SG66545A1 - Apparatus for inspecting printed circuit boards and the like and method of operating the same - Google Patents
Apparatus for inspecting printed circuit boards and the like and method of operating the sameInfo
- Publication number
- SG66545A1 SG66545A1 SG1996003498A SG1996003498A SG66545A1 SG 66545 A1 SG66545 A1 SG 66545A1 SG 1996003498 A SG1996003498 A SG 1996003498A SG 1996003498 A SG1996003498 A SG 1996003498A SG 66545 A1 SG66545 A1 SG 66545A1
- Authority
- SG
- Singapore
- Prior art keywords
- light
- printed circuit
- inspection
- circuit board
- inspecting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Monitoring And Testing Of Exchanges (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Led Device Packages (AREA)
- Pressure Sensors (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63112054A JPH061173B2 (ja) | 1988-05-09 | 1988-05-09 | 曲面性状検査装置 |
JP63226767A JP2629880B2 (ja) | 1988-09-09 | 1988-09-09 | 基板検査装置における教示方法 |
JP63226768A JP2629881B2 (ja) | 1988-09-09 | 1988-09-09 | 基板検査のための検査領域設定方法およびその方法を用いた検査領域設定装置 |
JP63227963A JP2629882B2 (ja) | 1988-09-12 | 1988-09-12 | 基板検査のための教示方法及びその方法を用いた基板基査教示装置 |
JP63227964A JP2748977B2 (ja) | 1988-09-12 | 1988-09-12 | 基板検査結果表示装置 |
JP63230738A JPH07107514B2 (ja) | 1988-09-14 | 1988-09-14 | 基板検査装置における表示方法および表示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG66545A1 true SG66545A1 (en) | 1999-07-20 |
Family
ID=27552364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996003498A SG66545A1 (en) | 1988-05-09 | 1989-05-02 | Apparatus for inspecting printed circuit boards and the like and method of operating the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US5245671A (fr) |
EP (3) | EP0413817B1 (fr) |
KR (1) | KR920006031B1 (fr) |
AT (1) | ATE135110T1 (fr) |
AU (1) | AU3543689A (fr) |
DE (3) | DE68929062T2 (fr) |
SG (1) | SG66545A1 (fr) |
WO (1) | WO1989011093A1 (fr) |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5039868A (en) * | 1988-11-24 | 1991-08-13 | Omron Corporation | Method of and apparatus for inspecting printed circuit boards and the like |
EP0370527B1 (fr) * | 1988-11-24 | 1994-02-02 | Omron Tateisi Electronics Co. | Méthode et appareil pour inspecter un substrat |
JPH02231510A (ja) * | 1989-03-02 | 1990-09-13 | Omron Tateisi Electron Co | 基板検査装置 |
US5060065A (en) * | 1990-02-23 | 1991-10-22 | Cimflex Teknowledge Corporation | Apparatus and method for illuminating a printed circuit board for inspection |
JP3072998B2 (ja) * | 1990-04-18 | 2000-08-07 | 株式会社日立製作所 | はんだ付け状態検査方法及びその装置 |
US5598345A (en) * | 1990-11-29 | 1997-01-28 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for inspecting solder portions |
SG45181A1 (en) * | 1991-07-22 | 1998-01-16 | Omron Tateisi Electronics Co | Teaching method and system for mounted component inspection |
KR0170542B1 (ko) | 1993-04-21 | 1999-05-01 | 다테이시 요시오 | 육안 검사 지원장치 및 기판 검사장치와 이것들을 이용한 납땜 검사방법 및 수정방법 |
JP3205432B2 (ja) * | 1993-06-10 | 2001-09-04 | 松下電器産業株式会社 | 装着部品検査装置と装着部品検査方法 |
