention, the protective tape may have a cut portion in a boundary region between a portion covering the upper surface of the translucent member and a portion covering the upper surface of the sealing resin. By setting it as such a structure, after the protection of a translucent member is complete | finished, only the part which covers the upper surface of the translucent member in a protective tape can be removed.

本発明に係る第２の半導体装置は、基体と該基体の周縁部に設けられた枠体とを有するパッケージと、基体の上に搭載された半導体チップと、半導体チップと接着された透光部材と、透光部材を囲むように枠体内に充填された封止樹脂と、透光部材の上面を露出するように、封止樹脂の上面と粘着材により固定された保護テープとを備えていることを特徴とする。   A second semiconductor device according to the present invention includes a package having a base and a frame provided at a peripheral portion of the base, a semiconductor chip mounted on the base, and a translucent member bonded to the semiconductor chip. And a sealing resin filled in the frame so as to surround the translucent member, and a protective tape fixed with an adhesive material on the upper surface of the encapsulating resin so as to expose the upper surface of the translucent member It is characterized by that.

第２の半導体装置は、透光部材の上面を露出するように、封止樹脂の上面と粘着材により固定された保護テープを備えている。このため、透光部材の保護が終了した後の保護テープを、透光部材へ斜めから入射する光を制限する遮光材として用いることができる。   The second semiconductor device includes a protective tape fixed with an upper surface of the sealing resin and an adhesive material so that the upper surface of the translucent member is exposed. For this reason, the protective tape after the protection of the translucent member can be used as a light shielding material for limiting light incident obliquely on the translucent member.

本発明に係る半導体装置の実装方法は、基体と該基体の周縁部に設けられた枠体とを有するパッケージの基体の上に、透光部材を接着した半導体チップを実装した後、透光部材を囲むように枠体内に封止樹脂を充填する工程（ａ）と、透光部材及び封止樹脂の上面を覆うように、透光部材の上面を覆う部分を除いて粘着材を有する保護テープを固定する工程（ｂ）と、工程（ｂ）よりも後に、パッケージを基板の上に実装する工程（ｃ）と、工程（ｃ）よりも後に、保護テープにおける少なくとも透光部材の上面を覆う部分を除去する工程（ｄ）とを備えていることを特徴とする。   According to another aspect of the present invention, there is provided a semiconductor device mounting method comprising: mounting a semiconductor chip having a translucent member on a base of a package having a base and a frame provided on a peripheral portion of the base; A protective tape having an adhesive material except for a step of covering the upper surface of the translucent member so as to cover the upper surface of the translucent member and the encapsulating resin so as to cover the upper surface of the translucent member and the encapsulating resin. After the step (b) for fixing the substrate, the step (c) for mounting the package on the substrate after the step (b), and the step (c) for covering at least the upper surface of the translucent member in the protective tape And a step (d) of removing the portion.

本発明の半導体装置の実装方法は、透光部材及び封止樹脂の上面を覆うように、透光部材の上面を覆う部分を除いて粘着材を有する保護テープを固定する工程を備えている。このため、半導体装置の表面を確実に保護しつつ、保護テープを除去した際に透光部材の上面に粘着材が残存することを防止することができる。従って、保護テープを剥離した後に粘着材の残渣を除去するための拭き取り工程が不要であり、工程の簡略化及び実装に要するコストの削減が可能となる。また、拭き取り工程の不良により粘着材が残存し、光学特性が劣化するおそれもない。   The mounting method of the semiconductor device of the present invention includes a step of fixing a protective tape having an adhesive material except for a portion covering the upper surface of the translucent member so as to cover the upper surface of the translucent member and the sealing resin. For this reason, it is possible to prevent the adhesive material from remaining on the upper surface of the translucent member when the protective tape is removed while reliably protecting the surface of the semiconductor device. Therefore, a wiping process for removing the residue of the adhesive material after removing the protective tape is not necessary, and the process can be simplified and the cost required for mounting can be reduced. Further, the adhesive material remains due to a defect in the wiping process, and there is no possibility that the optical characteristics deteriorate.

本発明の半導体装置の実装方法は、工程（ｂ）では保護テープとして透光部材の上面を覆う部分と封止樹脂の上面を覆う部分との境界領域に切れ込み部を有する保護テープを用い、工程（ｄ）では切れ込み部において透光部材の上面を覆う部分と他の部分とを切り離すことにより透光部材の上面を覆う部分を除去する構成としてもよい。   In the method for mounting a semiconductor device of the present invention, in the step (b), a protective tape having a notch in a boundary region between a portion covering the upper surface of the translucent member and a portion covering the upper surface of the sealing resin is used as the protective tape. In (d), it is good also as a structure which removes the part which covers the upper surface of a translucent member by cut | disconnecting the part which covers the upper surface of a translucent member, and another part in a cut | notch part.

