541573 A7 B7___ 五、發明説明（1 ) 發明背景 本發明係關於用於乾燥一諸如使用在磁盤或積體電路 製造上之基材之工作件的方法和裝置。 在許多製造過程中其必需用一液體處理一工作件，然 後乾燥此工作件。例如，在製造磁盤的過程中，一般係執 行下述的製造步驟·· 1 ·首先，一鎳磷層被塗敷在一鋁基材上； 2.此鎳磷層被拋光及組織； 3 ·此基材被清潔、漂洗及乾燥； 4.數層被賤射至基材上，例如被濺射聚氯乙烯長絲或鉻的 一底基層，一磁盤鈷合金和一防護的與氫化合鈷外套。 這種過程的一例子描述在美國專利第6150015號，其頒 予Bertero等，且與此合併作為參照。 立刻地在此濺射前，此基材被清潔，然後乾燥。非常 重要的是當此基材被乾燥時，不應該有任何污染物遺留在 其表面上。 許多其他的製造過程需要乾燥一工作件。例如，在不 同半導體製造過程步驟中，半導體晶圓被浸在_液體中， 然後被乾燥。非常重要的是乾燥後沒有污染物在這些晶圓 的表面上。 々用來乾燥半導體晶圓的—裝置被描述於歐洲專利申請 案第〇385536號。在此第536號裝置中，一晶圓被浸在液^ 中’然後=乾燥過程甲蒸氣幫助的情況下，慢慢地從液體 中移離。療氣和液體的共同操作產生了所謂的馬蘭各尼效 本紙張尺度適用中國國家標準（⑶幻規格（2】〇χ297公爱） (請先閲讀背面之注意事項再填寫本頁) ，裝· 、τ. 線------ 4 541573 A7 _B7_ 五、發明説明（2 ) 應，其加速乾燥晶圓。在此第536號裝置中，一”刀型構件” 推動此晶圓離開液體且進入一晶圓可被乾燥的區域中。 (請先閲讀背面之注意事項再填寫本頁) 用來乾燥半導體晶圓的另一裝置描述在美國專利第 5569330號，其頒予Schild等。Schild也教授一結構，其推 動一晶圓離開液體且進入一晶圓可被乾燥的區域。 在一些習知乾燥過程中，一晶圓在其乾燥時藉由一夾 持結構被夾持。此有遺留一些沾染物的可能性或藉由夾持 結構夾持乾燥晶圓的那一點有遺留乾燥痕跡。用來處理這 些問題的一裝置描述在美國專利第5884640號，其頒予 Fishkin等。在Fishkin的乾燥裝置中，除了推動一晶圓離開 一液體容納池外，此液體也從池中排出。當液面相對於晶 圓降低時，此晶圓被夾持在不同點以致使當晶圓的部分被 乾燥時，這些部分沒有與一夾持結構做機械式的接觸。 美國專利第4722752號，其頒予Steck，描述用來乾燥 晶圓的另一裝置。Steck的裝置包含兩個能夠舉起晶圓而不 與液體接觸的支撐結構。一第一結構（包括在Steck第5圖的 棒34)舉起Steck的晶圓24部分地不與液體接觸。在此過程 中，一盒子25被浸入至液體中。然後，Steck推動盒子25 離開此液體。最後地，盒子25乾燥且其後與晶圓24的乾燥 部分接觸。Steck必需在盒子25離開而不與液體接觸的時間 及盒子25與晶圓24接觸的時間之間有足夠的時間，以便於 可乾燥此盒子25。此可能性限制了整個Steck的元件。 發明簡述 根據本發明用於乾燥一工作件的方法包括使用一第一 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） B7 541573 五、發明說明（3 夹持結構舉起此工作件離開液體槽，直到工作件的一第一 部分延伸離開此液體。（在此難中的此刻，此工作件的一 第二部分仍然在液體内。）在此方法之部分過程中，此第一 夹持結構被浸在液體中，且與第一夾持結構接觸之工作件 ^此部分被浸在液體中。乾燥此工作件延伸離開液體的那 立部分。-第二央持結構抓住此工作件延伸離開液體的乾燥 # m«此卫作件離開而不與此第_夾持結構和 液體接觸。（舉起此工作件之第二夹持結構的部分被乾焊， 且—般地，此第二夾持結構的部分不曾浸入至液體内。在 -具體實施例中，此第二夾持結構沒有任何部分浸入至液 體内。）然後乾燥此卫作件的第二部分。在—具體實施例 中，沒有任何時後此工作件的一乾燥部分與一夾持結構相 ^觸。因此’產生乾燥標記或沾染物在工作件上的機會減 根據本發明之-方法的另一優點為，因為第二央持结 構不曾浸在液體内，所以在其可抓住此工作件前不需要等 到第二线結構錢。因此，根據本發明的 前述Steck的方法更有效應。 』望比 在一具體實施例中，此工作件為一用來製造_磁盤的 基材。此工作件可以為一鎳嶙塗敷銘合金、玻璃、玻璃陶 竟或其他材料。在乾燥後’不同層例如一基底層、一磁碟 層和保β蒦層被設置（例如藉由滅射，CVD、PECvd或其 他技術)在此工作件上。然而’此工作件可以是諸如半導體 曰曰固結構的另^一型式。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐）541573 A7 B7___ V. Description of the Invention (1) Background of the Invention The present invention relates to a method and apparatus for drying a work piece such as a substrate used in the manufacture of magnetic disks or integrated circuits. In many manufacturing processes it is necessary to treat a work piece with a liquid and then dry the work piece. For example, in the process of manufacturing magnetic disks, the following manufacturing steps are generally performed ... 1 · First, a nickel-phosphorus layer is coated on an aluminum substrate; 2. The nickel-phosphorus layer is polished and organized; 3 · The substrate is cleaned, rinsed, and dried; 4. Several layers are shot onto the substrate, such as a base layer of sputtered polyvinyl chloride filament or chromium, a magnetic disk cobalt alloy, and a protective cobalt hydride coat. An example of this process is described in U.S. Patent No. 6150015, issued to Bertero et al., And incorporated herein by reference. Immediately before this sputtering, the substrate was cleaned and then dried. It is very important that no contaminants remain on the surface when this substrate is dried. Many other manufacturing processes require drying a work piece. For example, during different semiconductor manufacturing process steps, semiconductor wafers are immersed in liquid and then dried. It is very important that no contaminants are on the surface of these wafers after drying. The device for drying semiconductor wafers is described in European Patent Application No. 0385536. In this device No. 536, a wafer is immersed in the liquid ^ 'and then slowly removed from the liquid with the help of nail vapor during the drying process. The joint operation of healing gas and liquid produced the so-called Malangoni effect. The paper size is applicable to the Chinese national standard (3) (Magic Specification (2) 0 × 297 public love) (Please read the precautions on the back before filling this page). , Τ. Line ------ 4 541573 A7 _B7_ V. Description of the invention (2) It should accelerate the drying of wafers. In this device No. 536, a "knife member" pushes this wafer away from the liquid and Enter an area where a wafer can be dried. (Please read the precautions on the back before filling out this page.) Another device for drying semiconductor wafers is described in