SG74676A1 - Semi-conductor mounting apparatus with a chip gripper travelling back and forth - Google Patents

Semi-conductor mounting apparatus with a chip gripper travelling back and forth

Info

Publication number
SG74676A1
SG74676A1 SG1998004852A SG1998004852A SG74676A1 SG 74676 A1 SG74676 A1 SG 74676A1 SG 1998004852 A SG1998004852 A SG 1998004852A SG 1998004852 A SG1998004852 A SG 1998004852A SG 74676 A1 SG74676 A1 SG 74676A1
Authority
SG
Singapore
Prior art keywords
semi
forth
mounting apparatus
chip gripper
conductor mounting
Prior art date
Application number
SG1998004852A
Other languages
English (en)
Inventor
Samuel Schindler
Original Assignee
Esec Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sa filed Critical Esec Sa
Publication of SG74676A1 publication Critical patent/SG74676A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Transmission Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Feeding Of Workpieces (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
SG1998004852A 1997-12-07 1998-11-18 Semi-conductor mounting apparatus with a chip gripper travelling back and forth SG74676A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH280797 1997-12-07

Publications (1)

Publication Number Publication Date
SG74676A1 true SG74676A1 (en) 2000-08-22

Family

ID=4242039

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998004852A SG74676A1 (en) 1997-12-07 1998-11-18 Semi-conductor mounting apparatus with a chip gripper travelling back and forth

Country Status (10)

Country Link
US (2) US6185815B1 (ko)
EP (1) EP0923111B1 (ko)
JP (1) JP4220042B2 (ko)
KR (1) KR100550049B1 (ko)
CN (1) CN1130763C (ko)
AT (1) ATE361549T1 (ko)
DE (1) DE59813989D1 (ko)
MY (1) MY131974A (ko)
SG (1) SG74676A1 (ko)
TW (1) TW410413B (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6785815B1 (en) * 1999-06-08 2004-08-31 Intertrust Technologies Corp. Methods and systems for encoding and protecting data using digital signature and watermarking techniques
DE10042661B4 (de) * 1999-09-10 2006-04-13 Esec Trading S.A. Verfahren und Vorrichtungen für die Montage von Halbleiterchips
DE19958328A1 (de) * 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
SG100644A1 (en) 2000-04-04 2003-12-26 Esec Trading Sa Linear guide with air bearing
EP1189496B1 (de) 2000-09-13 2009-10-28 Esec AG Vorrichtung für die Montage von Halbleiterchips
EP1253817A3 (en) * 2001-04-23 2003-07-09 Liconic Ag Apparatus for picking and placing small objects
DE20116653U1 (de) * 2001-05-07 2002-01-03 Esec Trading Sa Montageautomat für die Plazierung eines Halbleiterchips als Flipchip auf einem Substrat
KR20030046306A (ko) * 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 반도체 칩을 설치하기 위한 장치
TW200414992A (en) * 2002-11-29 2004-08-16 Esec Trading Sa Method for picking semiconductor chips from a foil
US20050161814A1 (en) 2002-12-27 2005-07-28 Fujitsu Limited Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
TWI231561B (en) * 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
CH696103A5 (de) * 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
CH697278B1 (de) * 2003-09-12 2008-07-31 Oerlikon Assembly Equipment Ag Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips.
CH697294B1 (de) 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.
EP1612843A1 (de) * 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
TWI447840B (zh) * 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置
US7428958B2 (en) * 2004-11-15 2008-09-30 Nikon Corporation Substrate conveyor apparatus, substrate conveyance method and exposure apparatus
JP2006272523A (ja) * 2005-03-30 2006-10-12 Shinmei Ind Co Ltd ワーク搬送装置
US7569932B2 (en) * 2005-11-18 2009-08-04 Checkpoint Systems, Inc. Rotary chip attach
WO2009037108A2 (de) * 2007-09-18 2009-03-26 Oerlikon Assembly Equipment Ag, Steinhausen Pick und place system für eine halbleiter-montageeinrichtung
WO2009047214A2 (en) * 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
CH698334B1 (de) 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
DE102007058802B3 (de) * 2007-12-06 2009-06-10 Datacon Technology Gmbh Thermodenvorrichtung
JP4941422B2 (ja) * 2008-07-14 2012-05-30 パナソニック株式会社 部品実装システム
KR101493046B1 (ko) 2008-11-13 2015-02-12 삼성전자주식회사 유동 그리퍼를 포함하는 클램핑 장치
CN102848377B (zh) * 2011-06-28 2015-01-21 昆山市佰奥自动化设备科技有限公司 旋转摆动机械手臂
KR101360634B1 (ko) * 2013-03-08 2014-02-07 문정만 동력 전달 시스템
CN103594382B (zh) * 2013-11-21 2016-01-20 刘锦刚 一种由滑块驱动的竖直部分具有弹性材料的芯片安装装置
FR3039743B1 (fr) 2015-07-29 2017-07-21 Jfp Microtechnic Dispositif de manipulation de petits objets
CN105460681B (zh) * 2015-12-29 2017-07-11 重庆市大通茂纺织科技有限公司 单维度柔性物料铺平装置
JP6768454B2 (ja) * 2016-11-08 2020-10-14 コマツ産機株式会社 ワーク搬送装置
JP6618957B2 (ja) * 2017-06-14 2019-12-11 アイダエンジニアリング株式会社 プレス機械のワーク搬送装置
CN110597302A (zh) * 2019-10-25 2019-12-20 浙江正泰新能源开发有限公司 光伏跟踪器系统

