SG175986A1 - Method and apparatus for photoimaging a substrate - Google Patents
Method and apparatus for photoimaging a substrate Download PDFInfo
- Publication number
- SG175986A1 SG175986A1 SG2011082815A SG2011082815A SG175986A1 SG 175986 A1 SG175986 A1 SG 175986A1 SG 2011082815 A SG2011082815 A SG 2011082815A SG 2011082815 A SG2011082815 A SG 2011082815A SG 175986 A1 SG175986 A1 SG 175986A1
- Authority
- SG
- Singapore
- Prior art keywords
- rate
- mask
- light beam
- substrate
- exposure zone
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 36
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- 229920002120 photoresistant polymer Polymers 0.000 claims description 21
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- 238000007772 electroless plating Methods 0.000 description 4
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920006397 acrylic thermoplastic Polymers 0.000 description 2
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- 238000011161 development Methods 0.000 description 2
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- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 238000007639 printing Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/54—Lamp housings; Illuminating means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/472,618 US8339573B2 (en) | 2009-05-27 | 2009-05-27 | Method and apparatus for photoimaging a substrate |
| PCT/US2010/034707 WO2010138312A1 (en) | 2009-05-27 | 2010-05-13 | Method and apparatus for photoimaging a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG175986A1 true SG175986A1 (en) | 2011-12-29 |
Family
ID=43220644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011082815A SG175986A1 (en) | 2009-05-27 | 2010-05-13 | Method and apparatus for photoimaging a substrate |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8339573B2 (enExample) |
| EP (1) | EP2435881A1 (enExample) |
| JP (1) | JP5690334B2 (enExample) |
| KR (1) | KR20120018200A (enExample) |
| CN (1) | CN102460306B (enExample) |
| SG (1) | SG175986A1 (enExample) |
| WO (1) | WO2010138312A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6056770B2 (ja) * | 2011-12-20 | 2017-01-11 | 株式会社ニコン | 基板処理装置、デバイス製造システム、及びデバイス製造方法 |
| CN103057256B (zh) * | 2012-06-21 | 2015-12-09 | 深圳市众立生包装科技有限公司 | 一种高精度印刷系统和印刷方法 |
| JP5963194B2 (ja) * | 2012-07-17 | 2016-08-03 | 株式会社ブイ・テクノロジー | 露光装置 |
| CN106415193B (zh) * | 2014-03-21 | 2019-08-09 | 卡尔佩迪姆技术有限公司 | 用于在柔性基板上制造微型结构的系统和方法 |
| JP6510768B2 (ja) * | 2014-05-23 | 2019-05-08 | 株式会社オーク製作所 | 露光装置 |
| CN110297403B (zh) * | 2014-09-04 | 2023-07-28 | 株式会社尼康 | 处理系统 |
| CN107077080B (zh) * | 2015-01-15 | 2019-04-26 | 株式会社村田制作所 | 曝光装置 |
| KR102288354B1 (ko) * | 2015-08-10 | 2021-08-11 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치의 제조 방법 |
| CN105549340B (zh) * | 2016-02-24 | 2017-10-24 | 上海大学 | 卷对卷柔性衬底光刻方法和装置 |
| JP6332482B2 (ja) * | 2017-01-13 | 2018-05-30 | 株式会社ニコン | 基板処理装置 |
| CN110275388A (zh) * | 2018-03-17 | 2019-09-24 | 深圳市深龙杰科技有限公司 | 一种固体介质光学成像的方法 |
| JP7089920B2 (ja) * | 2018-03-29 | 2022-06-23 | 株式会社オーク製作所 | 露光装置 |
| DE102019128198B3 (de) * | 2019-10-18 | 2021-02-25 | Laser Imaging Systems Gmbh | Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat |
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| CN101501574B (zh) | 2006-08-03 | 2012-01-11 | 3M创新有限公司 | 长柔性电路及其制作方法 |
| US7683351B2 (en) * | 2006-12-01 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7400457B1 (en) | 2007-01-04 | 2008-07-15 | Stockeryale Canada Inc. | Rectangular flat-top beam shaper |
| US20080171422A1 (en) | 2007-01-11 | 2008-07-17 | Tokie Jeffrey H | Apparatus and methods for fabrication of thin film electronic devices and circuits |
-
2009
- 2009-05-27 US US12/472,618 patent/US8339573B2/en not_active Expired - Fee Related
-
2010
- 2010-05-13 SG SG2011082815A patent/SG175986A1/en unknown
- 2010-05-13 WO PCT/US2010/034707 patent/WO2010138312A1/en not_active Ceased
- 2010-05-13 EP EP10780995A patent/EP2435881A1/en not_active Withdrawn
- 2010-05-13 JP JP2012513096A patent/JP5690334B2/ja not_active Expired - Fee Related
- 2010-05-13 KR KR1020117030564A patent/KR20120018200A/ko not_active Abandoned
- 2010-05-13 CN CN201080032175.0A patent/CN102460306B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102460306A (zh) | 2012-05-16 |
| KR20120018200A (ko) | 2012-02-29 |
| CN102460306B (zh) | 2015-08-12 |
| WO2010138312A1 (en) | 2010-12-02 |
| US20100304309A1 (en) | 2010-12-02 |
| JP5690334B2 (ja) | 2015-03-25 |
| EP2435881A1 (en) | 2012-04-04 |
| JP2012528357A (ja) | 2012-11-12 |
| US8339573B2 (en) | 2012-12-25 |
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