US Patent No. 5,569,330, which was awarded to Schild et al. Schild also Teach a structure that pushes a wafer out of liquid and into a region where a wafer can be dried. In some conventional drying processes, a wafer is held by a holding structure while it is drying. This is left over The possibility of some contamination, or the point at which the dry wafer is held by the holding structure, leaves traces of dryness. A device to deal with these problems is described in US Patent No. 5,884,640, issued to Fishkin et al. In the drying device In addition to pushing a wafer out of a liquid containing cell, the liquid is also discharged from the cell. When the liquid level is lowered relative to the wafer, the wafer is clamped at different points so that when a portion of the wafer is dried, These parts do not make mechanical contact with a clamping structure. US Patent No. 4,727,252, issued to Steck, describes another device for drying wafers. Steck's device contains two devices that can lift the wafer without contacting it. Liquid contact support structure. A first structure (including rod 34 in Figure 5 of Steck) lifts Steck's wafer 24 partially out of contact with the liquid. In the process, a box 25 is immersed in the liquid. Then Steck pushes the box 25 out of the liquid. Finally, the box 25 dries and then comes into contact with the dry part of the wafer 24. Steck must wait for the time when the box 25 leaves without contacting the liquid and the time for the box 25 to contact the wafer 24 There is sufficient time between them to allow the box 25 to be dried. This possibility limits the components of the entire Steck. SUMMARY OF THE INVENTION The method for drying a work piece according to the present invention includes using a first paper size Use Chinese National Standard (CNS) A4 specification (210X297 mm) B7 541573 V. Description of invention (3 The clamping structure lifts the work piece out of the liquid tank until a first part of the work piece extends away from the liquid. (It is difficult here At this moment, a second part of the work piece is still in the liquid.) During part of this method, the first holding structure is immersed in the liquid and is in contact with the first holding structure ^ This part is immersed in the liquid. Dry the work piece that extends away from the liquid.- The second central holding structure grabs the work piece and extends away from the liquid to dry # m «This guard piece leaves without leaving this section_ The clamping structure is in contact with the liquid. (The portion of the second clamping structure that lifts the work piece is dry-welded, and generally, the portion of the second clamping structure has not been immersed in the liquid. In a specific embodiment, the second clamping structure No part is submerged in the liquid.) Then dry the second part of the guard. In a specific embodiment, there is no time when a dry part of the work piece comes into contact with a clamping structure. Therefore, the chance of producing dry marks or contamination on the work piece is reduced. Another advantage of the method according to the invention is that because the second holding structure has never been immersed in liquid, it does not Need to wait until the second line structure money. Therefore, the aforementioned Steck method according to the present invention is more effective. Wangbi In a specific embodiment, the work piece is a substrate for manufacturing magnetic disks. The work piece can be a nickel-coated alloy, glass, glass ceramic, or other material. After drying, different layers such as a substrate layer, a magnetic disk layer, and a β 蒦 layer are provided (for example, by extinction, CVD, PECvd, or other techniques) on the work piece. However, this work piece may be another type such as a semiconductor solid structure. This paper size applies to China National Standard (CNS) A4 (210X297 mm)
