SG90780A1 - Method and apparatus for dechucking a substrate - Google Patents

Method and apparatus for dechucking a substrate

Info

Publication number
SG90780A1
SG90780A1 SG200104369A SG200104369A SG90780A1 SG 90780 A1 SG90780 A1 SG 90780A1 SG 200104369 A SG200104369 A SG 200104369A SG 200104369 A SG200104369 A SG 200104369A SG 90780 A1 SG90780 A1 SG 90780A1
Authority
SG
Singapore
Prior art keywords
dechucking
substrate
Prior art date
Application number
SG200104369A
Other languages
English (en)
Inventor
Shang Quanyuan
R Harshbarger William
I Greene Robert
Shimizu Ichiro
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24483658&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG90780(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG90780A1 publication Critical patent/SG90780A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
SG200104369A 2000-07-20 2001-07-18 Method and apparatus for dechucking a substrate SG90780A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61987000A 2000-07-20 2000-07-20

Publications (1)

Publication Number Publication Date
SG90780A1 true SG90780A1 (en) 2002-08-20

Family

ID=24483658

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104369A SG90780A1 (en) 2000-07-20 2001-07-18 Method and apparatus for dechucking a substrate

Country Status (5)

Country Link
US (3) US6676761B2 (ko)
EP (1) EP1174910A3 (ko)
JP (1) JP4703050B2 (ko)
KR (2) KR20020008780A (ko)
SG (1) SG90780A1 (ko)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP2002064132A (ja) * 2000-08-22 2002-02-28 Tokyo Electron Ltd 被処理体の受け渡し方法、被処理体の載置機構及びプローブ装置
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
JP2005538566A (ja) * 2002-09-10 2005-12-15 アクセリス テクノロジーズ， インコーポレイテッド 温度固定されたチャックを用いた温度可変プロセスにおける基板の加熱方法
TWI220786B (en) * 2002-09-11 2004-09-01 Au Optronics Corp Supporting structure
US20040096636A1 (en) * 2002-11-18 2004-05-20 Applied Materials, Inc. Lifting glass substrate without center lift pins
KR20040048018A (ko) * 2002-12-02 2004-06-07 주식회사 에이디피엔지니어링 Ｆｐｄ 제조장치
EP1475670B1 (en) * 2003-05-09 2008-10-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1475667A1 (en) 2003-05-09 2004-11-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7083702B2 (en) * 2003-06-12 2006-08-01 Applied Materials, Inc. RF current return path for a large area substrate plasma reactor
EP1491953A1 (en) * 2003-06-23 2004-12-29 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
KR100484017B1 (ko) * 2003-11-11 2005-04-20 주식회사 에이디피엔지니어링 이중 버퍼 및 어라이너가 구비된 로드락 챔버
US7055229B2 (en) * 2003-12-31 2006-06-06 Intel Corporation Support system for semiconductor wafers and methods thereof
US7434712B2 (en) * 2004-07-09 2008-10-14 Blackhawk Industries Product Group Unlimited Llc Hooded holster
US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
US7081042B2 (en) * 2004-07-22 2006-07-25 Applied Materials Substrate removal from polishing tool
US20060156987A1 (en) * 2005-01-18 2006-07-20 Chien-Hsing Lai Lift pin mechanism and substrate carrying device of a process chamber
US7789963B2 (en) * 2005-02-25 2010-09-07 Tokyo Electron Limited Chuck pedestal shield
JP4628964B2 (ja) * 2005-04-26 2011-02-09 大日本スクリーン製造株式会社 基板処理装置
KR100916130B1 (ko) * 2005-12-28 2009-09-08 주식회사 에이디피엔지니어링 평판표시소자 제조장치의 리프트 핀 모듈
JP4906375B2 (ja) * 2006-03-20 2012-03-28 東京応化工業株式会社 基板支持部材
TWI293910B (en) * 2006-06-20 2008-03-01 Cando Corp Fixing board and polishing device using the same
JP4795899B2 (ja) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 基板載置機構および基板受け渡し方法
US7758028B1 (en) * 2006-09-25 2010-07-20 Farlow Douglas T Apparatus for assembling printed circuit boards
