SG80676A1 - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method

Info

Publication number
SG80676A1
SG80676A1 SG200000953A SG200000953A SG80676A1 SG 80676 A1 SG80676 A1 SG 80676A1 SG 200000953 A SG200000953 A SG 200000953A SG 200000953 A SG200000953 A SG 200000953A SG 80676 A1 SG80676 A1 SG 80676A1
Authority
SG
Singapore
Prior art keywords
semiconductor chip
insulation layer
substrate
adhesive material
divided
Prior art date
Application number
SG200000953A
Other languages
English (en)
Inventor
Fujisawa Atsushi
Konno Takafumi
Ohsaka Shingo
Haruta Ryo
Ichitani Masahiro
Original Assignee
Hitachi Hokkai Semiconductor
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor
Publication of SG80676A1 publication Critical patent/SG80676A1/en

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    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SG200000953A 1997-07-30 1998-07-23 Semiconductor device and its manufacturing method SG80676A1 (en)

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US6887739B2 (en) 2005-05-03
US6437428B1 (en) 2002-08-20
KR100623505B1 (ko) 2006-09-18
KR20060086500A (ko) 2006-08-01
CN1282983A (zh) 2001-02-07
CN1167122C (zh) 2004-09-15
US6448111B1 (en) 2002-09-10
KR100596549B1 (ko) 2007-09-05
MY127063A (en) 2006-11-30
KR20060086498A (ko) 2006-08-01
US6764878B2 (en) 2004-07-20
KR19990013968A (ko) 1999-02-25
US6232650B1 (en) 2001-05-15
KR100623507B1 (ko) 2006-09-18
CN1282982A (zh) 2001-02-07
CN1206936A (zh) 1999-02-03
CN100382260C (zh) 2008-04-16
US6759279B2 (en) 2004-07-06
US20040005733A1 (en) 2004-01-08
MY125230A (en) 2006-07-31
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US6476466B2 (en) 2002-11-05
TW442930B (en) 2001-06-23
KR100623506B1 (ko) 2006-09-18
US6590275B2 (en) 2003-07-08
CN1482658A (zh) 2004-03-17
US20020192872A1 (en) 2002-12-19
US20020079579A1 (en) 2002-06-27
JPH1154658A (ja) 1999-02-26
US20020182776A1 (en) 2002-12-05
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MY123366A (en) 2006-05-31
SG80675A1 (en) 2001-05-22

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