SG93932A1 - Method and apparatus for drying a substrate - Google Patents

Method and apparatus for drying a substrate

Info

Publication number
SG93932A1
SG93932A1 SG200201727A SG200201727A SG93932A1 SG 93932 A1 SG93932 A1 SG 93932A1 SG 200201727 A SG200201727 A SG 200201727A SG 200201727 A SG200201727 A SG 200201727A SG 93932 A1 SG93932 A1 SG 93932A1
Authority
SG
Singapore
Prior art keywords
drying
substrate
Prior art date
Application number
SG200201727A
Inventor
Rosano Michael
Asif Muhammad
Pui Chi Fung Robert
Original Assignee
Komag Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/837,536 external-priority patent/US6571806B2/en
Application filed by Komag Inc filed Critical Komag Inc
Publication of SG93932A1 publication Critical patent/SG93932A1/en

Links

SG200201727A 2001-04-17 2002-03-26 Method and apparatus for drying a substrate SG93932A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/837,536 US6571806B2 (en) 1998-09-04 2001-04-17 Method for drying a substrate

Publications (1)

Publication Number Publication Date
SG93932A1 true SG93932A1 (en) 2003-01-21

Family

ID=25274745

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200201727A SG93932A1 (en) 2001-04-17 2002-03-26 Method and apparatus for drying a substrate

Country Status (4)

Country Link
JP (2) JP2003031544A (en)
MY (1) MY140644A (en)
SG (1) SG93932A1 (en)
TW (1) TW541573B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080066339A1 (en) * 2006-09-14 2008-03-20 Mike Wallis Apparatus and method for drying a substrate
CN110544654B (en) * 2019-08-27 2022-04-15 西安奕斯伟材料科技有限公司 Silicon wafer processing device and method
CN116678188B (en) * 2023-08-03 2023-10-10 福建省德化县信良陶瓷有限公司 Ceramic body drying device and drying method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05290373A (en) * 1992-04-03 1993-11-05 Hitachi Electron Eng Co Ltd Disk cleaner
JPH11168080A (en) * 1997-12-04 1999-06-22 Sony Corp Device and method of washing
JP2962705B1 (en) * 1998-04-27 1999-10-12 株式会社ダン科学 Substrate drying apparatus and drying method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5902402A (en) * 1995-01-05 1999-05-11 Steag Microtech Gmbh Device for chemical wet treatment
US5884640A (en) * 1997-08-07 1999-03-23 Applied Materials, Inc. Method and apparatus for drying substrates

Also Published As

Publication number Publication date
JP4599386B2 (en) 2010-12-15
JP2008118148A (en) 2008-05-22
JP2003031544A (en) 2003-01-31
MY140644A (en) 2010-01-15
TW541573B (en) 2003-07-11

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