SG80529A1 (en) * | 1993-06-14 | 2001-05-22 | Omron Tateisi Electronics Co | Visual inspection supporting apparatus and printed circuit board inspecting apparatus, and methods of soldering inspection and correction using the apparatus |
US5500886A (en) * | 1994-04-06 | 1996-03-19 | Thermospectra | X-ray position measuring and calibration device |
EP0718623B1 (fr) * | 1994-12-19 | 2004-04-07 | Omron Corporation | Procédé et dispositif pour établir des zones d'observation et l'inspection des produits employant de telles zones |
KR0168243B1 (ko) * | 1994-12-19 | 1999-05-01 | 다떼이시 요시오 | 관측 영역 설정 방법 및 그 장치와, 이 관측 영역 설정 방법을 이용한 외관 검사 방법 및 그 장치 |
DE19511534C2 (de) * | 1995-03-29 | 1998-01-22 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Erfassung von 3D-Fehlstellen bei der automatischen Inspektion von Oberflächen mit Hilfe farbtüchtiger Bildauswertungssysteme |
US5751910A (en) * | 1995-05-22 | 1998-05-12 | Eastman Kodak Company | Neural network solder paste inspection system |
DE69530007D1 (de) * | 1995-06-15 | 2003-04-24 | British Nuclear Fuels Plc | Prüfen der oberfläche eines objekts |
US5991436A (en) * | 1995-06-30 | 1999-11-23 | Cognex Corporation | Apparatus and method for inspecting wirebonds on leads |
KR100200215B1 (ko) * | 1996-04-08 | 1999-06-15 | 윤종용 | 상관 신경 회로망을 이용한 납땜 검사 장치 및방법 |
JP3423572B2 (ja) * | 1996-06-06 | 2003-07-07 | キヤノン株式会社 | 画像読み取りシステム、その制御装置、画像読み取り方法、及び記憶媒体 |
JP3129245B2 (ja) | 1996-10-31 | 2001-01-29 | オムロン株式会社 | 撮像装置 |
JPH10143660A (ja) | 1996-11-11 | 1998-05-29 | Hitachi Ltd | 欠陥判定処理方法およびその装置 |
JPH10141929A (ja) * | 1996-11-12 | 1998-05-29 | Hitachi Ltd | はんだ付け検査装置 |
JP3802957B2 (ja) * | 1996-12-19 | 2006-08-02 | 富士機械製造株式会社 | 光沢を有する球冠状突起の撮像,位置特定方法およびシステム |
US6236747B1 (en) | 1997-02-26 | 2001-05-22 | Acuity Imaging, Llc | System and method for image subtraction for ball and bumped grid array inspection |
US6201892B1 (en) | 1997-02-26 | 2001-03-13 | Acuity Imaging, Llc | System and method for arithmetic operations for electronic package inspection |
US6118524A (en) * | 1997-02-26 | 2000-09-12 | Acuity Imaging, Llc | Arc illumination apparatus and method |
US5828449A (en) * | 1997-02-26 | 1998-10-27 | Acuity Imaging, Llc | Ring illumination reflective elements on a generally planar surface |
US5926557A (en) * | 1997-02-26 | 1999-07-20 | Acuity Imaging, Llc | Inspection method |
DE19709939A1 (de) * | 1997-03-11 | 1998-09-17 | Atg Test Systems Gmbh | Verfahren und Vorrichtung zum Prüfen von Leiterplatten |
US5774212A (en) * | 1997-03-19 | 1998-06-30 | General Electric Co. | Method and apparatus for detecting and analyzing directionally reflective surface flaws |
EP0871027A3 (fr) * | 1997-04-07 | 1999-05-19 | Hewlett-Packard Company | ContrÔle de plaques de circuits imprimés |
US6055054A (en) * | 1997-05-05 | 2000-04-25 | Beaty; Elwin M. | Three dimensional inspection system |
US6346966B1 (en) | 1997-07-07 | 2002-02-12 | Agilent Technologies, Inc. | Image acquisition system for machine vision applications |