本発明の半導体装置の実装方法において、工程（ｄ）では、保護テープ全体を剥離してもよい。   In the semiconductor device mounting method of the present invention, in the step (d), the entire protective tape may be peeled off.

本発明に係る半導体装置及びその実装方法によれば、表面保護テープを剥離した後の粘着材残渣の除去が不要な半導体装置及びその実装方法を実現できる。   According to the semiconductor device and the mounting method thereof according to the present invention, it is possible to realize a semiconductor device and a mounting method thereof that do not require removal of the adhesive material residue after the surface protection tape is peeled off.

本発明の一実施形態について図面を参照して説明する。図１（ａ）及び（ｂ）は本実施形態に係る半導体装置であり、（ａ）は平面構成を示し、（ｂ）は（ａ）のＩｂ−Ｉｂ線における断面構成を示している。   An embodiment of the present invention will be described with reference to the drawings. 1A and 1B show a semiconductor device according to the present embodiment. FIG. 1A shows a planar configuration, and FIG. 1B shows a cross-sectional configuration taken along line Ib-Ib in FIG.

本実施形態の半導体装置は固体撮像装置であり、パッケージ２１に受光素子である半導体チップ１１が搭載されている。半導体チップ１１は、受光領域である光学素子領域１３を有し、光学素子領域１３を覆うように光学素子領域１３を保護する透光部材１６が接着材１５により接着されている。接着材１５は、例えばエポキシ樹脂等を主材とし紫外線により硬化する透明接着材とすればよい。半導体チップ１１の光学素子領域１３の周囲は光学素子領域１３に形成された画素を駆動する周辺回路が形成された周辺回路領域であり、複数の電極パッド１７が形成されている。   The semiconductor device of this embodiment is a solid-state imaging device, and a semiconductor chip 11 that is a light receiving element is mounted on a package 21. The semiconductor chip 11 has an optical element region 13 that is a light receiving region, and a transparent member 16 that protects the optical element region 13 is bonded by an adhesive 15 so as to cover the optical element region 13. The adhesive 15 may be a transparent adhesive that is cured by ultraviolet rays, for example, with an epoxy resin or the like as a main material. The periphery of the optical element region 13 of the semiconductor chip 11 is a peripheral circuit region in which peripheral circuits for driving pixels formed in the optical element region 13 are formed, and a plurality of electrode pads 17 are formed.

パッケージ２１は、セラミクス又は樹脂等からなる絶縁性の基体２１Ａと基体２１Ａの周縁部に設けられた枠体２１Ｂとを有している。基体２１Ａの中央部には透光部材１６を接着した半導体チップ１１が銀ペースト等の接着材１２を介して接着されている。基体２１Ａにおける半導体チップが接着された領域の周囲にはメタライズ配線体等からなる配線２２が形成され、配線２２は基体２１Ａの下面に導出されている。配線２２と半導体チップ１１の電極パッド１７とは金等からなる金属細線１８により電気的に接続されている。   The package 21 includes an insulating base 21A made of ceramics or resin, and a frame body 21B provided at the peripheral edge of the base 21A. The semiconductor chip 11 to which the translucent member 16 is bonded is bonded to the central portion of the base 21A through an adhesive 12 such as silver paste. A wiring 22 made of a metallized wiring body or the like is formed around a region of the base 21A where the semiconductor chip is bonded, and the wiring 22 is led to the lower surface of the base 21A. The wiring 22 and the electrode pad 17 of the semiconductor chip 11 are electrically connected by a thin metal wire 18 made of gold or the like.

パッケージ２１の枠体２１Ｂの内側には、透光部材１６を囲むように封止樹脂３１が充填されている。封止樹脂３１は、エポキシ樹脂を主材とすればよく、金属細線１８を覆うように充填されている。   A sealing resin 31 is filled inside the frame body 21 </ b> B of the package 21 so as to surround the translucent member 16. The sealing resin 31 may be made of an epoxy resin as a main material, and is filled so as to cover the fine metal wires 18.

