USD980884S1 - Lift pin - Google Patents

Lift pin Download PDF

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Publication number
USD980884S1
USD980884S1 US29/772,523 US202129772523F USD980884S US D980884 S1 USD980884 S1 US D980884S1 US 202129772523 F US202129772523 F US 202129772523F US D980884 S USD980884 S US D980884S
Authority
US
United States
Prior art keywords
lift pin
view
lift
pin
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/772,523
Inventor
Eric J. Hoffmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/772,523 priority Critical patent/USD980884S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOFFMANN, ERIC J.
Priority to TW110304619F priority patent/TWD221365S/en
Application granted granted Critical
Publication of USD980884S1 publication Critical patent/USD980884S1/en
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Description

This application claims priority to U.S. patent application Ser. No. 17/061,015, filed Oct. 1, 2020, the entire disclosure of which is hereby incorporated by reference herein.
FIG. 1 is a top-front isometric view of a lift pin showing my new design;
FIG. 2 is a bottom-front isometric view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a back view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a lift pin, substantially as shown and described.
US29/772,523 2021-03-02 2021-03-02 Lift pin Active USD980884S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/772,523 USD980884S1 (en) 2021-03-02 2021-03-02 Lift pin
TW110304619F TWD221365S (en) 2021-03-02 2021-09-02 Lift pin for a semiconductor manufacturing processing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/772,523 USD980884S1 (en) 2021-03-02 2021-03-02 Lift pin

Publications (1)

Publication Number Publication Date
USD980884S1 true USD980884S1 (en) 2023-03-14

Family

ID=85462871

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/772,523 Active USD980884S1 (en) 2021-03-02 2021-03-02 Lift pin

Country Status (2)

Country Link
US (1) USD980884S1 (en)
TW (1) TWD221365S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1009817S1 (en) * 2021-09-28 2024-01-02 Applied Materials, Inc. Shadow ring lift pin
USD1019463S1 (en) * 2019-05-28 2024-03-26 Louis Vuitton Malletier Pin and the like

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3015709A (en) * 1959-04-09 1962-01-02 Ite Circuit Breaker Ltd Cover lift pin
JPS61214937A (en) 1985-03-15 1986-09-24 Canon Inc Attractive holder
US4790258A (en) 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
US5823153A (en) 1997-05-08 1998-10-20 Briggs & Stratton Corporation Compressing release with snap-in components
US6032691A (en) 1999-03-29 2000-03-07 Kaylynn, Inc. Valve assembly
US6148762A (en) 1998-02-17 2000-11-21 Frontec Incorporated Plasma processing apparatus
EP1174910A2 (en) 2000-07-20 2002-01-23 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US6389677B1 (en) 1999-03-30 2002-05-21 Lam Research Corporation Perimeter wafer lifting
US6550484B1 (en) 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
US20040045509A1 (en) * 2002-09-10 2004-03-11 Or David T. Reduced friction lift pin
US20050000453A1 (en) 2003-06-02 2005-01-06 Chul-Ju Hwang Apparatus for semiconductor device and method using the same
USD504313S1 (en) * 2002-02-20 2005-04-26 Airbus Deutschland Gmbh Lockbolt
US6884319B2 (en) * 2001-11-12 2005-04-26 Jusung Engineering Co., Ltd. Susceptor of apparatus for manufacturing semiconductor device
US7180283B2 (en) 2002-07-17 2007-02-20 Infineon Technologies, Ag Wafer lifting device
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US20070089672A1 (en) 2005-09-30 2007-04-26 Akinori Shimamura Substrate placing mechanism
US7292428B2 (en) 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
USD568914S1 (en) * 2002-09-10 2008-05-13 Applied Materials, Inc. Substrate support lift pin
US20080134814A1 (en) * 2006-12-11 2008-06-12 Jong Sun Kim Lift pin driving device and manufacturing apparatus having same
CN100440476C (en) 2005-09-30 2008-12-03 东京毅力科创株式会社 Substrate placing mechanism and substrate processing device
CN101352108A (en) 2005-12-28 2009-01-21 夏普株式会社 Stage apparatus and plasma processing apparatus
KR20090132335A (en) 2008-06-20 2009-12-30 세크론 주식회사 Molding apparatus for semiconductor device
WO2010109373A2 (en) 2009-03-24 2010-09-30 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
USD635597S1 (en) * 2008-11-17 2011-04-05 Applied Materials, Inc. Lift pin
USD640715S1 (en) * 2008-11-17 2011-06-28 Applied Materials, Inc. Lift pin assembly
US20110287631A1 (en) 2010-05-12 2011-11-24 Tokyo Electron Limited Plasma processing apparatus and method of manufacturing semiconductor device
USD650818S1 (en) * 2008-12-19 2011-12-20 Applied Materials, Inc. Inner lift pin
US8230931B2 (en) 2009-12-29 2012-07-31 Hydril Usa Manufacturing Llc Lifting device and method for lifting a bonnet
US20130333616A1 (en) 2012-06-18 2013-12-19 Tel Solar Ag Plasma processing system with movable chamber housing parts
US20140097175A1 (en) 2008-08-08 2014-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for Holding Semiconductor Wafers
US10192770B2 (en) 2014-10-03 2019-01-29 Applied Materials, Inc. Spring-loaded pins for susceptor assembly and processing methods using same
US20190051555A1 (en) 2017-08-08 2019-02-14 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US10262888B2 (en) 2016-04-02 2019-04-16 Applied Materials, Inc. Apparatus and methods for wafer rotation in carousel susceptor
US20190131167A1 (en) 2017-10-27 2019-05-02 Applied Materials, Inc. Single Wafer Processing Environments With Spatial Separation