Family Cites Families (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3337941A (en) 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US4144449A (en) 1977-07-08 1979-03-13 Sperry Rand Corporation Position detection apparatus
US4151945A (en) 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
DE2823360C3 (de) * 1978-05-29 1981-06-25 Texas Instruments Deutschland Gmbh, 8050 Freising Vorrichtung zur Überführung von Gegenständen
US4351264A (en) 1979-03-20 1982-09-28 S&S Corrugated Paper Machinery Co., Inc. Adhesive metering device
EP0020879A1 (en) 1979-06-06 1981-01-07 Erwin Sick GmbH Optik-Elektronik Optical electronic distance sensor
JPS5645337A (en) 1979-09-11 1981-04-25 Hitachi Ltd Feeding and assembling device for parts
DE2939102A1 (de) 1979-09-27 1981-04-16 Henkel KGaA, 4000 Düsseldorf Klebstoffauftragsvorrichtung und verfahren zum betrieb derselben
US4461610A (en) * 1980-06-02 1984-07-24 Tdk Corporation Apparatus for mounting chip type circuit elements on printed circuit boards
US4378134A (en) 1981-10-19 1983-03-29 Excellon Industries Air bearing guide system
GB2111863B (en) 1981-12-24 1985-09-04 Thorn Consumer Electronics Lim Spray apparatus and method of spraying articles and an article made by the method
GB2139597B (en) * 1983-05-13 1986-07-09 Tdk Corp Apparatus for automatically mounting chip type circuit elements on printed circuit boards
JPS6012799A (ja) 1983-07-01 1985-01-23 三洋電機株式会社 チップ状電子部品の自動装着装置
FR2548857B1 (fr) 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
FR2548852A1 (fr) 1983-07-08 1985-01-11 Drubay Fernand Reseau de communication de signaux video sous forme analogique
DE3474750D1 (en) 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
US4584047A (en) 1984-04-03 1986-04-22 Monarch Marking Systems, Inc. Hand-held labeler having improved web position sensing and print head control
US4586670A (en) 1984-12-17 1986-05-06 Usm Corporation Tape stripper for electrical component tape feeder
US4610083A (en) 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
GB2183820A (en) 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
JPS62144255U (ko) 1986-02-28 1987-09-11
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism
JP2662948B2 (ja) 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
DE3704505A1 (de) * 1987-02-13 1988-08-25 Leybold Ag Einlegegeraet fuer vakuumanlagen
JPS63277166A (ja) * 1987-05-09 1988-11-15 Hitachi Ltd チツプ電子部品供給装置
US4937511A (en) * 1987-07-21 1990-06-26 Western Technologies Automation, Inc. Robotic surface mount assembly system
KR970004947B1 (ko) * 1987-09-10 1997-04-10 도오교오 에레구토론 가부시끼가이샤 핸들링장치
US4924304A (en) 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
CH674886A5 (ko) 1987-11-09 1990-07-31 Alphasem Ag
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
US4961893A (en) 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
US4819326A (en) * 1988-06-16 1989-04-11 Stannek Karl H Method for robotic placement of electronic parts on a circuit board
US4943342A (en) * 1988-08-29 1990-07-24 Golemon Valia S Component feeding device for circuit board mounting apparatus
US5289625A (en) 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
JPH02303751A (ja) 1989-05-17 1990-12-17 Hitachi Ltd 部品位置決め方法
JPH038655A (ja) 1989-06-02 1991-01-16 Sanyo Electric Co Ltd 部品供給テープの部品残量報知方式
US5342460A (en) 1989-06-13 1994-08-30 Matsushita Electric Industrial Co., Ltd. Outer lead bonding apparatus
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
JPH03133763A (ja) 1989-10-11 1991-06-06 Sony Corp 部品連装置及びその部品切れ検知システム
US5157734A (en) 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
US5191693A (en) 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
CA2044649A1 (en) 1990-06-19 1991-12-20 Masanori Nishiguchi Method and apparatus for packaging a semiconductor device
JPH0469777A (ja) 1990-07-10 1992-03-04 Dainippon Screen Mfg Co Ltd プリント基板のパターン検査装置
