CN102460306B - 对基底进行感光成像的方法和设备 - Google Patents

对基底进行感光成像的方法和设备 Download PDF

Info

Publication number
CN102460306B
CN102460306B CN201080032175.0A CN201080032175A CN102460306B CN 102460306 B CN102460306 B CN 102460306B CN 201080032175 A CN201080032175 A CN 201080032175A CN 102460306 B CN102460306 B CN 102460306B
Authority
CN
China
Prior art keywords
mask
light beam
speed
substrate
photosensitive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080032175.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102460306A (zh
Inventor
丹尼尔·J·泰斯
利文特·伯耶克勒
杰弗里·H·托奇
大卫·L·霍费尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102460306A publication Critical patent/CN102460306A/zh
Application granted granted Critical
Publication of CN102460306B publication Critical patent/CN102460306B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00Photographic printing apparatus
    • G03B27/32Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52Details
    • G03B27/54Lamp housings; Illuminating means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201080032175.0A 2009-05-27 2010-05-13 对基底进行感光成像的方法和设备 Expired - Fee Related CN102460306B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/472,618 US8339573B2 (en) 2009-05-27 2009-05-27 Method and apparatus for photoimaging a substrate
US12/472,618 2009-05-27
PCT/US2010/034707 WO2010138312A1 (en) 2009-05-27 2010-05-13 Method and apparatus for photoimaging a substrate

Publications (2)

Publication Number Publication Date
CN102460306A CN102460306A (zh) 2012-05-16
CN102460306B true CN102460306B (zh) 2015-08-12

Family

ID=43220644

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080032175.0A Expired - Fee Related CN102460306B (zh) 2009-05-27 2010-05-13 对基底进行感光成像的方法和设备

Country Status (7)

Country Link
US (1) US8339573B2 (enExample)
EP (1) EP2435881A1 (enExample)
JP (1) JP5690334B2 (enExample)
KR (1) KR20120018200A (enExample)
CN (1) CN102460306B (enExample)
SG (1) SG175986A1 (enExample)
WO (1) WO2010138312A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6056770B2 (ja) * 2011-12-20 2017-01-11 株式会社ニコン 基板処理装置、デバイス製造システム、及びデバイス製造方法
CN103057256B (zh) * 2012-06-21 2015-12-09 深圳市众立生包装科技有限公司 一种高精度印刷系统和印刷方法
JP5963194B2 (ja) * 2012-07-17 2016-08-03 株式会社ブイ・テクノロジー 露光装置
CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
JP6510768B2 (ja) * 2014-05-23 2019-05-08 株式会社オーク製作所 露光装置
CN110297403B (zh) * 2014-09-04 2023-07-28 株式会社尼康 处理系统
CN107077080B (zh) * 2015-01-15 2019-04-26 株式会社村田制作所 曝光装置
KR102288354B1 (ko) * 2015-08-10 2021-08-11 삼성디스플레이 주식회사 플렉서블 디스플레이 장치의 제조 방법
CN105549340B (zh) * 2016-02-24 2017-10-24 上海大学 卷对卷柔性衬底光刻方法和装置
JP6332482B2 (ja) * 2017-01-13 2018-05-30 株式会社ニコン 基板処理装置
CN110275388A (zh) * 2018-03-17 2019-09-24 深圳市深龙杰科技有限公司 一种固体介质光学成像的方法
JP7089920B2 (ja) * 2018-03-29 2022-06-23 株式会社オーク製作所 露光装置
DE102019128198B3 (de) * 2019-10-18 2021-02-25 Laser Imaging Systems Gmbh Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5721606A (en) * 1995-09-07 1998-02-24 Jain; Kanti Large-area, high-throughput, high-resolution, scan-and-repeat, projection patterning system employing sub-full mask
US20010000974A1 (en) * 1999-05-19 2001-05-10 Nikon Corporation Scanning exposure method with reduced time between scans
US6538723B2 (en) * 1996-08-05 2003-03-25 Nikon Corporation Scanning exposure in which an object and pulsed light are moved relatively, exposing a substrate by projecting a pattern on a mask onto the substrate with pulsed light from a light source, light sources therefor, and methods of manufacturing