CA2307031C (fr) * | 1997-10-09 | 2007-03-27 | Joseph L. Vilella | Systeme d'inspection video d'ensemble electronique |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6915007B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6324298B1 (en) | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
KR100345001B1 (ko) * | 1998-08-27 | 2002-07-19 | 삼성전자 주식회사 | 기판 납땜 검사용 조명 및 광학 장치 |
US6088109A (en) * | 1998-09-24 | 2000-07-11 | Advanced Semiconductor Engineering, Inc. | System for detecting the presence of deposited metals on soldering points of an integrated circuit board substrate |
US6774931B1 (en) | 1999-04-27 | 2004-08-10 | Matsushita Electric Industrial Co., Ltd. | Inspection method and device by movement of the field of view of the camera |
IL131282A (en) | 1999-08-05 | 2009-02-11 | Orbotech Ltd | Apparatus and methods for inspection of objects |
US6542630B1 (en) * | 1999-09-14 | 2003-04-01 | Teradyne, Inc. | Inspecting component placement relative to component pads |
WO2001029542A1 (fr) * | 1999-10-18 | 2001-04-26 | Mv Research Limited | Systeme de vision artificielle |
EP1111375B1 (fr) * | 1999-12-22 | 2014-12-17 | Novartis AG | Dispositif de contrôle pour des emballages |
US6757420B2 (en) | 1999-12-22 | 2004-06-29 | Novartis Ag | Inspection device for packages |
EP1126412B1 (fr) * | 2000-02-16 | 2013-01-30 | FUJIFILM Corporation | Appareil de saisie d'images et méthode de mesure de distance |
SE516239C2 (sv) * | 2000-04-28 | 2001-12-03 | Mydata Automation Ab | Metod och anordning för bestämning av nominella data för elektroniska kretsar, genom att ta en digital bild och jämföra med lagrade nominella data. |
US6621566B1 (en) | 2000-10-02 | 2003-09-16 | Teradyne, Inc. | Optical inspection system having integrated component learning |
DE10128476C2 (de) * | 2001-06-12 | 2003-06-12 | Siemens Dematic Ag | Optische Sensorvorrichtung zur visuellen Erfassung von Substraten |
US7062080B2 (en) | 2001-11-26 | 2006-06-13 | Omron Corporation | Method of inspecting curved surface and device for inspecting printed circuit board |
EP1314974B1 (fr) * | 2001-11-26 | 2005-02-02 | Omron Corporation | Méthode pour inspecter une surface courbée et dispositif pour inspecter un circuit imprimé |
JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
JP2003269919A (ja) * | 2002-03-11 | 2003-09-25 | Mitsutoyo Corp | 画像処理型測定機の照明装置 |
US9684675B2 (en) | 2002-09-30 | 2017-06-20 | Adobe Systems Incorporated | Reduction of search ambiguity with multiple media references |
TWI221531B (en) * | 2002-10-25 | 2004-10-01 | Hwan-Chia Chang | Method for testing soldering reliability |
FI20021973A (fi) * | 2002-11-05 | 2004-05-06 | Sr Instr Oy | Synkroninen optinen mittaus- ja tarkistusmenetelmä ja laite |
DE10393783T5 (de) * | 2002-11-28 | 2005-10-27 | Advantest Corp. | Positionserfassungsvorrichtung, Positionserfassungsverfahren und Tragvorrichtung für elektronische Komponenten |
EP1455179A1 (fr) * | 2003-03-07 | 2004-09-08 | MV Research Limited | Système de vision artificielle et procédé pour l'inspection |
US20040184653A1 (en) * | 2003-03-20 | 2004-09-23 | Baer Richard L. | Optical inspection system, illumination apparatus and method for use in imaging specular objects based on illumination gradients |