(請先閲· 讀背面之注意事項再填寫本頁) •訂— 6 541573 A7 B7__ 五、發明說明（4 ) ' 在一具體實施例中，數個（或許多）工作件同時地被乾 燥。 在一具體實施例中，此工作件在其頂端碰到液體表面 的時間過程中以一第一速度被升起。此工作件在其頂端衝 破液體表面後以一第二速度被升起。此第一速度較第二速 度慢。此外，在一具體實施例中，當工作件的底部衝破此 液體表面的時間過程中，其以一第三速度升起。此第三速 度較第二速度慢。對此的理由為工作件的不同部分乾燥於 不同的速率。藉由調整此工作件被升起的速度以符合基材 不同部分的乾燥速率，而改善乾燥此工作件的全部速度。 此工作件可以是一具有一中央定位開口的基材。在這 種具體實施例中，在此中央定位開口之頂端衝破液體表面 的時間和此中央定位開口之底部衝破液體表面的時間之 間，此工作件以一第四速度升起。此第四速度一般地較為 了如上所述之理由而產生的第二速度慢。在此中央定位開 口之頂端衝破液體表面後，但在此中央定位開口之底部衝 破液體表面前，此基材以一第五速度升起。此第五速度一 叙地較第四速度慢。可擇地，此第五和第二速度可以相同。 此第一、第三和第四速度也可以相同。如上所述，此基材 升起的速度被模組化，以在基材之頂端和底部及此中央定 位開口之頂端和底部衝破液體表面的時間之間，說明此基 材乾燥的事實。 在一具體實施例中，一氣體或蒸氣被設置在此液體頂 表面上方以加速乾燥。在一具體實施例中，此蒸氣包括 本、，，氏張尺度適用中國國家標準从規格⑵狀Μ7公楚） (請先閲讀背面之注意事項再填寫本頁) 裝— ·、^τ— ，線- 541573 A7 -------^___ __ 五、發明説明（5 ) ---- IPA(異丙基乙醇）’但也可使用其他材料，例如丙綱。因此， 本發明的-具體實施例可使用上述的馬蘭各尼效應。 1式簡要說明 第1至第9圖例示根據本發明乾燥—基材的裝置。 第10圖例示一基材的平視圖。 第11圖例示根據本發明具體實施例之裝i，其與第i 至第9圖之平面垂直的橫截面圖。 詳細說 根據本發明具體實施例的方法，其用於乾燥一工作 件’例如一碟片型工作件，如第】圖所示之基材ι〇。基材 可以疋一用來製造一磁盤的基材。在一具體實施例中，基 材10可以疋-塗敷有一鎳碟合金的銘合金，例如玻璃或玻 璃陶兗。基材10-般地有一中央定位開口 12。在習知技藝 中，於製造結束時，此碟片安裝在一心軸（未顯示）上，且 開口 12位於碟片附加至此心軸的位置。 在製造的過程中，意欲攜帶基材10進入而與液體接觸 (例如清潔或漂洗基材10)，然後乾燥此基材10。因此，在 基材10已/文在一谷納一液體（未顯示）的第一槽後，其被移 動至一乾燥裝置13，在那裡其可以一方式被乾燥以減少表 面沾柒物的可能性。裝置丨3包括一容納一槽丨5的容器丨4， 此槽裝盛一液體例如水16(第丨圖）。（水16可以是去離子 水’且可有一位於室内溫度和大約6〇度間的溫度。然而， 也可使用其他液體和其他溫度。）如上所述，在此過程中， 意欲以一避免或減少乾燥標記或其他沾染物沉積在基材10 本紙張尺度適辭關轉準（_ Μ規格⑵狀撕公幻 (請先閲讀背面之注意事項再填寫本頁) C- 、\-ΰ 541573 A7 — —' _— B7 五、發明説明（6 ) 上的方式乾燥基材10。根據本發明的一方法促進達成此目 標。 關於第1圖，一來回穿梭裝置18攜帶基材1〇至一適當的 位置以使基材10超過槽15。當基材1〇超過槽15時，一蓋子 20依箭頭A的方向移動。一第一夾持器22向上移動（箭頭b) 而使其22位於適當的位置以夾持基材1〇。（在一具體實施例 中，夾持器22以一位於丨.0至2〇mm/秒間的速度向上移動。） 臂18a，18b向外移動（箭頭C，D)以藉此鬆開基材忉。在操作 的此刻，基材10藉由第一夾持器22夾持。（適當的延遲可被 插入此機械操縱以確保在來回穿梭裝置丨8釋放基材丨〇前， 夾持器22在適當的位置。） 在一具體實施例中，第一夾持器22夾持基材1〇於五個 接觸點22a-22e。然而，在另一具體實施例中，可有不同數 量的接觸點。 然後第一夾持器22降低基材1〇(方向E)進入槽15，藉此 將基材10浸入水16中（參第2圖）。此降低可以一相對較高的 速度（再次，於1.0至20mm/秒間）。基材10可保持浸在水16 中大約300秒。可擇地，在操作此部分的過程中，水16可被 機械式地攪:動以促進一清潔的過程。此攪動可以是超音波 或百萬音波。（百萬音波的攪動是非常高頻率的擾動。）蓋 子20依一方向F移動以關閉位於室24内的槽15。 其後，第一夾持器22開始以一第一相對較高的速度升 起基材10(參第3圖之箭頭G)。此第一速度大約為1至2〇mm/ 秒。在基材10的頂表面10t衝破水16的表面i6t前，夾持器 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) ··裝， 、訂— 9 541573 A7 發明説明 請 ！ 先 · 閲·： 讀' : 背 •丨 面 .1 之-· 注 ί 意 I 事 ： 項 ： 再 麄 f JP 寫裝 本 ： 頁 ： 22的速度減慢至一較低的第二速度，例如在大約0.2和 h〇mm/秒之間。此逮度持續到基材1〇的頂端10t通過水16 的頂表面16t後（參第3圖）。在升起基材丨〗前開始且持續貫 穿整個基材10的升起，—包含„^的蒸氣被注人至室⑽ 以加速基材10的乾燥，且促進上述的馬蘭各尼效應。在一 具體實施例巾，IPA藉由產生冒氣泡氣穿過異丙基乙醇以 形成一 IPA蒸氣。此蒸氣穿過在蓋子2〇底表面2〇b之，，蓮蓬 頭開口”或孔洞（未顯示）而注入。 訂 在基材10之頂端l〇t通過水16的表面16t後，夾持器22 升起基材10的速率增加至一相對較快的速度，例如大約在 1·〇和2〇mm/秒間。夾持器22以此增加的速率持續升起基材 10直到開口 12的頂端I2t大約通過水16的頂端I6t。於此 時，夾持器22升起基材1〇的速率再次下降，例如在ο』和 20mm/秒間。在開口 12的頂端12t通過水16的頂端丨以後，再 次’夾持器22的升起速度增加至較快的速度，例如在j ·〇 和20mm/秒間。對於基材升起速度上的改變有下述的優 點。基材10之部分P2，P4和P6(第10圖）的乾燥速率大於基材 10之部分P1和P3(分別位於基材1〇的頂端1〇t和開口 12的頂 端12t)的乾燥速率。因為基材1〇的升起速度是變動的以符 合基材10不同部分的乾燥速率，所以改善了乾燥過程的所 有速度。 開口 12之底部12b和基材10之底部i〇b的乾燥速率也小 於基材部分P2，P4和P6的乾燥速率。因此基材10升起的速 度，如基材之部份P5和P7通過水16表面16t的速度，也被減 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 10 541573 A7 - ~~~ ---— B7___ 五、發明説明（9 ) —'^ -- I二蒸氣停止流動進入室24,且熱氮氣經由一個或更多個 噴氣29被4人至至24。此氮氣可有—大約在15()至3〇〇度 間的溫度（例如200度）且可在大約5至j 5()㈣㈣間（例如 3〇秒）内注人。此氮氣可確们壬何剩餘的水從基材ι〇移離。 因為水從容器15傾倒’所以在此部分的過程中水沒有機會 ;賤起。 6在-具體實施例中，於全部的過程間，室溫氮氣穿過 至24。換句話說，在氣體加速乾燥這部分的過程中，此氮 氣注入室24並從室24浅漏出。室溫氮氣流動發生在全部的 乾燥過程間，除了a)當此ΙΡΑ蒸氣流動進人㈣糾當高溫 氮氣流動進入室24内時。 在上述的熱氮氣注入完成後，蓋子2〇打開，亦即，藉 由依方向κ移動。然後此第二夾持器舉起基材1〇離開裝置 13(參第8圖）。然後一第二來回穿梭裝置3〇以一方向乙移動 至一在基材10下的位置（第9圖）。然後此第二夾持器下降 (方向Μ),藉此放開基材1〇，使其至來回穿梭裝置3〇上， 此裝置可依方向Ν攜帶基材10至下一工作站，例如基材丄〇 可被放置在一盒内的工作站。 如上所述，此第一和第二夾持器可向上和向下移動於 不同的速度。在一具體實施例中，第一夾持器22耦合至一 馬達（圖解地顯示在第11圖的馬達32)，其移動夾持器向上 和向下。此馬達可以是一 DC輕刷自動馬達或是一步併馬 達。此馬達藉由一電子控制器控制，例如一 CTC控制器（未 顯示），由控制技術公司製造。同樣地，控制第二失持器垂 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） ^^裝----- (請先閲讀背面之注意事项再填寫本頁) .訂— 12 12t 〇 541573 五、發明説明（10 直移動的此馬達（未顯示）也是一 _ Dc輕刷自動馬達或是一 猎由此CTC控制器控制的步併馬 .t ^ ，連然而，其他機械（包括 其他型式的馬達）也可被用來移動 勒此第一和第二夾持器向 上和向下。這些馬達可藉由一 d有螺紋之導引螺絲耦合機 械耦&至此第-和第二夾持器。換句話說，此第一和第二 夾持器也機械式地搞合至-刻有螺紋之導引螺絲結構’盆 猎由上述的馬達旋轉以移動第—和第二夾持器向上和向 下。第11圖圖解地例示此方式，失持器22可被麵合至刻有 螺紋的螺旋式螺絲驅動器40，驅動器4〇藉由一馬 轉。當馬達32旋轉驅動器4〇，一輕人 … 耦合至夾持器22的托架44 在驅動器40上滑上和滑下以升起和降低夹持器22。應該要 強調的是第11圖只是此夾持器可向上和向下移動之一種方 式的-代表性例示而已。此第二失持器可同樣地安裝在一 托架上以向上和向下移動。 在-具體實施例中’第二夾持器之臂26a，26b藉由一氣 力裝置’例如-氣缸’被向内和向外移動。然而，其他機 械也可用來移動臂26a，26b向内和向外。 第10圖顯示基材10的平面圖，並顯示在基材1〇之頂端 lot的第一區域P1、在基材1〇之頂端1〇t和開口 12之頂端 間的第二區域P2、在開口 12之頂端的第三區域p3、在開 12之頂端I2t和底部12b間的第四區域P4、在開口 12之底部 12b的第五區域P5、在開口 12之底部12b和基材1〇之底部 l〇b間的第六區域P6，和在基材1〇之底部1〇b的第七區域 P7。如上所述，當區域P1，p3，p5*p7移動通過水16的頂端 (請先閲讀背面之注意事項再填寫本頁) .、可| 13 541573 A7 B7 五、發明説明（11 ) 16t時，基材10相對緩慢地移動。當區域P2，P4和P6移動通 過水16的頂端16t時，基材10相對快速地移動。（在區域P1 到達水16之頂端16t前和在區域P7通過水16之頂端16t後， 基材10也可相對快速地移動。當基材10正下降進入水中 時，其也可相對快速地移動。）區域P1可在大約基材10之頂 端10t中央有一 5至10mm間寬的距離D。同樣地，區域P3，P5 和P7也分別地在大約頂端i2t，底部12b和底部10b中央有一 5至10mm間I的距離D。基材1 〇在直徑上可大約為95mm。 然而，這些面積僅僅只是範例。 應該要注意的是在一些具體實施例中，當區域？1通過 水16之頂表面I6t時，基材1〇的速度不相同，但寧願可以改 變。同樣地，在一些具體實施例中，當區域^至…通過水 16之頂表面16t時，基材1〇之速度也可改變。