US8004293B2 (en) 2006-11-20 2011-08-23 Applied Materials, Inc. Plasma processing chamber with ground member integrity indicator and method for using the same
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
TWI349720B (en) * 2007-05-30 2011-10-01 Ind Tech Res Inst A power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same
US7824146B2 (en) * 2007-09-07 2010-11-02 Advanced Technology Development Facility Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters
JP5347294B2 (ja) * 2007-09-12 2013-11-20 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
FR2930561B1 (fr) * 2008-04-28 2011-01-14 Altatech Semiconductor Dispositif et procede de traitement chimique en phase vapeur.
US8505178B2 (en) * 2008-05-30 2013-08-13 Production Solutions, Inc. Adjustable support tooling apparatus
TW201005825A (en) * 2008-05-30 2010-02-01 Panasonic Corp Plasma processing apparatus and method
JP5261085B2 (ja) * 2008-09-05 2013-08-14 東京エレクトロン株式会社 基板載置機構、基板処理装置、基板載置機構の制御方法及び記憶媒体
JP5683469B2 (ja) * 2008-10-09 2015-03-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 大型プラズマ処理チャンバのｒｆ復路
US20100184290A1 (en) * 2009-01-16 2010-07-22 Applied Materials, Inc. Substrate support with gas introduction openings
US8313612B2 (en) 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
WO2011017226A2 (en) * 2009-08-07 2011-02-10 Applied Materials, Inc. Compound lift pin tip with temperature compensated attachment feature
WO2011136075A1 (ja) * 2010-04-28 2011-11-03 株式会社アルバック 真空処理装置並びに基板とアラインメントマスクの移動方法及び位置合わせ方法並びに成膜方法
CN101812676B (zh) * 2010-05-05 2012-07-25 江苏综艺光伏有限公司 用于半导体太阳能镀膜的工艺腔室
US9435626B2 (en) * 2011-08-12 2016-09-06 Corning Incorporated Kinematic fixture for transparent part metrology
US8777685B2 (en) * 2011-08-15 2014-07-15 Shenzhen China Optoelectronics Technology Co., Ltd. Apparatus and method for assembling backlight module
US8900364B2 (en) * 2011-11-29 2014-12-02 Intermolecular, Inc. High productivity vapor processing system
DE102012215513A1 (de) * 2012-08-31 2014-03-06 J. Schmalz Gmbh Greifvorrichtung
WO2014059304A1 (en) * 2012-10-12 2014-04-17 Sri International Conformable electroadhesive gripping system
US9859145B2 (en) * 2013-07-17 2018-01-02 Lam Research Corporation Cooled pin lifter paddle for semiconductor substrate processing apparatus
JP6320812B2 (ja) * 2014-03-19 2018-05-09 株式会社東芝 圧力センサの製造方法、成膜装置及び熱処理装置
US10892180B2 (en) * 2014-06-02 2021-01-12 Applied Materials, Inc. Lift pin assembly
JP6240042B2 (ja) * 2014-08-05 2017-11-29 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
US10192770B2 (en) 2014-10-03 2019-01-29 Applied Materials, Inc. Spring-loaded pins for susceptor assembly and processing methods using same
US10269557B2 (en) * 2015-10-20 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus of processing semiconductor substrate
CN105845609B (zh) 2016-05-27 2019-08-20 京东方科技集团股份有限公司 支撑设备及支撑方法
JP7030416B2 (ja) * 2017-03-16 2022-03-07 キヤノン株式会社 基板保持装置、リソグラフィ装置、物品の製造方法
KR102339350B1 (ko) * 2017-04-03 2021-12-16 주식회사 미코세라믹스 세라믹 히터
CN109068467A (zh) * 2018-09-18 2018-12-21 张家港康得新光电材料有限公司 一种除静电装置及除静电方法
CN111261573B (zh) * 2020-01-20 2024-02-27 京东方科技集团股份有限公司 支撑架、真空干燥装置、干燥系统、基板干燥方法
JP2021180298A (ja) * 2020-05-15 2021-11-18 東京エレクトロン株式会社 接合装置および接合方法
US20220106683A1 (en) * 2020-10-01 2022-04-07 Applied Materials, Inc. Apparatus and methods to transfer substrates into and out of a spatial multi-substrate processing tool
CN112605787B (zh) * 2020-12-14 2022-02-15 凯盛科技股份有限公司蚌埠华益分公司 用于k9玻璃加工超薄玻璃的抛光盘及抛光设备
USD980884S1 (en) 2021-03-02 2023-03-14 Applied Materials, Inc. Lift pin
CN113199645A (zh) * 2021-05-25 2021-08-03 关鸿 一种辅助钻孔器
US20230197495A1 (en) * 2021-12-16 2023-06-22 Applied Materials, Inc. Substrate support gap pumping to prevent glow discharge and light-up