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3229607A (en) 1963-03-19 1966-01-18 Polaroid Corp Photographic products, processes and apparatus
US3562005A (en) 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3783520A (en) 1970-09-28 1974-01-08 Bell Telephone Labor Inc High accuracy alignment procedure utilizing moire patterns
US3998544A (en) 1975-06-13 1976-12-21 Terminal Data Corporation Synchronous auxiliary camera projector
US4174174A (en) 1977-03-15 1979-11-13 Xerox Corporation Composing reducing camera
US4190352A (en) 1977-06-30 1980-02-26 Bell Telephone Laboratories, Incorporated Method and apparatus for continuously patterning a photosensitive tape
JPS5614573A (en) 1979-07-13 1981-02-12 Kuraray Co Ltd Preparing hot melt adhesive
US4302096A (en) 1980-02-11 1981-11-24 Sperry Corporation Graphic forms overlay apparatus
US4801979A (en) 1987-12-23 1989-01-31 Innovative Technology, Inc. Device for copying microfiche
US4924257A (en) 1988-10-05 1990-05-08 Kantilal Jain Scan and repeat high resolution projection lithography system
US5227839A (en) 1991-06-24 1993-07-13 Etec Systems, Inc. Small field scanner
JPH0567558A (ja) 1991-09-06 1993-03-19 Nikon Corp 露光方法
KR950004968B1 (ko) 1991-10-15 1995-05-16 가부시키가이샤 도시바 투영노광 장치
US5328073A (en) 1992-06-24 1994-07-12 Eastman Kodak Company Film registration and ironing gate assembly
US5285236A (en) 1992-09-30 1994-02-08 Kanti Jain Large-area, high-throughput, high-resolution projection imaging system
US5591958A (en) 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
JP3291849B2 (ja) 1993-07-15 2002-06-17 株式会社ニコン 露光方法、デバイス形成方法、及び露光装置
US5563867A (en) 1994-06-30 1996-10-08 Discovision Associates Optical tape duplicator
US5739964A (en) 1995-03-22 1998-04-14 Etec Systems, Inc. Magnification correction for small field scanning
US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
US5621216A (en) 1996-04-26 1997-04-15 International Business Machines Corporation Hardware/software implementation for multipass E-beam mask writing
JPH09320933A (ja) 1996-05-28 1997-12-12 Nikon Corp 走査型露光装置
US6312134B1 (en) 1996-07-25 2001-11-06 Anvik Corporation Seamless, maskless lithography system using spatial light modulator
JPH10189414A (ja) * 1996-12-26 1998-07-21 Nikon Corp X線投影露光装置及びx線投影露光方法
US5795299A (en) 1997-01-31 1998-08-18 Acuson Corporation Ultrasonic transducer assembly with extended flexible circuits
US5897986A (en) 1997-05-28 1999-04-27 Anvik Corporation Projection patterning of large substrates using limited-travel x-y stage
US5923403A (en) 1997-07-08 1999-07-13 Anvik Corporation Simultaneous, two-sided projection lithography system
US6018383A (en) 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
US20010003028A1 (en) * 1997-09-19 2001-06-07 Nikon Corporation Scanning Exposure Method
JPH11251229A (ja) 1998-02-27 1999-09-17 Canon Inc 露光装置およびデバイス製造方法
AU1262499A (en) 1998-03-11 1999-09-27 Nikon Corporation Ultraviolet laser apparatus and exposure apparatus comprising the ultraviolet laser apparatus
US6304316B1 (en) 1998-10-22 2001-10-16 Anvik Corporation Microlithography system for high-resolution large-area patterning on curved surfaces
JP2000252192A (ja) * 1999-02-26 2000-09-14 Nikon Corp 投影露光方法および投影露光装置
JP2000277408A (ja) * 1999-03-23 2000-10-06 Nikon Corp 露光装置および露光方法
AU6865300A (en) 1999-09-10 2001-04-17 Nikon Corporation Light source and wavelength stabilization control method, exposure apparatus andexposure method, method for producing exposure apparatus, and device manufactur ing method and device
JP2001007023A (ja) * 2000-01-01 2001-01-12 Nikon Corp 投影露光方法及び装置、並びに素子製造方法
US6933098B2 (en) 2000-01-11 2005-08-23 Sipix Imaging Inc. Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
JP2001319871A (ja) 2000-02-29 2001-11-16 Nikon Corp 露光方法、濃度フィルタの製造方法、及び露光装置
JP2001274054A (ja) 2000-03-24 2001-10-05 Canon Inc 露光装置、半導体デバイス製造方法および半導体デバイス製造工場
JP2001284210A (ja) 2000-03-30 2001-10-12 Canon Inc 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP4947842B2 (ja) 2000-03-31 2012-06-06 キヤノン株式会社 荷電粒子線露光装置
JP2001358056A (ja) 2000-06-15 2001-12-26 Canon Inc 露光装置
JP2002009133A (ja) 2000-06-26 2002-01-11 Canon Inc 基板搬送装置
EP2264524A3 (en) 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System High-resolution overlay alignement methods and systems for imprint lithography
JP2002050559A (ja) 2000-08-01 2002-02-15 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP2002057089A (ja) 2000-08-09 2002-02-22 Canon Inc 露光装置
JP2002110526A (ja) 2000-10-03 2002-04-12 Canon Inc 走査露光方法及び走査露光装置
JP2002217095A (ja) 2000-11-14 2002-08-02 Canon Inc 露光装置、半導体デバイス製造方法、半導体製造工場及び露光装置の保守方法並びに位置検出装置
JP2002158155A (ja) 2000-11-17 2002-05-31 Canon Inc 露光装置および露光方法
TW556044B (en) 2001-02-15 2003-10-01 Sipix Imaging Inc Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
JP3762307B2 (ja) 2001-02-15 2006-04-05 キヤノン株式会社 レーザ干渉干渉計システムを含む露光装置
US6621553B2 (en) 2001-03-30 2003-09-16 Perkinelmer, Inc. Apparatus and method for exposing substrates
US7217503B2 (en) 2001-04-24 2007-05-15 Canon Kabushiki Kaisha Exposure method and apparatus
JP2002334826A (ja) 2001-05-09 2002-11-22 Canon Inc 露光方法、面位置合わせ方法、露光装置及びデバイス製造方法
EP1276016B1 (en) 2001-07-09 2009-06-10 Canon Kabushiki Kaisha Exposure apparatus
JP3977086B2 (ja) 2002-01-18 2007-09-19 キヤノン株式会社 ステージシステム
US6774509B2 (en) * 2002-01-30 2004-08-10 Defond Manufacturing Limited Electrical switch assembly
JP3849932B2 (ja) 2002-08-12 2006-11-22 キヤノン株式会社 移動ステージ装置
US6774983B2 (en) 2002-08-12 2004-08-10 Anvik Corporation Distributed projection system
JP2004111579A (ja) 2002-09-17 2004-04-08 Canon Inc 露光方法及び装置
JP3689698B2 (ja) 2003-01-31 2005-08-31 キヤノン株式会社 投影露光装置、投影露光方法および被露光部材の製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US7165959B2 (en) 2003-09-09 2007-01-23 3M Innovative Properties Company Apparatus and method for producing two-sided patterned webs in registration
US7270942B2 (en) * 2003-10-22 2007-09-18 Lsi Corporation Optimized mirror design for optical direct write
US7296717B2 (en) 2003-11-21 2007-11-20 3M Innovative Properties Company Method and apparatus for controlling a moving web
EP2058108B1 (en) 2005-03-09 2012-06-06 3M Innovative Properties Company Patterned roll for casting a patterned surface onto an opaque web
JP4648063B2 (ja) 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
JP2009501280A (ja) 2005-07-12 2009-01-15 スリーエム イノベイティブ プロパティズ カンパニー 基材上に材料模様を連続的に付着させるための装置及び方法
US8383330B2 (en) 2005-09-07 2013-02-26 Fujifilm Corporation Pattern exposure method and pattern exposure apparatus
CN101501574B (zh) 2006-08-03 2012-01-11 3M创新有限公司 长柔性电路及其制作方法
US7683351B2 (en) * 2006-12-01 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7400457B1 (en) 2007-01-04 2008-07-15 Stockeryale Canada Inc. Rectangular flat-top beam shaper
US20080171422A1 (en) 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5721606A (en) * 1995-09-07 1998-02-24 Jain; Kanti Large-area, high-throughput, high-resolution, scan-and-repeat, projection patterning system employing sub-full mask
US6538723B2 (en) * 1996-08-05 2003-03-25 Nikon Corporation Scanning exposure in which an object and pulsed light are moved relatively, exposing a substrate by projecting a pattern on a mask onto the substrate with pulsed light from a light source, light sources therefor, and methods of manufacturing
US20010000974A1 (en) * 1999-05-19 2001-05-10 Nikon Corporation Scanning exposure method with reduced time between scans