可擇地，當區 域P1，P3，P5和P7通過水16之頂端16t時，基材1〇的向上速度 也可相同。另可擇地，當區域P2，P4*P6通過水16之頂端l6t 時，基材10的速度也可相同。然而，在其他具體實施例中， 它們也可不同。 當本發明已根據特定的具體實施例描述時，這些熟知 此技藝者將認可在形式上和細節上做改變，但不會從本發 明的精神和範圍中分離。例如，不同型式的工作件可根據 本發明被漂洗和乾燥。此工作件有不同的速度、時間參數 和舉起機械’及其他參數，例如於此所述的溫度或氣體和 液體成分是範例，其可使用其他參數。雖然圖式只顯示一 個基材10正被漂洗和乾燥，一般地，數個或許多個（例如5〇) 本紙張尺度適用中國國家標準（CNS) A4規格（2〗0X297公釐） (請先閲讀背面之注意事項再填寫本頁)(Please read and read the notes on the back before filling in this page) • Order — 6 541573 A7 B7__ V. Description of the Invention (4) 'In a specific embodiment, several (or many) work pieces are dried simultaneously. In a specific embodiment, the work piece is raised at a first speed during the time that its tip meets the liquid surface. The work piece is lifted at a second speed after its tip breaks through the liquid surface. This first speed is slower than the second speed. Furthermore, in a specific embodiment, when the bottom of the work piece breaks through the liquid surface, it rises at a third speed. This third speed is slower than the second speed. The reason for this is that different parts of the work piece are dried at different rates. By adjusting the speed at which the work piece is raised to match the drying rate of different parts of the substrate, the overall speed of drying the work piece is improved. The work piece may be a substrate having a central positioning opening. In this specific embodiment, between the time when the top of the central positioning opening penetrates the liquid surface and the time when the bottom of the central positioning opening penetrates the liquid surface, the work piece is raised at a fourth speed. This fourth speed is generally slower than the second speed due to the reasons described above. After the top of the central positioning opening has broken through the liquid surface, but before the bottom of the central positioning opening has broken through the liquid surface, the substrate is raised at a fifth speed. This fifth speed is slower than the fourth speed. Alternatively, this fifth and second speed may be the same. The first, third and fourth speeds may also be the same. As mentioned above, the raising speed of the substrate is modularized to account for the fact that the substrate dries between the top and bottom of the substrate and the time between the top and bottom of the central positioning openings breaking through the liquid surface. In a specific embodiment, a gas or vapor is placed over the top surface of the liquid to accelerate drying. In a specific embodiment, the steam includes the standard, the standard, and the Zhang's scales are in accordance with Chinese national standards (Specification M7) (please read the precautions on the back before filling this page). — —, ^ Τ —, Line-541573 A7 ------- ^ ___ __ V. Description of the invention (5) ---- IPA (isopropyl alcohol) 'But other materials such as Cgang can also be used. Therefore, specific embodiments of the present invention may use the Marangoni effect described above. Brief Description of Formula 1 Figures 1 to 9 illustrate an apparatus for drying a substrate according to the present invention. Figure 10 illustrates a plan view of a substrate. FIG. 11 illustrates a device i according to a specific embodiment of the present invention, which is a cross-sectional view perpendicular to the planes of the i to ninth figures. In detail, the method according to a specific embodiment of the present invention is used to dry a work piece, such as a disc-shaped work piece, as shown in the figure. Substrate The substrate used to make a magnetic disk can be used. In a specific embodiment, the base material 10 may be coated with a nickel alloy, such as glass or glass ceramic. The substrate 10 generally has a central positioning opening 12. In the conventional art, at the end of manufacturing, the disc is mounted on a mandrel (not shown), and the opening 12 is located where the disc is attached to the mandrel. In the manufacturing process, the substrate 10 is intended to be brought into contact with a liquid (such as to clean or rinse the substrate 10), and then the substrate 10 is dried. Therefore, after the substrate 10 has received the first tank of a liquid (not shown) in a valley, it is moved to a drying device 13 where it can be dried in one way to reduce the possibility of surface contamination. Sex. The device 3 comprises a container 4 containing a tank 5 which contains a liquid such as water 16 (figure 丨). (Water 16 may be deionized water 'and may have a temperature between room temperature and about 60 degrees. However, other liquids and other temperatures may be used.) As described above, in this process, it is intended to avoid or Reduce the deposition of dry marks or other contaminates on the substrate. 