US7352892B2 (en) * | 2003-03-20 | 2008-04-01 | Micron Technology, Inc. | System and method for shape reconstruction from optical images |
US7171037B2 (en) * | 2003-03-20 | 2007-01-30 | Agilent Technologies, Inc. | Optical inspection system and method for displaying imaged objects in greater than two dimensions |
US7019826B2 (en) * | 2003-03-20 | 2006-03-28 | Agilent Technologies, Inc. | Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection |
WO2004088588A1 (fr) * | 2003-03-28 | 2004-10-14 | Fujitsu Limited | Camera, procede de reglage de la source lumineuse et progiciel associe |
JP4299049B2 (ja) * | 2003-04-24 | 2009-07-22 | 株式会社 日立ディスプレイズ | 表示デバイス用制御信号の検査方法及び検査装置並びにこの検査機能を備えた表示装置 |
US20040218006A1 (en) * | 2003-04-30 | 2004-11-04 | Dickerson Stephen Lang | Scanning apparatus |
JP3953988B2 (ja) * | 2003-07-29 | 2007-08-08 | Tdk株式会社 | 検査装置および検査方法 |
JP4041042B2 (ja) * | 2003-09-17 | 2008-01-30 | 大日本スクリーン製造株式会社 | 欠陥確認装置および欠陥確認方法 |
ES2229927B1 (es) * | 2003-10-02 | 2006-03-16 | Sony España, S.A. | Procedimiento y equipo para la inspeccion de soldadura de dispositivos de montaje en superficie. |
JP3867724B2 (ja) * | 2004-02-27 | 2007-01-10 | オムロン株式会社 | 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置 |
JP4736764B2 (ja) * | 2005-01-11 | 2011-07-27 | オムロン株式会社 | 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置 |
US7315361B2 (en) * | 2005-04-29 | 2008-01-01 | Gsi Group Corporation | System and method for inspecting wafers in a laser marking system |
CN2867100Y (zh) * | 2005-07-13 | 2007-02-07 | 王锦峰 | 在线光源发生装置 |
JP2007188128A (ja) * | 2006-01-11 | 2007-07-26 | Omron Corp | カラー画像を用いた測定方法および測定装置 |
CN101520309A (zh) * | 2008-02-28 | 2009-09-02 | 鸿富锦精密工业(深圳)有限公司 | 成像装置 |
US8077307B2 (en) * | 2008-04-09 | 2011-12-13 | Orbotech Ltd. | Illumination system for optical inspection |
IT1395116B1 (it) * | 2009-07-29 | 2012-09-05 | Utpvision S R L | Sistema di rilevamento ottico di difetti superficiali |
JP5948797B2 (ja) * | 2011-11-07 | 2016-07-06 | オムロン株式会社 | 検査結果の目視確認作業の支援用のシステムおよび装置ならびに方法 |
US8947590B2 (en) | 2011-11-22 | 2015-02-03 | Cognex Corporation | Vision system camera with mount for multiple lens types |
US10498933B2 (en) | 2011-11-22 | 2019-12-03 | Cognex Corporation | Camera system with exchangeable illumination assembly |
US11366284B2 (en) | 2011-11-22 | 2022-06-21 | Cognex Corporation | Vision system camera with mount for multiple lens types and lens module for the same |
JP6116710B2 (ja) * | 2014-01-08 | 2017-04-19 | ヤマハ発動機株式会社 | 外観検査装置および外観検査方法 |
JP6470506B2 (ja) * | 2014-06-09 | 2019-02-13 | 株式会社キーエンス | 検査装置 |
KR101610148B1 (ko) * | 2014-11-17 | 2016-04-08 | 현대자동차 주식회사 | 차체 검사 시스템 및 방법 |
KR101622628B1 (ko) | 2014-12-16 | 2016-05-20 | 주식회사 고영테크놀러지 | 부품이 실장된 기판 검사방법 및 검사장치 |
CN104568964B (zh) * | 2014-12-24 | 2018-05-01 | 昆山元茂电子科技有限公司 | 一种印刷电路板外观检测装置及其检测方法 |
KR101750521B1 (ko) * | 2015-07-27 | 2017-07-03 | 주식회사 고영테크놀러지 | 기판 검사 장치 및 방법 |
KR101739696B1 (ko) * | 2016-07-13 | 2017-05-25 | 서장일 | 재질인식 조명 시스템 및 이를 이용한 재질인식 방법 |