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3015709A (en) * 1959-04-09 1962-01-02 Ite Circuit Breaker Ltd Cover lift pin
JPS61214937A (en) 1985-03-15 1986-09-24 Canon Inc Attractive holder
US4790258A (en) 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
US5823153A (en) 1997-05-08 1998-10-20 Briggs & Stratton Corporation Compressing release with snap-in components
US6148762A (en) 1998-02-17 2000-11-21 Frontec Incorporated Plasma processing apparatus
US6032691A (en) 1999-03-29 2000-03-07 Kaylynn, Inc. Valve assembly
US6389677B1 (en) 1999-03-30 2002-05-21 Lam Research Corporation Perimeter wafer lifting
US7160392B2 (en) 2000-07-20 2007-01-09 Applied Materials, Inc. Method for dechucking a substrate
EP1174910A2 (en) 2000-07-20 2002-01-23 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US6884319B2 (en) * 2001-11-12 2005-04-26 Jusung Engineering Co., Ltd. Susceptor of apparatus for manufacturing semiconductor device
US6550484B1 (en) 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
USD504313S1 (en) * 2002-02-20 2005-04-26 Airbus Deutschland Gmbh Lockbolt
US7180283B2 (en) 2002-07-17 2007-02-20 Infineon Technologies, Ag Wafer lifting device
US20040045509A1 (en) * 2002-09-10 2004-03-11 Or David T. Reduced friction lift pin
US6887317B2 (en) 2002-09-10 2005-05-03 Applied Materials, Inc. Reduced friction lift pin
US20050194100A1 (en) 2002-09-10 2005-09-08 Applied Materials, Inc. Reduced friction lift pin
USD568914S1 (en) * 2002-09-10 2008-05-13 Applied Materials, Inc. Substrate support lift pin
US20050000453A1 (en) 2003-06-02 2005-01-06 Chul-Ju Hwang Apparatus for semiconductor device and method using the same
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7292428B2 (en) 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
US20070089672A1 (en) 2005-09-30 2007-04-26 Akinori Shimamura Substrate placing mechanism
CN100440476C (en) 2005-09-30 2008-12-03 东京毅力科创株式会社 Substrate placing mechanism and substrate processing device
CN101352108A (en) 2005-12-28 2009-01-21 夏普株式会社 Stage apparatus and plasma processing apparatus
US20100212832A1 (en) 2005-12-28 2010-08-26 Sharp Kabushiki Kaisha Stage device and plasma treatment apparatus
US20080134814A1 (en) * 2006-12-11 2008-06-12 Jong Sun Kim Lift pin driving device and manufacturing apparatus having same
KR20090132335A (en) 2008-06-20 2009-12-30 세크론 주식회사 Molding apparatus for semiconductor device
US20140097175A1 (en) 2008-08-08 2014-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for Holding Semiconductor Wafers
USD635597S1 (en) * 2008-11-17 2011-04-05 Applied Materials, Inc. Lift pin
USD640715S1 (en) * 2008-11-17 2011-06-28 Applied Materials, Inc. Lift pin assembly
USD650818S1 (en) * 2008-12-19 2011-12-20 Applied Materials, Inc. Inner lift pin
WO2010109373A2 (en) 2009-03-24 2010-09-30 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
US8230931B2 (en) 2009-12-29 2012-07-31 Hydril Usa Manufacturing Llc Lifting device and method for lifting a bonnet
US20110287631A1 (en) 2010-05-12 2011-11-24 Tokyo Electron Limited Plasma processing apparatus and method of manufacturing semiconductor device
US20130333616A1 (en) 2012-06-18 2013-12-19 Tel Solar Ag Plasma processing system with movable chamber housing parts
US10192770B2 (en) 2014-10-03 2019-01-29 Applied Materials, Inc. Spring-loaded pins for susceptor assembly and processing methods using same
US10262888B2 (en) 2016-04-02 2019-04-16 Applied Materials, Inc. Apparatus and methods for wafer rotation in carousel susceptor
US20190051555A1 (en) 2017-08-08 2019-02-14 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US20190131167A1 (en) 2017-10-27 2019-05-02 Applied Materials, Inc. Single Wafer Processing Environments With Spatial Separation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"PCT International Search Report and Written Opinion in PCT/US2021/052564 dated Jan. 14, 2022, 11 pages".

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1019463S1 (en) * 2019-05-28 2024-03-26 Louis Vuitton Malletier Pin and the like
USD1009817S1 (en) * 2021-09-28 2024-01-02 Applied Materials, Inc. Shadow ring lift pin

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Publication number Publication date
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