10 Paper size is appropriate (_ Μ size ⑵ tearing public magic (please read the precautions on the back before filling this page) C- 、 \-ΰ 541573 A7 — — '_ — B7 V. Drying the substrate 10 in the manner described in the invention (6). A method according to the present invention facilitates this goal. Regarding FIG. 1, the shuttle device 18 carries the substrate 10 to a proper Position so that the substrate 10 exceeds the groove 15. When the substrate 10 exceeds the groove 15, a cover 20 moves in the direction of arrow A. A first holder 22 moves upward (arrow b) so that 22 is positioned appropriately The position is to hold the substrate 10. (In a specific embodiment, the holder 22 moves upward at a speed between 1.00 and 20 mm / sec.) The arms 18a, 18b move outward (arrow C , D) to thereby loosen the substrate 忉. At the moment of operation, the substrate 10 is passed through the first clamp Holder 22 is clamped. (A suitable delay can be inserted into this mechanical manipulation to ensure that the gripper 22 is in place before the shuttle device 8 releases the substrate 8). In a specific embodiment, the first The holder 22 holds the substrate 10 at five contact points 22a-22e. However, in another specific embodiment, there may be a different number of contact points. Then the first holder 22 lowers the substrate 10 ( Direction E) enters the groove 15, thereby immersing the substrate 10 in the water 16 (see FIG. 2). This reduction can be performed at a relatively high speed (again, between 1.0 and 20 mm / second). The substrate 10 can remain immersed Approximately 300 seconds in water 16. Alternatively, during operation of this part, water 16 may be mechanically stirred: to promote a cleaning process. This agitation may be ultrasonic or millions of sound waves. (100 The agitation of the million sound waves is a very high frequency disturbance.) The cover 20 moves in a direction F to close the groove 15 located in the chamber 24. Thereafter, the first holder 22 starts to rise at a first relatively high speed Substrate 10 (see arrow G in Figure 3). This first speed is approximately 1 to 20 mm / sec. On the top surface of the substrate 10 Before breaking the surface of the water 16 at 10t, the paper size of the holder is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page). 541573 A7 Description of invention please! Read first: read ': back • side. 1 of--note I matter: item: then f JP paperback: page: 22 speed slows to a lower The second speed is, for example, between about 0.2 and 〇mm / sec. This degree of seizure continues after the top 10t of the substrate 10 passes through the top surface 16t of the water 16 (see FIG. 3). The lifting of the substrate 10 starts before and continues throughout the entire substrate 10—a vapor containing ^ is injected into the chamber to accelerate the drying of the substrate 10 and promote the Marangoni effect described above. In a specific embodiment of the towel, IPA generates an IPA vapor by passing bubble gas through isopropyl alcohol. The vapor passes through the bottom surface of the lid 20b, the opening of the shower head or holes (not shown) And injected. After being set at the top 10t of the substrate 10 and passing through the surface 16t of the water 16, the rate at which the holder 22 lifts the substrate 10 increases to a relatively fast speed, such as between about 1.0 and 20 mm / sec . The holder 22 continues to raise the substrate 10 at this increasing rate until the top end I2t of the opening 12 passes approximately through the top end I6t of the water 16. At this time, the rate at which the holder 22 lifts the substrate 10 is decreased again, for example, between 0 ° and 20 mm / sec. After the top end 12t of the opening 12 passes the top end of the water 16, the lifting speed of the holder 22 is increased to a faster speed, for example, between j · 0 and 20 mm / sec. The