CN106645161B (zh) * | 2016-09-27 | 2020-02-04 | 凌云光技术集团有限责任公司 | 一种表面缺陷检测系统及方法 |
JP6815169B2 (ja) * | 2016-11-07 | 2021-01-20 | Juki株式会社 | 極性判別装置、実装装置、極性判別方法 |
US11282187B2 (en) * | 2019-08-19 | 2022-03-22 | Ricoh Company, Ltd. | Inspection system, inspection apparatus, and method using multiple angle illumination |
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US4249827A (en) * | 1978-04-17 | 1981-02-10 | Solid Photography Inc. | Arrangement for color coding of surfaces |
JPS59153108A (ja) * | 1983-02-22 | 1984-09-01 | Matsushita Electric Ind Co Ltd | 鏡面体の表面欠陥検査方法 |
US4727498A (en) * | 1984-10-31 | 1988-02-23 | University Of South Carolina | Process for segmenting reservoir pores |
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JPS61293657A (ja) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | 半田付け外観検査方法 |
JPS62127617A (ja) * | 1985-11-29 | 1987-06-09 | Fujitsu Ltd | 線状物体検査装置 |
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DE3750285T2 (de) * | 1986-10-03 | 1995-03-30 | Omron Tateisi Electronics Co | Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe. |
US5093797A (en) * | 1987-01-13 | 1992-03-03 | Omron Tateisi Electronics Co. | Apparatus for inspecting packaged electronic device |
JPH02116259A (ja) * | 1988-10-26 | 1990-04-27 | Toshiba Corp | 画像形成装置 |
JPH02231510A (ja) * | 1989-03-02 | 1990-09-13 | Omron Tateisi Electron Co | 基板検査装置 |
-
1989
- 1989-05-02 AU AU35436/89A patent/AU3543689A/en not_active Abandoned
- 1989-05-02 KR KR1019900700025A patent/KR920006031B1/ko not_active IP Right Cessation
- 1989-05-02 DE DE68929062T patent/DE68929062T2/de not_active Expired - Lifetime
- 1989-05-02 DE DE68925901T patent/DE68925901T2/de not_active Expired - Lifetime
- 1989-05-02 WO PCT/JP1989/000470 patent/WO1989011093A1/fr active IP Right Grant
- 1989-05-02 AT AT89905170T patent/ATE135110T1/de not_active IP Right Cessation
- 1989-05-02 EP EP89905170A patent/EP0413817B1/fr not_active Expired - Lifetime
- 1989-05-02 US US07/601,722 patent/US5245671A/en not_active Expired - Lifetime
- 1989-05-02 DE DE68929481T patent/DE68929481T2/de not_active Expired - Lifetime
- 1989-05-02 SG SG1996003498A patent/SG66545A1/en unknown
- 1989-05-02 EP EP95113574A patent/EP0687901B1/fr not_active Expired - Lifetime
- 1989-05-02 EP EP95113579A patent/EP0685732B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE135110T1 (de) | 1996-03-15 |
DE68929062D1 (de) | 1999-09-30 |
EP0413817A1 (fr) | 1991-02-27 |
WO1989011093A1 (fr) | 1989-11-16 |
DE68925901T2 (de) | 1996-11-14 |
DE68929481T2 (de) | 2004-06-09 |
DE68925901D1 (de) | 1996-04-11 |
AU3543689A (en) | 1989-11-29 |
EP0413817A4 (en) | 1991-10-23 |
DE68929481D1 (de) | 2003-09-18 |
KR920006031B1 (ko) | 1992-07-27 |
DE68929062T2 (de) | 2000-03-16 |
EP0413817B1 (fr) | 1996-03-06 |
US5245671A (en) | 1993-09-14 |
KR900702353A (ko) | 1990-12-06 |
EP0687901B1 (fr) | 2003-08-13 |
EP0685732B1 (fr) | 1999-08-25 |
EP0685732A1 (fr) | 1995-12-06 |
EP0687901A1 (fr) | 1995-12-20 |
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