透光部材１６及び封止樹脂３１の上にはポリイミド等からなる保護テープ４１が粘着材４２を介在させて固定されている。保護テープ４１における透光部材１６の上面を覆う部分には粘着材４２は塗布されておらず、封止樹脂３１の上面を覆う部分のみに粘着材４２は塗布されている。   A protective tape 41 made of polyimide or the like is fixed on the translucent member 16 and the sealing resin 31 with an adhesive material 42 interposed therebetween. The adhesive material 42 is not applied to the portion of the protective tape 41 that covers the upper surface of the translucent member 16, and the adhesive material 42 is applied only to the portion that covers the upper surface of the sealing resin 31.

本実施形態の半導体装置は、透光部材１６の上面を覆う保護テープ４１を有している。従って、例えば半導体装置を基板等に実装する際に半導体装置の表面に傷が入ったり、ダストが付着したりすることを防止できる。また、封止樹脂３１の上面にのみ粘着材４２が接し、透光部材１６の上面には粘着材４２が接することはない。このため、実装等が終了した後、保護テープ４１を剥離しても図２に示すように光が透過する透光部材１６の上面に粘着材４２が残存することはない。従って、保護テープを剥離した後の粘着材残渣の除去を行う必要がない。   The semiconductor device of this embodiment has a protective tape 41 that covers the upper surface of the translucent member 16. Therefore, for example, when the semiconductor device is mounted on a substrate or the like, it is possible to prevent the surface of the semiconductor device from being damaged or dust from adhering. Further, the adhesive material 42 contacts only the upper surface of the sealing resin 31, and the adhesive material 42 does not contact the upper surface of the translucent member 16. For this reason, even after the mounting or the like is completed, even if the protective tape 41 is peeled off, the adhesive material 42 does not remain on the upper surface of the translucent member 16 that transmits light as shown in FIG. Therefore, it is not necessary to remove the adhesive material residue after peeling off the protective tape.

封止樹脂３１の上面に粘着材４２が残存する可能性はあるが、封止樹脂３１の部分は光が透過する必要はなく、何ら問題はない。また、封止樹脂３１の上に保護テープ４１を残存させてもよい。   There is a possibility that the adhesive material 42 remains on the upper surface of the sealing resin 31, but it is not necessary for light to pass through the portion of the sealing resin 31 and there is no problem. Further, the protective tape 41 may be left on the sealing resin 31.

この場合には、図３に示すように保護テープ４１における透光部材１６と封止樹脂３１との境界領域の上側の部分に切れ込み部４１ａを形成すればよい。保護テープ４１による保護が不要となった後、切れ込み部４１ａを用いて保護テープ４１における透光部材１６の上面を覆う部分を他の部分から切り離す。これにより、保護テープ４１における透光部材１６の上面を覆う部分だけを容易に除去できる。   In this case, as shown in FIG. 3, the cut portion 41 a may be formed in the upper portion of the boundary region between the translucent member 16 and the sealing resin 31 in the protective tape 41. After the protection with the protective tape 41 is no longer necessary, the portion of the protective tape 41 that covers the upper surface of the translucent member 16 is separated from the other portions using the cut portions 41a. Thereby, only the part which covers the upper surface of the translucent member 16 in the protective tape 41 can be removed easily.

このようにすれば、図４に示すように透光部材１６を露出する保護テープ４１が封止樹脂３１の上に残存する。保護テープ４１を遮光性を有する有色テープとすれば、透光部材１６に斜め方向から入射する光を制限することができる。従って、斜めからの入射光によって透光部材１６内において乱反射が生じることを防止でき、撮像品質を向上することができる。   In this way, the protective tape 41 that exposes the translucent member 16 remains on the sealing resin 31 as shown in FIG. If the protective tape 41 is a colored tape having a light shielding property, the light incident on the light transmitting member 16 from an oblique direction can be limited. Therefore, it is possible to prevent irregular reflection from occurring in the translucent member 16 due to obliquely incident light, and to improve the imaging quality.

本実施形態の半導体装置は、保護テープ４１を剥離した後に透光部材１６の上面に粘着材４２が残存することがない。このため、エタノール等の有機溶剤により透光部材１６の上面を拭き取ることにより、粘着材４２の残渣を除去する工程が不要となる。拭き取り必要時間、拭き取り用溶剤及び拭き取り作業スペース等を削減することができ、コストメリットが大きく非常に有益である。また、粘着材４２の残渣が残ることによる撮像品質の悪化が生じるおそれもない。   In the semiconductor device of this embodiment, the adhesive material 42 does not remain on the upper surface of the translucent member 16 after the protective tape 41 is peeled off. For this reason, the process of removing the residue of the adhesive material 42 becomes unnecessary by wiping the upper surface of the translucent member 16 with an organic solvent such as ethanol. The time required for wiping, the wiping solvent, the wiping work space, and the like can be reduced, and the cost merit is large and very useful. Further, there is no possibility that the imaging quality is deteriorated due to the residue of the adhesive material 42 remaining.