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5380566A (en) * 1993-06-21 1995-01-10 Applied Materials, Inc. Method of limiting sticking of body to susceptor in a deposition treatment
EP0798775A2 (en) * 1996-03-26 1997-10-01 Nec Corporation Semiconductor wafer chucking device and method for removing semiconductor wafer
US5677824A (en) * 1995-11-24 1997-10-14 Nec Corporation Electrostatic chuck with mechanism for lifting up the peripheral of a substrate
US6183189B1 (en) * 1998-11-27 2001-02-06 Chartered Semiconductor Manufacturing, Ltd. Self aligning wafer chuck design for wafer processing tools
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3817402A (en) * 1970-10-08 1974-06-18 California Injection Molding C Molding articles containing inserts
US5374147A (en) * 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
US4556362A (en) * 1983-12-21 1985-12-03 At&T Technologies, Inc. Methods of and apparatus for handling semiconductor devices
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置
US4776745A (en) * 1987-01-27 1988-10-11 The United States Of America As Represented By The Secretary Of The Air Force Substrate handling system
JP2508540B2 (ja) 1987-11-02 1996-06-19 三菱マテリアル株式会社 ウェ―ハの位置検出装置
KR0155545B1 (ko) * 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
US4994650A (en) * 1989-12-01 1991-02-19 Ppg Industries, Inc. Electric field detector for a heatable windshield
CA2031776A1 (en) * 1989-12-08 1991-06-09 Masanori Nishiguchi Pickup method and the pickup apparatus for chip-type part
US5197089A (en) * 1990-05-21 1993-03-23 Hampshire Instruments, Inc. Pin chuck for lithography system
JP3238432B2 (ja) * 1991-08-27 2001-12-17 東芝機械株式会社 マルチチャンバ型枚葉処理装置
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5345639A (en) * 1992-05-28 1994-09-13 Tokyo Electron Limited Device and method for scrubbing and cleaning substrate
US5352294A (en) * 1993-01-28 1994-10-04 White John M Alignment of a shadow frame and large flat substrates on a support
JP2662365B2 (ja) 1993-01-28 1997-10-08 アプライド マテリアルズ インコーポレイテッド 改良された排出システムを有する単一基板式の真空処理装置
US5665167A (en) * 1993-02-16 1997-09-09 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus having a workpiece-side electrode grounding circuit
US5421893A (en) * 1993-02-26 1995-06-06 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
JPH0799162A (ja) * 1993-06-21 1995-04-11 Hitachi Ltd Ｃｖｄリアクタ装置
GB2285759B (en) * 1994-01-05 1998-01-07 Murata Manufacturing Co Apparatus for pushing chip components into holding plate
JP3671379B2 (ja) * 1994-02-03 2005-07-13 アネルバ株式会社 静電吸着された被処理基板の離脱機構を持つプラズマ処理装置および静電吸着された被処理基板の離脱方法
US5518593A (en) 1994-04-29 1996-05-21 Applied Komatsu Technology, Inc. Shield configuration for vacuum chamber
JP3052116B2 (ja) * 1994-10-26 2000-06-12 東京エレクトロン株式会社 熱処理装置
US5558717A (en) * 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
JP3151118B2 (ja) * 1995-03-01 2001-04-03 東京エレクトロン株式会社 熱処理装置
JP3350278B2 (ja) * 1995-03-06 2002-11-25 大日本スクリーン製造株式会社 基板処理装置
US6193506B1 (en) * 1995-05-24 2001-02-27 Brooks Automation, Inc. Apparatus and method for batch thermal conditioning of substrates
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
US5605574A (en) * 1995-09-20 1997-02-25 Kabushiki Kaisha Toshiba Semiconductor wafer support apparatus and method
JP3477953B2 (ja) * 1995-10-18 2003-12-10 東京エレクトロン株式会社 熱処理装置
US6140256A (en) * 1995-11-28 2000-10-31 Tokyo Electron Limited Method and device for treating semiconductor with treating gas while substrate is heated
KR100245260B1 (ko) * 1996-02-16 2000-02-15 엔도 마코토 반도체 제조장치의 기판 가열장치
JP3462657B2 (ja) * 1996-02-29 2003-11-05 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
JPH09266241A (ja) * 1996-03-29 1997-10-07 Nikon Corp 基板支持装置
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US5788778A (en) 1996-09-16 1998-08-04 Applied Komatsu Technology, Inc. Deposition chamber cleaning technique using a high power remote excitation source
US5788776A (en) * 1996-12-02 1998-08-04 Chorus Corporation Molecular beam epitaxy isolation tube system
US5983906A (en) 1997-01-24 1999-11-16 Applied Materials, Inc. Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
KR100284567B1 (ko) * 1997-04-15 2001-04-02 후지이 아키히로 수직 웨이퍼 보트
US6177023B1 (en) * 1997-07-11 2001-01-23 Applied Komatsu Technology, Inc. Method and apparatus for electrostatically maintaining substrate flatness
US6002840A (en) 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
US5964391A (en) * 1997-10-24 1999-10-12 E. I. Du Pont De Nemours And Company Wrap detection device
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6077026A (en) * 1998-03-30 2000-06-20 Progressive System Technologies, Inc. Programmable substrate support for a substrate positioning system
US6596086B1 (en) * 1998-04-28 2003-07-22 Shin-Etsu Handotai Co., Ltd. Apparatus for thin film growth
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6146504A (en) * 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
US6109677A (en) 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
JP3874960B2 (ja) 1999-04-02 2007-01-31 東京エレクトロン株式会社 基板処理装置
US6187134B1 (en) * 1999-07-09 2001-02-13 The Board Of Trustees Of The Leland Stanford Junior University Reusable wafer support for semiconductor processing
US6432255B1 (en) * 2000-01-31 2002-08-13 Applied Materials, Inc. Method and apparatus for enhancing chamber cleaning
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP2002064132A (ja) * 2000-08-22 2002-02-28 Tokyo Electron Ltd 被処理体の受け渡し方法、被処理体の載置機構及びプローブ装置
KR100378187B1 (ko) * 2000-11-09 2003-03-29 삼성전자주식회사 정전척을 구비한 웨이퍼 지지대 및 이를 이용한 웨이퍼 디척킹 방법
US6887317B2 (en) * 2002-09-10 2005-05-03 Applied Materials, Inc. Reduced friction lift pin
US20040096636A1 (en) * 2002-11-18 2004-05-20 Applied Materials, Inc. Lifting glass substrate without center lift pins
US7083702B2 (en) * 2003-06-12 2006-08-01 Applied Materials, Inc. RF current return path for a large area substrate plasma reactor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5380566A (en) * 1993-06-21 1995-01-10 Applied Materials, Inc. Method of limiting sticking of body to susceptor in a deposition treatment
US5677824A (en) * 1995-11-24 1997-10-14 Nec Corporation Electrostatic chuck with mechanism for lifting up the peripheral of a substrate
EP0798775A2 (en) * 1996-03-26 1997-10-01 Nec Corporation Semiconductor wafer chucking device and method for removing semiconductor wafer
US6183189B1 (en) * 1998-11-27 2001-02-06 Chartered Semiconductor Manufacturing, Ltd. Self aligning wafer chuck design for wafer processing tools
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting

Also Published As

Publication number Publication date
US20030079691A1 (en) 2003-05-01
US7160392B2 (en) 2007-01-09
US20040089239A1 (en) 2004-05-13
KR20020008780A (ko) 2002-01-31
EP1174910A3 (en) 2010-01-06
EP1174910A2 (en) 2002-01-23
US6676761B2 (en) 2004-01-13
KR100636487B1 (ko) 2006-10-18
KR20050091673A (ko) 2005-09-15
US20070062454A1 (en) 2007-03-22
JP4703050B2 (ja) 2011-06-15
JP2002151581A (ja) 2002-05-24

Similar Documents

Publication Publication Date Title
SG90780A1 (en) Method and apparatus for dechucking a substrate
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
SG97931A1 (en) Method and apparatus for manufacturing a device
GB2361808B (en) Methods and apparatus for forming a film on a substrate
WO2002013237A3 (en) METHOD AND APPARATUS FOR A WAFER HOLDER WITH A TRIM
EP1196944B8 (en) Apparatus and method for transferring a workpiece
GB2405534B (en) Method and apparatus for supporting a substrate
AU2002305120A1 (en) Method and apparatus for transferring a credit
EP1308992A4 (en) DEVICE AND METHOD FOR TREATING SUBSTRATES
GB2364121B (en) Method and apparatus for locating a talker
IL149542A0 (en) A method for degrading a substrate
SG107570A1 (en) Substrate feeding device and method
GB2355992B (en) Method and apparatus for forming a film on a substrate
GB2356786B (en) Method and apparatus for aligning a crystalline substrate
AU2002329860A1 (en) Method and apparatus for sensing a wafer in a carrier
GB9812850D0 (en) A method and apparatus for dechucking
AU2003237738A1 (en) Method and device for transferring a pattern
AU2002367224A1 (en) Apparatus and method for electroplating a wafer surface
SG93932A1 (en) Method and apparatus for drying a substrate
GB2365117B (en) Method of and apparatus for heating a substrate
GB0012754D0 (en) Apparatus for forming interconnects on a substrate and related method
AU6075000A (en) Apparatus and method for handling a wafer
GB9912376D0 (en) A method and apparatus for etching a substrate
GB2355268B (en) A method and apparatus for manufacturing paint
AU4438401A (en) Apparatus and a method for solving problems