JP4906375B2 - 基板支持部材 - Google Patents
基板支持部材 Download PDFInfo
- Publication number
- JP4906375B2 JP4906375B2 JP2006075841A JP2006075841A JP4906375B2 JP 4906375 B2 JP4906375 B2 JP 4906375B2 JP 2006075841 A JP2006075841 A JP 2006075841A JP 2006075841 A JP2006075841 A JP 2006075841A JP 4906375 B2 JP4906375 B2 JP 4906375B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tip
- support member
- substrate support
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 132
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 206010004542 Bezoar Diseases 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Description
特許文献1においては、東レ・デュポン社(登録商標)製のカプトン(登録商標)等のポリイミド樹脂からなるプロキシミティピンを用いて、基板をプロキシミティピン上に載置して熱処理を行う基板加熱装置が開示されている。
なお図2に示す状態では、コイルスプリング12が縮んで先端部8の下端がチューブ10の上端にひっかかっており、図示しないが載置台1上に基板Wが載置されている状態を示している。因みに載置台1上から基板Wがはずされた状態は、コイルスプリング12が伸びて先端部8の下端がチューブの上端から離れた状態となる。
さらに逆円錐形状の場合は、例えば円柱形状の場合と比較して長さ方向において全ての径が同径ではないので(長さ方向にいくに従って径が短くなる)、部分的に貫通孔5の側壁(内壁)と支持ピン7の先端部8側面との間に隙間が形成される。これにより支持ピン7が載置台1の貫通孔5内に収まる際に貫通孔5の測壁へ接触する危険性を低くできる。
Claims (4)
- 基板載置部材上で基板を支持するために、前記基板載置部材に形成された貫通孔より出没可能とされた基板支持部材であって、この基板支持部材は前記貫通孔に昇降自在に挿入されるロッド11と、基板の裏面を支持するため前記ロッドの小径先端部11aに昇降可能に取り付けられた先端部8と、前記小径先端部11aの周囲で前記先端部8の下端と前記小径先端部11a下端との間に前記先端部8を上方に付勢すべく装着されたコイルスプリング12と、前記ロッド11の外側に配置される間隔調整用のチューブ10とからなり、前記コイルスプリング12は前記先端部8に基板が載置されていない場合には前記先端部8を押し上げ、前記先端部8に基板が載置されている場合には前記先端部8と基板の重みで沈むスプリング定数とされ、これにより前記ロッド11が降下して基板を前記基板載置部材上に載置した際に前記先端部8が前記基板載置部材上面と面一となって基板裏面との接触状態を維持することを特徴とする基板支持部材。
- 請求項1に記載の基板支持部材において、前記基板支持部材の先端がアルミニウム又は樹脂から成ることを特徴とする基板支持部材。
- 請求項1に記載の基板支持部材において、前記基板支持部材の先端部が円柱形状であることを特徴とする基板支持部材。
- 請求項1に記載の基板支持部材において、前記基板支持部材の先端部が逆円錐形状であることを特徴とする基板支持部材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006075841A JP4906375B2 (ja) | 2006-03-20 | 2006-03-20 | 基板支持部材 |
TW096107558A TW200802683A (en) | 2006-03-20 | 2007-03-05 | Member for supporting substrate |
KR1020070024790A KR100948759B1 (ko) | 2006-03-20 | 2007-03-14 | 기판 지지부재 |
CNA2007100875094A CN101043014A (zh) | 2006-03-20 | 2007-03-16 | 基板支承构件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006075841A JP4906375B2 (ja) | 2006-03-20 | 2006-03-20 | 基板支持部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007251073A JP2007251073A (ja) | 2007-09-27 |
JP4906375B2 true JP4906375B2 (ja) | 2012-03-28 |
Family
ID=38595009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006075841A Active JP4906375B2 (ja) | 2006-03-20 | 2006-03-20 | 基板支持部材 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4906375B2 (ja) |
KR (1) | KR100948759B1 (ja) |
CN (1) | CN101043014A (ja) |
TW (1) | TW200802683A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018006362A (ja) * | 2016-06-27 | 2018-01-11 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100968814B1 (ko) | 2008-05-14 | 2010-07-08 | 세메스 주식회사 | 리프트 핀 구조체 및 이를 구비하는 기판 처리 장치 |
JP2010087343A (ja) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | 基板処理装置及び基板載置方法 |
JP2010087342A (ja) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | リフトピン |
KR101715147B1 (ko) * | 2015-07-24 | 2017-03-14 | 주식회사 선익시스템 | 글라스기판처짐보완장치를 포함하는 버퍼챔버 |
CN106311525A (zh) * | 2016-08-23 | 2017-01-11 | 豪威光电子科技(上海)有限公司 | 涂胶工艺 |
US10784142B2 (en) * | 2018-01-09 | 2020-09-22 | Varian Semiconductor Equipment Associates, Inc. | Lift pin system for wafer handling |
CN111312653B (zh) * | 2020-03-16 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 晶片承载装置及半导体加工设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3028462B2 (ja) * | 1995-05-12 | 2000-04-04 | 東京エレクトロン株式会社 | 熱処理装置 |
JP3343012B2 (ja) * | 1995-12-25 | 2002-11-11 | 大日本スクリーン製造株式会社 | 回転式基板処理装置 |
JP3881062B2 (ja) * | 1996-08-14 | 2007-02-14 | 大日本スクリーン製造株式会社 | 基板保持機構および基板処理装置 |
KR100493011B1 (ko) * | 1998-10-13 | 2005-08-01 | 삼성전자주식회사 | 디스크 사이트에 결합되어 있는 슬라이드 핀을 갖춘 웨이퍼 핸들러 시스템 |
JP2000237983A (ja) * | 1999-02-22 | 2000-09-05 | Hitachi Electronics Eng Co Ltd | 基板チャック装置 |
EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
JP2002093890A (ja) * | 2000-09-19 | 2002-03-29 | Olympus Optical Co Ltd | リフトピン及びステージ装置 |
JP2004059116A (ja) * | 2002-07-31 | 2004-02-26 | Sharp Corp | ディスプレイ用基板収納用トレイ及びディスプレイ用基板の取り出し機構並びにディスプレイ用基板の取り出し方法 |
US8033245B2 (en) * | 2004-02-12 | 2011-10-11 | Applied Materials, Inc. | Substrate support bushing |
-
2006
- 2006-03-20 JP JP2006075841A patent/JP4906375B2/ja active Active
-
2007
- 2007-03-05 TW TW096107558A patent/TW200802683A/zh unknown
- 2007-03-14 KR KR1020070024790A patent/KR100948759B1/ko active IP Right Grant
- 2007-03-16 CN CNA2007100875094A patent/CN101043014A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018006362A (ja) * | 2016-06-27 | 2018-01-11 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
US10263167B2 (en) | 2016-06-27 | 2019-04-16 | Nichia Corporation | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWI364811B (ja) | 2012-05-21 |
CN101043014A (zh) | 2007-09-26 |
KR100948759B1 (ko) | 2010-03-23 |
JP2007251073A (ja) | 2007-09-27 |
TW200802683A (en) | 2008-01-01 |
KR20070095197A (ko) | 2007-09-28 |
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