本実施形態は、半導体チップ１１が受光素子である例を示した。しかし、受光素子以外の発光素子等の光学デバイスに対しても同様に適用することができる。また、実装工程等において表面を保護する必要がある半導体装置であれば、光学デバイス以外の半導体装置においても有用である。   In the present embodiment, an example in which the semiconductor chip 11 is a light receiving element is shown. However, the present invention can be similarly applied to an optical device such as a light emitting element other than the light receiving element. Further, any semiconductor device that needs to protect the surface in a mounting process or the like is also useful in a semiconductor device other than an optical device.

製品の信頼性を向上し且つ組立コストを抑えることができるため、本実施形態の半導体装置をビデオカメラ及びスチルカメラ等の電子機器に実装すれば、従来品と比較して信頼性の向上及びコストの削減が可能である。   Since the reliability of the product can be improved and the assembling cost can be reduced, if the semiconductor device of this embodiment is mounted on an electronic device such as a video camera or a still camera, the reliability is improved and the cost is higher than that of the conventional product. Can be reduced.

本発明に係る半導体装置及びその実装方法は、表面保護テープを剥離した後の粘着材残渣の除去が不要な半導体装置及びその実装方法を実現でき、特に実装工程等において表面の保護が必要な半導体装置及びその実装方法等として有用である。   The semiconductor device and the mounting method thereof according to the present invention can realize a semiconductor device and its mounting method that do not require removal of the adhesive residue after the surface protective tape is peeled off, and particularly a semiconductor that requires surface protection in a mounting process or the like. It is useful as a device and its mounting method.

（ａ）及び（ｂ）は本発明の一実施形態に係る半導体装置を示し、（ａ）は断面図であり、（ｂ）は（ａ）のＩｂ−Ｉｂ線における断面図である。(A) And (b) shows the semiconductor device which concerns on one Embodiment of this invention, (a) is sectional drawing, (b) is sectional drawing in the Ib-Ib line | wire of (a). 本発明の一実施形態に係る半導体装置において保護テープを剥離した状態を示す断面図である。It is sectional drawing which shows the state which peeled the protective tape in the semiconductor device which concerns on one Embodiment of this invention. （ａ）及び（ｂ）は本発明の一実施形態に係る半導体装置の変形例を示し、（ａ）は断面図であり、（ｂ）は（ａ）のIIIｂ−IIIｂ線における断面図である。(A) And (b) shows the modification of the semiconductor device which concerns on one Embodiment of this invention, (a) is sectional drawing, (b) is sectional drawing in the IIIb-IIIb line | wire of (a). . 本発明の一実施形態に係る半導体装置の変形例において透光部材を露出させた状態を示す断面図である。It is sectional drawing which shows the state which exposed the translucent member in the modification of the semiconductor device which concerns on one Embodiment of this invention.

符号の説明Explanation of symbols

１１ 半導体チップ
１２ 銀ペースト
１３ 光学素子領域
１５ 接着材
１６ 透光部材
１７ 電極パッド
１８ 金属細線
２１ パッケージ
２１Ａ 基体
２１Ｂ 枠体
２２ 配線
３１ 封止樹脂
４１ 保護テープ
４１ａ 切れ込み部
４２ 粘着材 11 Semiconductor chip 12 Silver paste 13 Optical element region 15 Adhesive material 16 Translucent member 17 Electrode pad 18 Metal thin wire 21 Package 21A Base 21B Frame body 22 Wiring 31 Sealing resin 41 Protective tape 41a Cut portion 42 Adhesive material

Claims (6)