following advantages are provided for the change in the raising speed of the substrate. The drying rates of the portions P2, P4, and P6 of the substrate 10 (Fig. 10) are higher than those of the portions 10 and 10 of the substrate 10 (located at the top end 10t of the substrate 10 and the top end 12t of the opening 12, respectively). Because the raising speed of the substrate 10 is variable to match the drying rate of different parts of the substrate 10, all speeds of the drying process are improved. The drying rate of the bottom portion 12b of the opening 12 and the bottom portion 10b of the substrate 10 is also smaller than that of the substrate portions P2, P4, and P6. Therefore, the speed at which the substrate 10 rises, such as the speed at which parts of the substrate P5 and P7 pass through the surface of water 16 and 16t, is also reduced. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 10 541573 A7- ~~~ ----- B7___ V. Description of the invention (9) — '^-I The two vapors stop flowing into the chamber 24, and the hot nitrogen gas is passed from 4 to 24 by one or more air jets 29. This nitrogen can have a temperature between about 15 () to 300 degrees (for example, 200 degrees) and can be injected within about 5 to 5 (for example, 30 seconds). This nitrogen confirms that any remaining water is removed from the substrate. Because the water is poured from the container 15 'there is no chance of water in this part of the process; 6 In a specific embodiment, room temperature nitrogen is passed to 24 during all processes. In other words, this nitrogen gas is injected into the chamber 24 and leaks out of the chamber 24 during the accelerated gas drying portion. Room temperature nitrogen flow occurs throughout the drying process, except for a) when this IPA vapor flows into the oven and high temperature nitrogen flows into the chamber 24. After completion of the hot nitrogen injection described above, the lid 20 is opened, that is, by moving in the direction κ. The second holder then lifts the substrate 10 and leaves the device 13 (see Fig. 8). Then a second shuttle device 30 moves in one direction B to a position under the substrate 10 (Fig. 9). Then the second holder is lowered (direction M), thereby releasing the substrate 10 to the shuttle device 30, which can carry the substrate 10 to the next workstation in the direction N, such as the substrate丄 〇 Workstation that can be placed in a box. As mentioned above, the first and second holders can be moved up and down at different speeds. In a particular embodiment, the first holder 22 is coupled to a motor (motor 32 shown diagrammatically in Figure 11) that moves the holder up and down. This motor can be a DC light brush automatic motor or a single step motor. This motor is controlled by an electronic controller, such as a CTC controller (not shown), manufactured by Control Technology Corporation. Similarly, the paper size for controlling the second holder is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ^^ Packing ----- (Please read the precautions on the back before filling this page). Order — 12 12t 〇541573 V. Description of the invention (10 This motor (not shown) that moves directly is also a _ Dc light brush automatic motor or a hunting horse controlled by the CTC controller. T ^, but even other Machinery (including other types of motors) can also be used to move the first and second holders up and down. These motors can be coupled to the mechanical coupling by a threaded guide screw & And the second gripper. In other words, the first and second grippers are also mechanically engaged to a threaded guide screw structure 'the bowl is rotated by the motor described above to move the first and second The two grippers are up and down. Fig. 11 illustrates this mode diagrammatically. The stopper 22 can be face-attached to a screw driver 40 engraved with a thread, and the driver 40 turns by one horse. When the motor 32 rotates Driver 40, a light man ... The bracket 44 coupled to the holder 22 is at the driver 40 Slide up and down to raise and lower the gripper 22. It should be emphasized that Figure 11 is just one way in which this gripper can be moved up and down-a representative example. This second gripper It can be similarly mounted on a bracket for upward and downward movement. In the