JP2870142B2 (ja) 1990-07-17 1999-03-10 日本電気株式会社 コプラナリティ測定方法及びその装置
US5213653A (en) 1990-09-05 1993-05-25 Yamaha Hatsudoki Kabushiki Kaisha Waste tape disposing means of tape feeder
US5235164A (en) 1990-09-19 1993-08-10 Matsushita Electric Industrial Co., Ltd. Parts supply device, parts supply method, parts managing system, and parts managing apparatus
US5400497A (en) 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5248362A (en) 1991-05-24 1993-09-28 Interfic Developments, Inc. Method for applying glue to the flute tips of a single-faced corrugated paperboard sheet
DE4119401C2 (de) 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
US5309223A (en) 1991-06-25 1994-05-03 Cyberoptics Corporation Laser-based semiconductor lead measurement system
US5195234A (en) 1991-08-19 1993-03-23 Motorola, Inc. Method and apparatus for visual alignment of parts
DE4127696A1 (de) 1991-08-21 1993-02-25 Adalbert Fritsch Vorrichtung zum positionieren von smd-bauelementen, insbesondere smd-chips
JPH0718448B2 (ja) 1991-09-19 1995-03-06 テイエチケー株式会社 リニアベアリング用スライダ及びその製造法
JPH05121470A (ja) * 1991-10-29 1993-05-18 Toshiba Corp ダイボンダ装置
JPH05145283A (ja) 1991-11-15 1993-06-11 Sony Corp 部品情報読取装置
US5275657A (en) 1991-11-25 1994-01-04 E. I. Du Pont De Nemours And Company Apparatus for applying adhesive to a honeycomb half-cell structure
JPH05169885A (ja) 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
JP3008655B2 (ja) 1992-04-01 2000-02-14 ソニー株式会社 固体撮像装置
US5547537A (en) 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
JPH0666319A (ja) 1992-06-19 1994-03-08 Nippon Thompson Co Ltd 転がり案内ユニット及びその製造方法
JPH0689910A (ja) 1992-09-07 1994-03-29 Toshiba Corp ダイボンディング装置
US5415693A (en) 1992-10-01 1995-05-16 Hitachi Techno Engineering Co., Ltd. Paste applicator
JPH06302992A (ja) 1993-04-14 1994-10-28 Toshiba Corp 部品実装機のカートリッジ構造及び部品実装機の管理システム
US5459794A (en) 1993-07-15 1995-10-17 Ninomiya; Takanori Method and apparatus for measuring the size of a circuit or wiring pattern formed on a hybrid integrated circuit chip and a wiring board respectively
EP0647943B1 (fr) 1993-10-08 2000-10-04 VALTAC, Alex Beaud Dispositif à mémoire
EP0649719B1 (de) 1993-10-26 1997-10-01 Siemens Aktiengesellschaft Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen
KR0163366B1 (ko) * 1993-11-26 1999-02-01 오쿠라 고이치 펠레트 본딩장치
JPH07157259A (ja) 1993-12-02 1995-06-20 Hitachi Ltd 乗客コンベア乗り込み時の転倒防止装置
CA2113752C (en) 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging
US5559727A (en) 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
US5488771A (en) 1994-03-09 1996-02-06 Advanced Engineering Systems, Operations & Products Inc. Method for manufacturing externally pressurized bearing assemblies
DE4416697A1 (de) 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
US5650081A (en) 1994-06-29 1997-07-22 Zevatech, Inc. Thermode solder blade with electric heater greater than four ohms
US5554821A (en) 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US5475919B1 (en) 1994-10-07 2000-10-17 Three View Technology Co Ltd Pcmcia card manufacturing process
US5499756A (en) 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
US5669970A (en) 1995-06-02 1997-09-23 Mpm Corporation Stencil apparatus for applying solder paste
JP3129151B2 (ja) 1995-06-13 2001-01-29 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
JP3202543B2 (ja) * 1995-06-23 2001-08-27 株式会社東芝 ダイボンディング方法及びその装置
JP3305923B2 (ja) 1995-08-21 2002-07-24 株式会社東芝 半導体製造装置および半導体製造方法
US5768125A (en) * 1995-12-08 1998-06-16 Asm International N.V. Apparatus for transferring a substantially circular article
JPH09323276A (ja) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd 搬送装置及びロボットアーム
US5708419A (en) 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
US6077022A (en) 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US5788379A (en) 1997-04-08 1998-08-04 Zevatech, Inc. High precision plate bearing structures and methods of assembly