Also Published As

Publication number Publication date
CN102460306A (zh) 2012-05-16
KR20120018200A (ko) 2012-02-29
WO2010138312A1 (en) 2010-12-02
US20100304309A1 (en) 2010-12-02
JP5690334B2 (ja) 2015-03-25
EP2435881A1 (en) 2012-04-04
JP2012528357A (ja) 2012-11-12
SG175986A1 (en) 2011-12-29
US8339573B2 (en) 2012-12-25

Similar Documents

Publication Publication Date Title
CN102460306B (zh) 对基底进行感光成像的方法和设备
CN101359188B (zh) 带状工件的曝光装置及带状工件的曝光装置的聚焦调整方法
EP2376983B1 (en) Roll-to-roll digital photolithography
TWI415532B (zh) 長可撓性電路及其製造方法
JP5144992B2 (ja) 露光装置
KR100665165B1 (ko) 띠 형상 워크의 양면 투영 노광 장치
JP5117672B2 (ja) 露光方法及び露光装置
CN107450276B (zh) 曝光装置
JP7446687B2 (ja) ダイレクト露光装置
JP3541783B2 (ja) フィルム回路基板の周辺露光装置
JP6554330B2 (ja) マスクレス露光装置および露光方法
KR20050048466A (ko) 기판의 신축(伸縮)에 대응하는 프린트 배선 기판용 노광장치
JP3678144B2 (ja) フィルム回路基板の周辺露光装置
JP2682002B2 (ja) 露光装置の位置合わせ方法及び装置
JP2015018006A (ja) 基板処理装置、デバイス製造システム及びデバイス製造方法
TW200845848A (en) Manufacturing method of circuit board
JP2007114357A (ja) 投影露光装置
JPH08160626A (ja) 露光方法及びその装置
CN116184767A (zh) 曝光装置
JPH01298362A (ja) 露光装置におけるフイルムの位置決め方法及びその装置
JP2006098488A (ja) 両面描画装置
JP2007127942A (ja) 投影露光装置
KR20150073252A (ko) 롤투롤 기판 제조장치
JP2015018027A (ja) 露光装置
JP2014032354A (ja) 露光装置、およびデバイス製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150812

Termination date: 20180513