embodiment, the arms of the second gripper 26a, 26b are moved inwardly and outwardly by a pneumatic device such as a cylinder However, other machinery can also be used to move the arms 26a, 26b inward and outward. Figure 10 shows a plan view of the substrate 10, and shows the first region P1 of the top lot of the substrate 10, and the substrate 1 The second region P2 between the top end 10t and the top of the opening 12, the third region p3 between the top end of the opening 12 and the fourth region P4 between the top 12t of the opening 12 and the bottom 12b, and the bottom 12b of the opening 12 The fifth region P5, the sixth region P6 between the bottom 12b of the opening 12 and the bottom 10b of the substrate 10, and the seventh region P7 between the bottom 10b of the substrate 10. As described above, When the areas P1, p3, p5 * p7 move through the top of the water 16 (please read the precautions on the back before filling this page). 541573 A7 B7 V. Description of the invention (11) When 16t, the substrate 10 moves relatively slowly. When the regions P2, P4, and P6 move through the top 16t of the water 16, the substrate 10 moves relatively quickly. (Arrival in region P1 The substrate 10 can also move relatively quickly before the top 16t of the water 16 and after passing the top 16t of the water 16 in the region P7. When the substrate 10 is descending into the water, it can also move relatively quickly.) The region P1 can There is a distance D between 5 and 10 mm in the center of approximately the top end 10t of the substrate 10. Similarly, the regions P3, P5, and P7 are also at approximately the top i2t, and the bottom 12b and the bottom 10b have a distance I between 5 and 10 mm in the center. The substrate 10 may be approximately 95 mm in diameter. However, these areas are only examples. It should be noted that in some specific embodiments, when the area? When passing the top surface I6t of water 16, the speed of the substrate 10 is different, but it can be changed. Similarly, in some embodiments, the speed of the substrate 10 can also be changed when the region ^ ... passes through the top surface 16t of the water 16. Alternatively, when the areas P1, P3, P5, and P7 pass through the top 16t of the water 16, the upward speed of the substrate 10 may be the same. Alternatively, when the regions P2, P4 * P6 pass through the top 16t of the water 16, the speed of the substrate 10 may also be the same. However, they may be different in other specific embodiments. While the invention has been described in terms of specific embodiments, those skilled in the art will recognize changes in form and detail without departing from the spirit and scope of the invention. For example, different types of work pieces can be rinsed and dried according to the present invention. This work piece has different speed, time parameters and lifting machinery 'and other parameters, such as the temperature or gas and liquid composition described herein are examples, and other parameters may be used. Although the drawing only shows that one substrate 10 is being rinsed and dried, generally, several or more (for example, 50) This paper size is applicable to China National Standard (CNS) A4 specification (2〗 0X297 mm) (please (Read the notes on the back and fill out this page)
14 五 發明説明（12) 基材可同時地被漂洗和 ^ ^ E L , 展。不同的夾持器和來回穿赭奘 置縱長地沿耆一與圖式 技衣 臂。這些臂-般地包括用“ 、伸作為一組 來夾持許多基材的V形刻痕。 根據本發明的裝置 θ 罝了乂疋包括一控制器的光學哎豆他 形式的感測器或送碼機， 次八他14 V. Description of the invention (12) The substrate can be rinsed and developed at the same time. Different grippers and back-and-forth loops are placed lengthwise along the first and patterned arms. These arms generally include V-shaped notches that hold a number of substrates with a "" extension as a set. The device according to the present invention θ includes an optical sensor in the form of a controller or Code feeder