基体と該基体の周縁部に設けられた枠体とを有するパッケージと、
前記基体の上に搭載された半導体チップと、
前記半導体チップと接着された透光部材と、
前記透光部材を囲むように前記枠体内に充填された封止樹脂と、
前記透光部材及び封止樹脂の上面を覆うように粘着材により固定された保護テープとを備え、
前記粘着材は、前記保護テープにおける前記透光部材の上面を覆う部分を除いて設けられていることを特徴とする半導体装置。 A package having a base and a frame provided on the peripheral edge of the base;
A semiconductor chip mounted on the substrate;
A translucent member bonded to the semiconductor chip;
A sealing resin filled in the frame so as to surround the translucent member;
A protective tape fixed with an adhesive material so as to cover the upper surface of the translucent member and the sealing resin,
The said adhesive material is provided except the part which covers the upper surface of the said translucent member in the said protective tape, The semiconductor device characterized by the above-mentioned. 前記保護テープは、前記透光部材の上面を覆う部分と前記封止樹脂の上面を覆う部分との境界領域に切れ込み部を有していることを特徴とする請求項１に記載の半導体装置。   2. The semiconductor device according to claim 1, wherein the protective tape has a cut portion in a boundary region between a portion covering the upper surface of the translucent member and a portion covering the upper surface of the sealing resin. 基体と該基体の周縁部に設けられた枠体とを有するパッケージと、
前記基体の上に搭載された半導体チップと、
前記半導体チップと接着された透光部材と、
前記透光部材を囲むように前記枠体内に充填された封止樹脂と、
前記透光部材の上面を露出するように、前記封止樹脂の上面と粘着材により固定された保護テープとを備えていることを特徴とする半導体装置。 A package having a base and a frame provided on the peripheral edge of the base;
A semiconductor chip mounted on the substrate;
A translucent member bonded to the semiconductor chip;
A sealing resin filled in the frame so as to surround the translucent member;
A semiconductor device comprising: an upper surface of the sealing resin and a protective tape fixed by an adhesive material so as to expose the upper surface of the translucent member. 基体と該基体の周縁部に設けられた枠体とを有するパッケージの前記基体の上に、透光部材を接着した半導体チップを実装した後、前記透光部材を囲むように前記枠体内に封止樹脂を充填する工程（ａ）と、
前記透光部材及び封止樹脂の上面を覆うように、前記透光部材の上面を覆う部分を除いて粘着材を有する保護テープを固定する工程（ｂ）と、
前記工程（ｂ）よりも後に、前記パッケージを基板に実装する工程（ｃ）と、
前記工程（ｃ）よりも後に、前記保護テープにおける少なくとも前記透光部材の上面を覆う部分を除去する工程（ｄ）とを備えていることを特徴とする半導体装置の実装方法。 A semiconductor chip having a translucent member attached thereto is mounted on the base of a package having a base and a frame provided at the peripheral edge of the base, and then sealed in the frame so as to surround the translucent member. A step (a) of filling a stop resin;
A step (b) of fixing a protective tape having an adhesive material except for a portion covering the upper surface of the translucent member so as to cover the upper surface of the translucent member and the sealing resin;
(C) mounting the package on a substrate after the step (b);
A method of mounting a semiconductor device, comprising: a step (d) of removing at least a portion of the protective tape covering the upper surface of the translucent member after the step (c). 前記工程（ｂ）では、前記保護テープとして、前記透光部材の上面を覆う部分と前記封止樹脂の上面を覆う部分との境界領域に切れ込み部を有する保護テープを用い、
前記工程（ｄ）では、前記切れ込み部において前記保護テープの前記透光部材の上面を覆う部分と他の部分とを切り離すことにより、前記透光部材の上面を覆う部分を除去することを特徴とする請求項４に記載の半導体装置の実装方法。 In the step (b), as the protective tape, a protective tape having a notch in a boundary region between a portion covering the upper surface of the translucent member and a portion covering the upper surface of the sealing resin is used.
In the step (d), a portion covering the upper surface of the light transmitting member is removed by separating a portion of the protective tape covering the upper surface of the light transmitting member from the other portion at the cut portion. A method for mounting a semiconductor device according to claim 4. 前記工程（ｄ）では、前記保護テープ全体を剥離することを特徴とする請求項４に記載の半導体装置の実装方法。   The semiconductor device mounting method according to claim 4, wherein in the step (d), the entire protective tape is peeled off.
JP2008288026A 2008-11-10 2008-11-10 Semiconductor device and its mounting method Pending JP2010114382A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101898055B1 (en) * 2017-08-11 2018-09-12 (주)파트론 Optical sensor package and manufacturing method thereof
WO2023112521A1 (en) 2021-12-13 2023-06-22 ソニーセミコンダクタソリューションズ株式会社 Semiconductor device, electronic device and method for producing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101898055B1 (en) * 2017-08-11 2018-09-12 (주)파트론 Optical sensor package and manufacturing method thereof
WO2023112521A1 (en) 2021-12-13 2023-06-22 ソニーセミコンダクタソリューションズ株式会社 Semiconductor device, electronic device and method for producing semiconductor device

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