Also Published As

Publication number Publication date
US6185815B1 (en) 2001-02-13
EP0923111B1 (de) 2007-05-02
EP0923111A3 (de) 2004-12-29
TW410413B (en) 2000-11-01
MY131974A (en) 2007-09-28
ATE361549T1 (de) 2007-05-15
DE59813989D1 (de) 2007-06-14
KR19990062846A (ko) 1999-07-26
JPH11260841A (ja) 1999-09-24
EP0923111A2 (de) 1999-06-16
CN1130763C (zh) 2003-12-10
JP4220042B2 (ja) 2009-02-04
CN1220487A (zh) 1999-06-23
KR100550049B1 (ko) 2006-10-04
US20010000057A1 (en) 2001-03-22

Similar Documents

Publication Publication Date Title
SG74676A1 (en) Semi-conductor mounting apparatus with a chip gripper travelling back and forth
MY109894A (en) Belt transfer section and method of use for right angle blank feeder.
GB2353882A (en) Method and apparatus for floating point operations and format conversion operations
MY109372A (en) Selectively releasing conductive runner and substrate assembly.
EP0261518A3 (en) Brake, particularly for the locking of tensioning elements provided in ski boots
FR2692986B1 (fr) Dispositif de mesure d'un couple de torsion sur un arbre tournant.
ES2086501T3 (es) Horno de espigas.
CA2222953A1 (en) Aerator control mechanism
FR2786561B1 (fr) Dispositif de freinage en translation d'un projectile sur trajectoire
TW350109B (en) A cut piece feeder
ATE37937T1 (de) Aus zwei teleskopisch angeordneten teilen bestehende vorrichtung.
FR2676468B1 (fr) Dispositif d'alimentation de ruban sur une machine a coudre.
FR2537745B1 (fr) Dispositif de blocage des positions d'un arbre de mecanisme de changement de vitesses
EP0849157A3 (en) Bicycle shifting control apparatus
FR2702445B1 (fr) Dispositif de guidage de ralingue de guindant notamment d'une voile enroulable sur bome.
FR2704691B1 (fr) Procédé d'enrobage de composants électroniques hybrides par billes sur un substrat.
FR2750625B1 (fr) Dispositif pour deplacer une partie d'une machine et exercer un effort en fin de course
FR2654188B1 (fr) Ensemble d'eclairage comprenant un element support destine a etre fixe sur une gaine technique.
ATE158762T1 (de) Zusammenstellung eines längs eingebauten getriebes in ''transaxle''-bauweise
IT8920187A0 (it) Leva principale per ratiera rotativa funzionante ad alta velocita'.
FR2670850B1 (fr) Crochet a monter sur l'extremite d'un cable, notamment d'un cable elastique de sandow.
EP0154525A3 (en) Low power coin routing gate apparatus
FR2656173B1 (fr) Dispositif de commande du fonctionnement d'au moins deux moteurs thermiques accouples sur un meme arbre d'entrainement d'un alternateur.
ES2126455A1 (es) Palanca de mando.
FR2674619B1 (fr) Dispositif de deplacement d'une ailette d'un projectile.