成其用來傳遞至此裝置不同元件之 位置。此控制器可利用μ _欠A 用此貝訊以控制與此描述不同之來回 穿杬装置和夾持器的移動。 在-具體實施例中，在槽15充滿水16的全部時間中， 一超出數量的水總是緩慢地注人槽15内，錢是緩慢地滅 出槽15的頂端i5t。應該要相信的是如果有任何沾染物在水 中匕將存在於靠進水16的頂端16t。因此，藉由使水固 定地溢流出槽15’要相信的是任何沾染物將固定地從裝置 13被沖洗出。 當上述的具體實施例包括舉起工作件離開液體的夾持 裔時，在其他具體實施例中，液體從槽排出且此工作件仍 保持不動。在一具體實施例中，一排水裝置或泵被設置用 來以不同的速率從槽移離液體，以便於水16的頂端i6t相對 於工作件以不同的速度移動。因此，當水16的頂端16t通過 此工作件之一緩慢·乾燥部分時，頂端16t移動於一和當頂 端16t通過此工作件之快速-乾燥部分時，其與頂端6t移動的 速度相比起來相對較緩慢的速度。 此外’在一具體實施例中，當水16的頂端161降低在此 工作件之一第一部分下時，第一夾持器22夾持此工作件。 在此工作件之第一部分乾燥後，但此工作件的一第二部分 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 15 541573 A7 -----B7_ 五、發明説明（13 ) 浸在水16内時，第二夾持器26抓緊此工作件的乾燥部分且 第一夾持器22放開此工作件。水丨6的頂端持續從槽排除且 最後地，工作件沒有任何部分與水16接觸。在此具體實例 中’第二夾持器不曾與水16接觸。 在另一具體實施例中，夾持器22和26兩者及水16的頂 表面16t可同時地移動。 應該要了解的是本發明於此描述的不同態樣可獨立於 本發明的其他態樣運行。因此，所以這樣的改變都可在本 發明内實行。 ----- **- (請先閲讀背面之注意事項再填寫本頁) 元件標號對照表 10 基材 10t 基材頂表面 10b 基材底部 12 開口 12t 開口頂端 12b 開口底部 13 乾燥裝置 14 容器 14b 位置 15 槽 15t 槽的頂端 16 水 16t 水表面 18 來回穿梭裝置 18a 臂 18b 臂 20 蓋子 20b 盍子底表面 22 第一夾持器 22a-22e接觸點 24 室 25 盒子 26a，26b 第二 夾持器之臂 、一叮丨 -線丨 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 16 541573 A7 B7 五、發明説明（14 ) 29 喷氣口 30 第二來回穿梭裝 32 馬達 40 驅動器 P1 基材之第一區域 P2 基材之第二區域 P3 基材之第三區域 P4 基材之第四區域 P5 基材之第五區域 P6 基材之第六區域 P7 基材之第七區域 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 17This is where it is passed to the different components of the device. This controller can use μ _ A to use this Besson to control the movement of the penetrating device and the gripper different from this description. In the specific embodiment, during the entire time that the tank 15 is filled with water 16, an excessive amount of water is always slowly injected into the tank 15, and the money is slowly eliminated from the top i5t of the tank 15. It should be believed that if there is any contamination in the water, the dagger will exist at the top 16t of the water 16. Therefore, it is believed that any contamination will be fixedly flushed out of the device 13 by allowing the water to overflow out of the tank 15 'fixedly. When the above-mentioned embodiment includes the holding member that lifts the work piece away from the liquid, in other embodiments, the liquid is discharged from the tank and the work piece remains stationary. In a specific embodiment, a drainage device or pump is provided to remove the liquid from the tank at different rates so that the tip i6t of the water 16 moves at different speeds relative to the work piece. Therefore, when the top end 16t of the water 16 passes through the slow-drying part of this work piece, the top end 16t moves to one and when the top end 16t passes the fast-drying part of the work piece, it is compared with the speed at which the top end 6t moves. Relatively slow speed. Further, in a specific embodiment, when the top end 161 of the water 16 is lowered below the first portion of one of the work pieces, the first holder 22 holds the work piece. After the first part of this work piece is dried, but the second and second parts of this work piece, the paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 15 541573 A7 ----- B7_ V. Description of the invention ( 13) When immersed in water 16, the second holder 26 grasps the dry part of the work piece and the first holder 22 releases the work piece. The top of the water 6 is continuously removed from the tank and finally, no part of the work piece is in contact with the water 16. In this specific example, the 'second holder has never been in contact with the water 16. In another embodiment, both the holders 22 and 26 and the top surface 16t of the water 16 can be moved simultaneously. It should be understood that the different aspects of the invention described herein may operate independently of other aspects of the invention. Therefore, all such changes can be implemented within the present invention. ----- **-(Please read the precautions on the back before filling this page) Component reference table 10 Substrate 10t Substrate top surface 10b Substrate bottom 12 Open 12t Open top 12b Open bottom 13 Drying device 14 Container 14b position 15 slot 15t top of slot 16 water 16t water surface 18 shuttle device 18a arm 18b arm 20 cover 20b bottom surface of ladle 22 first holder 22a-22e contact point 24 chamber 25 box 26a, 26b second holder The arm of the device, a bite 丨 -line 丨 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 16 541573 A7 B7 V. Description of the invention (14) 29 Jet port 30 Second shuttle shuttle 32 Motor 40 Driver P1 First region of substrate P2 Second region of substrate P3 Third region of substrate P4 Fourth region of substrate P5 Fifth region of substrate P6 Sixth region of substrate P7 Seventh region of substrate (Please read the precautions on the back before filling out this page) The paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm) 17